Resistance Value Varied By Removing Or Adding Material Patents (Class 338/195)
  • Patent number: 11555831
    Abstract: A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient or resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: January 17, 2023
    Assignee: VISHAY DALE ELECTRONICS, LLC
    Inventors: Todd Wyatt, Tom Bertsch, Joshua Johnson, Aaron Krause, Sara Vo, Darin Glenn
  • Patent number: 11532410
    Abstract: Provided is a thermistor which has a smaller change in resistance value between before and after a heat resistance test and from which a high B constant is obtained, a method for manufacturing the same, and a thermistor sensor. The thermistor is a thermistor formed on a substrate and includes: an intermediate stacked portion formed on the substrate; and a main metal nitride film layer formed of a thermistor material of a metal nitride on the intermediate stacked portion, wherein the intermediate stacked portion includes a base thermistor layer formed of a thermistor material of a metal nitride and an intermediate oxynitride layer formed on the base thermistor layer, the main metal nitride film layer is formed on the intermediate oxynitride layer, and the intermediate oxynitride layer is a metal oxynitride layer formed through oxidation of the thermistor material of the base thermistor layer immediately below the intermediate oxynitride layer.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: December 20, 2022
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshiaki Fujita, Shunpei Suzuki, Nagisa Sako, Norihisa Chitose, Noriaki Nagatomo
  • Patent number: 11488750
    Abstract: A manufacturing method of shunt resistor according to the present invention includes a step of calculating a difference between an initial resistance value and a desired resistance value as a resistance value to be adjusted, a step of providing a plurality of recess forming members capable of forming recesses each having a characteristic size in the surface of a resistive alloy plate, a recess determining step of determining the size and the number of the recesses necessary to be formed at the surface of the resistive alloy plate, and a recess forming step of forming the recesses according to the size and the number determined in the recess determining step by using the corresponding recess forming members.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: November 1, 2022
    Assignee: Suncall Corporation
    Inventors: Hiroya Kobayakawa, Kenji Murakami
  • Patent number: 11400541
    Abstract: A method for producing a component from two plates, which are electrically isolating, at least one is optically transparent, and between them at least one planar conductor section and at least one isolator section are formed, comprises bonding the plates at mutually facing bonding faces, wherein a metal layer is arranged therebetween, and processing the metal layer by local heating using laser radiation such that the metal layer is converted into the at least one isolator section in a part region, and the at least one conductor section is formed adjacent thereto. To form the at least one isolator section, the light path of the laser radiation and the component are moved relative to each other to convert the metal layer into the at least one isolator section over a line or area. Bonding faces of metallic bond layers are polished. The plates are bonded by atomic diffusion bonding.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: August 2, 2022
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Jan Ingwersen, David Kieven
  • Patent number: 11315708
    Abstract: A chip resistor includes: an insulating substrate; a resistor portion disposed on one surface of the insulating substrate and including a plurality of resistor bodies spaced apart from each other and a plurality of internal electrodes connecting the plurality of resistor bodies to each other; and a first external electrode and a second external electrode disposed on the one surface of the insulating substrate to be spaced apart from each other and respectively connected to the resistor portion, wherein each of the plurality of resistor bodies has a first end adjacent to the first external electrode and a second end opposing the first end and adjacent to the second external electrode, and each of the first end and the second end of each of the plurality of resistor bodies is connected to one of the plurality of internal electrodes, the first external electrode, or the second external electrode.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Hyun Park, Ah Ra Cho
  • Patent number: 11170918
