With Fusible Metal Overlay (e.g., Alloy-forming) Patents (Class 337/160)
  • Patent number: 11410826
    Abstract: A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 9, 2022
    Assignee: SCHURTER AG
    Inventors: Mauro Castellani, Peter Straub
  • Patent number: 10224707
    Abstract: In an embodiment, an electronic component fuse 10 includes: (1) an insulator sleeve 11 having a hollow part 11a that opens to the exterior at both ends; (2) a conductor element 12 having a fusible part 12a whose cross-section is smaller than the cross-section of the hollow part 11a, a first engagement part 12b provided at one end of the fusible part 12a, and a second engagement part 12c provided at the other end of the fusible part 12a, where the fusible part 12a is positioned in the hollow part 11a, the first engagement part 12b and the second engagement part 12c are disposed on the respective ends of the insulator sleeve 11; (3) a first terminal 13 having a first connection part 13a connected to the first engagement part 12b; and (4) a second terminal 14 having a second connection part 14a connected to the second engagement part 12c.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: March 5, 2019
    Assignee: TAIYO YUDEN CO., LTD
    Inventors: Yousuke Nakada, Kenji Matsumoto, Tetsuo Shimura, Kazuya Sato
  • Patent number: 10192705
    Abstract: The invention relates to a fuse element (12_1; 12_2), comprising two connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) and an interposed conductive track (26_1; 26_2), wherein the conductive track (26_1; 26_2) has a reduced line-cross-section, in relation, to the connecting contacts (24_1?, 24_1?; 24_2?, 24_2?) at least in some sections, further comprising at least one overlay (16_1; 16_2?, 16_2?), wherein the fuse element (12_1; 12_2) and the overlay (16_1; 16_2?, 16_2?) each comprise materials which undergo diffusion when a predetermined ambient temperature is exceeded and when an electric current is conducted by the fuse element (12_1; 12_2). The invention further relates to a fuse (TO) having such a fuse element (12_1; 12_2) and a base support (14), wherein the fuse element (12_1; 12_2) is disposed on a surface of the base support (14).
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: January 29, 2019
    Assignee: SCHURTER AG
    Inventors: Peter Straub, Hans-Peter Blättler
  • Patent number: 9613775
    Abstract: Disclosed is a highly durable blade fuse for which a fused site in a narrow section and the rated current are determined in conformity with its design and the temperature of which does not increase greatly when a current flows through it. A blade fuse according to the present invention includes terminal sections (A, B) and a connection section (1), which are made of the same metal base material that is zinc or a zinc alloy. Furthermore, a low-melting-point metal piece (3), made of tin, which has an outer size identical or similar to a width of the connection section (1) is melted and stuck on at least one surface of the connection section (1) outside the fused section (2), and is positioned to partially traverse an edge of the fused section (2) or not to traverse the edge but to be adjacent to the edge.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: April 4, 2017
    Assignee: PACIFIC ENGINEERING CORPORATION
    Inventors: Masashi Ebi, Daiji Kondo
  • Patent number: 8976001
    Abstract: A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: March 10, 2015
    Assignee: Cyntec Co., Ltd.
