Abstract: A liquid discharge head includes a substrate including a plurality of nozzle arrays formed by arranging nozzles having heat generating elements generating thermal energy for discharging a liquid, and a plurality of common liquid chambers formed along the plurality of nozzle arrays to supply the liquid to the plurality of nozzle arrays, the substrate being divided into a plurality of substrate portions by the plurality of common liquid chambers. The substrate includes a first substrate portion having a first nozzle array among the plurality of nozzle arrays and a second substrate portion having a second nozzle array different from the first nozzle array and a thermal capacity larger than that of the first substrate portion. A heating area of each first heat generating element provided in the first nozzle array is smaller than that of each second heat generating element provided in the second nozzle array.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.

Abstract: A liquid ejector includes a substrate, a heating element, a dielectric material layer, and a chamber. The substrate includes a first surface. The heating element is located over the first surface of the substrate such that a cavity exists between the heating element and the first surface of the substrate. The dielectric material layer is located between the heating element and the cavity such that the cavity is laterally bounded by the dielectric material layer. The chamber, including a nozzle, is located over the heating element. The chamber is shaped to receive a liquid with the cavity being isolated from the liquid.

Abstract: An inkjet printhead includes a plurality of nozzle chambers disposed on a substrate. Each nozzle chamber includes: a floor having an ink inlet defined therein; a roof having a nozzle aperture defined therein; sidewalls extending between the floor and the roof; and a heater element suspended in the nozzle chamber, the heater element being connected to corresponding electrodes so as to heat fluid within the nozzle chamber thereby forming a gas bubble in the fluid which causes ejection of fluid through the nozzle aperture. The ink inlet is laterally offset from the nozzle aperture and a plane of the heater is parallel with a plane of the roof.

Abstract: A liquid discharging recording head includes an element substrate including a plurality of discharge ports configured to discharge liquid and a plurality of energy generating elements configured to generate energy for discharging the liquid, a support member configured to support the element substrate, a first member configured to support an end of the element substrate in an array direction in which the discharge ports are arrayed, the first member having a thermal conductivity lower than a thermal conductivity of the support member, and a second member configured to support an end of the element substrate in an intersecting direction intersecting the array direction, the second member having a thermal conductivity lower than the thermal conductivity of the support member and a thermal resistance lower than a thermal resistance of the first member.

Abstract: In an ink jet head using a thermal energy for ejecting ink, this invention aims to reliably and uniformly remove kogations deposited on a heat application portion in contact with the ink. To realize this objective, the upper protective layer is arranged in an area including the heat application portion so that it can be electrically connected to serve as an electrode which causes an electrochemical reaction with the ink. The upper protective layer is formed of a material containing a metal which is dissolved by the electrochemical reaction and which does not form, on heating, an oxide film which hinders the dissolution. With this arrangement, a reliable electrochemical reaction can be produced to dissolve a surface layer of the upper protective layer, thereby removing kogations on the heat application portion reliably and uniformly.

Abstract: In an embodiment, a method of fabricating a fluid ejection device includes forming a resistor on the front side of a substrate, depositing a dielectric film on the resistor to protect the resistor from chemical exposure during a slot formation process, and forming a slot in the substrate that extends from the back side to the front side of the substrate.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.

Abstract: A base for a liquid discharge head includes a heat element which forms an exothermic portion, an electrode wire that is electrically connected with the heat element, an insulative protective layer provided above the heat generating resistive element and the electrode wire and an upper protective layer provided on the protective layer. The upper protective layer is made from a TaSi alloy containing 22 at. % or more Si.

Abstract: Disclosed is a method for fabricating a planar heater structure for an ejection device. The method includes providing a substrate wafer having a plurality of plugs configured therewithin. The method also includes depositing and patterning a layer of a second metallic material over the substrate wafer, providing a layer of a dielectric material of a predetermined thickness over the patterned layer of the second metallic material, and conducting chemical mechanical polishing of the layer of the dielectric material to form a planarized top surface while exposing the patterned layer of the second metallic material. The method further includes cleaning the planarized top surface, depositing and patterning a resistor film over the planarized top surface, depositing one or more blanket films over the patterned resistor film, and patterning and etching the one or more blanket films. Further disclosed are planar heater structures and additional methods for fabricating the planar heater structures.

Abstract: An insulation container has an insulation material, a filter arranged to encase the insulation material, the filter of a material that prevents escape of the insulation material while allowing air to pass through, and a container arranged to encase the filter, the container being heat sealable. A printer has an ink supply, a print head arranged to receive ink from the ink supply and configured to receive electrical signals from a controller and to dispense ink in accordance with the electrical signals onto a print substrate, and an insulator to absorb heat from the print head.