    Abstract: A chip resistor is capable of improving surge characteristic while finely adjusting a resistance value with high accuracy. A chip resistor includes a resistor which is print-formed such that a first meandering portion is consecutively connected to a second meandering portion across a rectangular adjustment portion. The adjustment portion is provided with a first trimming groove to lengthen a current path of the resistor, thereby improving the surge characteristic while coarsely adjusting a resistance value of the resistor to bring it close to a target resistance value. Furthermore, a second trimming groove is provided in an area of the second meandering portion where a current distribution is small, thereby finely adjusting the resistance value of the resistor to make it coincide with the target resistance value in accordance with a cutting amount of the second trimming groove.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: November 9, 2021
    Assignee: KOA CORPORATION
    Inventors: Kazuhisa Ushiyama, Natsuki Iguchi, Yasuhiro Kamijo, Hisakazu Nagata
  • Patent number: 11164688
    Abstract: An object is to provide a chip resistor in which hot spots can be dispersed and the adverse effects on performance caused by microcracks can also be reduced. A chip resistor includes an insulating substrate, a resistive element, and electrodes. In the resistive element, a first trimming groove and a second trimming groove are formed. A first vertical groove of the first trimming groove and a second vertical groove of the second trimming groove are formed with a spacing in between in an X1-X2 direction. A first horizontal groove of the first trimming groove and a second horizontal groove of the second trimming groove extend in directions approaching each other, and terminal ends of the first horizontal groove and the second horizontal groove are formed to be separated in the X1-X2 direction such that the first horizontal groove and the second horizontal groove do not overlap in a Y1-Y2 direction.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: November 2, 2021
    Assignee: KOA CORPORATION
    Inventors: Natsuki Iguchi, Kazuhisa Ushiyama, Yasuhiro Kamijo
  • Patent number: 10923253
    Abstract: A resistor component includes a support substrate, a resistive layer disposed on one surface of the support substrate, and a plurality of slits disposed in the resistive layer, each extending from one end or another end of the resistive layer opposing each other in a first direction, and spaced apart from each other in a second direction traversing the first direction. First and second internal electrodes are disposed on the support substrate and are respectively disposed on one end and another end of the resistive layer opposing each other in the second direction to be spaced apart from each other. A first protective layer is disposed on the resistive layer. The plurality of slits include a primary slit covered by the first protective layer, and a secondary slit extending in the first protective layer.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gwang Hyeon Park, Ji Sook Yoon, Ah Ra Cho
  • Patent number: 10867109
    Abstract: An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling range.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsien Yu Tseng, Chun-Wei Chang, Szu-Lin Liu, Amit Kundu, Sheng-Feng Liu
  • Patent number: 10832837
    Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: November 10, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Takanori Shinoura, Wataru Imahashi
  • Patent number: 10811174
    Abstract: One aspect of the present disclosure provides a chip resistor. In the chip resistor, a top electrode is disposed on a front surface of a substrate. A resistor is disposed on the front surface and electrically connected to the top electrode. A protective layer covers the resistor. A protective electrode is electrically connected to the top electrode. A side electrode is electrically connected to the top electrode. The side electrode has a side portion disposed on the side surface, and a top portion and a bottom portion respectively overlapping the front surface and the back surface in plan view. An intermediate electrode covers the protective electrode and the side electrode. An outer electrode covers the intermediate electrode. The protective electrode is in contact with both the top electrode and the protective layer and covers a portion of the top electrode and a portion of the protective layer.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: October 20, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Wataru Imahashi, Takanori Shinoura
  • Patent number: 10535651
    Abstract: An impedance circuit includes a first poly-resistor and a second poly-resistor. The first poly-resistor has a first terminal coupled to a first node, and a second terminal coupled to a second node. The second poly-resistor has a first terminal coupled to the first node, and a second terminal coupled to the second node. The resistance between the first terminal and the second terminal of the first poly-resistor is determined according to a first control voltage. The resistance between the first terminal and the second terminal of the second poly-resistor is determined according to a second control voltage. The first control voltage and the second control voltage are determined according to a first voltage at the first node and a second voltage at the second node.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: January 14, 2020
    Assignee: MEDIATEK INC.
