With Heat Dissipating Projections (e.g., Vanes) Patents (Class 338/51)
  • Publication number: 20150042444
    Abstract: A resistor and an integrated heat spreader are provided. A resistive element having a first surface is in contact with electrically conducting terminals. A heat spreader is provided having at least a portion in thermally conductive contact with at least a portion of the first surface of the resistive element. The heat spreader comprising a thermally conducting and electrically insulating material, and has terminations, each termination adjacent to one of the electrically conducting terminals. Each termination is in thermally conducting contact with the adjacent electrically conducting terminal. A method of fabricating a resistor and an integrated heat spreader is also provided.
    Type: Application
    Filed: August 29, 2014
    Publication date: February 12, 2015
    Applicant: VISHAY DALE ELECTRONICS, INC.
    Inventors: Clark Smith, Todd Wyatt
  • Patent number: 8823483
    Abstract: An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: September 2, 2014
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Clark Smith, Todd Wyatt
  • Publication number: 20130342308
    Abstract: A chip resistor includes a resistor main body, an insulating layer, a heat dissipating layer, and two electrodes. The resistor main body is formed with plural longitudinally extending slits arranged and spaced apart from one another. The resistor main body has transversely opposite ends connected electrically and respectively to the electrodes. The heat dissipating layer dissipates heat generated by the resistor main body and is formed with a dividing slot extending across one of the slits and dividing the heat dissipating layer into two transversely spaced-apart portions. The insulating layer is sandwiched between the resistor main body and the heat dissipating layer and electrically insulates the heat dissipating layer from the resistor main body.
    Type: Application
    Filed: February 27, 2013
    Publication date: December 26, 2013
    Applicant: RALEC ELECTRONIC CORPORATION
    Inventor: Full Chen
  • Publication number: 20130154523
    Abstract: A resistor unit adapted to be used in a resistor grid assembly. The resistor unit includes a supporting element and a resistor element. The supporting element has an aperture formed therein. The resistor element has a body portion and a tip portion at an end, which is adapted to be received in the aperture to mount the resistor element to the supporting element. Further, a tab extends from the end of the resistor element forming a part of the resistor element. The tab is configured to provide a heat shield between the supporting element and the resistor element.
    Type: Application
    Filed: December 15, 2011
    Publication date: June 20, 2013
    Applicant: Caterpillar Inc.
    Inventors: Gerald M. Brown, Bradley S. Bailey
  • Patent number: 8369696
    Abstract: Example embodiments relate to micro-heaters, micro-heater arrays, methods for manufacturing the micro-heater, and methods for forming a pattern using the micro-heater. A micro-heater according to example embodiments may include a metal pattern formed on a substrate. A support may be formed beneath the metal pattern, the support securing the metal pattern to the substrate while spacing the metal pattern apart from the substrate. A spacer may be formed on the substrate and adjacent to the metal pattern, a first distance from the substrate to the top surface of the spacer being greater than a second distance from the substrate to the top surface of the metal pattern. The distance between the micro-heater and a target substrate positioned above the metal pattern may be controlled by the spacer, thus allowing the formation of a relatively fine pattern on the target substrate.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: February 5, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Junhee Choi
  • Patent number: 8230910
    Abstract: An apparatus for conveying a cooling air flow for at least one motor vehicle heat exchanger has a fan frame, a fan wheel, a fan control unit, and a cooling body. The fan frame has a frame opening, which the fan wheel rotates within. The fan control unit is arranged in an edge region of the frame opening. The cooling body cools the fan control unit and has cooling domes. A first cooling dome is arranged entirely radially exterior to the frame opening and a second cooling dome is located partially radially within the frame opening and partially radially exterior to the frame opening. The first cooling dome exchanges heat with an auxiliary flow that flows radially exterior to the frame opening with respect to the center of the fan wheel when the fan wheel rotates.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: July 31, 2012
    Assignee: Behr GmbH & Co. KG
    Inventors: Thomas Bielesch, Benjamin Schweizer, Michael Spieth, Ulrich Vollert
  • Patent number: 8063732
    Abstract: This electrical resistor structure which includes a frame (2) for receiving elements which form an electrical resistor (3) in the form of a serpentine resistive element, the folded ends of the branches of which are associated with elements (8, 9) for fixing to opposing cross-members (5, 6) of the frame, is characterised in that the fixing elements include elements which form spacing members (12) which are fixed to the cross-members of the frame and which are provided with projecting portions which are spaced-apart from each other and which together define zones for receiving, by clamping and with axial clearance, at least a part of the corresponding ends of the resistive element (3).
