With Nonconductive Core (e.g., Printed Circuit) Patents (Class 337/297)
  • Patent number: 11735906
    Abstract: To provide a power converter and a breaking mechanism which can break a DC current and can suppress that a fused material scatter to other circuits at fusing, in the case where the breaking mechanism of excess current is formed by a circuit pattern of a circuit board. In a power converter, a supporting member is provided with a support body part; a fixation projection part which projected from the support body part and to which the multilayer circuit board was fixed; and a support projection part which projected from the support body part and supports an one side circuit board face, wherein the fuse pattern is provided in an inner layer, and the support projection part overlaps with at least one part of a fusing part of the fuse pattern, viewing in a normal direction of the circuit board face of the multilayer circuit board.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: August 22, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Katsushi Nakada, Kenta Fujii
  • Patent number: 11399426
    Abstract: A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: July 26, 2022
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Toshio Suzuki, Masami Kanayama, Akiyoshi Hattori, Masanori Kito
  • Patent number: 11217369
    Abstract: An overvoltage protection device having a printed circuit board, varistor, and gas discharge tube, the varistor and discharge tube connected in series between a second and third electrical connection terminal of the circuit board via conductive tracks, wherein the varistor is connected to the first terminal by a third conductive track, the discharge tube is connected to the varistor by a fourth conductive track, the discharge tube is connected to the third electrical connection terminal by a sixth conductive track, and wherein the fourth and sixth conductive tracks have curved portions situated on either side of the discharge tube, having a concavity facing in the same orientation respective to the discharge tube and a thermofusible area able to separate a corresponding track into two parts in response to an overcurrent, a distance between the two parts of each track allowing generation of an arc in response to an overvoltage that activates the discharge tube.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: January 4, 2022
    Assignee: CITEL
    Inventor: Vincent Crevenat
  • Patent number: 10755884
    Abstract: A fuse element, in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material, which is usable particularly in the multilayer technology and is coated with a metal or metal alloy from which the fuse is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse is distinguished in that the printed circuit board substrate material, on which the fuse can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy from which the fuse is made.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: August 25, 2020
    Assignee: SCHURTER AG
    Inventors: Hans-Peter Blattler, Peter Straub, Jose Ramos
  • Patent number: 10593504
    Abstract: Various embodiments include a fuse electrically connecting two connection regions comprising: a heat sink; a set of layers arranged on a surface of the heat sink, the set of layers including an electrically insulating layer arranged on the heat sink and an electrically conductive conductor layer arranged on a side of the insulation layer facing away from the heat sink; and an electrical connecting path between the connection regions. The surface of the heat sink defines two material cutouts. A portion of the heat sink arranged between the material cutouts forms a bridge element. The set of layers is disposed on the bridge element.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: March 17, 2020
    Assignee: CONTINENTAL AUTOMOTIVE GMBH
    Inventor: Magnus Jaster
  • Patent number: 10143078
    Abstract: A support device for a printed circuit board includes a plate body and a shielding cover formed integrally with the plate body, the plate body is provided with an opening and a mounting structure for mounting a printed circuit board, the shielding cover is formed from an extension of a side wall of the opening and covers the printed circuit board.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: November 27, 2018
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lei Cao, Nannan Hu, Zifeng Wang, She Lin, Yan Ren
  • Patent number: 10064266
    Abstract: A printed circuit board to which corresponding wiring connectors such as power wiring connectors, may be connected to couple electrical components and a power supply to the printed circuit board and a control housing, which may be used for operably storing such a printed circuit board.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: August 28, 2018
    Assignee: Whirlpool Corporation
    Inventors: Kevin J. Fitzpatrick, Ryan K. Roth
  • Patent number: 10032591
    Abstract: A fuse arrangement, including: at least a first terminal, a second terminal, and a fuse, wherein the first terminal and the second terminal may be electrically connected via the fuse, and wherein the fuse may be configured to be under fuse internal mechanical stress to deform the fuse along its width direction in case it is broken.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: July 24, 2018
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Achim Gratz
  • Patent number: 9917434
    Abstract: A wire cable assembly, such as those used in electric or hybrid electric vehicles, having a plurality of shielded wire cables spliced together. The center conductors are joined together and enclosed in an inner insulator. The shield conductors of the cable are joined by an electrically conductive sleeve enclosing the inner insulator and attached to the shield conductors of the shielded wire cables. The sleeve separates the outer insulating layers of the shielded wire cables. The sleeve is encased by an outer insulator that is sealed to the outer insulating layers of the shielded wire cables. A method of splicing shielded wire cables together is also presented.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: March 13, 2018
    Assignee: DELPHI TECHNOLOGIES, INC.
