Abstract: An inductor may include a body and external electrodes on respective external surfaces of the body. The body may include a support member, an insulator on the support member and including a first opening, a coil in the first opening, and a thin film conductor layer between the coil and the support member. The thin film conductor layer may include a second opening, and one or both of its end portions may be between the support member and the insulator.

Abstract: A semiconductor device includes a semiconductor substrate having a main surface, a first insulating film formed on the main surface, a first coil formed on the first insulating film, a second insulating film formed on the first coil and having a first main surface and first side surfaces continuous with the first main surface, a third insulating film formed on the first main surface of the second insulating film and having a second main surface and second side surfaces continuous with the second main surface, and a second coil formed on the second main surface of the third insulating film. The second insulating film and the third insulating film are formed as a laminated insulating film together. A thickness of the second coil is greater than a thickness of the first coil in a thickness direction of the semiconductor substrate.

Abstract: A semiconductor device includes a semiconductor substrate having a main surface; a first coil formed on the main surface; a first insulating film formed over the first coil and having a first main surface; a second insulating film formed on the first main surface of the first insulating film and having a second main surface; and a second coil formed on the second main surface of the second insulating film, wherein the first main surface of the first insulating film has a first area on which the second insulating film is formed, and has a second area without the first area in a plan view, and wherein the second insulating film is surrounded with the second area in the plane view.

Abstract: A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer.

Abstract: A data writer may be configured with at least a write pole and a continuous coil with the continuous coil having a first turn with a first cross-sectional shape and a second turn with a second cross-sectional shape that differs from the first cross-sectional shape. The second turn may be positioned proximal a leading edge of the write pole and an air bearing surface while the first turn is positioned distal the air bearing surface.

Abstract: A write circuit and a head for a hard disk drive. The head includes a substrate that has an electrical ground and a write element that has a center tap. The head also has a resistor that is connected to the center tap and the electrical ground. The resistor provides a return path for AC and DC components of any common mode signal in a write circuit. The resistor can also generate heat that thermally expands the head and varies a head flying height. The write element is connected to an write driver circuit that provides in phase currents to a write element during the write operation and out of phase currents during a read operation. The out of phase currents allow for thermal expansion and flying height control even during a read operation.

Abstract: There is provided a method of manufacturing a coil component, where a first insulation layer is formed on a first magnetic substrate, an insulation film is formed on the first insulation layer, a coil conductor is formed on the insulation film, another insulation film is formed on the coil conductor, and an open region is formed on the inner circumference side and on the outer circumference side of the coil conductor. A magnetic later is embedded, at least partially, in the open region, and a second magnetic substrate is secured on the magnetic layer. Also, a plurality of electrode terminals are formed, where one of the electrode terminals is connected to a terminal portion of the coil conductor, and the electrode terminals are provided across sides of the first and second magnetic substrates. Therefore, the first insulation layer can suitably prevent shorting failures between the electrode terminals.

Abstract: A thin film device is provided, in which inductance can be increased when a thin film coil wound on a magnetic film is provided. In a thin film coil wound on a magnetic film, thickness of lower coil portions is smaller than thickness of upper coil portions. Consequently, a magnetic property (permeability) tends to be hardly deteriorated.

Abstract: A thin film magnetic head capable of shortening a manufacturing time and a method of manufacturing the same are provided. After forming a write gap layer by using a non-magnetic conductive material such as copper, a top pole is formed on the write gap layer by growing a plating film with the write gap layer used as a seed layer. Unlike the case where the write gap layer is formed by using a non-magnetic insulating material such as alumina, a step of newly forming a seed layer aside from the write gap layer and a step of selectively removing the newly formed seed layer become unnecessary. Therefore, the number of manufacturing processes is reduced, and the manufacturing time of the thin film magnetic head is shortened.

Abstract: The invention is directed to a method for manufacturing a thin film magnetic head comprising forming a first coil, a first pole piece and a first back gap piece on a first insulating film formed on a surface of a first magnetic film, so that the first coil, the first pole piece and the first back gap piece have a taper angle making a sectional shape wider in a lower part and narrower in an upper part; forming a second insulating film on surfaces of the first coil, the first pole piece and the first back gap piece; forming a first seed film on the second insulating film; growing a first plating film for a second coil on the first seed film in an area where the second coil is to be formed, so that the first plating film fills up spaces between the first pole piece and an outermost coil turn of the first coil, between coil turns of the first coil, and between an innermost coil turn of the first coil and the first back gap piece; and flattening the first plating film by polishing, so that to obtain a pattern of t

Abstract: A method of manufacturing a thin-film magnetic head including the step of forming a thin-film coil. The step of forming the thin-film coil forms: a flat first coil of a single turn; a flat second coil of two turns arranged to sandwich the first coil from inner and outer sides thereof; a flat third coil of a single turn located above the first and second coils; and a flat fourth coil of two turns arranged to sandwich the third coil from inner and outer sides thereof. The first and fourth coils are connected in series to constitute a first three-turn coil. The second and third coils are connected in series to constitute a second three-turn coil. The first three-turn coil and the second three-turn coil are connected in series.