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: November 22, 2011
    Assignee: MCB Industrie
    Inventors: Abdallah Kamal, Michael Ott
  • Patent number: 7994895
    Abstract: A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: August 9, 2011
    Assignee: International Business Machines Corporation
    Inventors: Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis, Anthony K. Stamper, William J. Murphy
  • Patent number: 7907045
    Abstract: A hoisting machine having a load hoisting motor and a speed reduction mechanism and driving the load hoisting motor with an inverter 12 incorporated in the hoisting machine main body is provided with a heat dissipation means that dissipates heat generated from the inverter 12 to a speed reduction mechanism casing 15 that houses the speed reduction mechanism. The heat dissipation means is a means for attaching the inverter 12 directly to the speed reduction mechanism casing 15 in close contact therewith through surface contact at least a part of the inverter 12.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: March 15, 2011
    Assignee: Kito Corporation
    Inventors: Kazumitsu Ishikawa, Kazuhiro Nishikawa
  • Patent number: 7902957
    Abstract: A technique is disclosed for cooling resistive elements, such as brake resistors used in motor drives, as well as other resistors. A phase change heat spreader is thermally coupled to the resistive element and a continuous phase change cycle takes place in the heat spreader to extract heat from the resistive element. The element and heat spreader may be packaged as a modular unit or may be integrated into a system.
    Type: Grant
    Filed: April 30, 2007
    Date of Patent: March 8, 2011
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Richard A. Lukaszewski, John R. Brubaker, Paul J. Grosskreuz, Neil Gollhardt, Lawrence D. Radosevich, Bruce W. Weiss
  • Publication number: 20100127818
    Abstract: A hoisting machine is provided that is capable of efficiently dissipating heat generated from an inverter incorporated in the hoisting machine main body into the surrounding air with a simple structure and hence capable of performing high-frequency operation. A hoisting machine having a load hoisting motor and a speed reduction mechanism and driving the load hoisting motor with an inverter 12 incorporated in the hoisting machine main body is provided with a heat dissipation means that dissipates heat generated from the inverter 12 to a speed reduction mechanism casing 15 that houses the speed reduction mechanism. The heat dissipation means is a means for attaching the inverter 12 directly to the speed reduction mechanism casing 15 in close contact therewith through surface contact at least a part of the inverter 12.
    Type: Application
    Filed: March 4, 2008
    Publication date: May 27, 2010
    Applicant: KITO CORPORATION
    Inventors: Kazumitsu Ishikawa, Kazuhiro Nishikawa
  • Patent number: 7543632
    Abstract: An automotive heat, ventilation and air conditioning (HVAC) system including an electrical control module for controlling the motor of the system. The module includes a connector base supporting a circuit board having spaced side edges extending into the housing. The circuit board having a first leg extending from the base and through a curved section and into a second leg to a distal end spaced from the base with an electrical circuit extending over the exterior of the first leg and over the curved section and over the second leg. The circuit board includes an offset section between the base and the first leg for centralizing the legs on the base.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: June 9, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Edward Douglas Pettitt, Jeffrey Charles Kinmartin
  • Patent number: 7535335
    Abstract: An anti-condensate resistance (1) with PTC thermistor 5 is disclosed, comprising a central heat sink element (3), such central heat sink element (3) being composed of two dissipating plates (3a, 3b) which are mutually facing and continuously joined in such a way as to form, in a space interposed between the plates, an inserting housing (15) of the PTC thermistor 5 together with a securing element (11), a first and a second closing plugs (7a, 7b) for closing openings of the inserting housing (15) and for hermetically sealing the PTC thermistor 5 inside the inserting housing (15); the dissipating plates (3a, 3b) being equipped with a convex curvature towards their center, each one of the dissipating plates (3a, 3b) being equipped at their ends with inserting tracks (4a, 4b) forming working portions (6a, 6b) on which forces (F) are exerted which are adapted to permanently set joining hourglasses (4c) of the dissipating plates (3a, 3b) for cancelling or reverting the curvature and blocking the PTC thermistor 5 in
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: May 19, 2009
    Assignee: Gianus S.p.A.