    Inventors: Terry A. George, Eric B. Poma, Jeremy M. Richardson, Brian K. Dew, William J. Palm, Bruce D. Taylor, John Raymond Metzger
  • Patent number: 9496112
    Abstract: An electric device is disclosed. In an embodiment, the device includes an electric element having an element terminal and a conductive spring being deflected, the spring being electrically coupled to the element terminal by a fusible joint. The device further includes a switch including a first monitor terminal and a second monitor terminal, the switch having a state that is changeable between a first connection state, where the first monitor terminal and the second monitor terminal are electrically coupled, and a second connection state, where the first monitor terminal and the second monitor terminal are electrically decoupled, and wherein the electrical device is configured such that when the joint fuses, the spring relaxes, thereby decoupling the spring and the element terminal and changing the state of the switch.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: November 15, 2016
    Assignee: EPCOS AG
    Inventors: Jifeng Qin, Shaoyu Sun, Dongjian Song, Zhouquan He
  • Patent number: 9431203
    Abstract: A circuit protection device includes a housing, which includes first and second electrodes. The device includes a conductive slider inside the housing. At a first location within the housing, the slider provides an electrical connection between the first and second electrodes. At a second location within the housing, the slider does not provide the electrical connection. A spring is secured to and stretched between the slider and an inner side of the housing such that the spring is held in tension in an expanded state. The slider is held at the first location by a solder between the slider and the first and second electrodes. After the device is armed, detection of an over-temperature condition causes the solder to begin to melt and the spring to compress and pull the slider to the second location within the housing, thus severing the electrical connection between the first and second electrodes.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: August 30, 2016
    Assignee: Littelfuse, Inc.
    Inventors: Shelomon Patrick Doblack, Jianhua Chen, Matthew P. Galla
  • Patent number: 9323187
    Abstract: A fixing device includes an endless belt extending in a first direction and configured to rotate, a heater extending inside the endless belt in the first direction and configured to heat the endless belt, a first temperature sensor for detecting a temperature of the endless belt heated by the heater, the first temperature sensor being disposed inside the endless belt, a second temperature sensor for detecting a temperature of the endless belt heated by the heater, the second temperature sensor being disposed outside of the endless belt, and a thermal cutoff disposed outside of the endless belt and configured to interrupt electric current to the heater when the temperature of the endless belt exceeds a specified temperature.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: April 26, 2016
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Tomohiro Kondo
  • Patent number: 9035740
    Abstract: A circuit protecting element includes insulating substrate (11), a pair of surface electrodes (12) provided to both ends of a top face of insulating substrate (11), element (13) bridging the pair of surface electrodes (12) and electrically connected to the pair of surface electrodes (12), base layer (14) formed between element (13) and insulating substrate (11), and insulating layer (15) covering element (13). Base layer (14) is formed of a mixture of diatom earth and silicone resin. The structure discussed above allows stabilizing the blowout characteristics of the circuit protecting element.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: May 19, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomoyuki Washizaki, Toshiyuki Iwao, Takashi Kitamura, Takashi Watanabe, Naohiro Mikamoto, Masahito Fuchigami, Kazutoshi Matsumura
  • Patent number: 8976001
    Abstract: A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: March 10, 2015
    Assignee: Cyntec Co., Ltd.
    Inventors: Kuo-Shu Chen, Chung-Hsiung Wang
  • Publication number: 20150054615
    Abstract: A convenient, cost-effective method for manufacturing low-current fuse elements. The method may include the steps of stamping a substrate out of a sheet of material and stamping at least one hole in the substrate. The method may further include the steps of bonding a layer of fuse material to a surface of the substrate with a portion of the fuse material covering the hole, stamping a fuse element out of the portion of fuse material covering the hole, and separating an individual fuse from the fuse material and the substrate. A low-current fuse can thereby be obtained using an easily performed stamping process.
    Type: Application
    Filed: May 16, 2013
    Publication date: February 26, 2015
    Applicant: LITTELFUSE, INC.
