Abstract: A composite circuit protection device includes: a first positive temperature coefficient (PTC) component; a first voltage-dependent resistor (VDR); a second VDR; and a plurality of conductive leads that correspondingly connect to the first PTC component, the first VDR and the second VDR. The second VDR and the first PTC component are electrically connected in series, the first VDR is electrically connected to the series connection of the first PTC component and the second VDR in parallel, and the first VDR has a varistor voltage greater than that of the second VDR as determined at 1 mA.

Abstract: A higher precision resistive element suppresses variation of the resistance value due to variation of film thickness. A resistive element includes a first portion having a first film thickness and a first width, and a second portion having the first film thickness and a second width determined by the first width. The sum of the first and second widths is constant. The first portion has an upper surface at a position at which a height from the bottom surface of the resistive element first portion is a first height. The resistive element second portion has an upper surface of the resistive element second portion at a position at which a height from a surface including the bottom surface of the resistive element first portion is the first height. The resistive element first portion and the resistive element second portion are coupled to each other via a coupling portion.

Abstract: A laminated body and fabrication method thereof, which allow space saving and control of variation in internal layer resistance, are provided. When forming an internal-layer resistive element 7 in a multilayer ceramic substrate 10, the internal-layer resistive element 7 is connected to exterior electrodes (an upper surface electrode 32 and an undersurface electrode 34) via multiple via-electrodes 3a and 3b arranged in parallel, without a pad electrode adopted in the conventional laminated body. Moreover, in a multilayer ceramic substrate having multiple internal-layer resistive elements arranged in a multilayer structure, multiple internal-layer resistive elements are directly connected via multiple via-electrodes arranged in parallel.

Abstract: A ceramic heater includes a core material and a ceramic sheet covering the core material, and wherein a side of the ceramic sheet opposite the core material is an outer side of the ceramic heater. A method for manufacturing the ceramic heater includes forming a through hole in a ceramic sheet which is diametrically enlarged from a first surface toward a second surface of the ceramic sheet, forming a via conductor, forming on the second surface a heating portion and lead portion for connecting the heating portion and the via conductor, and covering a core material with the ceramic sheet such that the first surface faces an outer side of the ceramic heater.

Abstract: The present invention relates to an adjustable resistor embedded in a circuit board and a method of fabricating the same. The adjustable resistor comprises a resistor with a number of connection terminals, and a number of via holes extending to contact with the resistor. The resistive value of the resistor is variable depending on the size of the via holes, the number of the via holes, or the distance between the via holes.

Abstract: A low-capacitance multilayer chip varistor has capacitance lower than 0.5 pF at 1 MHz and has a characteristic of resisting more than thousands of times of 8 KV electrostatic shock, which comprises a ceramic main body, outer electrodes disposed at two ends of the ceramic main body and inner electrodes disposed therein; the ceramic main body comprises inorganic glass of 3˜50 wt % and semi-conductive or conductive particles of 50˜97 wt % with particle size of more than 0.1 ?m, and a layer of inorganic glass film covers the surface of semi-conductive or conductive particles, wherein the inorganic glass film contains semi-conductive or conductive particles of submicron or nanometer which is smaller than 1 micron, and the quantity contained of semi-conductive or conductive particles is less than 20 wt % of that of inorganic glass.

Abstract: The present invention provides a novel method for electrical connection between a polymer PTC device and a metal lead element to thereby prevent the problems of the connection by caulking or soldering. For this purpose, the present invention provides a process for producing a connection structure by laser welding, said connection structure having (A) a PTC device (10) including (i) a laminar polymer PTC element (12) and (ii) a metal foil electrode (14) disposed on a main surface of the laminar polymer PTC element (12), and (B) a metal lead element (20) electrically connected to the metal foil electrode. The metal foil electrode (14) has at least two metal layers, one of which, the X-th layer, has laser beam absorption a % that is the lowest among the metal layers of the metal foil electrode (14). The X-th layer is present between a first metal layer (18) of the metal foil electrode and the laminar polymer PTC element (12).

Abstract: The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.