    Inventor: Roberto Brioschi
  • Patent number: 7427911
    Abstract: The invention provides an electrical device having improved insulation and reduced partial discharge. The electrical device comprises an electrically conductive resistive element provided on a heat transfer medium for transferring heat from the element. The heat transfer medium includes a layer or body of electrically conductive material and a layer of thermally conductive dielectric material disposed between the element and the electrically conductive material. A continuous film of electrically insulating material, for example a silica over-glaze or polymer encapsulant, is applied around the perimeter of the resistive element to surround the element with the film overlying the edge or edges of the element and the ceramic material adjacent thereto.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: September 23, 2008
    Assignee: Tyco Electronics UK Ltd.
    Inventor: Jonathan Catchpole
  • Publication number: 20070262845
    Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.
    Type: Application
    Filed: May 4, 2007
    Publication date: November 15, 2007
    Applicant: KOA CORPORATION
    Inventors: Katsumi Takagi, Koichi Hirasawa
  • Patent number: 7102484
    Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of ?65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: September 5, 2006
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Greg Schneekloth, Nathan Welk, Brandon Traudt, Joel Smejkal, Ronald J. Miksch, Steve Hendricks, David L. Lange
  • Patent number: 7042328
    Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of ?65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: May 9, 2006
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Greg Schneekloth, Nathan Welk, Brandon Traudt, Joel Smejkal, Ronald J. Miksch, Steve Hendricks, David L. Lange
  • Patent number: 6882266
    Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: April 19, 2005
    Assignee: CTS Corporation
    Inventors: Cynthia A. Christian, Richard Cooper, Yinggang Tu, David A. Christian
  • Publication number: 20040233032
    Abstract: A high power resistor includes a resistance element with first and second leads extending out from the opposite ends thereof. A heat sink of dielectric material is in heat conducting relation to the resistance element. The heat conducting relationship of the resistance element and the heat sink render the resistance element capable of operating as a resistor between the temperatures of −65° C. to +275° C. The heat sink is adhered to the resistance element and a molding compound is molded around the resistance element.
    Type: Application
    Filed: May 20, 2003
    Publication date: November 25, 2004
    Applicant: VISHAY DALE ELECTRONICS, INC.
    Inventors: Greg Schneekloth, Nathan Welk, Brandon Traudt, Joel Smejkal, Ronald J. Miksch, Steve Hendricks, David L. Lange
  • Patent number: 6747543
    Abstract: A resistor for driving a motor for an air conditioner blower is provided, in which internal resistance bodies are stacked over one after another between insulation plates in the resistor, to accordingly reduce the volume of the entire of the resistor is reduced, and the resistance bodies are separated into a plurality of metal thin plates not a single plate and stacked over one after another, to thereby increase a line width. Also, a temperature fuse is disposed externally. The air conditioner fan blower motor driving resistor is obtained by stacking resistance bodies made of at least two metal thin plates over one after another. The resistance bodies are formed of an independent resistance body forming a second resistance body and a third resistance body on two separate thin plates, and another independent resistance body forming a first resistance body on another thin plate.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: June 8, 2004
    Assignee: Dong
    Inventor: Peong Ju Lim
  • Patent number: 6528860
    Abstract: A high-accuracy current detecting resistor is provided whose resistance does not change greatly according to temperature change and which has an excellent dielectric strength. In a resistor in which an electrical resistance alloy plate and a radiating metallic plate are laminated via a resin insulating layer, the electrical resistance alloy plate is formed of an alloy containing nickel and copper and is adhered to the resin insulating layer by etching a grain boundary of the alloy in the form of a concave.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: March 4, 2003
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Kenji Okamoto, Kazuhiko Imamura, Mayumi Matsumoto, Yuzo Saito, Jun Fujiki
  • Patent number: 5945905
    Abstract: A high power resistor includes a substrate of an insulating material having opposed first and second surfaces, and a strip of a resistance material on the first surface of the substrate. The resistance strip has side edges which are spaced from the side edges of the substrate. A contact of a conductive material is at each end of the resistance strip. Each contact extends to a separate end of the substrate, across the end and over a portion of the second surface of the substrate. The portions of the contacts which are on the second surface of the substrate or no longer than the portions of the contacts on the first surface of the substrate. At least one heat sink strip of a conductive material is on the second surface of the substrate. The heat sink strip is of a size that it does not overlap the resistance strip so as to minimize any capacitance between the heat sink strip and the resistance strip.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: August 31, 1999
    Assignee: EMC Technology LLC
    Inventor: Joseph B. Mazzochette
  • Patent number: 5841340
    Abstract: Solderless RF power film resistor and termination assemblies which include a flat film resistor or termination pressed by a nonmetallic clamping plate into thermal contact with a base plate functioning as a heat sink. A substrate such as a BeO ceramic substrate provides an RF power film resistor or termination, and has a flat mounting surface positioned against a flat mounting surface of the base plate. A clamping plate clamps the ceramic substrate securely against the base plate, thereby eliminating a soldered interface connection between the flat mounting surfaces of the ceramic substrate and the base plate. The clamping plate includes at least one lug, and the base plate includes at least one lug hole. The lug is larger than, and is plastically deformed into and through the hole to clamp the flat surface of the ceramic substrate securely against the flat surface of the base plate. The hole in the base plate preferably includes an undercut shoulder through and around which the lug is plastically deformed.
