Abstract: Machines and methods for curing ultraviolet (UV)-curable coating materials. In one embodiment, the machine includes a UV radiation source having one or more lamps partially enclosed within a shroud of a curing head. The machine may further include a supplemental energy source located outside of the shroud. The supplemental energy source may illuminate an uncured area of the floor coating material that is beyond the curing head. In some embodiments, the supplemental energy source may reduce or prevent the partial curing of the coating material outside of the curing head resulting from stray UV energy.

Abstract: An electromagnetic energy spot curing system is provided which utilizes a template which moves relative to a source of radiation in the electromagnetic spectrum, such as an ultraviolet (UV) lamp. A channel is formed through the template of varying widths so that during the course of relative movement, different intensities of radiation emanating from the source is continuously passed through the channel and applied to a desired location, typically a curable material.

Abstract: A drying station for drying printed sheets transported by a transport belt includes an irradiation device for irradiating the printed sheets, a deflection section located in vicinity of the irradiation device for guiding the transport belt away from the irradiation device, and a shielding device disposed between the transport belt and the irradiation device for shielding the transport belt against radiation from the irradiation device while the sheets are exposed to the radiation. A printing machine including the drying station and a method for drying printed sheets are also provided.

Abstract: A process for the drying of woven glass fabric to be used in a reinforcing laminate in sensitive electronic equipment is disclosed. The process implements a drying technique utilizing microwave energy for drying.

Abstract: A heat-controlling device is provided with a transporting carriage for supporting and transporting a semiconductor substrate and a heating device having a plurality of heaters which apply heat in the width-wise direction of the heat-receiving member that is perpendicular to the transporting direction thereof and which are individually controlled by a controller. The controller only operates a set of the heaters that are adjacent the semiconductor substrate. Among the heaters being operated, those heaters, which are located at at least the leading end and the rear end in the transporting direction, have their outputs successively varied in accordance with the movement of the semiconductor substrate. Thus, it becomes possible to easily narrow the temperature distribution of the semiconductor substrate merely by controlling the output of the heaters.

Abstract: A dryer mounted in a housing includes a precision balance arranged in the housing for determining the moisture content of material to be weighed which is placed on a weighing dish and is subjected to heat radiation from a heat source of the dryer. For making the material to be weighed accessible, the precision balance can be moved in and out of the housing. A duct for conducting an air flow is mounted between the weighing dish and the load-receiving unit which supports the weighing dish and is mounted above the measuring cell of the precision balance.

Abstract: A drying apparatus includes a built-in precision balance for determining the moisture content of material to be weighed. The apparatus includes a weighing dish for receiving the material. The weighing dish is connected to a load-receiving member of the measuring cell of the balance. A heat source is arranged above the weighing dish for heating the material. During drying, the weighing dish is located within the housing. The weighing dish can be moved in and out of the housing for charging and weighing-in of the material.