Abstract: A method of manufacturing a PTC element comprising a pair of lead terminals bonded together by thermocompression with a matrix held therebetween comprises a matrix preparing step of preparing a matrix constructed by dispersing a conductive filler into a crystalline polymer; a terminal preparing step of preparing a pair of lead terminals holding the matrix therebetween, a surface of each lead terminal facing the matrix being formed with a plurality of anchor protrusions separated from each other; a flattening step of flattening the anchor protrusions formed in respective nonoverlapping areas in the pair of lead terminals kept from overlapping the matrix; and a thermocompression bonding step of holding the matrix between respective overlapping areas in the pair of lead terminals overlapping the matrix, and securing the pair of lead terminals and the matrix together by thermocompression bonding.

Abstract: A chip resistor includes a metal resistor element having a flat lower surface. The lower surface is formed with two electrodes spaced from each other, and an insulating resin film is formed between these electrodes. Each of the electrodes partially overlaps the insulating film so that a portion of the insulating film is inserted between each of the electrodes and the lower surface of the resistor element.

Abstract: A microelectronic assembly, including a microelectronic element such as a semiconductor chip and a dielectric material covering the chip and forming a body having a bottom surface. The assembly includes conductive units having portions exposed at the bottom surface, posts extending upwardly from said exposed portions and top flanges spaced above the bottom surface.

Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.

Abstract: A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other.

Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.

Abstract: An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 &mgr;m thick electrodes such as chip resistors, chip capacitors, and chip inductors.

Abstract: A first rotor and a second rotor are prepared. The first rotor has a resistor and inner-peripheral and outer-peripheral electrodes respectively connected to end portions of this resistor. The second rotor has a resistor and inner-peripheral and outer-peripheral electrodes symmetrical with those of the first rotor, provided at a position corresponding to that obtained by rotating the first rotor about the axis of the first rotor by an angle of 180° with respect to the first rotor. A variable resistor selectively uses either one of the first rotor and second rotor. This makes it possible to provide a variable resistor which requires few parts. Also, this makes it possible to reduce the kinds of bending operations that must be performed on the terminals.

Abstract: A printed circuit board having resistors formed therein. A conductive layer composed of two different metals is provided on top of an insulating layer in a printed circuit board. The first metal layer is highly conductive and the second metal layer is highly resistive. For a major portion of the layer, both layers are connected electrically in parallel so that they provide a highly conductive path. At selected locations throughout the printed circuit board, the highly conductive metal is removed providing only the high resistivity metal to act as a resistor between selected locations in the conductive layer. Many resistors are formed at the same time, thus providing ease of fabrication and precision in resistor values across the entire printed circuit board. Following the formation of the resistor, additional insulating and conductive layers are formed to complete the printed circuit board.

Abstract: A surface mountable electrical devices includes a PTC resistive element having opposite first and second surfaces and lateral faces interconnecting the first and second surfaces, spaced apart first and third electrode layers formed on the first surface, a second electrode layer formed on the second surface, and a conductive layer. Each two adjacent lateral faces defines a corner that has a terraced face. The conductive layer has a first lateral segment formed on the third electrode layer, a second lateral segment formed on the second electrode layer, and a transverse segment formed on the terraced face of one of the corners and having a terraced cross-section.

Abstract: An electronic device includes two or more conductive polymer layers sandwiched between two external electrodes and one or more internal electrodes.

Abstract: A conductive polymer PTC device includes upper, lower, and center electrodes, with a first PTC conductive polymer layer between the upper and center electrodes, and a second PTC conductive polymer layer between the center and lower electrodes. Each of the upper and lower electrodes is separated into an isolated portion and a main portion. The isolated portions of the upper and lower electrodes are electrically connected to each other and to the center electrode by an input terminal. Upper and lower output terminals are provided, respectively, on the main portions of the upper and lower electrodes and are electrically connected to each other. The resulting device is, effectively, two PTC devices connected in parallel, thereby providing an increased effective cross-sectional area for the current flow path, and thus a larger hold current, for a given footprint.