Abstract: An apparatus includes nozzles and an ink passage. Each nozzle includes a pressure chamber which houses an electrothermal transducer provided on a substrate to apply ejection energy to ink, an ink ejection orifice which faces the electrothermal transducer, and an ink passage along which the ink is supplied to the pressure chamber. The ink supply port is provided on the substrate and communicates with the ink passages. A distance between a center of gravity of the electrothermal transducer and the ink supply port differs between the nozzles which are next to each other. In at least one of the nozzles, a center of gravity of the ink ejection orifice is shifted from that of the electrothermal transducer in a direction toward the ink supply port by an amount which is increased as the distance increases.

Abstract: An inkjet nozzle assembly includes: a nozzle chamber having a floor and a roof spaced apart from the floor, the roof having a displaceable portion defining an ejection port; and an actuator for displacing the displaceable portion of the roof towards the floor. Displacement of the displaceable portion of the roof alters a volume of the nozzle chamber such that when the volume is altered, fluid is ejected from the ejection port.

Abstract: A micro-fluid ejection head has a resistor layer defining a heater element. An insulative layer underlies the heater element and a capping layer on the insulative layer substantially prevents ion mobility between the resistor and insulative layers. Resistance stability of the heater has been shown improved as has adhesion of the heater to the insulator. Representative layers include insulation of methyl silesquioxane (MSQ) in a thickness of about 5000 Angstroms or more, while the cap is a silicon nitride in a thickness of about 2000 Angstroms or less. Other capping layers include silicon carbide, silicon oxide or dielectrics. The resistor layer typifies TaAlN in a thickness of about 350 Angstroms, including overlying anode and cathode conductors that define the heater. Coating layers are also disclosed as are thermal barrier layers.

Abstract: A liquid ejection head is provided that is adapted, when the ejection of comparatively small ink droplets by one print head is required, to not only increase a printing speed and a printing resolution but also to prevent the occurrence of cavitation. The liquid ejection head includes: nozzles, for which heaters are formed to generate thermal energy used to eject ink; and bubble generation chambers, for which ejection ports are formed for ejecting ink upon the application of thermal energy provided by the heaters. Further, a partition wall is formed in each bubble generation chamber at a position opposite the ejection port.

Abstract: Thermal inkjet print head, comprising a fluid feed channel for delivering fluid, fluid chambers arranged near the fluid feed channel for receiving fluid from the fluid feed channel, resistors for actuating the fluid in the chambers, arranged in a staggered pattern with respect to a fluid feed channel wall, and a cantilever extending over the fluid feed channel wall, having a staggered edge that follows the staggered pattern of the resistors.

Abstract: A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata.

Abstract: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

Abstract: An inkjet nozzle includes an aperture with a noncircular opening substantially defined by a polynomial equation. A droplet generator is also described which includes a firing chamber fluidically coupled to a fluid reservoir, a heating resistor and a nozzle. The nozzle includes an aperture forming a passage from the firing chamber to the exterior of the droplet generator through a top hat layer. The nozzle is defined by a closed polynomial and has a mathematically smooth and mathematically continuous shape around aperture's perimeter wall, with two protrusions extending into the center of the aperture.

Abstract: An inkjet nozzle assembly has a chamber with a nozzle opening for ejecting a liquid, a heater element disposed in the chamber, and a dielectric layer sandwiched between the heater element and a wall of the chamber. The dielectric layer has a thermal product of less than 1495 Jm?2K?1s?1/2. The thermal product is defined as (?Ck)1/2, where ? is the density of the layer, C is specific heat of the layer and k is thermal conductivity of the layer.

Abstract: An inkjet printhead that has an array of ink chambers arranged to remove air bubbles entrained in the ink supply flow. Each of the ink chambers has a nozzle and a thermal actuator respectively, the array of ink chambers defined by sidewalls extending between a nozzle plate and an underlying wafer substrate. The printhead also has ink inlets extending through the underlying wafer substrate. Each of the ink inlets has an ink permeable trap and a vent sized such that the surface tension of an ink meniscus across the vent prevents ink leakage. The ink permeable trap has columns extending from the underlying wafer substrate to the vent to direct gas bubbles entrained in a flow of ink through the ink inlet towards the vent.

