Plural Coil Layers Patents (Class 360/123.15)
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Patent number: 9969001Abstract: Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.Type: GrantFiled: December 9, 2015Date of Patent: May 15, 2018Assignee: Washington State UniversityInventors: Rahul P. Panat, Deuk H. Heo
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Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive
Patent number: 8077433Abstract: A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film magnetic head has an equidistant two-stage structure in which a first turn part of a first conductor layer and a second turn part of a second conductor layer overlap vertically along the medium-opposing surface while having the same front distance from respective front side faces closer to the medium-opposing surface to the medium-opposing surface.Type: GrantFiled: June 3, 2008Date of Patent: December 13, 2011Assignees: Headway Technologies, Inc., SAE Magnetics (H.K.) Ltd.Inventors: Yoshitaka Sasaki, Hiroyuki Ito, Atsushi Iijima -
Patent number: 8004792Abstract: A magnetic write transducer includes a yoke having a lower pole portion, an upper pole portion, and a first bobbin portion; a first coil turn wrapped around the first bobbin portion of the yoke in a first plane; a second coil turn wrapped around the first bobbin portion of the yoke in a second plane above the first plane; a third coil turn wrapped around the First bobbin portion of the yoke in a third plane above the second plane; and a fourth coil turn wrapped around the first bobbin portion of the yoke in a fourth plane above the third plane.Type: GrantFiled: April 12, 2007Date of Patent: August 23, 2011Assignee: International Business Machines CorporationInventors: Robert Glenn Biskeborn, Leif Stefan Kirschenbaum
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Patent number: 7760466Abstract: A thin film magnetic head with a metal lamination part and method of manufacturing the same are provided. The thin film magnetic head including a metal lamination part in which an upper metal layer is laminated on a lower metal layer. The metal lamination part is formed in the laminated structure. An interlayer connection surface between the lower metal layer and the upper metal layer of the metal lamination part is formed in a concave shape that is curved toward the lower metal layer.Type: GrantFiled: November 17, 2006Date of Patent: July 20, 2010Assignee: TDK CorporationInventors: Hideki Gochou, Kiyoshi Kobayashi
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Patent number: 7526857Abstract: A method of manufacturing a thin-film magnetic head including the step of forming a thin-film coil. The step of forming the thin-film coil forms: a flat first coil of a single turn; a flat second coil of two turns arranged to sandwich the first coil from inner and outer sides thereof; a flat third coil of a single turn located above the first and second coils; and a flat fourth coil of two turns arranged to sandwich the third coil from inner and outer sides thereof. The first and fourth coils are connected in series to constitute a first three-turn coil. The second and third coils are connected in series to constitute a second three-turn coil. The first three-turn coil and the second three-turn coil are connected in series.Type: GrantFiled: July 6, 2005Date of Patent: May 5, 2009Assignees: Headway Technologies, Inc., SAE Magnetics (H.K.) Ltd.Inventors: Yoshitaka Sasaki, Takehiro Kamigama
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Patent number: 7428776Abstract: A method of manufacturing a thin-film coil in which a first coil and a second coil each having a desired number of winding are electrically connected in series and the second coil is formed between winding portions of the first coil on substantially the same plane, comprising: forming the first coil having a predetermined number of windings via a first insulating film; forming a second insulating film on a surface of the first coil and between the winding portions of the first coil; forming an underlying conductive film on the second insulating film, and treating the underlying conductive film so as to leave only the bottom portions of the underlying conducting film between the winding portions of the first coil; and growing deposition originating from a remaing portion of the underlying conductive film on the bottom portions of the underlying conducting film between the winding portions of the first coil so as to form the second coil.Type: GrantFiled: December 16, 2003Date of Patent: September 30, 2008Assignee: Sony CorporationInventor: Teruo Inaguma