    Inventors: Kuo-Shu Chen, Chung-Hsiung Wang
  • Patent number: 8633795
    Abstract: The invention relates to a thermal fuse in a circuit structure, particularly a punched grid, having a plurality of circuit areas, having the circuit structure with connections sites (9) and having a fusible element (3), which is electrically and mechanically connected to the connection sites (9) of the circuit structure, a material of the fusible element (3) having a melting point, in order to melt at an ambient temperature greater than the melting point, such that material of the fusible element (3) collects at the connection sites (9) and the electrical connection formed by the fusible element (3) breaks.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: January 21, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Norbert Knab, Georg Schulze-Icking-Konert, Thomas Mohr, Stefan Kotthaus, Nikolas Haberl, Stefan Stampfer, Michael Mueller
  • Patent number: 7884698
    Abstract: An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: February 8, 2011
    Assignee: Panasonic Corporation
    Inventors: Hideki Tanaka, Tomoyuki Washizaki, Kiyoshi Ikeuchi, Toshiyuki Iwao, Yasuki Nagatomo, Kesato Iiboshi, Jiro Ota, Yasuhiro Izumi
  • Patent number: 7851885
    Abstract: An electrically programmable fuse comprising a cathode member, an anode member, and a link member, wherein the cathode member, the anode member, and the link member each comprise one of a plurality of materials operative to localize induced electromigration in the programmable fuse.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: December 14, 2010
    Assignee: International Business Machines Corporation
    Inventors: Deok-kee Kim, Keith Kwong Hon Wong, Chih-Chao Yang, Haining S. Yang
  • Patent number: 7637781
    Abstract: A hinge section including bending sections at both side edges of a band plate section is provided in center of a busbar. On both sides of the hinge section, two fuse circuit constituting plate sections are integrally formed to be linked thereto. Two resin housings are assembled by insert molding to the respective fuse circuit constituting plate sections, thus forming two bodies. The two bodies are pivoted in the same direction at the bending sections, and engagement units are locked, thus constituting a fusible link unit having a U-shaped plan view. The two bodies are engaged with each other in vicinity areas of the hinge section in the opposed surfaces of the opposed resin housing when the two bodies are pivoted. The fusible link unit also includes recessed and projected guides guiding the two resin housings to proper positions.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: December 29, 2009
    Assignee: Yazaki Corporation
    Inventors: Yusuke Matsumoto, Norihiro Ohashi
  • Patent number: 7312688
    Abstract: A fuse element strip with a central metallic section having a part with a high melting point and a part with a low melting point embedded in the high melting point part, and two lateral metallic sections with a high melting point. Each lateral section is joined to the high melting point part of the central section by a weld of fused material, and the joined sections have the same thickness so that the strip has three coplanar sections. The high melting point and low melting point parts of the central metallic section alloy at the low melting point causing the strip to melt at the melting temperature of the alloy.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: December 25, 2007
    Assignee: Metalor Technologies International S.A.
    Inventors: Brian Ely, Gaël Arnaud
  • Patent number: 7173510
    Abstract: A thermal fuse includes a fusible alloy including tin, a couple of lead conductors connected to both ends of the fusible alloy, respectively, and a surface layer on the lead conductors, respectively. The surface layer is made of tin or alloy including tin as main substance, and has a thickness not greater than 14 ?m. The thermal fuse has a stable fusing temperature.
    Type: Grant
    Filed: July 28, 2003
    Date of Patent: February 6, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Atsushi Kono, Kenji Senda, Tatsuya Wada
  • Patent number: 7142088
    Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation stability after an operation can be sufficiently assured, and a fuse element can be easily thinned. A fuse element having an alloy composition in which Sn is larger than 25% and 44% or smaller, Bi is 1% or larger and smaller than 20%, and In is larger than 55% and 74% or smaller is used.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: November 28, 2006
    Assignee: Uchibashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 7109839
    Abstract: A fuse link, especially for low voltage, high-breaking-capacity fuses, includes at least one fusible conductor having a soldering substance in a solder depot of a carrier, the solder being tin-based and the carrier being copper-based. The solder contains a tin alloy as an active substance, the tin alloy having two other constituents. The first constituent, which is the larger of the two in weight percent but which is smaller in weight percent than the proportion of the base substance tin, is selected for lowering the fusion temperature of the solder. The second constituent, which is the smaller of the two in weight percent, is a substance which does not dissolve in tin. Crystal nuclei are formed when said substance is cooled from the liquid state to the solid state, creating a fine structure and preventing the structure from becoming coarse under a load.
