Abstract: The present invention is a load resistor that receives power transmitted from an apparatus and performs an energization test on the apparatus. The load resistor is characterized by comprising a rod-shaped resistive base body that is energized with the power and generates heat, a pipe-shaped protective member through which the rod-shaped resistive base body penetrates, and rod-shaped resistors having an insulation member that are packed in between the rod-shaped resistive base body and the protective member, the rod-shaped resistive base body having used therein a stretched nichrome wire that is wound in the shape of a coil.

Abstract: Reliable flow sensors with enclosures that have predictable thermal variations and reduced mechanical tolerances for a more consistent fluid flow and more consistent flow measurements. Thermal variations can be made predictable by using etched structures in silicon blocks. Mechanical tolerances can be reduced using lithography and high-precision semiconductor manufacturing equipment and techniques.

Abstract: A load test system performs a load test of an emergency generator. The load test system includes a plurality of chargers having an AC/DC conversion function being connected in parallel, to which AC power generated from an emergency generator is inputted, and a storage battery to which AC power inputted to the plurality of chargers having the AC/DC conversion function being connected in parallel is converted into DC power of a predetermined output voltage and then inputted at an input voltage being set to substantially the same value as or lower than the output voltage.

Abstract: The microflow sensor includes a base wafer having opposed upper and lower surfaces, and a cap wafer, also having opposed upper and lower surfaces. The base wafer and the cap wafer may be formed from a semiconductor material. A flow sensing element is embedded in the upper surface of the base wafer. The flow sensing element may be any suitable type of flow sensing element, such as a central heater and at least one temperature-sensitive element. A flow channel is formed in the lower surface of the cap wafer and extends continuously between first and second longitudinally opposed edges of the cap wafer. The lower surface of the cap wafer is bonded to the upper surface of the base wafer such that fluid flowing through the flow channel passes above and across the sensing element.

Abstract: A sensor for determining at least one process variable of a medium, comprising: a metallic substrate which has a recess at least in a first area; a first dielectric layer which is arranged on the metallic substrate at least in the first area, wherein the first dielectric layer forms a membrane; at least one heating structure which is arranged on the first dielectric layer formed as a membrane in the first area, wherein the heating structure heats the medium; at least one temperature sensor element assigned to the first area, which temperature sensor element is arranged so as to be spaced apart from the heating structure on the first dielectric layer and detects the temperature of the medium heated on the heating structure; and at least one protective layer which covers at least the at least one heating structure and the at least one temperature sensor element.

Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.

Abstract: An electrical heating conductor arrangement for heating a furnace has one or more strip-shaped portions with a generally horizontal sheet-like extent. The strip-shaped portions are formed by individual bands which have along their width an arcuate curvature with respect to a horizontal plane. The individual bands are partially mounted by at least one bearing element pivotably in the longitudinal direction of the respective band.

Abstract: A portable battery operated heater powered by a battery includes a housing having an air inlet formed at a rear wall and an air outlet formed at a front wall, the housing further comprising an interiorly concave portion extending from the rear wall to the front wall, the interiorly concave portion directing a flow of air from the air inlet to the air outlet; a fan electrically connectable to the battery, the fan being disposed within the housing for creating the flow of air; and a heating element electrically connectable to the battery, the heating element being interposed between the air inlet and the air outlet in such manner that the flow of air passes over the heating element and is heated thereby.

Abstract: A multiple stage open coil electrical resistance heater uses a unique coil configuration on either side of a dividing support plate so that the air passing through the heater is heated uniformly when one or more stages of the heater are energized. The coil configuration also creates a termination zone on one side of the heater so that the terminations of the coils can be situated on the cool side of the heater. The heater coils also includes specially configured terminals to facilitate connection to power using an elongated member such as a stud or bolt.

Abstract: An open coil electrical resistance heater uses a number of offset insulators to support the coil of the heater. The offset insulators configure the run of coil in a sinusoidal shape to hold the insulators in a more secure manner and reduce vibration and noise generation during heat operation. The sinusoidal configuration of the coil also reduces the problem of shadowing of portions of the resistance wire coil.