    Inventors: Sung-Han Wen, Kuan-Ta Chen
  • Patent number: 10453593
    Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: October 22, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Takanori Shinoura, Wataru Imahashi
  • Patent number: 10366813
    Abstract: Shown herein is a method of forming an electrical resistor comprising the steps of: forming an electrically resistive layer on a substrate; measuring an electrical resistance-related parameter of the electrically resistive layer and determining a target length of the electrically resistive layer corresponding to a target electrical resistance; and forming first and second electrically conductive terminals contacting the electrically resistive layer, said first and second electrically conductive terminals being separated by a distance corresponding to the target length.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: July 30, 2019
    Assignee: Hochschule für angewandte Wissenschaften München
    Inventor: Ulrich Moosheimer
  • Patent number: 10288670
    Abstract: The invention relates to a diagnosis apparatus for detecting a defect of at least one of a plurality of light emitting diodes which are interconnected to form a light emitting diode series connecting a first supply terminal to a second supply terminal. The defect is intended to be detected with little wiring outlay. The invention provides that a resistance element is connected in parallel with each light emitting diode and a measuring device is configured to generate a diagnosis current between the two supply terminals in a luminous pause, during which none of the light emitting diodes emit light, said diagnosis current giving rise, at each resistance element, to a voltage lower than a forward voltage, starting from which the light emitting diode respectively connected in parallel emits light, and to provide a voltage value of a diagnosis voltage dropped between the supply terminals.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: May 14, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Wolfgang Koellner, Maximilian Austerer, Philipp Brejcha
  • Patent number: 10247620
    Abstract: A wiring board includes an insulating substrate composed of a stack of a plurality of insulating layers, the insulating substrate having an upper face, a lower face, and side faces; and a plurality of line conductors formed of platinum or a metallic material comprising platinum as a main component, the plurality of line conductors each including a first end and a second end located on a side opposite to the first end, the plurality of line conductors being respectively disposed in interlayers between the plurality of insulating layers, in the line conductors, a line width of a line conductor located in an interlayer among the interlayers which interlayer is closest to the upper face or the lower face of the insulating substrate being greater than a line width of a line conductor located in each of the other interlayers.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: April 2, 2019
    Assignee: KYOCERA CORPORATION
    Inventors: Hiroshi Matsumoto, Kengo Morioka, Takahito Hirata
  • Patent number: 10242776
    Abstract: The chip resistor includes insulating substrate 10, first and second top electrodes (11x, 11b) on the top surface of the insulating substrate each on either longitudinal end thereof, and resistive element 12 electrically in contact with the top electrodes, wherein each of the top electrodes has, on its inner side facing to the other, cutout part 11a and protruding part 11b, with the cutout part in the first top electrode extending from at least one longitudinal side of the insulating substrate, transversely inwards thereof, and with the cutout part in the second top electrode arranged substantially point-symmetrically to the cutout part in the first top electrode with respect to the center of the insulating substrate, wherein the resistive element has contacting regions 12b, and non-contacting regions 12c, and trimming slot (53a, 53b) including a linear part.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: March 26, 2019
    Assignee: Kamaya Electric Co., Ltd.
    Inventors: Tomiharu Morita, Yuusuke Nojiri
  • Patent number: 10224391
    Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: March 5, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
  • Patent number: 10217550
    Abstract: A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: February 26, 2019
    Assignee: Vishay Dale Electronics, LLC
    Inventors: Clark L. Smith, Thomas L. Bertsch, Todd L. Wyatt, Thomas L. Veik
  • Patent number: 10134510
    Abstract: A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: November 20, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Shogo Nakayama
  • Patent number: 10083826
    Abstract: The present invention is provided to reduce the distortion or delay of the input waveform of a high-speed analog signal due to the capacitance of a protection element inserted for the purpose of ESD protection in an input circuit for a high-speed analog signal, so as to determine the correct waveform of the high-speed analog signal.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: September 25, 2018
    Assignee: SHIMADZU CORPORATION
    Inventor: Eizo Kawato
  • Patent number: 10048240