    Type: Grant
    Filed: September 11, 2001
    Date of Patent: September 19, 2006
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alexander Etschmaier, Helmut Wieser
  • Patent number: 7064648
    Abstract: An alloy type thermal fuse is provided in which a Bi—Sn alloy is used as a fuse element, which has an operating temperature of about 140° C., which, even when used at a high power, can safely operate, and in which dispersion of the operating temperature can be sufficiently reduced. Also a material for a thermal fuse element is provided. An alloy composition in which Bi is larger than 50% and 56% or smaller, and a balance is Sn is used as a fuse element of the alloy type thermal fuse.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: June 20, 2006
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 7042327
    Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, the operating temperature belongs to the range of 130 to 170° C., the overload characteristic and the dielectric breakdown characteristic are excellent, the insulation stability after an operation can be sufficiently ensured, and thinning of a fuse element can be easily realized. A fuse element having an alloy composition in which Sn is larger than 43% and 70% or smaller, In is 0.5% or higher and 10% or lower, and a balance is Bi is used.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: May 9, 2006
    Assignee: Uchihashi Estec Co., Ltd.
    Inventors: Yoshiaki Tanaka, Toshiaki Saruwatari
  • Patent number: 7038569
    Abstract: The present invention relates to an alloy type thermal fuse and a fuse element which are particularly useful as a thermoprotector for a battery. It is an object of the invention to provide an alloy type thermal fuse in which a ternary In—Sn—Bi alloy or an alloy in which Ag or Cu is added to the ternary alloy is used as a fuse element, or the fuse element wherein dispersion of the operating temperature can be satisfactorily suppressed, the operating temperature can be set to about 100° C. or lower, and the specific resistance and the mechanical strength of the fuse element can be sufficiently ensured. A low-melting fusible alloy serving as the fuse element has an alloy composition of 50 to 55% In, 25 to 40% Sn, and balance Bi. In a preferable range of the composition, In is 51 to 53%, Sn is 32 to 36%, and a balance is Bi.
    Type: Grant
    Filed: April 25, 2003
    Date of Patent: May 2, 2006
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshihito Hamada
  • Patent number: 6917277
    Abstract: The invention is to offer a fuse and a fuse production method excellent in reducing manufacturing cost. A fuse having an electrically conductive fuse element. The fuse element has a pair of terminal connection portions and a fusible member for electrically connecting the terminal connection portions to each other and for being fused and broken when an overload electric current flows. At least a part of the fusible portion is formed by spouting or dropping the melting metal drops.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: July 12, 2005
    Assignee: Yazaki Corporation
    Inventors: Hitoshi Ohashi, Tatsuya Kato, Hitoshi Ushijima, Hiroyo Ayuzawa
  • Patent number: 6911892
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 37 to 43% In, 10 to 18% Sn, and the balance Bi. As a result, the operating temperature is in the range of 65 to 75° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 ?m?, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: June 28, 2005
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 6819215
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 37 to 43% In, 10 to 18% Sn, and the balance Bi. As a result, the operating temperature is in the range of 65 to 75° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: November 16, 2004
    Assignee: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 6791448
    Abstract: A fuse has a fuse element (6) with a fusible conductor (7) of a conductor material (8) such as Ag, Cu or Al and is provided with doping points (9) following one another at regular intervals. There, the conductor material (8) has a directly adjoining layer of a first compound (10) of the same with a doping material such as In or Ge. It forms mixed crystals which contain the conductor material (8) and the doping material in a fixed stoichiometric ratio, such as for example Ag2In, and is separated from said conductor material by a stable phase boundary. The doping points (9) weaken the fusible conductor by lowering the melting point to below 250° C., so that arc formation rapidly occurs there when there are short-circuit currents, although its electrical resistance per unit of length is under some circumstances only a few percent greater than in the remaining region. The fusible conductor (7) bears a continuous layer of a burn-up material (12).
