Abstract: A continuous wood modification by heat process, that comprises: stacking wooden boards on a trolley at intervals; exerting pressure on said wooden boards; transferring said wooden boards to a heating kiln, pre-heated by microwave and hot air circulation, that has a water vapor flow of 2-5 meter3/hour, a temperature range of 60-100° C., and a humidity range of 50%-100%; transferring said wooden boards to a shallow drying kiln, pre-heated by microwave and hot air circulation, that has a drying temperature of 100-120° C.; transferring said wooden boards to a deep drying kiln, pre-heated by microwave and hot air circulation, that has a drying temperature of 120-120° C., an oxygen content range of 1-10%, and a water vapor flow rate of 1-10 m3/hour; transferring said wooden boards to a carbonization kiln, pre-heated by microwave and hot air circulation, that has a temperature range of 120-180° C.

Abstract: Disclosed herein are a clothes dryer and a control method thereof in which a drying time is adjusted according to wool content during a drying cycle of a wool course. Wool content of woolen textiles is judged by sensing a dryness of the woolen textiles during a drying cycle of a wool course, and a drying time is adjusted according to the wool content, thereby minimizing contraction or deformation of the woolen textiles while satisfying the range of a target dryness set by wool mark standards. Further, only a high-capacity heater is driven during the drying cycle of the wool course, thereby allowing an internal temperature of a rotary drum to keep the optimum temperature without contraction or deformation of the woolen textiles.

Abstract: A laundry drying unit includes a process air circuit and a component arranged in the process air circuit. Provided above the component is a washing tank for dispensing a cleaning fluid, with a flow of cleaning fluid dispensed from the washing tank to the component being controlled by a controllable valve. The valve can be controlled on the basis of an amount of cleaning fluid in the washing tank.

Abstract: A method of controlling and enhancing the nucleation of product in a freeze dryer, wherein the product is maintained at a predetermined temperature and pressure in a chamber of the freeze dryer, and a predetermined volume of condensed frost is created on an inner surface of a condenser chamber separate from the product chamber and connected thereto by a vapor port. The condenser chamber has a predetermined pressure that is greater than that of the product chamber. The opening of the vapor port into the product chamber creates gas turbulence that breaks down the condensed frost into ice crystals that rapidly enter the product chamber for even distribution therein to create uniform and rapid nucleation of the product in different areas of the product chamber.

Abstract: A system for drying a load of wood including: a heat generating device providing heat necessary for drying the load of wood, apparatus for generating a gaseous coolant flow for treating the load of wood by combustion of biomass under O2, the gaseous coolant flow being essentially constituted by CO2, a heat exchange device allowing the transfer of the heat produced by the heat generating device to the gaseous coolant flow for treating the load of wood, a unit for treating/drying the load of wood, including a central volume, known as a technical or treatment volume, dedicated to the drying of the wood, and inlet and outlet hatches for the loads of wood, situated at the upstream and downstream ends of said central volume, and a thermal device for the dehydration and condensation of the steam extracted from the wood during the drying cycle.

Abstract: A method of controlling and enhancing the nucleation of product in a freeze dryer, wherein the product is maintained at a predetermined temperature and pressure in a chamber of the freeze dryer, and a predetermined volume of ice fog is created in a condenser chamber separate from the product chamber and connected thereto by a vapor port. The ice fog has a predetermined pressure that is greater than that of the product chamber, and is rapidly conveyed through the vapor port into the product chamber for even distribution therein to create uniform and rapid nucleation of the product in different areas of the product chamber.

Abstract: Disclosed herein are a clothes dryer and a control method thereof in which a drying time is adjusted according to wool content during a drying cycle of a wool course. Wool content of woolen textiles is judged by sensing a dryness of the woolen textiles during a drying cycle of a wool course, and a drying time is adjusted according to the wool content, thereby minimizing contraction or deformation of the woolen textiles while satisfying the range of a target dryness set by wool mark standards. Further, only a high-capacity heater is driven during the drying cycle of the wool course, thereby allowing an internal temperature of a rotary drum to keep the optimum temperature without contraction or deformation of the woolen textiles.

Abstract: A method and an apparatus are disclosed for removing a solvent from a solvent wetted surface of a heat exchange tube. The method includes placing the heat exchange tube in a vacuum chamber, evacuating the vacuum chamber to a lower pressure at which the solvent boils to a vapor, and reclaiming the solvent vapor. The method may include heating the heat exchange tube within the vacuum chamber to a temperature of at least room temperature, but below the solvent's flash point temperature. The apparatus includes a vacuum chamber, a vacuum pump for evacuating the vacuum chamber and a solvent reclaimer for recovering solvent vapor. The apparatus may also include an infrared heater, a radiant heater or other non-flame heater. The method and apparatus may be used for removing solvent from a heat exchange tube having an inside surface wetted with a solvent carrying a dry lubricant.