    Abstract: A control apparatus that controls a gas concentration sensor includes a sweep circuit, a current detection resistor, and a calculation portion. The sweep circuit supplies the gas concentration sensor with a sweep current. The calculation portion calculates impedance of the gas concentration sensor. The gas concentration sensor and the current detection resistor are sequentially connected in series along a direction from the sweep circuit to a reference voltage. The sweep circuit has a constant voltage circuit and a reference resistor. An increasing and decreasing tendency of a manufacturing variation of the reference resistor and an increasing and decreasing tendency of a manufacturing variation of the current detection resistor are identical. The calculation portion divides a product of a resistance value of the current detection resistor and a time variation of applied voltage to the gas concentration sensor by a time variation of applied voltage to the current detection resistor.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: August 14, 2018
    Assignee: DENSO CORPORATION
    Inventors: Satoshi Nishimoto, Masafumi Umeno, Yuji Yamada
  • Patent number: 9997281
    Abstract: A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: June 12, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Takanori Shinoura, Wataru Imahashi
  • Patent number: 9972427
    Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: May 15, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Yasuhiro Kondo, Hiroshi Tamagawa, Hiroki Yamamoto
  • Patent number: 9947443
    Abstract: A chip resistor includes a base member, a resistive element formed on the base member, a first inner electrode held in contact with a first end portion of the resistive element, a second inner electrode held in contact with a second end portion of the resistive element, a first reverse surface electrode reaching a first end portion of the base member, and a second reverse surface electrode reaching a second end portion of the base member. The length of the first and the second reverse surface electrodes is in a range of 2/10 to 3/10 of the length of the base member. Also, the length of the first and the second reverse surface electrodes is greater than the length of the first and the second inner electrodes.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: April 17, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Shinsuke Ogawa, Makoto Toyonaga
  • Patent number: 9909944
    Abstract: A sensor (1) comprising a membrane, an isolation layer (3) arranged on the membrane, measuring electronics comprising a thin film circuit (4), e.g. in the form of a Wheatstone bridge, deposited on the isolation layer (3), and a power supply (14) arranged to supply a quasi-DC voltage to the thin film circuit (4) is disclosed. The sensor (1) is cost effective to manufacture, due to the thin film circuit (4), and corrosion effects are avoided, without having to apply a coating or passivation layer onto the thin film circuit (4), due to the quasi-DC voltage being supplied to the thin film circuit (4).
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: March 6, 2018
    Assignee: Danfoss A/S
    Inventor: Steen Moellebjerg Matzen
  • Patent number: 9618317
    Abstract: A position indicator includes a resonance circuit housed in a casing and having an inductance element and a capacitor variable in capacitance, such that the resonance circuit resonates at a predetermined frequency. The position indicator is electromagnetically coupled to a position detecting device. The capacitor includes a dielectric, an electrode disposed on one side of the dielectric, and a trimming electrode disposed on another side of the dielectric such that at least one part of a region of the trimming electrode is opposed to the electrode with the dielectric interposed in between, to form the capacitance of the capacitor. The capacitor is housed in the casing such that the at least one part can be exposed from the casing. The area of the at least one part exposed from the casing to the outside is changed so as to correspond to a resonance frequency desired for the resonance circuit.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: April 11, 2017
    Assignee: Wacom Co., Ltd
    Inventors: Kazuo Hara, Takashi Yamaguchi
  • Patent number: 9530546
    Abstract: [Subject]To provide a chip resistor free from chipping of corner portions thereof and a method of producing the chip resistor. [Solution] The chip resistor (1) includes: a board (2) having a device formation surface (2A), a back surface (2B) opposite from the device formation surface (2A) and side surfaces (2C-2F) connecting the device formation surface (2A) to the back surface (2B), a resistor portion (56) provided on the device formation surface (2A), a first connection electrode (3) and a second connection electrode (4) provided on the device formation surface (2A) and electrically connected to the resistor portion (56), and a resin film (24) covering the device formation surface (2A) with the first connection electrode (3) and the second connection electrode (4) being exposed therefrom. Intersection portions (11) of the board (2) along which the back surface (2B) intersects the side surfaces (2C-2F) each have a rounded shape.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: December 27, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Eiji Nukaga, Hiroshi Tamagawa, Yasuhiro Kondo, Katsuya Matsuura
  • Patent number: 9508473
    Abstract: [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: November 29, 2016
    Assignee: ROHM CO., LTD.