    Inventors: James J. Beckert, Gregory G. Stumpo, Stephen R. Shierry
  • Patent number: 8957755
    Abstract: A multi-layer fuse and its manufacturing method are provided. The multi-layer fuse comprises a ceramic substrate, back electrodes, front electrodes, fuse wire, protective layers and metal ends, wherein the fuse wire is prepared in multiple layers and the adjacent layers of fuse wire are connected in a head-to-tail style; the two lead-outs of the fuse wire as a whole are respectively connected to the two front electrodes located at the two ends of the substrate, and each layer of the fuse wire is deposited with a protective layer. During manufacturing, all protective layers but the upmost one leaves the tail of each layer of fuse wire uncovered so that the head-to-tail series connection is possible.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: February 17, 2015
    Assignee: Nanjing Sart Science & Technology Development Co., Ltd.
    Inventors: Xiurong Lu, Shirong Nan, Manxue Yang
  • Patent number: 8941461
    Abstract: A circuit protection device includes a substrate with first and second electrodes connected to the circuit to be protected. The circuit protection device also includes a heater element between the first and second electrodes. A sliding contact is connected by a sensing element to the first electrode, second electrode, and heater element, thereby bridging and providing a conductive path between each. A spring element is held in tension by, and exerts a force parallel to a length of the substrate against, the sliding contact. Upon detection of an activation condition, the sensing element releases the sliding contact and the force exerted by the spring element moves the sliding contact to another location on the substrate at which the sliding contact no longer provides a conductive path between the first electrode, second electrode, and heater element.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: January 27, 2015
    Assignee: Tyco Electronics Corporation
    Inventors: Anthony Vranicar, Martyn A. Matthiesen, Wayne Montoya
  • Publication number: 20140266565
    Abstract: A compact, high breaking capacity fuse that includes a top insulative layer, at least one intermediate insulative layer, and a bottom insulative layer arranged in a vertically stacked configuration. The at least one intermediate layer may have a hole formed therethrough that defines an air gap within the fuse. A first conductive terminal may be formed on a first end of the fuse and a second conductive terminal may be formed on a second end of the fuse. At least one fusible element may connect the first terminal to the second terminal, thus providing an electrically conductive pathway therebetween. A portion of the at least one fusible element may pass through the air gap defined by the hole in the at least one intermediate insulative layer.
    Type: Application
    Filed: April 15, 2014
    Publication date: September 18, 2014
    Applicant: LITTELFUSE, INC.
    Inventors: ALBERT ENRIQUEZ, DEMETRIO CRISTE, CONRADO DE LEON, CRISPIN ZULUETA, ROEL RETARDO, JOHN SEMANA, Gordon Todd Dietsch
  • Patent number: 8803652
    Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position, enabling a speedy and precise blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to a power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. In addition, the protection element is provided with a protrusive stripe portion 20 which is formed on an interior face of the insulation cover 14 in opposite to the soluble conductor 13 and in which a stepped portion 20a for retaining the flux 19 is formed at a predetermined position while in contact with the flux 19.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: August 12, 2014
    Assignee: Dexerials Corporation
    Inventors: Yuji Kimura, Takahiro Asada, Kazuaki Suzuki
  • Patent number: 8749020
    Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a semiconductor substrate; a dielectric layer over the semiconductor substrate; a metal fuse in the dielectric layer; a dummy pattern adjacent the metal fuse; and a metal line in the dielectric layer, wherein a thickness of the metal fuse is substantially less than a thickness of the metal line.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: June 10, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsien-Wei Chen, Hao-Yi Tsai, Shin-Puu Jeng, Shih-Hsun Hsu
  • Patent number: 8659384
    Abstract: A chip fuse includes a plurality of parallel fusible link layers disposed between a corresponding plurality of insulating glass layers deposited on a substrate and laminated together. The fusible link layers are interconnected between the glass layers without the need for vias. A first of the plurality of fusible link layers extends beyond a cover disposed over the chip fuse and one of the glass layers to form a first electrical terminal connection. Another of the plurality of the fusible link layers also extends beyond the cover and another of the glass layers to form a second electrical terminal connection.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: February 25, 2014
    Assignee: Littelfuse, Inc.