    Type: Grant
    Filed: May 7, 1996
    Date of Patent: November 24, 1998
    Assignee: RF Power Components, Inc.
    Inventors: Thomas J. Passaro, Jr., Thomas J. Dowling, Paul S. Davidsson
  • Patent number: 5786745
    Abstract: A package (10) has outermost surfaces (12, 13, 14, 16) that form a polygon shape. The body (11) of the package (10) has axial symmetry about an axis (21). A lead (22) exits the package along the axis (21).
    Type: Grant
    Filed: February 6, 1996
    Date of Patent: July 28, 1998
    Assignee: Motorola, Inc.
    Inventors: Alexander J. Elliott, Lonne L. Mays
  • Patent number: 5739743
    Abstract: A chip resistor includes a substantially rectangular substrate of an insulating material having opposed substantially flat top and bottom surfaces and edges extending between the top and bottom surfaces. A layer of a resistance material is on the top surface of the substrate. Separate termination layers of a conductive material are on the top surface or the substrate and contact the resistance layer at opposite ends thereof. Each of the termination layers extends across an edge of the substrate and over a portion of the bottom surface of the substrate. The total area of the portions of the termination layers on the bottom surface of the substrate is greater than the total area of the portions of the termination layers on the top surface of the substrate so that the spacing between the ends of the portions of the termination layers on the bottom surface of the substrate is smaller than the spacing between the ends of the portions of the termination layers on the top surface of the substrate.
    Type: Grant
    Filed: February 5, 1996
    Date of Patent: April 14, 1998
    Assignee: EMC Technology, Inc.
    Inventor: Joseph B. Mazzochette
  • Patent number: 5665261
    Abstract: An electric heating device includes a plurality of heating elements which are assembled to form a block. Such a heating element is formed from two metal plates, with the interposition of PTC elements. In order to increase the heat transfer, the metal plates are provided with corrugation ribs. Each heating element includes a pair of metal plates which are angled off essentially in the form of an L such that the angled-off sections are connected in a frictionally locking manner to each other. The angled-off sections are arranged at opposite ends of the heating elements and angled in opposite directions, the length of the angled-off sections of the metal plates being dimensioned such that angled-off sections of one pair of metal plates are in mutual abutment with angled-off sections of respectively adjacent pairs of metal plates.
    Type: Grant
    Filed: September 21, 1995
    Date of Patent: September 9, 1997
    Assignee: Behr GmbH & Co.
    Inventors: Herbert Damsohn, Karl-Gerd Krumbach, Michael Loehle, Eberhard Zwittig
  • Patent number: 5621378
    Abstract: A power resistor having much improved heat dissipation ability to an underlying heatsink because a step or protuberance is provided that cooperates with the mounting bolt or screw to largely nullify the effects of molding-caused camber or curvature.
    Type: Grant
    Filed: April 20, 1995
    Date of Patent: April 15, 1997
    Assignee: Caddock Electronics, Inc.
    Inventors: Richard E. Caddock, Jr., Richard E. Caddock
  • Patent number: 5581227
    Abstract: A hybrid circuit unit having a film resistor on a circuit carrier and a ceramic stripe having an area of at least approximately the same size as the film resistor is secured in a highly thermally conductive way to at least one side of the plate-shaped circuit carrier.