Abstract: An electro-optical device includes: a substrate; a plurality of wiring lines which is formed on the substrate; and an IC which is mounted on the substrate so as to be electrically connected to the plurality of wiring lines. At least a pair of wiring lines among the plurality of wiring lines include a first conductive layer formed on the substrate and a second conductive layer formed on at least the first conductive layer. The first conductive layer and the second conductive layer have different resistance values. The first conductive layer of one of the pair of wiring lines has a plurality of first resistors each extending toward the other wiring line, and the second conductive layer of the other wiring line has a second resistor extending toward the one wiring line. The plurality of first resistors is connected to the second resistor.

Abstract: An improved high-power resistor comprising a housing which can be or is traversed by a cooling medium and in which one or more resistance elements are provided.

Abstract: A thermally stabilized device is described. Single or multiple input ports are accommodated and single and multiple power ports are described. The variation of resistance of a resistor subject to varying power dissipations is minimized by injecting complementary power dissipation and thermally linking it to the resistor. In this manner the temperature of a resistor may be maintained constant even though it dissipates varying amounts of power.

Abstract: A precision AC input voltage divider of input resistance RI and feedback resistance RF on a substrate is printed as a serpentine pattern for a thin line of resistive material. The input resistance is formed between a first and second terminal, and feedback resistance is formed between the second terminal and a third terminal. A first metallic conductor is formed on the substrate, connected to the first terminal, disposed to be adjacent to the input resistance, and having a distributed capacitive coupling to the input resistance that compensates for corresponding distributed stray capacitance from the input resistance to a circuit ground. A second metallic conductor is formed on the substrate, connected to the third terminal, disposed to be adjacent the feedback resistance, and having a distributed capacitive coupling to the feedback resistance that compensates for corresponding distributed stray capacitance from the feedback resistance to the circuit ground.

Abstract: A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.

Abstract: A device for electrically heating a vertically erect chamber comprising several heating zones arranged vertically one above the other. The components of the device, with the exception of the insulating components, are made from graphite materials. Each zone (Z) comprises a number of supports (1), arranged in an essentially even distribution around the chamber for heating, which simultaneously serve as electrical supplies for the heater, and the heater for each zone (Z) is fixed at one end and longitudinally displaceable at the other end.

Abstract: A method and apparatus for a stacked power chip resistor is disclosed. The invention provides for multiple power chip resistors to be stacked, providing for encapsulant such as glass to separate each power chip resistor and a metal barrier such as nickel plating on each end of the stacked power chip resistor to provide for electrical and mechanical connection of each power chip resistor in the stack.

Abstract: A high-power resistor comprises a plurality of resistor elements (1), made of sheets of an electrically conductive resistance material, with a first (13) and a second (14) terminal. The resistor elements are mutually separated by disc-shaped insulating first shims (2). Said first and second terminals are connected to adjacently located resistor elements so that the respective first terminals are connected to a first terminal and that the respective second terminals are connected to a second terminal. Two adjacent resistor elements form a current path, whereby, viewed in a direction perpendicular to the plane of the sheets, said first and second terminals, respectively, are so mutually positioned that, for a current supplied thereto, the current path in one resistor element substantially overlaps the current path in an adjacent resistor element and hence carries current in mutually opposite directions in the two adjacent resistor elements.

Abstract: A high voltage resistor comprising an array of a plurality of parallel electrically connected resistor elements each containing a resistive solution, attached at each end thereof to an end plate, and about the circumference of each of the end plates, a corona reduction ring. Each of the resistor elements comprises an insulating tube having an electrode inserted into each end thereof and held in position by one or more hose clamps about the outer periphery of the insulating tube. According to a preferred embodiment, the electrode is fabricated from stainless steel and has a mushroom shape at one end, that inserted into the tube, and a flat end for engagement with the end plates that provides connection of the resistor array and with a load.