Abstract: A thermal head avoids a drop in print quality caused by adhesion of printing chaff. A thermal head 39 that presses against thermal paper that moves from one side to the other side and prints by melting dye contained in the thermal paper has a glazed layer 150 that is formed in an area on one part of a ceramic substrate 43 and stores in-flowing heat, and a heating resistor 140 that is located offset to one side from the center of the glazed layer 150, selectively heats the thermal paper S pressed in contact therewith, and melts a dye material contained in the thermal paper. A smooth surface P against which the thermal paper S heated by the heating resistor 140 slides is formed to the other side of the glazed layer 150 from the heating resistor 140.

Abstract: Provided is an inkjet printhead having an array of ink chambers formed on a planar support surface of a wafer substrate. Each ink chamber in the array has a nozzle, a thermal actuator for ejecting ink through the nozzle and a droplet stem anchor. The thermal actuator has two sections with higher resistance than the remainder of the thermal actuator. The droplet stem anchor is positioned between the two sections with higher resistance of the thermal actuator.

Abstract: Provided is an inkjet printhead integrated circuit that has a wafer substrate that has an ink passage, and a nozzle plate supported on the substrate by side walls to define an ink chamber supplied with ink via the ink passage. The nozzle plate has an ink ejection port corresponding to the ink chamber. A heater element is bonded to the nozzle plate inside the chamber for vaporising ink to generate a vapor bubble that ejects ink through the ejection port. The heater element is bonded to the nozzle plate with a low thermal product layer. The thermal product thermal product is less than 1495 Jm?2K?1s?1/2, the thermal product being (?Ck)1/2, where ? is the density of the layer, C is specific heat of the layer and k is thermal conductivity of the layer.

Abstract: A thermal inkjet printhead integrated circuit has an array of ink chambers formed on a wafer substrate, each having a nozzle aperture and a thermal actuator. The thermal actuator has a heater element extending between two contacts. The printhead IC also has CMOS (complementary metal-oxide semiconductor) drive circuitry formed by a plurality of flat, metal layers interleaved with interlayer dielectric for selectively providing the thermal actuators of the array with drive signals. The CMOS drive circuitry has a top-most metal layer providing electrodes for each of the thermal actuators respectively. The electrodes each have a flat surface that the contacts of each of the thermal actuators overlie for face to face contacting engagement. The contacts and the heater element are coplanar such that the thermal actuator is an integral planar structure.

Abstract: A printhead is provided having corresponding nozzles, chambers and heaters. Each heater has a heater element and electrodes connecting current from a power source to the heater elements to heat, and form gas bubbles in, liquid within the chambers which causes ejection of the liquid from the nozzles. Each heater element has a cross section with a lateral dimension at least triple that of the thickness of that heater element and different than a lateral dimension of each other heater element of the corresponding chamber. The thickness of each heater element is less than 0.3 microns. The heater elements and associated electrodes are arranged so that the electrodes are non-coincident with the electrodes of the other heater elements.

Abstract: Provided is a method of manufacturing a liquid ejection head having an element which generates energy utilized for ejecting liquid and an electrode layer electrically connecting the element. The method includes the steps of: providing an electrode layer on a substrate, a width of one portion of the electrode layer being smaller than that of another portion near the one portion; providing a resist layer on a part of the electrode layer by a screen printing method or a dispense method in such a manner that an end of the resist layer is positioned at the one portion; providing another layer on another part excluding the part of the electrode layer by utilizing the resist layer as a mask; and removing the resist layer.

Abstract: In order to hermetically seal more surely a gap between a back surface of a liquid discharge substrate and a front surface of a support member, and an electrode portion etc., without adversely affecting discharge performance, a liquid discharge head includes a first sealing resin coated on a portion between the liquid supply port and the pad on the support surface so as to surround a tip end portion at the liquid supply port of the support member and a second sealing resin for sealing a gap between the support member and the liquid discharge substrate, and a peripheral part of the liquid supply port.

Abstract: A method of manufacturing an ink jet print head capable of bonding the printing element substrate to the support surface with high precision in a reduced period of time is provided. For this purpose, raised flat portions are formed in the support surface of the supporting member to provide in an adhesive layer between the printing element substrate and the supporting member a portion of the thermosetting adhesive that is thinner than others. After the relative positions of the printing element substrate and the supporting member are adjusted, the thin portions of the adhesive layer are hardened. This enables the printing element substrate to be bonded to the supporting member in a relatively short period of time. As a result, if there are undulations on the support surface, the printing element substrate can be bonded to the supporting member with high precision, improving the mass productivity of the print head.