    Inventor: Masaki Yoneda
  • Patent number: 9451215
    Abstract: In a control circuit apparatus and an endoscope apparatus circuit disposition in which the outer edge of the first overheating region and the outer edge of the second overheating region approach the outer edge of the first overheating region and the outer edge of the second overheating region to an extreme in a state in which the outer edge of the first overheating region and the outer edge of the second overheating region do not overlap the outer edge of the first overheating region and the outer edge of the second overheating region serves as circuit disposition having a minimum mounting area on a substrate.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: September 20, 2016
    Assignee: OLYMPUS CORPORATION
    Inventor: Ayumi Doi
  • Patent number: 9424891
    Abstract: Methods, apparatuses and systems are disclosed involving a memory device. In one embodiment, a memory device is disclosed that includes a command error module of the memory device operably coupled to at least one of a command signal and an address signal and configured to detect and report a parity error on the command signal, the address signal, or combinations thereof. In some embodiments, a memory device may include a temperature sensor operably coupled to a mode register. The temperature sensor may be configured to sense a device temperature and report a temperature status. Furthermore, the memory device may be incorporated into a memory module, which may be included in an electronic system.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: August 23, 2016
    Assignee: Micron Technology, Inc.
    Inventor: David R. Resnick
  • Patent number: 9418932
    Abstract: An integrated circuit system, and a method of manufacture thereof, includes: an integrated circuit substrate; and a discretized tunable precision resistor having a total resistance including: a resistor body over the integrated circuit substrate, interconnects directly on the resistor body, metal taps directly on the interconnects and at opposing sides of the resistor body, and conductive metal strips over the interconnects, wherein the total resistance is a function of an active resistor length of the resistor body between a pair of the metal taps in contact with two of the conductive metal strips.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: August 16, 2016
    Assignee: Altera Corporation
    Inventors: Queennie Suan Imm Lim, Jeffrey T. Watt, ShuXian Chen
  • Patent number: 9378872
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: June 28, 2016
    Assignee: Vishay Dale Electronics, LLC
    Inventors: Clark L. Smith, Joel J. Smejkal, David Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Patent number: 9305685
    Abstract: A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: April 5, 2016
    Assignee: ROHM CO. LTD.
    Inventor: Masaki Yoneda
  • Patent number: 9245079
    Abstract: A computer implemented method for performing extraction is provided in the present invention. First, a layout of a semiconductor circuit having a resistor is imported by using a computer wherein a device region is defined in the layout and the resistor is located within the device region. Next, the device region of the layout are extracted, and a compensation value of Rs (Rc) is obtained according to the extracting step. An adjustment process is performed according to Rc to obtained a refined R value.
    Type: Grant
    Filed: July 6, 2014
    Date of Patent: January 26, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Hsun Huang, Hsi-Chang Chang, Chao-Yao Chiang, Chien-Hung Chen
  • Patent number: 9224731
    Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. [Solution Means] A chip resistor 10 is arranged to have a resistor network 14 on a substrate. The resistor network 14 includes a plurality of resistor bodies R arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies R being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films C and fuse films F. By selectively fusing a fuse film F, a resistance unit can be electrically incorporated into the resistor network 14 or electrically separated from the resistor network to make the resistance value of the resistor network 14 the required resistance value.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: December 29, 2015
    Assignee: ROHM CO., LTD.
    Inventors: Hiroshi Tamagawa, Yasuhiro Kondo, Yasuhiro Fuwa, Hiroyuki Okada, Eiji Nukaga, Katsuya Matsuura
  • Patent number: 9207291
    Abstract: Embodiments relate to xMR sensors, sensor elements and structures, and methods. In an embodiment, a sensor element comprises a non-elongated xMR structure; and a plurality of contact regions formed on the xMR structure spaced apart from one another such that a non-homogeneous current direction and current density distribution are induced in the xMR structure when a voltage is applied between the plurality of contact regions.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: December 8, 2015
    Assignee: Infineon Technologies AG
    Inventor: Juergen Zimmer
  • Patent number: 8884733
    Abstract: The invention relates to a current-sensing resistor (1) for measuring an electric current, in particular also for measuring a battery current in a vehicle power supply, having a plate-shaped first connecting part (3) for introducing the electrical current to be measured, wherein the plate-shaped first connecting part (3) consists of an electrically conductive conductor material; a plate-shaped second connecting part (2) for conducting away the electrical current to be measured, wherein the plate-shaped second connecting part (2) consists of an electrically conductive conductor material; and a plate-shaped resistance element (4), which is connected in the current path between the two connecting parts and through which the electrical current to be measured flows, wherein the resistance element (4) consists of a comparatively high-impedance resistance material.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: November 11, 2014
    Assignee: Isabellenhuette Heusler GmbH & Co. KG
    Inventor: Ullrich Hetzler
  • Publication number: 20140327512
    Abstract: A resistor includes a substantially cylindrical resistive element having a resistance of less than about 1 m?, a substantially cylindrical first termination electrically connected to the resistive element and a second termination electrically connected to the resistive element. The substantially cylindrical first termination is hollow to allow for accepting a connection such as from a battery cable. In addition there may be sense leads present on the resistor. A method of forming a substantially cylindrical resistor includes forming a hollow cylindrical resistor body by rolling a flat sheet comprising a resistive element and a first termination and a second termination joined on opposite ends of the resistive element.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 6, 2014
    Applicant: Vishay Dale Electronics, Inc.
