Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

Abstract: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.

Abstract: A chip resistor device includes an insulating substrate, two indented patterns, and a resistor unit. The insulating substrate has opposite first and second surfaces. The first surface has two opposite edges and two electrode forming regions adjacent to the two opposite edges, respectively. The indented patterns are respectively formed in the electrode forming regions of the first surface and indented from the first surface. The resistor unit includes two contact electrodes respectively formed on the electrode forming regions of the first surface and filled into the indented patterns, and a resistor formed on the first surface between the two contact electrodes and electrically contacting the contact electrodes.

Abstract: A design structure including a pair of substantially parallel resistor material lengths separated by a first dielectric are disclosed. The resistor material lengths have a sub-lithographic dimension and may be spacer shaped.

Abstract: A resistor and design structure including a pair of substantially parallel resistor material lengths separated by a first dielectric are disclosed. The resistor material lengths have a sub-lithographic dimension and may be spacer shaped.

Abstract: A resistor and design structure including at least one resistor material length in a dielectric, each of the least one resistor material length having a sub-lithographic width are disclosed.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: A resistor and design structure including a pair of substantially parallel resistor material lengths separated by a first dielectric are disclosed. The resistor material lengths have a sub-lithographic dimension and may be spacer shaped.

Abstract: A semiconductor structure with high breakdown voltage and high resistance and method for manufacturing the same. The semiconductor structure at least comprises a substrate having a first conductive type; a deep well having a second conductive type formed in the substrate; two first wells having the first conductive type and formed within the deep well; a second well having the first conductive type and formed between two first wells within the deep well, and a implant dosage of the second well lighter than a implant dosage of the first well; and two first doping regions having the first conductive type and respectively formed within the first wells.

Abstract: It is provided that a reflection plate of semiconductor heat treatment, which is resistant to cracks or deformations by controlling the adsorption of foreign materials and the production of reaction. Said reflection plate 1 for semiconductor heat treatment is composed of a disk-shaped or ring-shaped plate of optically transmissible material and a plate 2 of inorganic material hermetically enclosed in said disk-shaped or ring-shaped plate, in which said plate of inorganic material has at least one side in contact with said plate of optically transmissible material, said at least one side 2a having a surface roughness of Ra 0.1 to 10.0 ?m, said at least one side 2a formed grooves 2c therein.

Abstract: Disclosed is a method of producing a printed circuit board (PCB) with an embedded resistor, in which a resistor with a desired shape and volume is precisely formed using a resistor paste so that resistance values according to a position of the PCB are uniform, thereby a laser trimming process is omitted or minimally utilized. The method has advantages in that a production time of the PCB is shortened and productivity is improved because an operation condition is rapidly set without being greatly affected by the position precision of a printing device. Other advantages of the method are that the resistor paste with a relatively uniform thickness is secured through a screen printing process, thereby easily forming the resistor and improving resistance tolerance.

Abstract: A method for fabricating the embedded thin film resistors of a printed circuit board is provided. The embedded thin film resistors are formed using a resistor layer built in the printed circuit board. Compared with conventional discrete resistors, embedded thin film resistors contribute to a smaller printed circuit board as the space for installing conventional resistors is saved, and better signal transmission speed and quality as the capacitive reactance effect caused by two connectors of the conventional resistors is avoided. The method for fabricating the embedded thin film resistors provided by the invention can be conducted using the process and equipment for conventional printed circuit boards and thereby saving the investment on new types of equipment. The method can be applied in the mass production of printed circuit boards and thereby reduce the manufacturing cost significantly.

Abstract: Electric heating/warming composite fabric articles have at least a fabric layer having inner and outer surfaces, and an electric heating/warming element, formed, e.g., of die cut, metallized textile or plastic sheeting or metal foil, affixed at the inner surface of the fabric layer and adapted to generate heating/warming when connected to a power source. A barrier layer may be positioned, for example, adjacent to the inner surface of the fabric layer; e.g., with the electric heating/warming element formed thereupon, including to protect the electric circuit, e.g. against abrasion.