Abstract: In accordance with the invention, a temperature compensating device comprises one or more integrated sheet thermistors. Because the sheet thermistors are relatively thick and integral with the substrate, they are less susceptible to changes in air temperature and to temperature gradients. Moreover, the sheet thermistors can be made smaller in area, permitting more compact, less expensive devices that exhibit improved high frequency performance. The devices can advantageously be fabricated using the low temperature co-fired ceramic (LTCC) process.

Abstract: An electrical current sensor and utility electricity meter, the current sensor comprising a &pgr; resistor shunt configuration, wherein the resistors comprise layered conductors at substantially equal temperatures to provide a zero temperature coefficient sensor. A fiscal electricity meter is described together with a four-layered current sensor fabricated using PCB techniques.

Abstract: A dry load test apparatus 40 comprises multi stage resistor bodies 57R, 57S and 57T for high voltage load tests. having a large number of flat shaped resistor assemblies Ri, Si and Ti consisting of numerous elongate resistor elements rj provided side by side in a flat shape with interval and serially connected at an end thereof, said large number of resistor assemblies Ri, Si and Ti being provided side by side with multi stages with interval in order that flat planes thereof become parallel so that numerous resistor element columns which are formed with corresponding said resistor elements rj of the multi stage resistor assemblies Ri, Si and Ti are provided.

Abstract: Resistors for use in electrical circuits are formed of an alloy comprising from about 50 to about 95 mol percent aluminum, from about 5 to about 50 mol percent titanium and up to about 15 mol percent of at least one additional metal or a combination of two or more additional metals.

Abstract: Enhanced linearity, low switching perturbation resistor string matrices. The resistor strings are arranged in an array of a plurality of rows of resistive elements and electrically arranged with rows equally spaced above and below the physical centerline of the array being coupled together in an opposite sense. Preferably also physically adjacent rows are equally spaced from the center of the electrical order of rows. This connection prevents accumulation of errors due to vertical and horizontal resistance gradients over the array. Also node selection by controlling node select transistors coupled to column select lines to select one node in each row, and also controlling row select transistors to select the row of the desired node minimizes settling time after a tap change by inducing equal and opposite voltage changes at points close together along the resistor string, whether in the array of the present invention or in the snake configuration.

Abstract: A plurality of protective resistors can be easily inserted between circuit forming elements, and opposite ends of each protective resistor can be properly press-contacted to each circuit forming element. The protective resistor can be easily replaced when broken. A resistor array board comprises a porous plate having a plurality of through-holes arranged in array and opening at opposite surfaces thereof; and a plurality of protective resistors removably loosely inserted into the through-holes, respectively. Each of the protective resistors are resiliently retained by an electrically conductive spring element, and opposite ends of each of the protective resistors are press-contacted with the circuit forming elements which are arranged in opposing relation on surfaces of the porous plates.

Abstract: The present invention relates, in one embodiment, to an integrated circuit including a first circuit structure, a first conductive bonding pad coupled to the first circuit structure, a second circuit structure, and a second conductive bonding pad coupled to the second circuit structure. The first conductive bonding pad is arranged to be separated from the second bonding pad by a gap having a gap dimension. The gap dimension is configured to be bridged by a wire bond, thereby permitting the wire bond to electrically couple the first conductive bonding pad with the second conductive bonding pad when the wire bond is coupled to the first bonding pad and the second bonding pad at the gap.

Abstract: A plurality of PTC material layers and a plurality of metal plates are sandwiched together with one adjacent pair of metal plates connected in series through one layer of PTC material. The remaining PTC material layers are connected in parallel with the one layer by selectively interconnecting the other metal plates with the one adjacent pair of metal plates.

Abstract: An electric element mounting system including a housing and at least one heating element. Each element includes a frame having a longitudinal axis and a distal end, a heating coil and a wire terminal for electrically and mechanically coupling the element to the front panel. A substantially planar mounting bracket is located within the housing; the bracket including at least one aperture. The bracket is located within the housing and placed in a plane perpendicular to the longitudinal axis of the frame so that the distal end is placed through the aperture to mount the element upon the bracket.