    Inventors: Clark Smith, Joel J. Smejkal, David Lange, Thomas L. Bertsch, Steve Hendricks, Rod Brune
  • Patent number: 8847117
    Abstract: There is described a method for stabilizing a post-trimming resistance of a thermally isolated electrical component made from a thermally mutable material, the method comprising: generating at least one heating pulse, the at least one heating pulse having an initial amplitude corresponding to a trimming temperature, a slope corresponding to a given cooling rate and a duration corresponding to a given cooling time; and applying the at least one heating pulse to one of the thermally isolated electrical component and a heating device in heat transfer communication with the thermally isolated electrical component, after a trimming process, in order to cause the electrical component to cool in accordance with the given cooling rate, the given cooling rate being slower than a passive cooling rate determined by the thermal isolation of the electrical component.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 30, 2014
    Assignee: Sensortechnics GmbH
    Inventors: Oleg Grudin, Yougui Liao, Leslie M. Landsberger, Gennadiy Frolov, Lyudmila Grudina, Gerald Arzoumanian, Saed Salman, Tommy Tsang, Bowei Zhang
  • Patent number: 8723637
    Abstract: A method for altering a resistance of a resistor including trimming the resistor using a first type of trim approach to increase a resistance measurement of the resistor to above a target resistance value, and iteratively trimming the resistor using a second type of trim approach until a power coefficient of resistance (PCR) or temperature coefficient of resistance (TCR) measurement of the resistor is substantially close to zero.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: May 13, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Fergus John Downey, Neville Craig, Patrick McGuinness, Patrick Elebert
  • Patent number: 8705245
    Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: April 22, 2014
    Assignee: EPCOS AG
    Inventors: Gerald Kloiber, Heinz Strallhofer, Norbert Freiberger
  • Patent number: 8558656
    Abstract: An over-current protection device comprises a resistance material with positive or negative temperature coefficient and an upper surface and a lower surface; a first electrode layer having a first groove, disposed on the upper surface; a first surface mount pad disposed on the upper surface; a second electrode layer disposed on the lower surface, electrically connecting to the first surface mount pad; a second surface mount pad disposed on the lower surface, electrically connecting to the first electrode layer; a second groove electrically separating the first surface mount pad from the first electrode layer; and a third groove electrically separating the second electrode layer from the second surface mount pad. The first groove divides the first electrode layer into two connected regions. The first and second surface mount pads are separated from each other and one end of the first groove connects to the second groove.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: October 15, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: David Shau Chew Wang, Chun Teng Tseng
  • Publication number: 20130265133
    Abstract: A method for altering a resistance of a resistor including trimming the resistor using a first type of trim approach to increase a resistance measurement of the resistor to above a target resistance value, and iteratively trimming the resistor using a second type of trim approach until a power coefficient of resistance (PCR) or temperature coefficient of resistance (TCR) measurement of the resistor is substantially close to zero.
    Type: Application
    Filed: July 20, 2012
    Publication date: October 10, 2013
    Applicant: ANALOG DEVICES, INC.