    Inventors: G. Todd Dietsch, Olga Spaldon-Stewart
  • Patent number: 8648688
    Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position and is capable of checking a retention state of the flux, enabling a speedy blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to an electric power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. The insulation cover 14 is provided with an opening porting 20 made of a through hole which is opposite to the soluble conductor 13. The flux 19 comes into contact with a peripheral edge part of the opening portion 20, retaining the flux 19 at a predetermined position on the soluble conductor 13.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: February 11, 2014
    Assignee: Dexerials Corporation
    Inventors: Yuji Kimura, Kazuaki Suzuki
  • Publication number: 20140022047
    Abstract: This electric power fuse has a fuse element that is formed continuously and integrally by a plurality of heat dissipating parts formed from a conductive film by the conductive film being formed on a ceramic substrate and a plurality of isolating parts. The conductive film is constituted of printed layers formed by printing one or more times on the surface of the ceramic substrate, and the number of laminations of printed layers formed in the heat dissipating parts is greater than or equal to the number of laminations of the printed layers constituting the isolating parts.
    Type: Application
    Filed: April 20, 2012
    Publication date: January 23, 2014
    Applicants: National University Corporation Saitama University, Soshin Electric Co., Ltd.
    Inventors: Akira Ando, Shinichi Kobayashi
  • Patent number: 8629750
    Abstract: Fuse element and bridge assemblies include a length of fuse wire being wrapped around first and second end edges of a nonconductive bridge to define a winding around the nonconductive bridge element extending for at least one complete turn having a first linear segment and a second linear segment each extending entirely between the first end edge and the second end edge of the nonconductive bridge element. The winding of the fuse wire allows for construction of small fractional amp fuses with larger fuse element wires that are less prone to breakage in automated manufacturing processes.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: January 14, 2014
    Assignee: Cooper Technologies Company
    Inventor: Keith Allen Spalding
  • Publication number: 20130321119
    Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.
    Type: Application
    Filed: August 8, 2013
    Publication date: December 5, 2013
    Applicant: CYNTEC CO., LTD.
    Inventors: Chung-Hsiung WANG, Hung-Ming LIN, Wen-Shiang LUO, Chun-Tiao LIU, Kuo-Shu CHEN
  • Publication number: 20130314201
    Abstract: A method of forming a fusible link on a printed circuit board. The method comprises integrally forming a first end pad, a second end pad, and a fusible link between the first and the second end pads on the printed circuit board; wherein the cross-sectional area of the fusible link is smaller than that of the first and second end pads.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 28, 2013
    Inventors: Tzye Perng Poh, Leng Hoo Tan, Kah Hoe Ng
  • Patent number: 8525633
    Abstract: A fuse element includes a substrate disposed between first and second terminals. The substrate includes an electrically insulative material. A conductive film is disposed on a first surface of the substrate and in electrical contact with the first terminal and second terminals.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: September 3, 2013
    Assignee: Littelfuse, Inc.
    Inventors: Stephen J. Whitney, William Travis, Jeffrey P. Youngblood, Sarah M. Book, Edward D. Barriball, Milea J. Kittle
  • Publication number: 20130127584
    Abstract: A metal fuse structure using redundant vias. The redundant vias are formed on one metal level in a stacked via metal fuse structure to force failures to occur in the metal level that does not have the redundant vias. The metal fuse structure includes: a first dielectric layer having a metal feature; a second dielectric layer having a first metal connector embedded therein; and a third dielectric layer having a second metal connector embedded therein. The metal connectors include at least one via and one line, and at least one metal connector has at least two vias.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 23, 2013
    Applicant: International Business Machines Corporation
    Inventors: Ronald G. Filippi, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Stephan Grunow, Naftali E. Lustig, Andrew H. Simon
  • Publication number: 20130043972
    Abstract: An electrical fuse structure includes a top conductive pattern having a top fuse and a top fuse extension portion, a bottom conductive pattern having a bottom fuse and a bottom fuse extension portion corresponding to the top fuse extension portion, and a via conductive layer positioned between the top fuse extension portion and the bottom fuse extension portion for electrically connecting the top fuse extension portion and the bottom fuse extension portion.
    Type: Application
    Filed: August 16, 2011
    Publication date: February 21, 2013
    Inventors: Kuei-Sheng Wu, Ching-Hsiang Tseng, Chang-Chien Wong
  • Patent number: 8368502
    Abstract: A surface mount current fuse of the present invention includes a first base which has a recess and is smaller in width at the other end than at one end in the longitudinal direction, and a second base which has the same shape as the first base. The first base and the second base are combined to form a box-shaped body by joining the lower surface of the second base to the upper surface of the upper surface of the first base in such a manner that one end of the first base and the other end of the second base are in contact with each other. The recess of the first base and the recess of the second base form a space portion in which to dispose an element portion. The borderline between the first base and the second base passes through the center point on a side surface of the body. As a result, the surface mount current fuse has high production efficiency.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: February 5, 2013
    Assignee: Panasonic Corporation
    Inventors: Tomoyuki Washizaki, Toshiyuki Iwao, Kenji Senda, Takashi Watanabe, Kazutoshi Matsumura, Seiji Tsuda
  • Publication number: 20130021131
    Abstract: A printed circuit board to which corresponding wiring connectors such as power wiring connectors, may be connected to couple electrical components and a power supply to the printed circuit board and a control housing, which may be used for operably storing such a printed circuit board.