    Type: Grant
    Filed: May 13, 1994
    Date of Patent: December 3, 1996
    Assignee: Siemens Aktiengesellschaft
    Inventor: Karl-Gerd Drekmeier
  • Patent number: 5563570
    Abstract: The present invention relates to a resistor device for controlling a rotational speed of a motor which has no directional property and provides a convenient setting. A resistance unit is positioned which includes at least four connecting points connected to connecting terminals at an upper predetermined position of a housing, and a heat sink having at least four supporting legs is provided to form passing paths open in all directions on the housing. Also, the resistance unit is adhered on the heat sink through an insulating layer, a second heat sink corresponding to the first heat sink is adhered on the resistance unit through the insulating layer, and short-circuit means having a soldered portion to be fused at a predetermined temperature upon an overloading of the motor is provided between the resistance unit and any one terminal.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: October 8, 1996
    Assignee: Dong A Electric Parts Co., Ltd.
    Inventor: Woo Y. Lee
  • Patent number: 5550527
    Abstract: A resistor device for controlling a rotational speed of a resistance unit and an open-circuit means. A receiving recess is provided to any one side surface of a heat sink vertically affixed to a top surface plate of a housing. A resistance unit, which is protected by a film and made of metal material forming a resistor circuit for gradually controlling the rotational speed of a motor, is received within the recess in the heat sink and connected to a terminal. An open-circuit means, having a soldered portion which is fused at a predetermined temperature upon an overload of the motor, is provided at a predetermined distance between the resistance unit and a terminal.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: August 27, 1996
    Assignee: Dong A Electric Parts Co., Ltd.
    Inventor: Woo Y. Lee
  • Patent number: 5481241
    Abstract: A low-cost heat sink-mounted power film resistor having a high power rating for its footprint size, and not incorporating any housing. The resistor is bolted or otherwise secured tightly to an external heat sink in high heat-conduction relationship, the external heat sink being contacted flatwise by a rectangular internal heat sink. The footprint size and shape of the internal heat sink correspond substantially to those of commercially-marketed power film resistors having molded synthetic resin housings. The internal heat sink is bonded in high heat-conductivity relationship to a ceramic chip having a resistive film on the side thereof remote from the heat sink. Over such resistive film is a thin environmental coating. The leads are provided and connected to spaced portions of the film, on metalization pads.
    Type: Grant
    Filed: November 12, 1993
    Date of Patent: January 2, 1996
    Assignee: Caddock Electronics, Inc.
    Inventor: Richard E. Caddock, Jr.
  • Patent number: 5436609
    Abstract: An electrical device in which a conductive terminal is physically and electrically attached directly or indirectly to a face of a laminar PTC resistive element. The terminal comprises a laminar portion and a non-laminar shaped portion which lies within a projection of the periphery of the PTC resistive element. The shaped portion serves to improve thermal transfer between the PTC element and the atmosphere surrounding the device. Devices of the invention are useful as circuit protection devices.
    Type: Grant
    Filed: July 6, 1993
    Date of Patent: July 25, 1995
    Assignee: Raychem Corporation
    Inventors: Chi-Ming Chan, Shou-Mean Fang
  • Patent number: 5355281
    Abstract: The present invention relates to an electrical device such as a resistor or silicon controlled rectifier that is provided with an improved heat transfer medium for transferring heat from the device to an adjacent structure such as a mounting panel. The improved heat transfer medium includes a bonded series of laminates including a layer of nickel-plated copper sandwiched between two layers of ceramic, such as aluminum oxide.
    Type: Grant
    Filed: June 29, 1993
    Date of Patent: October 11, 1994
    Assignee: E.B.G. Elektronische Bauelemente Gesellschaft m.b.H.
    Inventors: Harald E. Adelmann, Hans P. Peschl
  • Patent number: 5321382
    Abstract: A thermal type flow rate sensor comprising a sensor chip having a rectangular shape. The sensor chip is supported between supporting pins through ribbon-like leads connected to opposite ends of the sensor chip. The ribbon-like leads serve to correctly locate the surface of the sensor chip with respect to flow of fluid. The surfaces of the sensor chip is formed with a thin film heater. A heater portion of the thin film heater comprises a plurality of straight portions and a plurality of turn portions connecting the straight portions to each other. Each turn portion is formed in a smoothly curved shape to avoid the concentration of electric currents and is disposed at an end portion of the sensor chip which has a comparatively low temperature. This structure is effective in preventing generation of cracks in the turn portions. In addition, the plurality of straight portions are alternatively inclined to effectively utilize the surface of the sensor chip to form a long heating portion.