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: September 14, 2004
    Assignee: ABB Research LTD
    Inventors: Uwe Kaltenborn, Pal Kristian Skryten
  • Patent number: 6750753
    Abstract: The present invention provides a fuse structure. The fuse structure comprises a substrate, a plurality of conductive layers, a dielectric layer and a plurality of conductive plugs. The fuse structure includes a plurality of fuse units, with increased the pitch between the fuse units. This structure prevents the fuse structure from failing when both misalignment of the laser beam or thermal scattering of the laser beam damage the second layer of the fuse structure in the laser blow process, which raises reliability and yield.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: June 15, 2004
    Assignee: Nanya Technology Corporation
    Inventor: Wu-Der Yang
  • Publication number: 20040100353
    Abstract: An alloy type thermal fuse is provided in which a ternary Sn—In—Bi alloy is used, excellent overload characteristic and dielectric breakdown characteristic are attained, the insulation safety after an operation can be sufficiently assured, and a fuse element can be easily thinned. A fuse element having an alloy composition in which Sn is larger than 46% and 70% or smaller, Bi is 1% or larger and 12% or smaller, and In is 18% or larger and smaller than 48% is used.
    Type: Application
    Filed: September 3, 2003
    Publication date: May 27, 2004
    Applicant: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 6724292
    Abstract: An object is to provide a thermal fuse that is free of a trouble of welding contact between a movable electrode (4) and a lead (2) even when temperature of an equipment to which the thermal fuse is connected rises gradually and that has small electric resistance at the time of conduction.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: April 20, 2004
    Assignees: NEC Schott Components Corporation, Tokuriki Honten Co., Ltd.
    Inventors: Ikuhiro Miyashita, Tokihiro Yoshikawa, Michihiko Nishijima, Hideo Kumita
  • Patent number: 6698086
    Abstract: Linear configurations of metallic fuse sections have a bit combination which represents a characteristic of a circuit on a wafer. The metallic fuse sections need to be rid of a polyimide layer covering them in order to make it possible to burn the fuse sections. In the event of unsatisfactory adherence to process parameters and insufficient removal of polyimide on the metallic fuse sections, a resulting relative error in a characteristic of the circuit is minimized according to the method since the fuse section corresponding to the most significant bit is neighbored on both sides by other fuse sections.
    Type: Grant
    Filed: September 30, 1998
    Date of Patent: March 2, 2004
    Assignee: Infineon Technologies AG
    Inventor: Rüdiger Klette
  • Patent number: 6693343
    Abstract: In an integrated circuit structure, the improvement comprising a self-passivating Cu-laser fuse characterized by resistance to oxidation and corrosion and improved adhesion in the interface between Cu and metallization lines and Cu and a dielectric cap subsequent to blowing the fuse by an energizing laser, the fuse comprising: a metallization-line; a liner separating the metallization line and a combination Cu-alloy seed layer and a pure Cu layer; a dielectric surrounding the liner; and a dielectric cap disposed over the surrounding dielectric, the liner and the combination Cu-alloy seed layer and pure Cu layer; the laser fuse being characterized after Laser energizing by passivation areas: a) on the open Cu-fuse surface; and b) in the interfaces between: (i) the Cu-alloy seed layer and the liners and dielectric; and (ii) between the pure Cu layer and the dielectric cap.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: February 17, 2004
    Assignee: Infineon Technologies AG
    Inventor: Hans-Joachim Barth
  • Publication number: 20030206093
    Abstract: The present invention relates to an alloy type thermal fuse and a fuse element which are particularly useful as a thermoprotector for a battery. It is an object of the invention to provide an alloy type thermal fuse in which a ternary In—Sn—Bi alloy or an alloy in which Ag or Cu is added to the ternary alloy is used as a fuse element, or the fuse element wherein dispersion of the operating temperature can be satisfactorily suppressed, the operating temperature can be set to about 100° C. or lower, and the specific resistance and the mechanical strength of the fuse element can be sufficiently ensured. A low-melting fusible alloy serving as the fuse element has an alloy composition of 50 to 55% In, 25 to 40% Sn, and balance Bi. In a preferable range of the composition, In is 51 to 53%, Sn is 32 to 36%, and a balance is Bi.
    Type: Application
    Filed: April 25, 2003
    Publication date: November 6, 2003
    Applicant: Uchihashi Estec Co., Ltd.