Abstract: The present invention is to offer a resistor which can be mounted exactly on the terminals disposed on a circuit board regardless the sides of the resistor, and to offer its manufacturing method by forming the surface of the side-electrode layer at a height higher than the surface of protection layer, or by forming the surface of the second surface electrode layer at a height higher than the surface of protection layer. By these, the resistor can be mounted exactly on the terminal of circuit board at a high yield. Furthermore, since the first surface electrode layer and the second upper electrode layer are electrically connected together through a window provided on the protection layer, a higher connection reliability can be obtained.

Abstract: A composition material for use in manufacturing a varistor consists of the following constituents:a) zinc oxide,b) ceramic structure influencing additives selected from the group consisting of bismuth oxide, boric acid, chromium oxide, cobalt oxide, manganese oxide and tin oxide,c) a grain growth influencing additive selected from the group consisting of antimony oxide, silicon dioxide and titanium dioxide,d) an organic solvent carrier,e) an organic viscosity influencing additive, andf) an organic binder.The composition may serve as a ceramic ink for use in the manufacture of multilayer varistors, especially using a screen printing process.A multilayer varistor with pin receiving apertures has a plurality of electrode segments coplanar to each other surrounding the apertures.

Abstract: An electrical device having a resistive element having a first electrode in electrical contact with the top surface of the resistive element and a second electrode in electrical contact with the bottom surface of the resistive element. An insulating layer is formed on the first and second electrodes. A portion of the insulating layer is removed from the first and second electrodes to form first and second contact points. A conductive layer is formed on the insulating layer and makes electrical contact with the first and second electrodes at the contact points. The conductive layer has portions removed to form first and second end terminations separated by electrically non-conductive gaps. The wrap-around configuration of the device allows for an electrical connection to be made to both electrodes from the same side of the electrical device.

Abstract: An electrically powered functionally graded ceramic composite heater and a functionally stepped ceramic composite heater useful for cigarette lighters. The electrical resistance heater includes discrete heating zones wherein each zone of the heater can be activated using an electric control module, and is capable of heating to a temperature in the range of 600.degree. C. to 900.degree. C. using portable energy devices. The ceramic heater can be made by pressing together layers of differing amounts of constituents of the ceramic precursor material followed by secondary processing steps to obtain discrete heating elements. The heater design can include a hub on one end to provide structural integrity, and function as a common for the heating zones.

Abstract: A three dimensional polysilicon resistor and a method by which the three dimensional polysilicon resistor is manufactured. A semiconductor substrate has formed upon its surface an insulating layer. The insulating layer has a minimum of one aperture formed at least partially through the insulating layer. A polysilicon layer is formed upon the insulating layer and formed conformally into the aperture(s) within the insulating layer. The polysilicon layer is then patterned to form a resistor which includes the portion of the polysilicon layer which resides within the aperture(s).

Abstract: Electrical devices, particularly circuit protection devices, contain conductive polymer elements whose edges are formed by breaking the conductive polymer element, along a desired path, without the introduction of any solid body into the element. The resulting cohesive failure of the conductive polymer produces a distinctive fractured surface. One method of preparing such devices involves etching fracture channels in the electrodes of a plaque containing a PTC conductive polymer element sandwiched between metal foil electrodes, and then snapping the plaque along the fracture channels to form individual devices.

Abstract: A circuit protection device which comprises first and second laminar electrodes; a laminar PTC conductive polymer resistive element sandwiched between the electrodes; a third laminar conductive member which is secured to the same face of the PTC element as the second electrode but is separated therefrom; and an electrical connector which connects the third conductive member and the first electrode. This permits connection to both electrodes from the same side of the device, so that the device can be connected flat on a printed circuit board, with the first electrode on top, without any need for leads. The connector is preferably a cross-conductor which passes through an aperture in the PTC element, because this makes it possible to carry out the steps for preparing the devices on an assembly which corresponds to a number of individual devices, with division of the assembly as the final step.

Abstract: Multi-terminal, layered capacitors having excellent attenuation characteristics over a wide frequency range. A four-terminal, layered capacitor has a dielectric sheet with an internal inductor electrode connecting an external input terminal to an external output terminal, dielectric sheets with internal capacitor electrodes connected to the external input terminal, and internal capacitor electrodes connected to the external output terminal, and dielectric sheets with internal ground electrodes connected to external ground terminals. All these dielectric sheets are integrally stacked and calcined to form a one-piece structure.