Abstract: A wood kiln system and method that sequentially cures and dries layers of stacked wood during which each layer of wood is heated to 125 to 170 deg. F. as the kiln container is evacuated to approximately 13 inches of Hg for 8 to 12 hrs. After the wood has been cured, drying stage is commenced as the wood is continuously heated by evacuating the kiln container to 0.35 to 3 inches of Hg for 6 to 12 hrs. During the drying stage, a cold water bath is formed in the bottom of the kiln container. A condensation tank located between the vacuum pump and the kiln is used to continuously remove the water and water vapor from the kiln container. In one embodiment, the vacuum pump includes a primary vacuum pump serially connected to an auxiliary vacuum pump that allows the air to be continuously and gradually reduced in the kiln container.

Abstract: A laundry treating apparatus, particularly, a laundry treating apparatus using steam is disclosed. The laundry treating apparatus such as a washing machine, a dryer, a drying and washing machine is an apparatus which washes or dries articles such as clothes. The laundry treating apparatus includes an operation course including a drying process in which hot air is supplied into a drum adapted to accommodate articles to dry the articles and a cooling process in which cool air is supplied into the drum to cool the articles, wherein the operation course further includes a steam process in which steam is supplied into the drum, and the laundry treating apparatus includes a controller which controls a heater adapted to generate the steam such that an operation time point of the heater varies according to an amount of the articles.

Abstract: An apparatus and method for quickly drying porous materials. A sealable chamber is connected to a cold trap which is connected to a vacuum pump. A sample is placed inside the sealable chamber. The vacuum pump is turned on and air is evacuated through the cold trap to the vacuum pump. Because evaporation may lower the temperature inside the sealable chamber, an infrared lamp may be used to heat the chamber and sample therein directly or heated air may be allowed to enter the sealable chamber in response to the vacuum created by the vacuum pump. Air may be drawn directly from the sealable chamber to the vacuum pump bypassing the cold trap. A load cell may be placed in the bottom of the sealable chamber to monitor the weight of a sample to determine if the drying process is complete. Other parameters could be used, including the degree of vacuum achieved in the chamber.

Abstract: A system for processing a substrate is described. The system includes a proximity head, a mechanism, and a liquid supply. The proximity head is configured to generate a controlled meniscus. Specifically, the proximity head has a plurality of dispensing nozzles formed on a face of the proximity head. The dispensing nozzles are configured to supply a liquid to the meniscus and the suction holes are added to remove a used liquid from the meniscus. The mechanism moves the proximity head or the substrate with respect to each other while maintaining contact between the meniscus and a surface of the substrate. The movement causes a thin layer of the liquid to remain on the surface after being contacted by the meniscus.

Abstract: A proximity head for generating and maintaining a meniscus for processing a substrate is described. The proximity head includes a plurality of meniscus nozzles formed on a face of the proximity head, the nozzles being configured to supply liquid to the meniscus, a plurality of vacuum ports formed on the face of the proximity head, the vacuum ports being arranged to completely surround the plurality of meniscus nozzles, and a plurality of gas nozzles formed on the face of the proximity head, the gas nozzles at least partially surrounding the vacuum ports. The proximity head further includes means for reducing a size and frequency of entrance and/or exit marks at a leading edge and a trailing edge on the substrate by aiding and encouraging liquid from the meniscus to evacuate a gap between the substrate and the carrier.

Abstract: A first proximity head is configured to define a meniscus of a photoresist developer solution on a substrate. The meniscus is to be defined between a bottom of the first proximity head and the substrate. A second proximity head is configured to define a rinsing meniscus on the substrate and remove the rinsing meniscus from the substrate. The second proximity head is positioned to follow the first proximity head relative to a traversal direction of the first and second proximity heads over the substrate. Exposure of the substrate to the meniscus of photoresist developer solution causes previously irradiated photoresist material on the substrate to be developed to render a patterned photoresist layer. The first and second proximity heads enable precise control of a residence time of the photoresist developer solution on the substrate during the development process.

Abstract: A continuous process for the production of dried superabsorbent polymers (SAPs) the polymerization reaction is carried out either in an initially homogenous aqueous monomer solution (bulk aqueous solution polymerization) or in a heterogeneous water-in-oil reactant mixture (reverse phase suspension or emulsion polymerization) within a continuous closed polymerization reactor, then the resulting polymer gel is dried within a continuous moved bed in a closed dryer, avoiding the needs of standard intermediate maturity tank(s).