    Type: Grant
    Filed: July 7, 1992
    Date of Patent: June 14, 1994
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masahito Mizukoshi, Shinji Ota, Norikazu Hosokawa, Yasushi Kohno
  • Patent number: 5304977
    Abstract: The film-type electrical power resistor includes a flat ceramic chip on the upper surface of which is screen-printed a resistive film. Terminals (leads) are mechanically and electrically connected to the upper chip surface, the terminals being such that the chip may be positioned by the terminals in a predetermined position in a mold cavity during manufacture of the resistor--prior to introduction of synthetic resin. The synthetic resin forms a molded electrically insulating body that embeds the portions of the terminals that are relatively near the chip, and also embeds the upper portion of the chip, but does not embed the bottom surface of the chip. The relationships are such that the lower chip surface may be engaged flatwise with a flat region of a chassis or heatsink. Accordingly, the chip is a substrate for the film, a heatsink for the film, an insulator maintaining the film electrically insulated from the chassis, and a spacer maintaining the terminals spaced from the chassis.
    Type: Grant
    Filed: April 6, 1992
    Date of Patent: April 19, 1994
    Assignee: Caddock Electronics, Inc.
    Inventor: Richard E. Caddock, Jr.
  • Patent number: 5291174
    Abstract: An improved blower motor speed control resistor array in which the resistor elements are defined by multiple optimally sized patches of resistive ink deposited onto opposite sides of a thin flat ceramic substrate. The array comprises three resistive patches connected in series via fusing elements to provide three reduced blower motor speeds MH, M and L. The thin ceramic substrate is flat on both of its faces, and each face comprises a terminal region for attachment of the resistive patches to the terminal elements, and a resistor region for deposition of the three resistive patches. The resistive patch of lowest resistivity (the MH resistor) is deposited on the entire resistor region of a first side of the substrate. The resistor patches of intermediate and highest resistivity (the M and L resistors, respectively) share the resistor region of the other side of the substrate in relation proportion to their respective resistivities.
    Type: Grant
    Filed: February 4, 1993
    Date of Patent: March 1, 1994
    Assignee: General Motors Corporation
    Inventors: Richard A. Zirnheld, Ronald J. Goubeaux
  • Patent number: 5268665
    Abstract: A resistor device for blower motor comprising one plate of PTC element having two side surfaces and a plurality of electrodes disposed on at least one of the two side surfaces. A plurality of different resistance values can be obtained from the one plate of PTC element, which makes it possible to realize a small and compact structure for the resistor device.
    Type: Grant
    Filed: November 20, 1991
    Date of Patent: December 7, 1993
    Assignee: Pacific Engineering Co., Ltd.
    Inventor: Murakami Iwao
  • Patent number: 5254968
    Abstract: A blower motor speed control resistor array in which the resistor elements contain an electrically conductive plastic material which melts to limit the blower motor current in the event of an extreme temperature condition. The conductive plastic is insert molded on a terminal array to form a self-supporting structure adapted to be disposed in an air duct. Each resistor of the array is defined by a number of legs of electrically conductive plastic extending between a pair of parallel headers, in the manner of a picket fence.
    Type: Grant
    Filed: June 15, 1992
    Date of Patent: October 19, 1993
    Assignee: General Motors Corporation
    Inventor: Richard A. Zirnheld
  • Patent number: 5243683
    Abstract: A hair dryer includes a plurality of elongated positive-temperature-coefficient (PTC) semiconductor heating units disposed in transverse side-by-side spaced relation in a linear array in a central air flow passage of an elongated tubular duct connected to a discharge port of a casing having an air fan rotatably mounted in the casing for blowing air through the air flow passage of the duct, each PTC heating unit defining a longitudinal axis disposed perpendicular to a longitudinal axis of the air flow passage of the duct and a plurality of elongated spaced fins longitudinally juxtapositionally mounted on the PTC semiconductor heating unit transversely of the longitudinal axis of the PTC heating unit, whereby upon a powering of the PTC heating unit and the fan to heat air as blown by the fan, the heated air will be guided in the tubular duct by the plurality of elongaed spaced fins to produce laminar air streamflow helpful for smoothly setting and drying hair or the like.