Abstract: A heater for heating a rigid fluid line or hose for freeze protection. The heater has a base made of an outer base layer, a middle base layer attached to the outer base layer; and an inner base layer attached to the middle base layer. The inner base layer can be uncured silicone (before assembly processing). A resistance wire is wound around an electrically non-conductive core and located on the inner base layer. The resistance wire can be a high gauge wire providing for a small moment of flexure. A cover includes an inner cover layer covering said resistance wire. This inner cover layer can be uncured silicone (before assembly processing). A middle cover layer is attached to the inner cover layer, and an outer cover layer is attached to the inner cover layer. The outer cover layer protects the heater from abrasion.

Abstract: Circuit panels are provided with resistors in vias extending between the top and bottom surfaces of the panels. The resistors may be formed by depositing a composite in each via, as by depositing a dispersion of a conductive material and a dielectric or by depositing one or more thin layers of a conductor. The resistors may be disposed at interior locations buried within a multilayer circuit board formed by laminating one or more panels having such resistors with one or more additional elements.

Abstract: The substrate (2) containing the via-hole (3) is inserted into an electrophoretic cell (1) and an electrode (6) (the “first electrode”) is placed on top of a first orifice of the via-hole(s) (3), to be implemented with electrical component(s), so that the electrode (6) totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) (3) in a conductive medium (17) consisting of the electrically charged particles. An electric field is created between the first electrode (6) and a second electrode (4) through the via-hole(s) (3) and the conductive medium (17) and the electrically charged particles are precipitated on the inner surface of the first electrode (6) that is directed to the second orifice of the via-hole(s) (3), until a desired portion of the volume of the via-hole(s) (3) is filled with a first layer of the charged particles having a desired thickness.

Abstract: A temperature compensating device comprises one or more columnar thermistors embedded within a substrate. Because the thermistors are substantially covered by the substrate, they are less susceptible to changes in air temperature and to temperature gradients. Moreover, within the substrate the thermistors can be made thicker and smaller in lateral area, permitting more compact, less expensive devices that exhibit improved high frequency performance. The devices can advantageously be fabricated using the low temperature co-fired ceramic (LTCC) process.

Abstract: An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.

Abstract: SMD current-sense resistors are manufactured by dividing a drawn laminated wire structure that consists of a core of a resistive alloy and a jacket made of copper, e.g. After removing part of the copper jacket, jacket sections used as connector contact layers remain only at the ends of the resistor.

Abstract: A plurality of protective resistors can be easily inserted between circuit forming elements, and opposite ends of each protective resistor can be properly press-contacted to each circuit forming element. The protective resistor can be easily replaced when broken. A resistor array board comprises a porous plate having a plurality of through-holes arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors removably loosely inserted into the through-holes, respectively. Each of the protective resistors are resiliently retained by an electrically conductive spring element, and opposite ends of each of the protective resistors are press-contacted with the circuit forming elements which are arranged in opposing relation on surfaces of the porous plates.

Abstract: A wiring board having an insulating substrate of aluminum oxide ceramics and a surface wiring layer formed on the surface of said insulating substrate, wherein the aluminum oxide ceramics constituting said insulating substrate contains a manganese compound in an amount of from 2.0 to 10.0% by weight in terms of MnO2, and has a relative density of not smaller than 95%, and said surface wiring layer contains copper in an amount of from 10 to 70% by volume and at least one high-melting metal selected from the group consisting of tungsten and molybdenum in an amount of from 30 to 90% by volume, and further contains copper as a matrix, said copper matrix having a diffusion structure in which are diffused the particles of said high-melting metal having an average particle diameter of from 1 to 10 &mgr;m.

Abstract: A resistor may be embedded into a substrate. A portion of the resistor may be exposed, by segmenting the substrate, for instance, so that the resistor may be trimmed to a desired resistance level. Alternatively, a portion of a resistor may be embedded into a substrate, with another portion of the resistor being disposed on the outer surface of the substrate. The portion of the resistor on the outer surface may be trimmed to adjust the resistance of the resistor to a desired level.