    Inventor: Yoshihito Hamada
  • Patent number: 6622375
    Abstract: A method for producing a fuse element having a fusible portion and any other portion which are made of different kinds of metal. The method comprises the steps of boring through-hole in a substrate made of first metal, forming an element plate by fusion-bonding a second metal to the through-hole and integrally stamping a pair of substrate portion made of the first metal and a low-melting-point portion made of the second metal. The second metal is made of a metal whose melting point is lower than that of the first metal. Further, the pair of substrate portion is connected together by the low-melting-point portion so that the fuse element is formed.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: September 23, 2003
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Takashi Ishii
  • Publication number: 20030169143
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 37 to 43% In, 10 to 18% Sn, and the balance Bi. As a result, the operating temperature is in the range of 65 to 75° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.
    Type: Application
    Filed: March 4, 2003
    Publication date: September 11, 2003
    Applicant: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Publication number: 20030169144
    Abstract: The invention provides a thermal fuse and a fuse element of the low-melting fusible alloy type in which the fuse element has an alloy composition of 48 to 60% In, 10 to 25% Sn, and the balance Bi, and a total of 0.01 to 7 weight parts of at least one selected from the group consisting of Au, Ag, Cu, Ni, and Pd is added to 100 weight parts of the composition. As a result, the operating temperature is in the range of 57 to 67° C., requests for environment conservation can be satisfied, the diameter of the fuse element can be made very thin or reduced to about 300 &mgr;m&phgr;, self-heating can be suppressed, and the thermal stability can be satisfactorily guaranteed.
    Type: Application
    Filed: March 4, 2003
    Publication date: September 11, 2003
    Applicant: Uchihashi Estec Co., Ltd.
    Inventor: Yoshiaki Tanaka
  • Patent number: 6614341
    Abstract: A thick film circuit on an insulating substrate includes a thermal fuse. The circuit includes a conductive strip, which may be sufficiently resistive to comprise the resistor of an automotive fan motor controller, which is made of a material dissolved by a solder which melts at a predetermined temperature. When an abnormal event occurs which raises the temperature of the circuit, the solder melts and dissolves the underlying conductive strip. The solder and melted material of the strip then coalesce into one or more droplets thereby breaking the circuit.
    Type: Grant
    Filed: January 22, 2001
    Date of Patent: September 2, 2003
    Assignee: International Resistive Company, Inc.
    Inventor: Shaun G. Martin
  • Publication number: 20030156005
    Abstract: The invention is to offer a fuse and a fuse production method excellent in cost down. A fuse having an electrically conductive fuse element. The fuse element has a pair of terminal connection portions and a fusible member for electrically connecting the terminal connection portions each other and for being fused and broken when an over electric current flows. At least a part of the fusible portion is formed by spouting or dropping the melting metal drops.
    Type: Application
    Filed: February 20, 2003
    Publication date: August 21, 2003
    Applicant: YAZAKI CORPORATION
    Inventors: Hitoshi Ohashi, Tatsuya Kato, Hitoshi Ushijima, Hiroyo Ayuzawa
  • Publication number: 20030098770
    Abstract: A fuse has a fuse element (6) with a fusible conductor (7) of a conductor material (8) such as Ag, Cu or Al and is provided with doping points (9) following one another at regular intervals. There, the conductor material (8) has a directly adjoining layer of a first compound (10) of the same with a doping material such as In or Ge. It forms mixed crystals which contain the conductor material (8) and the doping material in a fixed stoichiometric ratio, such as for example Ag2In, and is separated from said conductor material by a stable phase boundary. The doping points (9) weaken the fusible conductor by lowering the melting point to below 250° C., so that arc formation rapidly occurs there when there are short-circuit currents, although its electrical resistance per unit of length is under some circumstances only a few percent greater than in the remaining region. The fusible conductor (7) bears a continuous layer of a burn-up material (12).