Abstract: A continuous ribbon resistor element having a plurality of conjunctive lengths alternately connected by reflexes is supported in a frame comprised of silicon bonded laminated mica. The ribbon elements are formed with a single, flat convolution center offset to one side of an original plane and lateral portions offset to an opposite side of the plane, joined to the center offset by transition portions such that the centroid for any transverse cross section lies on the original plane. The offsets originate at flat end portions near the reflexes and have maximum offset intermediate the ends. Metal members are received in openings of the laminated mica insulators to receive threaded fasteners when attaching an insulator in edge-wise relationship to another. Thermally conductive termination connections are brought outside the frame and airflow passageway to remove from the passageway the additional heat otherwise absorbed by the terminals.

Abstract: The current-limiting resistor has two connection electrodes (1, 2) which are arranged parallel to one another, a resistance body (3) which has PTC behavior and with which large-area contact is made by the connection electrodes (1, 2) and at least one varistor (4) which is in electrically conductive contact with the resistance body (3). The varistor (4) is of pillar-shaped design and has at least two first portions (4a) routed predominantly perpendicularly to the varistor axis and, arranged between said portions, a second portion (4b) having a reduced cross section compared with each of the first portions (4a). The material of the resistance body (3) fills an interspace (6), which is formed by the at least two first portions (4a) and the second portion (4b), and encloses the outwardly pointing edges (4c) of the at least two portions.This resistor can be operated at high voltages, for example 5 or 10 kV, and advantageously has a single resistance body 3 and a single varistor.

Abstract: A heater unit 1 has a plurality of flat heaters 11 adjacently arranged side by side and having common upper and lower surfaces. The thickness T of the heaters 11 is substantially uniform. Each heater 11 has an adjacent end surface 111 which faces toward an adjacent end surface 111 of the adjacent heater 11. The heater unit 1 also has upper and lower electrodes 21 holding the heaters 11 and respectively attached to the upper and lower surfaces of the heaters 11. The adjacent end surfaces 111 of the heaters 11 adjoining each other, and the upper and lower electrodes 21 form an air gap 12 therebetween. The creepage distance L along each adjacent end surface 111 is larger than the thickness T of the heaters 11. The dielectric strength of the heater unit 1 depends on the creepage distance L. The thickness T of the heaters 11 can be decreased without decreasing the dielectric strength of the heater unit 1. The output of the heater unit 1 increases when the thickness T is decreased.

Abstract: A chip-type composite electronic component according to the present invention comprises an insulating substrate (1), a common electrode (2) formed on the substrate (1), a plurality of individual electrodes (3a-3h) formed on the substrate (1) to be spaced from the common electrode (2), and a plurality of electronic elements (4a-4e) each interposed between each of the individual electrodes (3a-3h) and the common electrode (2). Each of the common electrode (2) and individual electrodes (3a-3h) has a plated solder layer as an outermost layer. Each of the electronic elements (4a-4e) has a direct current resistance of no less than 47K .OMEGA., and the solder layer of the common electrode (2) has a layer thickness which is no more than 2.9 times as great as that of the solder layer of the individual electrodes (3a-3h).

Abstract: A smoking system is provided in which a replaceable cigarette containing tobacco flavor material is electrically heated by a set of electrical heater elements contained within a lighter to evolve tobacco flavors or other components in vapor or aerosol form for delivery to a smoker. The cigarette and lighter are adapted to provide air flow patterns through the smoking system such that air flows transversely into the cigarette. Such patterns improve aerosol and flavor delivery to the smoker and reduce the condensation of residual heater-region vapor/aerosol in the smoking system.

Abstract: A resistor grid assembly has a continuous resistor weave with a plurality of generally parallel, plate-like electrical elements. U-shaped bends join two adjacent elements at adjacent ends. The U-shaped bends are located in a bottom group and a top group. There is a top electrical insulating member adjacent the U-shaped bends in the top group and spaced from the U-shaped bends. There is a bottom electrical insulating member adjacent the U-shaped bends in the bottom group. Stop U-shaped pins having a pair of legs with a pair of shoulders are supported by the bottom electrical insulating member. The legs of each stop U-shaped pin extends into a pair of holes in the bottom group of U-shaped pins and rest upon the shoulders which are spaced from the insulator. Wire U-shaped pins are supported by the top electrical insulating member. The wire U-shaped pins have legs inserted into holes in the U-shaped bends in the top group. The U-shaped bends in the top group are spaced from the top insulator.