    Type: Application
    Filed: July 19, 2011
    Publication date: January 24, 2013
    Applicant: WHIRLPOOL CORPORATION
    Inventors: KEVIN J. FITZPATRICK, RYAN K. ROTH
  • Publication number: 20120299692
    Abstract: A fuse in one embodiment includes first and second leads. A fuse element provides electrical communication between the first and second leads. The fuse element includes a material with a melting point of less than 250.degree. C. and acts as both an overcurrent fuse and a thermal fuse by melting when subjected to a predetermined current or upon reaching a predetermined temperature.
    Type: Application
    Filed: August 8, 2012
    Publication date: November 29, 2012
    Applicant: LITTELFUSE, INC.
    Inventors: Stephen J. Whitney, John E.C. Semana, Jamica P. Bato, Francisco De Guia, Bienvenido Salonga
  • Patent number: 8304853
    Abstract: A fuse layout structure of a semiconductor device includes a plurality of fuses in a fuse open area, wherein three neighboring fuses of the plurality of fuses form a fuse unit, and at least one of the fuses partially overlaps at least one of the other fuses of the same fuse unit in the fuse open area.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: November 6, 2012
    Assignee: Hynix Semiconductor Inc.
    Inventor: Yong-Ho Kim
  • Patent number: 8289122
    Abstract: A reflowable thermal fuse includes a positive-temperature-coefficient (PTC) device that defines a first end and a second end, a conduction element that defines a first end and a second end in electrical communication with the second end of the PTC device, and a restraining element that defines a first end in electrical communication with the first end of the PTC device and a second end, in electrical communication with a second end of the conduction element. The restraining element is adapted to prevent the conduction element from coming out of electrical communication with the PTC device in an installation state of the thermal fuse. During a fault condition, heat applied to the thermal fuse diverts current flowing between the first end of the PTC device and the second end of the conduction element to the restraining element, causing the restraining element to release the conduction element and activate the fuse.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: October 16, 2012
    Assignee: Tyco Electronics Corporation
    Inventors: Martyn A. Matthiesen, Jianhua Chen, Anthony Vranicar
  • Patent number: 8228158
    Abstract: A semiconductor device has a semiconductor substrate and a first electrical fuse and a second electrical fuse, which are provided on the semiconductor substrate. The first electrical fuse has a first upper layer wire and a first lower layer wire formed in different wire layers, and a via for connecting the first upper layer wire to the first lower layer wire. The second electrical fuse has a second upper layer wire and a second lower layer wire formed in different wire layers, and a via for connecting the second upper layer wire to the second lower layer wire. The semiconductor device has a connection portion for connecting the above described first upper layer wire of the first electrical fuse to the second lower layer wire of the second electrical fuse. The connection portion connects the first electrical fuse and the second electrical fuse in series.
    Type: Grant
    Filed: March 20, 2009
    Date of Patent: July 24, 2012
    Assignee: Renesas Electronics Corporation
    Inventor: Hiroshi Tsuda
  • Patent number: 8203420
    Abstract: Subminiature surface mount chip fuses include two part housings enclosing a fuse element and prefabricated end caps. The housing ends are shaped to restrict freedom of movement of the fuse element ends as the end caps are assembled to the housing. The end caps may include features to positively secure them in place and restrict relative movement of the end caps relative to the housing. Holes may be provided in the end caps that allow solder flow from a location exterior to the end caps to flow interior to the end caps to establish electrical connection with the fuse element.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: June 19, 2012
    Assignee: Cooper Technologies Company
    Inventors: Sidharta Wiryana, Essie Rahdar, Tianyu Zhu
  • Publication number: 20120112871
    Abstract: A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.
