Enclosure Formed On And Hardened On Element Patents (Class 338/193)
  • Patent number: 5517171
    Abstract: A high-voltage electronic component including a terminal connection structure capable of connecting a lead wire to a terminal fitment without soldering. An insulating substrate having a resistance element for a variable resistor formed on a front surface thereof and a high-voltage resistor are received in a hollow insulating casing. The insulating substrate is mounted on a rear surface thereof with a terminal fitment. The terminal fitment is formed with a press-fit channel in which a lead wire is press-fitted. Upon press fitting of the lead wire, the insulating casing is formed with an opening, through which insulating resin is charged in the insulating casing to form an insulating resin layer in which the terminal fitment and lead wire are embedded.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: May 14, 1996
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Hirokazu Kotani, Hiromasa Saikatsu, Hitoshi Ishiwari, Kenichi Hiraki
  • Patent number: 5475358
    Abstract: A high-voltage variable resistor unit capable of simply and positively connecting, to a holder of a high-voltage fixed resistor used as a bleeder resistor, a wire-like terminal inserted into an electrically conductive rubber terminal provided on a side of a fly-back transformer. An insulating substrate which is formed thereon with a resistance pattern including a pair of electrodes respectively connected to first and second lead wires is received in a holder of a hollow shape made of insulating resin. The holder includes a holder body formed with an opening through which the insulating substrate is received. A wire-like terminal formed by being a rigid metal wire is heldly fitted in terminal fitting members provided on an outside of the holder. The terminal fitting members includes at least one terminal fitting member provided a wall of the holder facing the opening of the insulating casing and at least one terminal fitting member provided on one of side walls of the holder adjacent to the wall.
    Type: Grant
    Filed: March 17, 1994
    Date of Patent: December 12, 1995
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Hirokaza Kotani, Hiromasa Saikatsu, Hitoshi Ishiwari, Kenichi Hiraki
  • Patent number: 5095298
    Abstract: A surface mount variable resistor includes a rotor assembly rotatably mounted on a substrate having an arcuate resistive element thereon. The rotor assembly includes a thermoplastic rotor and a conductive metal slider. The slider is a rivet having a flat head that is insert-molded into the plastic rotor, and a shank extending axially from the head, terminating in a tail end. A conductive metal wiper is welded to the head so as to be exposed from the rotor, thereby to establish electrical contact with the resistive element. A conductive metal collector element is disposed on the surface of the substrate opposite the resistive element. The substrate and the collector element have registering apertures through which the shank is inserted.
    Type: Grant
    Filed: December 13, 1990
    Date of Patent: March 10, 1992
    Assignee: Bourns, Inc.
    Inventors: John B. Chapman, Brenda K. Brunello
  • Patent number: 5043695
    Abstract: A miniature electronic device includes a housing attached to a substrate by a plurality of terminal leads, each of which has a first end embedded or molded into the housing near the top surface thereof, and a second end bent around a side wall of the housing to engage the bottom surface of the substrate. The bottom surface of the substrate has a plurality of metallized areas, each of which is electrically connected to a component on the upper surface of the substrate. The second end of each lead is soldered or welded to a metallized area. The connection of the leads to the metallized areas secures the housing to the substrate, with the leads also providing the structure for the electrical and mechanical connection of the substrate (and the components thereon) to a circuit board.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: August 27, 1991
    Assignee: Bourns, Inc.
    Inventors: Thomas E. Simon, Thanh V. Nguyen, Chin-Yuan Hsieh