Abstract: A resistor network is disclosed which is suited for surface mount which does not incorporate wire terminations. The network is fabricated entirely from cermet, ceramic, and solder, yet will absorb thermal stresses normally associated with circuitry energization when properly mounted upon a substrate. This is accomplished by controlling the formation of solder bumps and simultaneously controlling the mounted distance between those bumps and a wiring substrate upon which the network is mounted. Additionally, the network may be formed to be either a SIP or DIP configuration, depending upon whether an additional groove is incorporated into the termination side of the substrate. Two alternative embodiments are also disclosed which incorporate various features of the invention.

Abstract: An ignitor for fuel gas burners formed of a plurality of spaced parallel filaments of SiC coated Carbon (C) high temperature brazed with Chromium Silicide in grooves provided in a refractory base block of Aluminum Oxide and Silicon Oxide. Terminal posts of IVIoSi are embedded in the high temperature braze. Stainless steel lead attachment pads are nickel-chrome brazed to the posts at a lower temperature. Removable notched graphite bridges and graphite hold-down blocks position the filaments during the high temperature brazing.

Abstract: A modular type heating unit or assembly having particular utility for use in a high temperature electric furnace, preferably in a group arrangement, comprises an insulating fibrous refractory block, a pair of spaced apart support rods, inner and outer support tubes and a heating element. Both the heating element and the support rods are formed of alloys to enable operation at relatively high temperatures. By utilizing this concept of modular element/insulation units, furnaces can be operated at relatively higher temperatures than is currently possible for exposed electrical element type furnaces.

Abstract: An improved frame supported resistor grid used for dynamic braking of electric motors is provided. The resistor grid has a metal frame and fan-folded strips of resistance material arranged in columns within the frame. The strips of resistance material are supported by studs affixed to the folds of the strips and the studs are, in turn, supported in ceramic bushing insulators. An intermediate member is affixed to the frame and receives the individual ceramic bushing insulators.

Abstract: A trimmable resistor network including a plurality of series-connected sections each including a plurality of paralleled link resistors each capable of being cut so as to be eliminated from the network, the paralleled resistors in each section having resistance values such that the section resistance changes by at least approximately integral multiples of a fixed amount when the resistors are cut.

Abstract: A temperature sensor includes a ceramic layered product having a multilayer structure formed of a plurality of ceramic sheets, a plurality of resistive patterns, containing copper or nickel, formed on major surfaces of the plurality of ceramic sheets respectively, a conductive path passing through the ceramic sheets for series-connecting the plurality of resistive patterns with each other, and respective terminals connected to both ends of the series-connected plurality of resistive patterns. The ceramic sheets being formed of an unreducible ceramic material prepared from a TiO.sub.2.BaO.CaO.ZrO.sub.2 compound.

Abstract: A temperature sensor includes a ceramic layered product having a multilayer structure formed of a plurality of ceramic sheets containing an unreducible ceramic material, a plurality of resistive patterns, containing copper or nickel, formed on major surfaces of the plurality of ceramic sheets respectively, a conductive path passing through the ceramic sheets for series-connecting the plurality of resistive patterns with each other, and respective terminals connected to both ends of the series-connected plurality of resistive patterns.

Abstract: A resistor grid for dynamic braking of diesel electric locomotives has a rigid frame comprising outer metal side pieces and metal dividers within the frame between which are positioned columns of fan-folded resistor ribbon. The dividers carry support plates having transverse aligned tabs along both sides fixed normal to the support plate, each tab having a notch in its inside edge, supported plates which slide in those slots longitudinally, the supported plates and the folds of the resistor ribbon carrying studs and bushings which interfit by movement normal to those plates.