Abstract: An inkjet printhead has nozzles and respective heater elements. A print engine controller actuates the heater elements to eject ink through the corresponding nozzle. During use, the print engine controller actuates each of the heater elements at least once every decap time. The decap time is a predetermined time period in which the viscosity of the ejectable liquid at the nozzle increases to a threshold, at which ejection fails and the nozzle clogs.

Abstract: A manufacturing method forms an ink jet recording head including an energy generating element for generating energy for ejecting ink, wiring and electrode pad for supplying electric power to the energy generating element, and a flow path formation member in which an ink flow path is formed in fluid communication with an ink ejection outlet. The method includes steps of preparing a substrate on which the energy generating element, the wiring and the electrode pad have been formed; forming a protection layer covering edges of and around the generating element and the electrode pad; forming, with patterning, an adhesion layer for adhering the flow path formation member to a surface of the substrate through the protection layer, on a portion of the protection layer where the flow path formation member is formed and a portion surrounding the electrode pad; and forming through an electroless plating, a nickel layer covering the electrode pad and a gold layer covering the nickel layer to provide a bump.

Abstract: A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

Abstract: Provided is an ink jet recording head, including: an ink ejection portion, in which heat is applied to ink supplied inside thereof, thereby providing the ink with a pressure for ejecting the ink outside; a substrate having a first surface on which the ink ejection portion is provided and a second surface on an opposite side to the first surface, the second surface having at least one recess; and a heat radiation member for releasing heat outside, the heat being transmitted from the ink ejection portion to the substrate, the heat radiation member having a protrusion with a shape corresponding to a shape of the recess, the protrusion being embedded in the recess so that the protrusion is provided in direct contact with the recess.

Abstract: A fluid ejecting head includes a fluid storage chamber that temporarily stores a fluid, which is supplied from a fluid supply port, a plurality of pressure chambers, to which the fluid stored in the fluid storage chamber is supplied through a plurality of fluid supply paths, respectively, a plurality of driving elements that change pressure in the pressure chambers, respectively, and a plurality of nozzle openings, from which the fluids contained in the pressure chambers are ejected when the driving elements are driven, respectively. A specific driving element most distant from the fluid supply port among the driving elements has a maximum capability to discharge the air bubbles in the fluid from the nozzle opening among the driving elements.

Abstract: An inkjet head includes: an ink ejecting section including an ink chamber to which ink is supplied, a driving element provided in the ink chamber, a nozzle opened to the ink chamber, and a wire connected to the driving element, the ink ejecting section being configured to eject the ink in the ink chamber from the nozzle using the driving element; an ink passage section attached to the ink ejecting section and including a supply passage, which is connected to the ink chamber and through which the ink supplied to the ink chamber passes, and a discharge passage, which is connected to the ink chamber and through which the ink discharged from the ink chamber passes; and an IC electrically connected to the driving element via the wire and thermally connected to the ink passage section.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.

Abstract: An inkjet nozzle assembly includes: a nozzle chamber having a floor and a roof spaced apart from the floor, the roof having a displaceable portion defining an ejection port; and an actuator for displacing the displaceable portion of the roof towards the floor. Displacement of the displaceable portion of the roof alters a volume of the nozzle chamber such that when the volume is altered, fluid is ejected from the ejection port.

Abstract: A photoresist composition including an oxetane-containing compound represented by Formula 1 or 2, an oxirane-containing compound represented by Formula 3 or 4, a photoinitiator, and a solvent, a method of forming a pattern using the photoresist composition, and an inkjet print head including a polymerization product of the photoresist composition. The photoresist composition provides a polymerization product which resists formation of cracks due to an inner stress, and has excellent heat tolerance, excellent chemical resistance, excellent adhesiveness, and excellent durability.

Abstract: There is provided a printing head which improves durability and increases reliability by reducing stress occurring in a bonding part between an electrode pad and an inner lead at cooling. The electrode pad and the inner lead are electrically connected in such a manner that in the bonding portions between the electrode pad and a stud bump, only a part of contacting portions between the electrode and the stud bump is bonded.

Abstract: A printhead (10) for use in an inkjet printing process includes a substrate (12) having at least one ink feed opening (14) defined therein, an ink chamber (16) in operative and fluid communication with the ink feed opening(s) (14), and a nozzle plate (18) disposed on a portion (P1) of the substrate (12). The nozzle plate (18) has a plurality of orifices (20) defined therein. The printhead (10) further includes a firing resistor (22) disposed on another portion (P2) of the substrate (12) and proximate to the ink feed opening(s) (14) and a barrier structure (24) disposed on the other portion (P2) of the substrate (12) and positioned adjacent to the firing resistor (22).