Abstract: A panel heater is made of a metallic panel member and an ohmic heat generating body which is covered with a sheath member and which is embedded in the metallic panel member. One of the sheath member and the panel member is formed by a first material capable of being alloyed with, and having a coefficient of thermal expansion close to a coefficient of thermal expansion of, a second material for the other of the sheath member and the panel member. The sheath member and the panel member are seamlessly integrated by diffusion bonding at a high temperature and high pressure.

Abstract: A process for forming a thick-film resistor whose dimensions can be accurately obtained, thereby yielding a precise resistance value. The method includes providing on a substrate a photoimageable layer that preferably forms a permanent dielectric layer of a multilayer structure. An opening is photodefined in the surface of the photoimageable layer, and then overfilled with an electrically-resistive material to form a resistive mass having an excess portion that lies on the surface of the photoimageable layer surrounding the opening. Following curing which causes the surface of the resistive material to become recessed below the surface of the photoimageable layer, the excess portion of the resistive mass is removed, preferably by abrading or a similar operation, such that the lateral dimensions of the resistive mass are determined by the lateral dimensions of the opening in the photoimageable layer.

Abstract: A resistance wiring board having a cavity disposed on an insulated substrate, a resistance disposed in the cavity, a protective film disposed on a top face of the resistance, and electrodes electrically connected at near both ends of the resistance, wherein surfaces of the electrodes and a surface of the protective film are the same level as or lower than a surface of the wiring board. A method for manufacturing a resistance wiring board comprising the steps of forming a green sheet, forming an electrode pattern on the green sheet, forming a dented pattern on the green sheet, firing the green sheet, forming a resistance by filling a resistance material in the dent of the green sheet, and forming a protective film on a top face of the resistance.

Abstract: A recess portion is provided in a portion in the upper surface 1a of the stay member correspondingly to one longitudinal side edge of the insulating substrate so that a portion of the one longitudinal side edge faces the recess portion 6, so that the insulating substrate can crack by a heat accumulation effect in this portion facing the recess portion.

Abstract: A resistor having a diffused impurity region in a semiconductor substrate, an insulated gate surrounding and defining the resistor, and a pair of separated conductive contacts to the diffused region within the boundary of the insulated gate for applying and receiving current passing through the resistor.

Abstract: A noise-isolated buried resistor satisfies the requirements for low-noise analog designs requiring well controlled ohmic resistors. A field shield is provided between the buried resistor and the substrate to isolate the buried resistor from the substrate noise. This is accomplished by using the standard buried resistor layout and mask sequence with two exceptions. First, the buried resistor is placed in an N-well region, rather than simply a P-well region. Second, a boron implant is added through the buried resistor mask to provide a P-well inside the N-well to isolate the buried resistor electrically from the N-well. The N-well may then be electrically connected to a "quiet" ground. The P-well inside of the N-well may be left floating.

Abstract: A noise-isolated buried resistor satisfies the requirements for low-noise analog designs requiring well controlled ohmic resistors. A field shield is provided between the buried resistor and the substrate to isolate the buried resistor from the substrate noise. This is accomplished by using the standard buried resistor layout and mask sequence with two exceptions. First, the buried resistor is placed in an N-well region, rather than simply a P-well region. Second, a boron implant is added through the buried resistor mask to provide a P-well inside the N-well to isolate the buried resistor electrically from the N-well. The N-well may then be electrically connected to a "quiet" ground. The P-well inside of the N-well may be left floating.

Abstract: A three dimensional polysilicon resistor and a method by which the three dimensional polysilicon resistor is manufactured. A semiconductor substrate has formed upon its surface an insulating layer. The insulating layer has a minimum of one aperture formed at least partially through the insulating layer. A polysilicon layer is formed upon the insulating layer and formed conformally into the aperture(s) within the insulating layer. The polysilicon layer is then patterned to form a resistor which includes the portion of the polysilicon layer which resides within the aperture(s).