Abstract: Use is made of thermoplastic materials in layered configurations as a thermally stable, rigid but not brittle strip of lengths of six inches to ten feet or more. The layered strip contains layers of conductive fibers in a resin matrix, which, through use of appropriate contact mechanisms and wiring, provide an assembly with an infinite potentiometer scale. The strips are especially useful in linear positioning indicators such as pneumatic and hydraulic cylinder and liquid level gauges.

Abstract: A modular igniter system which preferably provides either direct electrical connection between the metallized ends of the hot surface igniter and the socket contact, or indirect electrical connection by a short lead wire held in place on the hot surface element by an active metal braze.

Abstract: A method for fabricating a thin film resistor comprises applying a tantalum nitride layer over a dielectric layer, applying a metallization layer over the tantalum nitride layer, and patterning the metallization layer with a first portion of the metallization layer situated apart from a second portion of the metallization layer and both the first and second portions being at least partially situated on the tantalum nitride layer. In one embodiment, after patterning the metallization layer, the resistance value between the first and second portions of the metallization layer is determined and compared to a predetermined resistance value, and at least one of the first and second portions is trimmed to obtain a modified resistance value between the first and second portions that is closer to the predetermined resistance value than the determined resistance value.

Abstract: An array of termination resistors has symmetrical geometry producing essentially no net magnetic field and a resultant low inductance is fabricated on a substrate as disk resistors. Conductive through vias are formed in the substrate in an array pattern defining what will be resistor first and second contacts. Each disk resistor has one first contact located at the resistor disk center, and preferably four second contacts located symmetrically about the resistor disk and shared by four adjacent disk resistors. For each resistor, a annular-shaped disk of resistive material is fabricated on a first surface of the substrate, such that a central opening in the disk overlies at least the upper surface of a first contact via. The disk geometry and material determines its resistance. Next, a layer of conductive material is formed over the first surface of the substrate to cover at least the periphery of each disk, and to fill the central opening in each disk.

Abstract: An electronic device which has, on a rectangular insulating substrate, an input electrode and an output electrode, grounding electrodes and a conductor for electrically connecting the input electrode and the output electrode. The input electrode and the output electrode are disposed on both ends of the substrate. The grounding electrodes are disposed on side surfaces of the substrate in the center, and the conductor is disposed on an upper surface of the substrate. The conductor is a conductor with a high conductivity, a resistor or a coil. A capacity is generated between the conductor and the grounding electrode. If the conductor is a resistor, an RC circuit is formed.

Abstract: A multi-layer module that has incorporated therein an additional sheet with a heat generating film resistor formed thereon. A temperature responsive controller regulates the film resistor current in order to regulate the temperature at the surface of the module. The invention is applicable to both single chip and multiple chip modules, and for multi-chip modules a plurality of discrete film resistors on a single may be used.

Abstract: A heater apparatus includes a substrate, a resistive film formed on a first portion of the substrate, and first and second conductive leads formed on the substrate engaging the resistive film. First and second electrodes are coupled to the first and second conductive leads, respectively. The heater apparatus also includes an overmolded body made of an insulating material formed on the substrate to encapsulate the resistive film, the first and second conductive leads, and a portion of the first and second electrodes in an insulating material. The substrate is formed to include first and second apertures in close proximity to the first and second conductive leads, respectively. The first and second electrodes each include a tab portion extending through the first and second apertures, respectively. The tab portions are deformed so that the tab portion of the first electrode engages the first conductive lead and the tab portion of the second electrode engages the second conductive lead.

Abstract: A low profile load resistor includes a base plate of an electrically conductive material having a pair of opposed flat surfaces and a hole therethrough. A chip resistor is mounted on one of the surfaces of the base plate. The chip resistor includes a substrate of an electrical insulating material having a pair of opposed flat surfaces and a hole therethrough which is aligned with the hole in the base plate. A resistance film is on one of the surfaces of the substrate and has termination films at opposite ends thereof. A termination tab is electrically connected to one of the termination films and extends through the holes in the substrate and base plate. The other termination film is electrically connected to the base plate. A cover plate of an electrical insulating material is over the resistor film and is mechanically connected to the substrate.