    Type: Grant
    Filed: July 9, 1992
    Date of Patent: September 7, 1993
    Inventor: Chiung-hsiang Yang
  • Patent number: 5229741
    Abstract: The resistor unit comprises resistors connected to electrical terminals secured to an insulating plate to which first and second legs of a spring sheet metal mounting clip are secured for insertion through an opening in a supporting wall. The legs are bent forwardly from a rear member and are formed with first and second spring latching members including ramp portions bent laterally from the legs, shoulder portions bent inwardly from the ramp portions for wedging engagement with edge portions of the wall, and front end portions bent forwardly from the inner ends of the shoulder portions. A soft resilient expanded rubber gasket is mounted on the plate for sealing engagement with a rib projecting forwardly from the wall around the opening. The spring force produced by compression of the gasket is counterbalanced by the wedging action of the shoulder portions, so that rattling is prevented. The legs are inserted with an interference fit into opposite end portions of the opening.
    Type: Grant
    Filed: June 9, 1992
    Date of Patent: July 20, 1993
    Assignee: Indak Manufacturing Corp.
    Inventor: Charles E. Black, III
  • Patent number: 5228460
    Abstract: A heating element to provide heat to a tobacco flavor medium, for use in an electrical smoking article, by converting electrical energy to heat through the use of a material with electrically resistive properties is provided. The material is arranged in a radial array of blades with a current density profile such that a maximum area of each blade provides heat to the tobacco flavor medium dispersed thereon. The blade is generally U-shaped to assure dispersion of heat evenly to avoid hot spots along the blade and is tapered to reduce mass toward the mouth end of the heating element so as to maximize the heated area.
    Type: Grant
    Filed: December 12, 1991
    Date of Patent: July 20, 1993
    Assignee: Philip Morris Incorporated
    Inventors: F. Murphy Sprinkel, Everett C. Grollimund
  • Patent number: 5185568
    Abstract: The invention describes an internal test load and method for forming an internal test load which is adapted to absorb energy from a power source such as an RF transmitter, transceiver, or amplifier. The test load is positioned internally within a housing, and includes at least one impedance device, such as a power resistor, coupled to the power source which is matched to the impedance thereof. The impedance device is supported on a heat sink which is adapted to absorb heat generated by the impedance device so as to be distributed over a relatively large area constituting the heat sink. The heat sink is positioned in spaced part relation to the housing, and is not directly supported or secured to the housing. A potting material surrounds the load assembly and supports the heat sink, wherein the heat sink effectively "floats" within the potting material such that heat absorbed by the heat sink will not be directly transferred to the housing, but will be dissipated through the potting compound.
    Type: Grant
    Filed: January 22, 1991
    Date of Patent: February 9, 1993
    Assignee: Circle Prime Mfg. Co.
    Inventors: James M. Mothersbaugh, John E. Keim
  • Patent number: 5179366
    Abstract: An end terminated high power chip resistor-printed circuit board assembly (9) suitable for use in applications requiring miniature surface mount resistors capable of high power dissipation. An end terminated high power chip resistor (8) is constructed by coating a portion of the bottom of an end terminated chip resistor with a conductive plate (12). The end terminated high power chip resistor (8) is mounted to a printed circuit board having at least one via (23) lined with metal (20) wherein the conductive plate (12) is positioned above the via (23) lined with metal (20). A heat sink (16) is mounted to the printed circuit board opposite to the side to which the end terminated high power chip resistor (8) is mounted and is in contact with the metal (20) lining via (23).
    Type: Grant
    Filed: June 24, 1991
    Date of Patent: January 12, 1993
    Assignee: Motorola, Inc.
    Inventor: Robert Wagner
  • Patent number: 5159310
    Abstract: A heat dissipating resistor grid has a rectangular or annular frame including side members carrying blocks or panels of insulating material having cavities in their inner surfaces. The resistor element is a zigzag strip formed from individual flat lengths of resistance material, each length having offset ends in opposite directions, adjoining offset ends forming a sandwich with a conductive support strip which extends beyond the offset end and terminates in projections which mate with the cavities in the insulating material. The support strip may extend into the space between the adjoining strips of resistance material forming a heat sink therein. The projecting ends of the support strip may be flat lengths, may be cut into tabs, may be formed into hollow cylinders in one piece with the support strip, may be solid cylindrical studs affixed to the support strip, or solid rod bent into U-shape with the base inside the offset ends.