Abstract: A nozzle arrangement for an inkjet printhead includes a substrate; a plurality of posts extending from the substrate; a roof portion defining an ejection port, the roof portion supported by the plurality of posts; a plurality of vanes extending from the substrate and arranged to define a chamber with the substrate and the roof portion; and a plurality of thermal bend actuators respectively positioned at a base of each vane, each thermal bend actuator including a rigid arm and an expandable arm attached to an end of the rigid arm. Each expandable arm contains therewithin a heater element. The plurality of thermal bend actuator are adapted to bend the vanes inwards with respect to the chamber in response to an electrical signal applied to each heater element, the plurality of thermal bend actuators bending the vanes in an iris-type manner to reduce a volume of the chamber.

Abstract: A heating element of a fluid ejection device includes an insulative layer, a resistor portion interposed between and spaced apart from a pair of conductive portions, and an upper structure defining a fluid chamber above the resistor portion. The insulative layer defines a shoulder portion adjacent a side edge of the resistor portion, the shoulder portion vertically spaced below a top surface of the resistor portion by a distance of no more than twice a thickness of the resistor portion.

Abstract: A thermal bend actuator includes: an active beam for connection to drive circuitry; and a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive beam, resulting in bending of the actuator. The passive beam has first and second layers with the second layer sandwiched between the first layer and the active beam. The first layer is thicker than the second layer.

Abstract: In an ink jet head using a thermal energy for ejecting ink, this invention aims to reliably and uniformly remove kogations deposited on a heat application portion in contact with the ink. To realize this objective, the upper protective layer is arranged in an area including the heat application portion so that it can be electrically connected to serve as an electrode which causes an electrochemical reaction with the ink. The upper protective layer is formed of a material containing a metal which is dissolved by the electrochemical reaction and which does not form, on heating, an oxide film which hinders the dissolution. With this arrangement, a reliable electrochemical reaction can be produced to dissolve a surface layer of the upper protective layer, thereby removing kogations on the heat application portion reliably and uniformly.

Abstract: A micro-electromechanical nozzle arrangement that has a substrate defining an ink inlet channel, an ink chamber having an active roof structure defining an ink ejection port, drive circuitry between the substrate and the ink chamber, a pair of thermal actuators connected to the drive circuitry and connected to the active roof structure for displacement of the ink ejection port towards the substrate, and a pair of coupling structures for respectively coupling the thermal actuators to the active roof structure. The pair of coupling structures are each configured to convert arcuate displacement at a connection to the thermal actuator into linear displacement at a connection to the active roof structure.

Abstract: A microfiltration apparatus and method for separating cells, such as circulating tumor cells, from a sample using a microfiltration device having a top porous membrane and a bottom porous membrane. The porous membranes are formed from parylene and assembled using microfabrication techniques. The porous membranes are arranged so that the pores in the top membrane are offset from the pores in the bottom membrane.

Abstract: This invention relates to a micro-electromechanical nozzle arrangement for an inkjet printhead. The arrangement includes a substrate defining an inverted pyramidal ink chamber with a vertex thereof terminating at an ink supply channel through the substrate. The substrate includes a layer of drive circuitry. The arrangement also includes a roof structure connected to the drive circuitry layer and covering the ink chamber, the roof structure defining a fluid ejection nozzle rim above said chamber. Also included is a plurality of actuators radially spaced about, and displaceable with respect to, the nozzle rim, each actuator having a serpentine heater element configured to thermally expand upon receiving current from the drive circuitry thereby moving said actuators into the chamber and operatively increasing a fluid pressure inside the chamber to eject a drop of ink via the ejection nozzle.

Abstract: A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.

Abstract: A fluid ejection device includes a chamber, and first and second electrodes configured to generate an electric field within the chamber. A related method includes, in a firing chamber, separating whole ink into colloidal particles and ink vehicle such that the firing fluid within the chamber comprises primarily ink vehicle.

Abstract: Provided is an inkjet printhead for a printer, the printhead having a plurality of micro-electromechanical nozzle assemblies. Each nozzle assembly includes a substrate defining an ink inlet channel and an arm fast with a thermal actuator itself fast with said substrate via an anchor arrangement. Each nozzle assembly also includes a nozzle on the substrate defining an ink aperture over the ink inlet channel, with a nozzle rim of the nozzle being inwardly displaceable by the actuator to eject ink from the aperture. The nozzle has a skirt portion and an inwardly directed lip that forms a fluidic seal in a complementary manner between the ink aperture and the thermal actuator.