Abstract: A method for the vaporization of particulate material includes providing one or more containers each containing possibly distinct particulate materials each having at least one component, fluidizing the particulate material in at least one of the containers, and providing a vaporization zone that is thermally isolated from at least one of the containers. The method further includes delivering particulate material received from each container to the vaporization zone, and applying heat to vaporize the delivered particulate materials at the vaporization zone.

Abstract: Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.

Abstract: Among the many embodiment, in one embodiment, a method for processing a substrate is disclosed which includes generating a fluid layer on a surface of the substrate, the fluid layer defining a fluid meniscus. The generating includes moving a head in proximity to the surface, applying a fluid from the head to the surface while the head is in proximity to the surface of the substrate to define the fluid layer, and removing the fluid from the surface through the proximity head by a vacuum. The fluid travels along the fluid layer between the head and the substrate at a velocity that increases as the head is in closer proximity to the surface.

Abstract: A system and apparatus for cleaning a substrate is provided. The system includes a first head configured as a bar shape that extends approximately a diameter of the substrate. The first head is configured for placement on a first side of the substrate. A second head is also provided, and is configured as a bar shape that extends approximately the diameter of the wafer, and the second head is configured for placement on a second side of the substrate, such that the second side is opposite the first side. In this example, each of the first head and the second head have conduits formed therein along the diameter of the substrate for delivering and removing fluids so that a meniscus is capable of being contained between each of the first head and a substrate surface of the first side of the substrate and the second head and a substrate surface of the second side of the substrate.

Abstract: Apparatus and method for eliminating wrinkles in clothes in a washing or drying machine using steam to eliminate the wrinkles in clothes, in a state in which the clothes are worn by a user or stored, as well as in a state in which washing of the clothes is terminated. The method includes determining whether or not a wrinkle-eliminating course is selected; supplying hot air to the clothes to eliminate dust from the clothes when it is determined that the wrinkle-eliminating course is selected; and supplying steam to the clothes, from which the dust was eliminated, to eliminate the wrinkles in the clothes.

Abstract: One of many embodiments of a substrate preparation system is provided which includes a drying system, the drying system including at least one proximity head for drying a substrate. The system also includes a cleaning system for cleaning the substrate.

Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.

Abstract: The downtime of a vacuum processing apparatus due to wet cleaning is reduced. In a vacuum processing apparatus that requires aging for its chamber or process container after vacuum evacuation of the apparatus and before actual processing of a workpiece, when the chamber has been opened to atmosphere for the purpose of wet cleaning or component replacement, the apparatus comprises a high precision absolute pressure gauge for use in processing, a wide range gauge capable of measuring a wide range of pressures, and a controller, wherein the controller uses a pressure trend during vacuum evacuation to determine whether the vacuum evacuation is satisfactory, and starts aging upon determining that the vacuum evacuation is satisfactory even if the actual pressure is not below a prescribed value.

Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.

Abstract: In one of the many embodiments, a method for processing a substrate is disclosed which includes generating a first fluid meniscus and a second fluid meniscus at least partially surrounding the first fluid meniscus wherein the first fluid meniscus and the second fluid meniscus are generated on a surface of the substrate.

Abstract: The invention provides drying apparatus including a first chamber for receiving articles to be dried and having an outlet, a second chamber having an outlet, and a fan having a fan inlet and a fan outlet, the fan inlet communicating with the outlet of the first chamber and the fan outlet communicating with the second chamber. The apparatus further includes a vacuum pump communicating with the outlet of the second chamber so that transfer of thermal energy can take place between the first and second chambers. The invention also provides a method of drying including placing articles into a first chamber, evacuating a significant proportion of the air from the first chamber and from a second chamber, evacuating water vapor from the first chamber to the second chamber, allowing the water vapor to condense in the second chamber, and transferring thermal energy from the second chamber to the first chamber.

Abstract: A method for performing multiple cleaning and vacuum drying operations in enclosed vessels uses cleaning and vacuum drying apparatus, low-dissolved-air cleaning solution, and drain-to-vacuum process to produce vacuum in a cleaning vessel, so that influence of air pressure on the operations is minimized. The method utilizes physical features that boiling points of general liquids lower with reduced pressure, that liquid saturated vapor pressure reduces with lowered temperature, and that two vacuum vessels of different working temperatures would have a pressure differential between their saturated vapor pressures, and uses heat control units and heat egress units to regulate temperature and pressure in the vacuumized cleaning vessel, so that wet clean, dry clean, vacuum heat drying, and vacuum freeze drying can be performed on the same apparatus, and low-pressure gas used in the dry clean and cleaning solution and waste solution can be recovered to achieve environment protection and energy saving.