    Inventors: Fergus John Downey, Neville Craig, Patrick McGuiness, Patrick Elebert
  • Patent number: 8531264
    Abstract: The present invention relates to a current sensing resistor made by an electrically conductive metal plate, and the current sensing resistor comprising: a middle portion; a first portion with a first slot located at one side of the middle portion; and a second portion with a second slot located at the other side of the middle portion opposite to the first portion; wherein each of the first and second portions is divided into a current terminal and a sensing terminal by the first and second slots respectively, and the current terminals of the first and second portions have a length greater than that of the sensing terminals of the first and second portions; characterized in that the middle portion has a middle slot and the length of the middle slot can be used for controlling the stability of resistance for the current sensing resistor.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: September 10, 2013
    Assignee: TA-I Technology Co., Ltd.
    Inventors: Chun-Yen Li, Yi-Kun Chiu, Ching-Chen Hu
  • Patent number: 8525637
    Abstract: A current sense resistor and a method of manufacturing a current sensing resistor with temperature coefficient of resistance (TCR) compensation are disclosed. The resistor has a resistive strip disposed between two conductive strips. A pair of main terminals and a pair of voltage sense terminals are formed in the conductive strips. A pair of rough TCR calibration slots is located between the main terminals and the voltage sense terminals, each of the rough TCR calibration slots have a depth selected to obtain a negative starting TCR value observed at the voltage sense terminals. A fine TCR calibration slot is formed between the pair of voltage sense terminals.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: September 3, 2013
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark L. Smith, Thomas L. Bertsch, Todd L. Wyatt, Thomas L. Veik
  • Patent number: 8466772
    Abstract: On the track of a potentiometer a resistive path of thin film is deposited or a foil is bonded to a matched substrate and a parallel path is formed of discrete contact straps extending from the resistive path. The resistive path has a protecting coating and the wiper is moving on abrasion resistant contact straps. This design enables application of high precision and stability resistor technologies in the production of variable resistors destined for long service life. It enables also, in high precision applications, by maintaining the linearity of the output versus input function, a two-wire connection to the variable resistor used as a position sensor.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: June 18, 2013
    Assignee: Vishay Israel, Ltd
    Inventors: Joseph Szwarc, Jean-Michel Lanot, Ruta Zandman
  • Patent number: 8441335
    Abstract: Apparatus and methods of trimming resistors are disclosed. In one embodiment, a method of controlling the PCR of a thin film resistor is provided. The method includes applying a first current to a resistor so as to alter a property of the resistor, and measuring the property of the resistor. Applying the first current and measuring the property of the resistor can be repeated until the PCR of the resistor is within an acceptable tolerance of a desired value for the property of the resistor.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: May 14, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Fergus John Downey, Bernard Patrick Stenson, James Michael Molyneaux
  • Patent number: 8432247
    Abstract: An over-current protection device includes a first electrode layer, a second electrode layer, and a resistance material disposed between the first and second electrode layers. The first electrode layer includes a first groove pattern formed on and through the first electrode layer. The first groove pattern is configured to separate the first electrode layer into a plurality of connected regions. The second electrode layer includes a second groove pattern formed on and through the second electrode layer. The second groove pattern is configured to separate the second electrode layer into a plurality of connected regions. The first and second groove patterns are further configured to be formed in an interlaced manner that when the first and second electrode layers are overlapped, the first and second groove patterns form a plurality of independent regions, which divide the resistance material into a plurality of electrically isolated and parallel connected units.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: April 30, 2013
    Assignee: Polytronics Technology Corp.
    Inventors: David Shau Chew Wang, Chun Teng Tseng
  • Patent number: 8373536
    Abstract: The invention relates to a magnetoresistive device formed to sense an externally applied magnetic field, and a related method. The magnetoresistive device includes a magnetoresistive stripe formed over an underlying, metallic layer that is patterned to produce electrically isolated conductive regions over a substrate, such as a silicon substrate. An insulating layer separates the patterned metallic layer from the magnetoresistive stripe. A plurality of conductive vias is formed to couple the isolated regions of the metallic layer to the magnetoresistive stripe. The conductive vias form local short circuits between the magnetoresistive stripe and the isolated regions of the metallic layer to alter the uniformity of a current flow therein, thereby improving the position and angular sensing accuracy of the magnetoresistive device.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: February 12, 2013
    Assignee: Infineon Technologies AG
    Inventors: Juergen Zimmer, Thomas Bever