Insulation Detail Patents (Class 360/123.16)
  • Patent number: 7948709
    Abstract: The thin-film magnetic head comprises a lower magnetic pole layer, an upper magnetic pole layer and a first thin-film coil. A resist film made of an organic insulating material is interposed between turns adjacent to each other in the lead constituting the first thin-film coil. The first thin-film coil has a minimum width part and a maximum width part. The minimum width part is arranged closer to an air bearing surface than is a second upper magnetic pole part, while the whole upper face of the minimum width part is covered with the resist film. The maximum width part is arranged on the side farther from the air bearing surface than is the second upper magnetic pole part, while the upper face of the maximum width part is formed with a resist-uncoated area free of the resist film.
    Type: Grant
    Filed: September 11, 2007
    Date of Patent: May 24, 2011
    Assignee: TDK Corporation
    Inventors: Tetsuya Hiraki, Hirotaka Gomi, Kazuhiko Maejima
  • Patent number: 7764465
    Abstract: A thin-film magnetic head is capable of securing an insulating property and minimizing the projection of a recording element section due to heat expansion. The thin-film magnetic head includes a pair of magnetic layers disposed with a predetermined gap therebetween on a surface facing a recording medium. The layers are connected to each other along an inner part in a height direction from the medium-facing surface. A spiral recording coil is disposed between the pair of magnetic layers and wound around a connecting portion of the pair of magnetic layers. The recording coil includes a dense coil portion formed with a pitch smaller than that of the inner part in the height direction so as to be closer to the medium-facing surface than the connecting portion. An organic insulating layer is locally formed to fill coil gaps of the dense coil portion, and coil gaps other than those of the dense coil portion are filled with an inorganic insulating layer.
    Type: Grant
    Filed: March 27, 2007
    Date of Patent: July 27, 2010
    Assignee: TDK Corporation
    Inventors: Sumihito Morita, Kiyoshi Kobayashi, Toru Takahashi