Abstract: A resistor substrate in which a resistor layer having an electroconductive powder and carbon fibers dispersed in a heat resistant resin is molded into a substrate comprising a heat resistant thermosetting molding material, and the surface of the resistor layer is in a mirror-finished state. The resistor substrate is manufactured by printing the resistor layer on a metal plate and heat-curing the same, molding the resistor layer formed on the metal plate in a die into a substrate shape with a heat resistant thermosetting resin and peeling the metal plate and transferring the resistor layer to the substrate molded from the heat resistant thermosetting resin.

Abstract: A heating block made from a heat conductive material has a passage through which a fluid heated by the heater can flow. A groove preferably having a looped configuration extends into the block from a peripheral surface in the block. A heater made from an electrically conductive and heat conductive material is disposed in the groove, preferably in a looped configuration corresponding to the looped configuration of the groove. A heat conductive member disposed in the groove is provided with a hole to receive the heater in an enveloping relationship. The member may be defined by a pair of separable portions. The member is preferably disposed in the looped relationship in the groove. Localized deformation of the heating block holds the member and the heater in a fixed relationship with the block. The heater may deteriorate or become defective with extended usage and may have to be replaced. To accomplish this, the heater and the member may be removed as a unit from the block after removing the deformation.

Abstract: An integrated circuit device includes a first insulation layer formed on a substrate; a second insulation layer formed above the first insulation layer; a thin-film resistor formed on the second insulation layer; a third insulation layer in covering relation to the thin-film resistor and the second insulating layer; first contact holes penetrating the third insulation layer in association with the thin-film resistor; second contact holes penetrating through the second and third insulation layers; and conductive layers for electromagnetically shielding the thin-film resistor, the conductive layers including a first conductive layer formed between the first and second insulation layers below the thin-film resistor and a wiring layers formed above the thin-film resistor within the first and second contact holes.

Abstract: A noise filter 11 of the CR type in which electrodes 17a and 17b and electrodes 17d and 17e are formed on the outer surface of a collar portion 15 in a bobbin 12 composed of a dielectric body, recess portions 15c and 15d are respectively formed between the electrodes 17a and 17b and between the electrodes 17d and 17e, and resistance films 18a and 18b are respectively formed along the recess portions 15c and 15d. To form a noise filter of the LCR type, a coil 14 is formed on the bobbin 12 and connected to the electrodes 17b and 17d via electrodes 13a and 13b, respectively.

Abstract: A resistor and method of forming the resistor as an annular resistor body between a conductive pad surrounding a through-hole in the PCB and a surrounding conductive layer, the annular resistor body being formed from a conductive material having a selected resistivity, the outer and inner perimeters of the annular resistor body preferably being substantially constant radii whereby the operative resistance of the annular resistor body may be simply determined from the radii of its outer and inner perimeters, an effective thickness of the annular resistor body and its resistivity, the annular resistor body more preferably being formed from a liquid precursor facilitating formation of conductive interconnections at its outer and inner perimeters.

Abstract: A method for the manufacture of a radiant electrical heater, intended more particularly for heating glass ceramic hotplates, comprises so inserting or pressing helical heating resistors in helical slots in a support, such that the support or the heater coils themselves are deformed and consequently fixed to the support. The coils penetrate the wall or bottom areas of the slot or are otherwise secured by parts of the support by positive engagement. An apparatus for performing the method has a tool with ribs which deforms the support or heater coils for positive engagement.A radiant heater is obtained, whose support has partly overlapping deformations in the slot area of the heater coils.

Abstract: The invention is an electrical component with a body element comprising an organic substrate portion and a laser formed, resistor portion carburized thereon. A first electrical conductor is electrically connected to one location on the resistor portion so as to form one terminal for connection to an electrical circuit and a second electrical conductor is electrically connected to the resistor portion at a different location so as to form another terminal for connection to the electrical circuit.

