Abstract: Provided are chip antennas for near field communication and methods of manufacturing the chip antennas. A chip antenna for near field communication includes a substrate; a first antenna element on the substrate; and a second antenna element on the first antenna element. The substrate, the first antenna element, and the second antenna element are included in a single chip. The first and second antenna elements are formed outside the chip. The substrate is a lower layer including a plurality of devices. The first antenna element is a metal structure having a fish bone shape. The second antenna element is a dipole antenna.
Type:
Grant
Filed:
August 19, 2015
Date of Patent:
September 5, 2017
Assignees:
SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventors:
Chulsoon Park, Hojung Kim, Hongyi Kim, Innyeal Oh, Joongho Lee, Taehwan Jang
Abstract: An antenna device that radiates or receives a radio wave includes: a first wire line; a second wire line that is parallel to the first wire line; a power feeding/receiving point that is provided at proximal portions of the first wire line and second wire line; and a terminal resistance that is provided at distal end portions of the first wire line and second wire line.