    Type: Application
    Filed: November 1, 2002
    Publication date: May 29, 2003
    Inventors: Uwe Kaltenborn, Pal Kristian Skryten
  • Patent number: 6570482
    Abstract: An electrical fuse includes a pair of terminal portions and a fusible link extending between the pair of terminal portions. The fusible link includes a fusing portion and a modifying portion in contact with the fusing portion. The modifying portion is formed of a material having a lower melting point than the fusing portion, and the fusible link includes a hole extending therethrough and defining an open-sided receptacle. A side of the open-sided receptacle forms one side of the fusing portion, and the modifying portion is disposed within the substantially open-sided receptacle.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: May 27, 2003
    Assignee: Cooper Technologies
    Inventors: Russell Brown, Rognvald Ridley Peterson, Stuart Richard Roberts
  • Patent number: 6566995
    Abstract: A protective element contains a heat-generating member and a low melting metal member on a substrate, in which the low melting metal member is molten by the heat generated by the heat-generating member and flows onto electrodes, which causes the low melting metal member to blow out, Formula (1) below is satisfied: (cross-sectional area of the low melting metal member)/(surface area of the blowout-effective electrode)≦0.15  (1) Alternatively, Formula (2) below is satisfied: 2.5≦(inter-electrode distance)/(cross-sectional area of the low melting metal member)≦30  (2) wheren the inter-electrode distance is defined as the distance between two electrodes, among the low melting metal member electrodes onto which the molten low melting metal member flows, which are adjacent to each other with the low melting metal member interposed therebetween.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: May 20, 2003
    Assignee: Sony Chemicals Corporation
    Inventors: Yuji Furuuchi, Masami Kawazu
  • Patent number: 6222438
    Abstract: A temperature fuse which is melted with high operating temperature accuracy at a desired predetermined temperature in the range of 140° C. to 160° C. A fuse element is made of an alloy consisting essentially of 52-100 wt. % indium and the balance tin, and with this construction there can be achieved the temperature fuse which is melted with high operating temperature accuracy at a desired predetermined temperature in the range of 140° C. to 160° C.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: April 24, 2001
    Assignee: Yazaki Corporation
    Inventors: Kinya Horibe, Takayoshi Endo, Takashi Ishii
  • Patent number: 6163244
    Abstract: A method for producing a fuse element having a fusible portion and any other portion which are made of different kinds of metal. The method comprises the steps of boring through-hole in a substrate made of first metal, forming an element plate by fusion-bonding a second metal to the through-hole and integrally stamping a pair of substrate portion made of the first metal and a low-melting-point portion made of the second metal. The second metal is made of a metal whose melting point is lower than that of the first metal. Further, the pair of substrate portion is connected together by the low-melting-point portion so that the fuse element is formed.
    Type: Grant
    Filed: December 16, 1998
    Date of Patent: December 19, 2000
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Takashi Ishii
  • Patent number: 6078245
    Abstract: A thin film surface-mountable fuse for protection against electrical overload. The fuse comprises a substrate, fusible link, a containment compound, and a pair of terminal pads. The fusible link is produced from a first conductive material and supported on the substrate. A diffusion bar of a second conductive material is deposited on a portion of the fusible link. The containment compound is also deposited over a portion of the fusible link. The containment compound inhibits migration of the diffusion bar along the fusible link during an electrical overload. The terminal pads are electrically connected to the fusible link and also supported by the substrate.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: June 20, 2000
    Assignee: Littelfuse, Inc.
    Inventors: Sandra E. Fritz, Anthony Minervini, Thomas Restis
  • Patent number: 6075434
    Abstract: A fusible element for an electrical fuse comprising a generally flat, strip-shaped body having a generally uniform cross-section; a constricted area formed in the body has a cross-section less than the cross-section of the body; an indentation formed in the body at least bordering on the constricted area; a solder coating disposed within the indentation; and a first solder stop coating on a first surface of the body that is disposed adjacent the solder coating to prevent migration of the coating along the surface.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: June 13, 2000
    Assignee: Ferraz S.A.