Abstract: There is disclosed a radiant heater having high efficiency, reduced cost, and longer life, and which allows rapid heat-up and cool-down. As in the prior art, a heating coil is placed in grooves formed in an insulating board; the radiating surface is a fiberglass cloth secured by adhesive to that face of the insulating board which contains the grooves and the wire coil. In making the heater of the invention, the cement is allowed to dry while the board and cloth are placed on a supporting surface with the cloth face down. The cement thus adheres primarily to that portion of the coil closest to the cloth. This manufacturing step results in a cement distribution which significantly affects both the cost, life and performance of the heater.

Abstract: This potentiometer has a pair of insulating standoffs integrally formed with the body of a model or toy incorporating the potentiometer. An insulated trough extends between the standoffs. A resistive element wound around an insulating core is disposed in the trough. A resilient contact element is slidably mounted engagement with the resistive element. Means extends through the body of the model or toy for sliding the resilient contact element along the resistive element. This potentiometer has major portions of its assembly formed in a molding operation used to form the body of the model or toy, and can be assembled by hand without the use of special tools.

Abstract: An electric band heater of low expansion characteristics having an integral ceramic core with resistance wire sandwiched therein and encased within a metal housing, the core being formed from a wire wound ceramic sheet sandwiched between ceramic sheets; and a method for making such a heater which includes the steps of arranging an assembly of a wire wound organic-ceramic core strip between organic-ceramic insulator strips and placing the same within a metal housing, compressing and forming the assembly and then heating the assembly to bake out organic binder materials and sinter ceramic materials into a ceramic mass.

Abstract: In a printed circuit substrate incorporating a resistor pattern film and a conductor pattern film are formed on the two surfaces of a high conductive material layer such as a copper foil, respectively, in a predetermined positional relationship, and an insulating support is combined directly or indirectly with the resistor pattern film on the high conductive material layer, whereby a printed circuit board with resistance elements having high performance can be manufactured, while the number of processing steps can be greatly reduced.

Abstract: A resistance element comprises an insulating cylinder having a helical thread groove on the outer surface thereof. A resistive channel is supported by the groove and a multi-strand wiper is guided by a follower which rides in the root of the channel. The resistance material on the sides of the groove may be notched for purposes of calibration.

Abstract: A grinding wheel is provided around the inside of its hole with a plurality of turns of an electrical conductor weaker in tension than the material of the wheel, the ends of which are brought out to terminals on the surface of the wheel. Incipient cracks in the wheel rupture the conductor, which is checked as desired with a continuity testing device.

Abstract: Down spouts have at least one section that is a length of an extruded conduit having lengthwise portions extending from end-to-end thereof with a backing, substantially coextensive in length connected thereto and with a heating element between the backing and the seat defined by the lengthwise portions. Where the down spout includes one or more elbows, shorter sections of the same extrusion are used to form them with those that are disposed angularly having the heating element disposed in an underlying position and with the abutting ends of the sections mitered and sealed together.

Abstract: A high temperature coil heater which is supported throughout its length in a manner to achieve substantial exposure of the coil to the product. A helically wound coil of resistance wire is supported continuously along its length by an anchor of electrically insulative high strength high thermal conductivity material and which in turn is bonded to a support member of electrically insulative low thermal conductivity low density material. The anchor embeds only a small segment of each coil turn and a major segment of the coil turns is disposed above the support member for efficient direct radiation to the product. Undesirable heat flow rearward of the coil is restricted by the low conductivity support member.

Abstract: A drip edge strip for a shingled roof is tapered and includes a first portion to be secured to the roof and provided with channels extending from end-to-end thereof and a second portion to underlie the first course of shingles and to cover the channels. A heating cable extends lengthwise of the channels.

Abstract: A device for heat fixation comprises a heating member comprising a heat resistant insulating support, a heat generating member provided on the support and a thin film of heat resistance, low surface tension and low friction coefficient overlying the heat generating member.