Abstract: A semiconductor wafer drying apparatus is provided. In one embodiment, this apparatus includes a bath which can contain much deionized water so that semiconductor wafers soak in the deionized water; a chamber providing a space where vapor flows over the bath; a vapor supply line supplying vapor to the internal space of the chamber; an exhaust line discharging vapor contained in the chamber; a deionized water exhaust line discharging deionized water in the bath; a semiconductor wafer holder supporting the semiconductor wafer in the bath; and pitch guides placed at left and right sides of the semiconductor wafer, movable to a first position and a second position in a vertical direction, wherein the pitch guides are separated from the semiconductor wafer at the first position and contact the semiconductor wafer at the second position thus preventing the movement of the semiconductor wafer.

Abstract: Disclosed is a method of drying timbers loaded in a drying chamber, which comprises the steps of heating the drying chamber by a heating system up to a temperature of 80 to 100° C., subjecting the timbers to vacuum blowing by connecting the inside of the drying chamber with a vacuum chamber (receiver) evacuated by a rotary pump until the inside pressure of the drying chamber drops to 1 to 10 mmHg, disconnecting the inside of the drying chamber from the vacuum chamber, connecting the drying chamber with the atmosphere. When the inside of the drying chamber is connected with the vacuum chamber, the moisture content of the timbers is sharply reduced, so that their temperature sharply drops. Thereafter, when it is disconnected from the vacuum chamber, and connected with the atmosphere, the inside temperature of the drying chamber is again increased. Meanwhile, the heating system is worked during the whole process.

Abstract: By a simple apparatus construction and process, it is made possible to “clean precisely” a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 1012 molecules/cm2 or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 105 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Abstract: A transportable skid for drying and testing generator stator windings includes a platform supporting a compressor adapted to supply compressed air to the stator winding; a dryer arranged to receive and dry compressed air from the compressor; a buffer tank arranged to receive a relatively small portion of compressed air from the compressor after passing through the dryer; and a receiving tank arranged to receive compressed air from the buffer tank and the compressor after passing through the dryer.

Abstract: Freeze drying apparatus and associated lyophilization procedures are provided employing vapor flow detection and/or vacuum control for monitoring and control of the lyophilization process. The vapor flow detector, such as a windmill sensor, is disposed to monitor vapor flow from product undergoing lyophilization. In a batch process, vapor flow is collectively monitored with the vapor flow detector between the process chamber and condenser chamber, while in a manifold configuration separate vapor flow detectors are employed at each flask attachment port. A windmill sensor provides visual feedback to an operator and/or electronic feedback to a system controller. A vacuum control system is also provided for use with or independent of vapor flow detection. This vacuum control disconnects the vacuum source from the process chamber when pressure within the process chamber falls below a first predefined set point.

Abstract: A vacuum dryer and a method of drying a semiconductor device using the same are provided. In the present invention, a vacuum dryer using isopropyl alcohol vapor, including an outer bath, an inner bath, a main water supply line, a supplementary water supply line, an inner bath drain line, and an outer bath drain line, is provided. After cleaning the inside of the vacuum dryer, the inner bath is filled with the supplied deionized water and the deionized water is continuously overflowed. Then, the semiconductor substrate is loaded into the inner bath of the vacuum dryer to which the deionized is continuously overflowed. The loaded semiconductor substrate is dried by supplying the isopropyl alcohol vapor to the inner bath into which the semiconductor substrate is loaded.

Abstract: A method and apparatus for drying of a material containing a volatile component, in which the material is disposed in a bed in a drying zone which is in communication with a closed circuit in which a gaseous drying medium is circulated. Associated with the drying gone is a closed heat pump system including a compressor, at least one condenser in the drying zone, a super heat exchanger and a working medium. The drying zone is supplied with super heat from the super heat exchanger, and the condenser is supplied with working medium from a super heat exchanger, thereby increasing the temperature in the drying zone.

Abstract: A process and apparatus are described for rapidly drying a wet, porous gel monolith of glass or ceramic, at subcritical temperatures without inducing any cracking of the gel. The wet gel is immersed in a liquid solvent in a chamber, and the liquid solvent is then heated and expelled from the chamber. Further heating, with or without the presence of a flowing inert gas, fully dries the wet gel. When an inert gas is used, the gas is delivered to the chamber with a controlled solvent partial vapor pressure, to correspondingly control the driving force for drying the gel.