Abstract: An electronic circuit device decreases dispersion in the output of the circuit caused by changes in the resistance of the resistors resulting from stress. Resistor positions are selected on the circuit board so that a change in the circuit output caused by a change in resistance of a first resistor group becomes equal to a change caused by a change in resistance caused by a second resistor group, these changes being in opposite directions so as to cancel each other. Alternately, a plurality of resistors are connected to form a composite resistor such that the effect upon resistance of the composite resistor caused by the resistor having decreased resistance is cancelled by the effect upon resistance of the composite resistor caused by a resistor having an increased resistance.

Abstract: An ignitor for fuel gas burners formed of a plurality of spaced parallel filaments of SiC coated Carbon (C) high temperature brazed with Chromium Silicide in grooves provided in a refractory base block of Aluminum Oxide and Silicon Oxide. Terminal posts of IVIoSi are embedded in the high temperature braze. Stainless steel lead attachment pads are nickel-chrome brazed to the posts at a lower temperature. Removable notched graphite bridges and graphite hold-down blocks position the filaments during the high temperature brazing.

Abstract: A resistor 1 in which at least one resistance film 4 is embedded in a ceramic sintered body 3, glass is diffused into the sintered body 3 to form a glass diffusion layer 6, and both end faces 4a and 4b of the resistance film 4 are respectively exposed to both end faces 3a and 3b of the ceramic sintered body 3.

Abstract: An exothermic resistor for use in a hot wire air flow meter, having a wire (2) in the form of a coil made of a metal, a pair of lead wires (3) connected to connections (21) formed at the opposite ends of the coil, and a support member (4) which integrally supports the connections as well as the coil located between the connections. An example of the support member is in the form of a tubular cylinder closed at its both ends. The support member is formed from glass only or formed of a layer of a glass-ceramic-composite material. The hot wire air flow meter is designed to be easely mass-produced and to have improved transient response characteristics with respect to abrupt changes in the air flow rate.

Abstract: A resistor and method of forming the resistor as an annular resistor body between a conductive pad surrounding a through-hole in the PCB and a surrounding conductive layer, the annular resistor body being formed from a conductive material having a selected resistivity, the outer and inner perimeters of the annular resistor body preferably being substantially constant radii whereby the operative resistance of the annular resistor body may be simply determined from the radii of its outer and inner perimeters, an effective thickness of the annular resistor body and its resistivity, the annular resistor body more preferably being formed from a liquid precursor facilitating formation of conductive interconnections at its outer and inner perimeters.

Abstract: The film-type electrical power resistor includes a flat ceramic chip on the upper surface of which is screen-printed a resistive film. Terminals (leads) are mechanically and electrically connected to the upper chip surface, the terminals being such that the chip may be positioned by the terminals in a predetermined position in a mold cavity during manufacture of the resistor--prior to introduction of synthetic resin. The synthetic resin forms a molded electrically insulating body that embeds the portions of the terminals that are relatively near the chip, and also embeds the upper portion of the chip, but does not embed the bottom surface of the chip. The relationships are such that the lower chip surface may be engaged flatwise with a flat region of a chassis or heatsink. Accordingly, the chip is a substrate for the film, a heatsink for the film, an insulator maintaining the film electrically insulated from the chassis, and a spacer maintaining the terminals spaced from the chassis.

Abstract: A hot-wire type flowmeter for measuring a flow rate of a fluid in a passage comprises a pair of support pins extending in parallel with an axis of the passage and an electrical resistor supported between the support pins in the passage. The resistor includes a pipe made of an electrically insulating material, a resistor wire wound on the pipe, and a pair of lead wires. The lead wires are secured to opposite end portions of the pipe and extend in opposite directions and in parallel to each other. The resistor is supported by the support pins through the lead wires.