    Type: Grant
    Filed: June 5, 1991
    Date of Patent: October 27, 1992
    Assignee: Mosebach Manufacturing Company
    Inventors: Robert Cummins, Victor V. Kirilloff, William A. Benson, Richard S. Dawson
  • Patent number: 4935717
    Abstract: A blower control resistor device includes a plurality of resistors leading to resistor terminals, and a plurality of connecting terminals joined with the resistor terminals by thermal fuses. The joint portions between the resistor terminals and the connector terminals are concealed by a cover or the like so as to prevent an authorized modification of the resistor device. Preferably, one of the thermal fuses which is connected with a connector terminal near a power supply has a lower-melting point than other thermal fuses.
    Type: Grant
    Filed: June 19, 1989
    Date of Patent: June 19, 1990
    Assignee: Diesel Kiki Co., Ltd.
    Inventors: Katsuyoshi Osawa, Shinichi Ohi, Tadahiro Takahashi, Kazuo Noguchi, Kashiwa Kobayashi
  • Patent number: 4868997
    Abstract: A dryer timer includes a housing and a motor and a cam assembly carried in the housing. A switch in the housing is responsive to the cam to switch the motor between a 120 VAC standard timer circuit and a 240 VAC dryer heater circuit. A leadless voltage dropping resistor in the 240 VAC circuit is mounted on the exterior of the housing clasped between the feed-through to the switch and a terminal strap connected to the timer terminal which connects to the dryer heater circuit. A flanged member connected to the feed-through and the terminal strap engaged the flat surfaces of the disk-shaped leadless voltage dropping resistor to dissipate the heat it produces.
    Type: Grant
    Filed: June 20, 1988
    Date of Patent: September 26, 1989
    Assignee: Emhart Industries, Inc.
    Inventors: Steven W. Smock, Ross G. Helet
  • Patent number: 4638284
    Abstract: A tubular varistor arrangement, particularly suitable for use in electrical connectors of circular cross-section, attains an electrical breakdown voltage equalling the cumulation of the breakdown voltages of multiple varistor sections of the arrangement. The varistor arrangement includes a plurality of tubular varistor sections that are interconnected in electrical serial relationship.
    Type: Grant
    Filed: December 5, 1984
    Date of Patent: January 20, 1987
    Assignee: General Electric Corp.
    Inventor: Lionel M. Levinson
  • Patent number: 4523079
    Abstract: An electric steam iron includes a plastic housing shell forming a hollow handle structure and a soleplate with steam generating means and ports for distribution of steam. A pump actuated by a handle button delivers water from a tank within the housing shell to the steam generating means. The iron is controlled by a low DC voltage electronic control including a printed circuit board disposed in the housing shell away from the soleplate and having means including a power resistor for reducing high AC line voltage to low DC supply to the circuit. The shell and hollow handle structure are open to the soleplate and the printed circuit board is directly exposed to heat from the power resistor.
    Type: Grant
    Filed: September 20, 1983
    Date of Patent: June 11, 1985
    Assignee: Black & Decker Inc.
    Inventor: Harry Albinger, Jr.
  • Patent number: 4412126
    Abstract: An infrared source comprising an electrically powered, hollow cylindrical rod which operates at lower temperatures and yet has no decrease in output power is configured by increasing the outside diameter of the rod and inserting grooves therein which provide cavities increasing the apparent surface emissivity of the rod.
    Type: Grant
    Filed: February 4, 1982
    Date of Patent: October 25, 1983
    Assignee: Sanders Associates, Inc.
    Inventor: Richard J. Brockway
  • Patent number: 4359710
    Abstract: An improved annular resistor, suitable for use in a diesel electric locomotive dynamic braking system and similar applications comprising an assembly of similar arcuate segments. Each resistor segment has a supporting frame (11, 13) and a continuous resistance ribbon (53, 55, 57, 59) having a plurality of reflexed radial extensions between the two parts of the frame, electrically isolated from the frame. To allow expansion and contraction of the ribbon, U-shaped folds of the ribbon are mounted on pin supports (51). The pin supports are mounted to insulator blocks (27, 29, 37, 39), and are set so as to position the ribbons in a zig-zag or chevron pattern, in order to enhance cooling and improve the flow of air over the ribbon surfaces. Three terminals (67, 73, 75) are provided on each segment to allow part of the resistance of each segment to be removed from the circuit.
    Type: Grant
    Filed: February 11, 1980
    Date of Patent: November 16, 1982
    Assignee: Eaton Corporation
    Inventor: William R. Luy