    Type: Application
    Filed: November 8, 2011
    Publication date: May 10, 2012
    Inventors: Kuo-Shu CHEN, Chung-Hsiung WANG
  • Publication number: 20120013431
    Abstract: A fuse element (10), in particular suited for use in electric and/or electronic circuits constructed by multilayer technology, including a printed circuit board substrate material (11), which is usable particularly in the multilayer technology and is coated with a metal or metal alloy (15), from which metal or metal alloy the fuse (12) is generated by means of photolithographic and/or printing image-producing techniques and ensuing etching or engraving processes, is proposed. The fuse (10) is distinguished in that the printed circuit board substrate material (11), on which the fuse (12) can be provided, includes at least a high-temperature-stable, electrically insulating material, with a coefficient of thermal expansion that varies essentially analogously to the coefficient of thermal expansion of the metal or metal alloy (15) from which the fuse (12) is made.
    Type: Application
    Filed: June 16, 2011
    Publication date: January 19, 2012
    Inventors: Hans-Peter Blattler, Peter Straub, Jose Ramos
  • Publication number: 20120001720
    Abstract: A protective device is provided that allows a fusible conductor to be fused off quickly in stability at the time of protective operation against over-current or the like. The protective device includes a fusible conductor 13 and an insulation cover 14 mounted on a base substrate 11 to overlie the fusible conductor 13. The fusible conductor, arranged on an insulating base substrate 11 and connected to a power delivery path of equipment to be protected, is fused off by a preset unusual power. The protective device also includes a flux 19 coated on the fusible conductor 13 and provided within the insulation cover 14. The fusible conductor 13 is immobilized on pair electrodes 12 and a conductor layer 17 on the base substrate 11 via a solder paste 20 containing a metal component exhibiting sufficient wettability against the fusible conductor 13 in a fused state. The solder paste 20, arranged on the pair electrodes 12 and the conductor layer 17, is spread more outwardly than the rim of the fusible conductor 13.
    Type: Application
    Filed: January 14, 2010
    Publication date: January 5, 2012
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventors: Yuji Kimura, Youzo Ohashi, Takahiro Asada
  • Patent number: 8081057
    Abstract: A current protection device comprises a substrate having an upper portion and a lower portion; a fusing layer installed between the upper portion and the lower portion; ends of the fusing layer exposed from the substrate; a cavity formed near surfaces of the fusing layer for providing a space to receive the fusing layer as the fusing layer fuses; and an end electrode having three layers including a silver thin layer, a nickel thin layer and a tin thin layer; the end electrode being formed as a conductive electrode. The method for forming the same is provided.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: December 20, 2011
    Inventor: Hung-Chih Chiu
  • Publication number: 20110279219
    Abstract: A protection element is provided which is capable of stably retaining a flux on a soluble conductor at a predetermined position and is capable of checking a retention state of the flux, enabling a speedy blowout of the soluble conductor in the event of an abnormality. This protection element includes: a soluble conductor 13 which is disposed on an insulation baseboard 11 and is connected to an electric power supply path of a device targeted to be protected, to cause a blowout by means of a predetermined abnormal electric power; a flux 19 which is coated onto a surface of the soluble conductor 13; and an insulation cover 14 which is mounted on the baseboard 11 with the soluble conductor 13 being covered therewith. The insulation cover 14 is provided with an opening porting 20 made of a through hole which is opposite to the soluble conductor 13. The flux 19 comes into contact with a peripheral edge part of the opening portion 20, retaining the flux 19 at a predetermined position on the soluble conductor 13.
    Type: Application
    Filed: January 14, 2010
    Publication date: November 17, 2011
    Applicant: Sony Chemical & Information Device Corporation
    Inventors: Yuji Kimura, Kazuaki Suzuki
  • Publication number: 20110057761
    Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.
    Type: Application
    Filed: September 3, 2010
    Publication date: March 10, 2011
    Applicant: CYNTEC CO., LTD.
    Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Wen-Shiang Luo, Chun-Tiao Liu, Kuo-Shu Chen
  • Patent number: 7884698
    Abstract: An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: February 8, 2011
    Assignee: Panasonic Corporation
    Inventors: Hideki Tanaka, Tomoyuki Washizaki, Kiyoshi Ikeuchi, Toshiyuki Iwao, Yasuki Nagatomo, Kesato Iiboshi, Jiro Ota, Yasuhiro Izumi
  • Publication number: 20100308953
    Abstract: A fuse layout structure of a semiconductor device includes a plurality of fuses in a fuse open area, wherein three neighboring fuses of the plurality of fuses form a fuse unit, and at least one of the fuses partially overlaps at least one of the other fuses of the same fuse unit in the fuse open area.