Abstract: A ceramic soldering element, which is utilized in reflow soldering of electrical components that have a multitude of thermal legs, comprises a ceramic substrate, which is thermally conductive but electrically insulating, has a plurality of heating resistors disposed along an edge of the substrate, which edge forms a soldering edge and an arrangement consisting of metal layers on opposite surfaces of the substrate for applying electrical current to each of the heating resistors.

Abstract: A thin-film thermistor element which has an electrically insulating substrate having first and second surfaces opposite to each other and also having a pair of through-holes defined therein so as to extend completely across the thickness thereof, and a pair of electrode films each including a body portion of large surface area and a generally comb-shaped portion continued outwardly from the body portion. The electrode films are formed by the use of a firing process on the first surface of the substrate with the respective comb-shaped portions thereof confronting with each other. First and second electroconductive films are also formed on respective surrounding wall faces defining the corresponding through-holes in the substrate in electrically connected relationship with the body portions of the associated electrode films. A temperature sensitive resistance film is formed by the use of a high frequency sputtering process on the first surface of the substrate so as to overlay the electrode films.

Abstract: A sensor for thermal mass flowmeters is described herein. The sensor includes a plate-shaped, thin-film resistor and a cylindrical holder into which the resistor is fastened. In order to fasten the thin-film resistor in a mechanically stable manner, the end surface of the holder is provided with a pocket hole which closely matches the cross section of the thin-film resistor. The thin-film resistor is suitably inserted into this pocket hole and fastened therein with an adhesive agent.

Abstract: A resistor element for determining a parameter, including a planar ceramic substrate having a bearing surface and at least one aperture formed through the thickness thereof, an electrically resistive metallic layer which is substantially formed on the bearing surface of the ceramic substrate and has at least one extension which covers an inner wall surface of the above-indicated at least one aperture, a pair of conductors for connecting the resistive metallic layer to an external circuit, at least one of the pair of conductors being inserted into a corresponding one of the above-indicated at least one aperture of the ceramic substrate, and an electrically conductive adhesive at least partially filling each of the above-indicated at least one aperture, for securing an end portion of the corresponding one of the pair of conductors to the ceramic substrate, the electrically conductive adhesive electrically connecting the above-indicated at least one conductor to the above-indicated at least one extension of the

Abstract: A resistor substrate for a variable resistor of the enclosed type which may be employed in a throttle sensor of an automobile. The resistor substrate has a disk portion and a rectangular apron provided at a circumferential portion of the disk portion. The apron is stepped with respect to the disk portion to form a reduced thickness portion, and a plurality of projections each having an arcuate section in a widthwise direction are formed at end portions of the reduced thickness portion of the apron. A plurality of terminals are embedded at base portions thereof in the disk portion and extend along a surface of the reduced thickness portion of the apron. The terminals individually have arcuate protruded portions formed therein in accordance with a configuration of the projections of the apron, and the projections individually have lateral holes formed therein in an opposing relationship to the protruded portions of the terminals such that they extend to the protruded portions.

Abstract: A process of automatic sequential production of potentiometers, and potentiometers obtained thereby. The potentiometers are generally low profile rotary-type potentiometers. The potentiometers are formed with a low profile cylindrical casing into which is inserted a laminate electrical resistance element of an incomplete annular shape, the ends of which remain connected to terminals. The casing engages a slider, which is in permanent mechanical and electrical contact with the resistance element and a collector terminal. The slider is assembled on a slider-holder rotatably attached through an aperture formed axially through the body and which is operable from the external surface of the casing. The process consists of automatically assembling the potentiometers in an in-line process. The metallic components are formed on a continuous metallic band by die-cutting the band to produce such components.

Abstract: A mechanism for a potentiometer, especially a miniature potentiometer used as a volume control in a hearing aid, onto a face plate includes a metallic band circumferentially surrounding a portion of the housing of the potentiometer. The band includes means for mechanically engaging a surface of an aperture in the face plate such that the housing is secured within the aperture. Preferably, the potentiometer also includes a stop means that engages a shoulder or surface of the face plate of the hearing aid positioning the potentiometer within the aperture a selected distance such that the knob of the potentiometer extends beyond a front surface of the face plate.