Abstract: A high power resistor grid assembly formed of a plurality of stainless steel resistor U-shaped elements arranged in a substantially parallel relationship welded together in a continuous path. Each element comprising a slotted rectangular sheet in a U-shape having elongated curved embossments to prevent warpage of the element upon heating. Each U-shaped element has alternately a right and left leg offset to permit end to end attachments of elements while maintaining uniform spacing between the elements. The elements are supported by pairs of double insulated members which are affixed to the top and bottom of a frame with a floating end to permit expansion of the assembly upon heating and contraction upon cooling.

Abstract: An electric heating unit for heating fluid, such as air in a hair drier, includes two ring-shaped electrodes and a plurality of spaced, plate-like ceramic heating elements having a positive temperature coefficient of resistance (PTC) aligned between the electrodes. The electrodes comprise an inner ring and an outer ring disposed in a nested, concentric, spaced relationship. The PTC ceramic plates are radially arranged in aligned spaced relationship with the opposite ends of each PTC ceramic plate mechanically and electrically connected respectively to the inner and outer rings. The inner and outer rings can be formed as arc-shaped segments separated by gaps prevent damage to the PTC ceramic plates by heat strain, and are provided with slits, grooves, etc., for firmly positioning the PTC ceramic plates.

Abstract: A gaseous composition sensor which is a microstructure device comprising a heated planar thin film diaphragm sensor member suspended over a shallow flat bottomed etched pit in a single crystal silicon substrate.

Abstract: A semiconductor device comprising a semiconductor body having a depression formed into the first surface of the body. The device further comprises member means comprising first and second thermal-to-electric transducer or static electric element, the member means having a predetermined configuration suspended over the depression. The member means is connected to the first surface at least at one location, the depression opening to the first surface around at least a portion of the predetermined configuration. The depression provides substantial physical and thermal isolation between the elements and the semiconductor body. In this manner, an integrated semiconductor device provides an environment of substantial physical and thermal isolation between the transducer or element and the semiconductor body.

Abstract: A resistor network having resistor elements disposed equally spaced apart in parallel relation to each other and one or more insulation substrates to which the resistor elements are rigidly mounted. The substrates and the elements are all enclosed in a resin seal in the form of a belt. The resin seal is provided with one or more holes extending through it for dissipating heat. The holes are rectangular in shape, and are disposed between every two of the resistor elements or in other regular manner.

Abstract: A grid assembly for converting electrical energy to heat and then dissipating same. A plurality of parallel grid members include outwardly extending legs received in holes provided on mutually facing surfaces on polyester glass insulator members. The grid members are arranged in a continuous serpentine path from an input to an output terminal. The grid members are of sheet metal construction with the cylindrical legs formed by a radiused sheet metal configured leg portion of one grid member positioned adjacent an identical configured and mutually opposed leg portion of an adjacent grid member. The main body of each grid member extends from the legs through a flat portion and then through a diverging end portion spacing the main bodies of the grid members apart. In an alternate embodiment, the grid members are arranged with different lengths to provide a particular sized and configured grid assembly.

Abstract: A grid assembly for converting electrical energy to heat and then dissipating same. A plurality of parallel grid members include outwardly extending legs received in holes provided on mutually facing surfaces on polyester glass insulator members. The grid members are arranged in a continuous serpentine path from an input to an output terminal. The grid members are of sheet metal construction with the cylindrical legs formed by a radiused sheet metal configured leg portion of one grid member positioned adjacent an identical configured and mutually opposed leg portion of an adjacent grid member. The main body of each grid member extends from the legs through a flat portion and then through a diverging end portion spacing the main bodies of the grid members apart. In an alternate embodiment, the grid members are arranged with different lengths to provide a particular sized and configured grid assembly.

Abstract: Circuit protection devices which have a PTC conductive polymer element and an enclosure which is spaced apart from the PTC element and at least a part of whose interior surface is composed of a material which has an oxygen index of at least 70 and has a thermoset polymer, preferably an alkyd resin, and a filler, such as alumina trihydrate, which, when heated in the absence of air, decomposes to give a gaseous by-product.