    Type: Application
    Filed: December 4, 2009
    Publication date: December 9, 2010
    Inventor: Yong-Ho Kim
  • Publication number: 20100289612
    Abstract: A current protection device comprises a substrate having an upper portion and a lower portion; a fusing layer installed between the upper portion and the lower portion; ends of the fusing layer exposed from the substrate; a cavity formed near surfaces of the fusing layer for providing a space to receive the fusing layer as the fusing layer fuses; and an end electrode having three layers including a silver thin layer, a nickel thin layer and a tin thin layer; the end electrode being formed as a conductive electrode. The method for forming the same is provided.
    Type: Application
    Filed: May 14, 2009
    Publication date: November 18, 2010
    Inventor: Hung-Chih Chiu
  • Publication number: 20100264514
    Abstract: Provided is a semiconductor device having an electric fuse structure which receives the supply of an electric current to be permitted to be cut without damaging portions around the fuse. An electric fuse is electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the supply of an electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers.
    Type: Application
    Filed: April 15, 2010
    Publication date: October 21, 2010
    Inventors: Takeshi IWAMOTO, Kazushi KONO, Masashi ARAKAWA, Toshiaki YONEZU, Shigeki OBAYASHI
  • Publication number: 20100265031
    Abstract: The present invention discloses a surface mount thin film fuse structure including a fusible fuse circuit structure disposed on a side of an insulating substrate, and the fusible fuse circuit structure has a fusible link portion electrically connected between two opposite electrode portions. If an overload current is passed through the fusible link portion, the fusible link portion will be melted down by a high temperature or a specific temperature to achieve the over current protection effect. At least one space is defined between the fusible link portion and the insulating substrate, such that a heat generated by the electrically energized the fusible link portion will not be dissipated through the heat conduction of the insulating substrate to achieve the circuit protection effect.
    Type: Application
    Filed: April 22, 2008
    Publication date: October 21, 2010
    Inventor: Chun-Chang Yen
  • Publication number: 20100245027
    Abstract: A reflowable thermal fuse includes a positive-temperature-coefficient (PTC) device that defines a first end and a second end, a conduction element that defines a first end and a second end in electrical communication with the second end of the PTC device, and a restraining element that defines a first end in electrical communication with the first end of the PTC device and a second end, in electrical communication with a second end of the conduction element. The restraining element is adapted to prevent the conduction element from coming out of electrical communication with the PTC device in an installation state of the thermal fuse. During a fault condition, heat applied to the thermal fuse diverts current flowing between the first end of the PTC device and the second end of the conduction element to the restraining element, causing the restraining element to release the conduction element and activate the fuse.
    Type: Application
    Filed: March 24, 2009
    Publication date: September 30, 2010
    Applicant: Tyco Electronics Corporation
    Inventors: Martyn A. Matthiesen, Jianhua Chen, Anthony Vranicar
  • Publication number: 20100245028
    Abstract: A circuit protecting element includes insulating substrate (11), a pair of surface electrodes (12) provided to both ends of a top face of insulating substrate (11), element (13) bridging the pair of surface electrodes (12) and electrically connected to the pair of surface electrodes (12), base layer (14) formed between element (13) and insulating substrate (11), and insulating layer (15) covering element (13). Base layer (14) is formed of a mixture of diatom earth and silicone resin. The structure discussed above allows stabilizing the blowout characteristics of the circuit protecting element.
    Type: Application
    Filed: November 6, 2008
    Publication date: September 30, 2010
    Inventors: Tomoyuki Washizaki, Toshiyuki Iwao, Takashi Kitamura, Takashi Watanabe, Naohiro Mikamoto, Masahito Fuchigami, Kazutoshi Matsumura
  • Publication number: 20100164679
    Abstract: An integrated circuit includes a first inner circuit including at least one first semiconductor device, a second inner circuit including at least one second semiconductor device, and a fusing circuit connected between the first inner circuit and the second inner circuit to perform a fusing operation which electrically disconnects the first inner circuit from the second inner circuit through a fusing voltage. The fusing circuit bypasses a spark current occurring during the fusing operation to a ground power source so as not to flow the spark current into the first inner circuit and the second inner circuit.
    Type: Application
    Filed: December 21, 2009
    Publication date: July 1, 2010
    Inventors: Sung-Min Park, Seok-Hoon Bang