    Inventor: Hans-Werner Rueckling
  • Patent number: 6064293
    Abstract: A thermal fuse, preferably for a high-temperature battery, comprising leads and a body therebetween having a melting point between approximately 400.degree. C. and 500.degree. C. The body is preferably an alloy of Ag--Mg, Ag--Sb, Al--Ge, Au--In, Bi--Te, Cd--Sb, Cu--Mg, In--Sb, Mg--Pb, Pb--Pd, Sb--Zn, Sn--Te, or Mg--Al.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: May 16, 2000
    Assignee: Sandia Corporation
    Inventors: Rudolph G. Jungst, James R. Armijo, Darrel R. Frear
  • Patent number: 6008716
    Abstract: The present invention provides a fuse structure formed in an inter-layer insulator having a first level interconnection and a second level interconnection isolated by the inter-layer insulator from the first level interconnection. The fuse structure comprises a conductive plug for providing an electrical connection between a first connecting part of the first level interconnection and a second connecting part of the second level interconnection, wherein the fuse structure further comprises at least a void which extends within the inter-layer insulator and also at least a part of the void extends adjacent to the second connecting part of the second level interconnection, so that when the second connecting part is rapidly evaporated by receiving a thermal energy, an evaporated material of the second connecting part is deposited on an inner wall of the void for causing an electrical disconnection between the first and second interconnections.
    Type: Grant
    Filed: September 21, 1998
    Date of Patent: December 28, 1999
    Assignee: NEC Corporation
    Inventor: Tetsuya Kokubun
  • Patent number: 5900798
    Abstract: In the metal piece 32 which diffuses into the fuse element so that an alloy layer is generated, there is formed an expanding slot 30, which is inserted and pressured in the fusing portion 25b of the fusible body 25 which forms the fuse element. Due to the foregoing, the metallic mass 32 of low fusing point is fixed to the fusible body 25 while it surrounds the circumferential surface of the fusing portion 25b.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: May 4, 1999
    Assignee: Yazaki Corporation
    Inventors: Hisashi Hanazaki, Kenji Muramatsu, Mitsuhiko Totsuka, Toshiharu Kudo
  • Patent number: 5898357
    Abstract: A fuse comprising: a fusible portion constituted by a connection portion which is formed of the same metal base material as a pair of terminals so as to connect the pain of terminals to each other, and a low-melting metal having a melting point lower than that of the connection portion and stacked by welding on at least a portion of the connection portion; and at least one protrusion formed on the fusible portion by making the connection portion and the low-melting metal project in a direction parallel to the plane of an interface between the connection portion and the low-melting metal. Further disclosed is a method of manufacturing the fuse. The fuse can be manufactured with a simple manufacturing process in comparison with a conventional method, and in the fuse, only the fusing-off time in a layer short-circuit range can be shortened by use of diffusion between the low-melting metal and base material.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: April 27, 1999
    Assignee: Yazaki Corporation
    Inventors: Takayoshi Endo, Takashi Ishii, Naoki Matsuoka
  • Patent number: 5892427
    Abstract: A current limiting high voltage fuse wherein a hollow body 1 has conductive caps 2, 3 at either end and is filled with silica sand. A plurality of fusible strips 8 extend between the two caps. Each fusible strip has a low melting alloy spot 10. The locations of the spots are staggered and are positioned substantially one third of the way along a respective fusible strip. In an alternative construction, the fusible strips 13, 14 are wound around a pair of coaxial formers 11, 12, with the fusible strips 14 wound around the central former 12 having a smaller cross section than the fusible strips 13 wound around the outer former 11.
    Type: Grant
    Filed: April 24, 1998
    Date of Patent: April 6, 1999
    Assignee: Cooper Technologies Company
    Inventor: Harold John Handcock
  • Patent number: 5883560
    Abstract: A fusible member of a fusible link element used as a large-current fuse comprises a sealed box-shaped structure having a pouring hole through an upper wall thereof. Molten tin is poured into this sealed box-shaped structure through the pouring hole, and is solidified to be integrated with the sealed box-shaped structure.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: March 16, 1999
    Assignee: Yazaki Corporation
    Inventors: Goro Nakamura, Kenji Muramatsu
  • Patent number: 5844477
    Abstract: A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: December 1, 1998
    Assignee: Littelfuse, Inc.
    Inventors: Vladmir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
  • Patent number: 5821847
    Abstract: To effectively prevent the efflux at the time of depositing a fusible metal, a fuse includes a clamping piece in the longitudinal middle portion of a fusible element, a fusible metal having a low melting point is clamped by and deposited on the clamping piece, in which the fusible metal is deposited on the fusible element while parts of the fusible metal exposed when fusible metal is clamped with the clamping piece, are covered with enclosing walls that are formed by bending the fusible element on both sides of the clamped part to the sides of the fusible metal.
    Type: Grant
    Filed: March 27, 1997
    Date of Patent: October 13, 1998
    Assignee: Yazaki Corporation
    Inventor: Mitsuhiko Totsuka
  • Patent number: 5821849
    Abstract: A device for providing a visual indication of the status of a fuse, i.e., whether or not the fuse has blown. The device includes a substrate onto which the elements of the visual indication device are printed. A pair of conductive terminals is screen printed upon that substrate, preferably spaced apart from each other along that substrate. Between the terminals, at least two spaced apart resistance elements are positioned upon the substrate. These two resistance elements are in series with each other, and they are also in series with the pair of conductive terminals. The first of these at least two resistance elements is comprised of a combination of a substance which melts at an elevated temperature, and also of carbon. The second of these at least two resistance elements is comprised solely of carbon.
    Type: Grant
    Filed: July 17, 1997
    Date of Patent: October 13, 1998
    Assignee: Littelfuse, Inc.
    Inventors: G. Todd Dietsch, Heraclio R. Gomez, Joseph W. Kowalik
  • Patent number: 5777540
    Abstract: A simplified method of manufacturing an electrothermal fuse includes the steps of screening conductive epoxy onto fuse link termination pads, placing a metal alloy fuse link into the conductive epoxy on the termination pads, curing the conductive epoxy, applying deoxidant, applying encapsulant, and curing the encapsulant. The resultant fuse of the preferred embodiment comprises a substrate, termination pads, conductive epoxy interconnects, a solder type fuse link, liquid deoxidant and encapsulant.
    Type: Grant
    Filed: January 29, 1996
    Date of Patent: July 7, 1998
    Assignee: CTS Corporation
    Inventors: Ronald J. Dedert, Steven J. Hreha, William A. Hollinger, Jr.
  • Patent number: 5770993
    Abstract: A resistor with a thermal fuse includes: a substrate consisting of an insulating material; a wire pattern formed on a surface of the substrate; a gap for electrically cutting off the wire pattern; a plate spring consisting of an electrically conductive material arranged across the gap; an electrically conductive member fixed to one end of the plate spring on a side of the wire pattern and having approximately the same linear conduction coefficient as that of the substrate; a first low melting point alloy for welding the electrically conductive material and the wire pattern provided on one side of the gap; a second low melting point alloy for welding the other end of the plate spring and the wire pattern provided on the other side of the gap; wherein, when the first low melting point alloy is melted, the electrically conductive member is released from the first low melting point alloy so that the plate spring is also released from the wire pattern.
    Type: Grant
    Filed: September 25, 1996
    Date of Patent: June 23, 1998
    Assignee: Nippondenso Co., Ltd
    Inventors: Kazuhiro Miyazawa, Shinji Iwama, Masaki Sanji, Yasufumi Kojima
  • Patent number: 5748067
    Abstract: There is provided a fusing portion constituted by a high-melting point fusible metal element for coupling a pair of box-type terminals in the form of a link, and a low-melting point fusible metal element disposed at a substantially center portion of the high-melting point fusible metal element and containing a reducing element.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: May 5, 1998
    Assignee: Yazaki Corporation
    Inventors: Takashi Ishii, Naoki Matsuoka