Electrical Connection Detail Onto Actuator Arm Patents (Class 360/264.2)
  • Patent number: 8354597
    Abstract: A wired circuit board includes a metal supporting board having at least one depressed portion, a conductive portion embedded in the at least one depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wires formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: January 15, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takahiko Yokai, Toshiki Naito
  • Patent number: 8320083
    Abstract: An electrical interconnect and a method of making an electrical interconnect in which a conductor has been substantially plated with a first protective metal shell, such as nickel, and a second outer metal shell, such as gold, before a covercoat has been applied. Such an electrical interconnect can be characterized as having an even-thickness outer shell on both its terminal pads and underneath the covercoat adjacent to the terminal pads, without overhangs or gaps near the bottom of the covercoat caused by surface etching during production.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: November 27, 2012
    Assignee: Magnecomp Corporation
    Inventors: Christopher Dunn, Keith A. Vanderlee
  • Patent number: 8307538
    Abstract: A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step.
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: November 13, 2012
    Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.
    Inventor: Kenjiro Hata
  • Patent number: 8300365
    Abstract: An electronic substrate includes: a flexible printed circuit comprising a head connecting portion being provided with a first terminal to be electrically connected to a magnetic head, and a board connecting portion being provided with a second terminal to be electrically connected to a main printed board; a first reinforcing member provided on the head connecting portion of the flexible printed circuit, the first reinforcing member reinforcing the head connecting portion; and a second reinforcing member provided on the board connecting portion of the flexible printed circuit, the second reinforcing member reinforcing the board connecting portion, wherein the second reinforcing member includes a additional enhancement portion formed with a sterically enhanced shape.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: October 30, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kosuke Awaga, Kengo Saruta, Takao Ohmi
  • Patent number: 8289656
    Abstract: A disk drive is disclosed comprising a disk, a head actuated over the disk, a preamp, and an interconnect for coupling the head to the preamp. The interconnect comprises a first transmission line stacked over a second transmission line, and a dielectric between the first transmission line and second transmission line. A shape of the first and second transmission lines varies along a length of the interconnect such that the interconnect comprises an approximation of an inductor/capacitor ladder network.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: October 16, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventor: William Don Huber
  • Patent number: 8270120
    Abstract: A flex cable assembly for a head stack assembly of a hard disk drive comprises a flex cable for conducting data signals from the head stack assembly to a connector. The flex cable comprises a dynamic loop section between a termination for the head stack assembly and the connector. A constrained layer damper is attached adjacently to an area of the flex cable that is configured to receive the coupler. The constrained layer damper extends into the dynamic loop section of the flex cable.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: September 18, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Jeffrey Kerner, Kirk B. Price, Robert C. Reinhart, Edgar D. Rothenberg, Jr-Yi Shen
  • Patent number: 8247700
    Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: August 21, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Yasunari Ooyabu, Visit Thaveeprungsriporn
  • Patent number: 8243395
    Abstract: A method of utilizing a solder reflow channel in the formation of a hard disk drive is disclosed. The method provides a first hard disk drive component having at least one solder reflow channel, the at least one solder reflow channel for retaining a predeposited solder material. The solder reflow channel is utilized to provide a solder location for coupling the first hard disk drive component and a second hard disk drive component to the predeposited solder material.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: August 14, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Iraj Kavosh, Russell D. Moates, Jorge Rubio
  • Patent number: 8238061
    Abstract: A printed circuit cable assembly (PCCA) for a hard disk drive (HDD) is disclosed. The PCCA includes a stiffener portion having an elongated shape that includes an integrated circuit (IC) chip. The PCCA also includes a flexible portion extending from the elongated stiffener portion, wherein the PCCA is configured to be mountable on a headstack of the HDD such that an entire footprint of the IC chip overlays a metallic portion of the headstack of the HDD.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: August 7, 2012
    Assignee: Texas Instruments Incorporated
    Inventor: Ramlah Binte Abdul Razak
  • Patent number: 8233241
    Abstract: A method of reducing oscillation at the read write element of a hard disk drive, is described. In one embodiment, a flex cable for conducting data signals from a head stack assembly to a connector is provided. One or more weights are then coupled with the flex cable at one or more predetermined locations. The one or more predetermined locations are selected based upon mass distribution along the flex cable.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: July 31, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Fu-Ying Huang, Jr-Yi Shen, Jifang Tian
  • Patent number: 8228639
    Abstract: A flex cable assembly for a head stack assembly of a hard disk drive comprises a flex cable for conducting data signals from the head stack assembly to a connector. The flex cable has a dynamic loop section between a termination for the head stack assembly and the connector. The flex cable has a constrained layer damper for attenuating random transient vibration. The constrained layer damper has a symmetrically tapered shape for reducing stress concentration and is coupled with the dynamic loop section of the flex cable adjacent to an area of the flex cable configured for receiving a coupler for coupling the flex cable assembly with the head stack assembly.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: July 24, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Fu-Ying Huang, Jr-Yi Shen, Jifang Tian
  • Patent number: 8213124
    Abstract: A hard disk drive flex cable assembly, for conveying data between a connector to a host system and a head stack assembly, comprises a flex cable, which in part has a first end for coupling to the connector, and a second end for coupling to the head stack assembly; and a stiffener coupled to the second end, wherein the stiffener supports at least one termination pad of the second end on three sides of the termination pad.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: July 3, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Jen-Yuan Chang, Robert C. Reinhart, Edgar D. Rothenberg, See C. Young
  • Patent number: 8213125
    Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: July 3, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Martin John McCaslin, Szu-Han Hu, Alex Enriquez Cayaban, Voon Yee Ho
  • Patent number: 8194355
    Abstract: A novel head stack assembly (HSA) includes a flex cable with a first side and an opposing second side, and having a hole therethrough. The HSA also includes a head gimbal assembly (HGA) having a load beam, a laminated flexure attached to the load beam, and a head attached to the laminated flexure. The laminated flexure includes a flexure tail with a snap-through feature. The snap-through feature has a plurality of windows in the flexure tail, a snap-through feature central portion that is centric to the plurality of windows, and a plurality of lobes. Each lobe extends out from the snap-through feature central portion radially into one of the plurality of windows. The laminated flexure overlies and contacts the flex cable on its first side, but the snap-through feature is disposed through the hole so that each of the plurality of lobes contacts the flex cable on its second side.
    Type: Grant
    Filed: May 8, 2008
    Date of Patent: June 5, 2012
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Ali Hosseinzadeh
  • Patent number: 8169748
    Abstract: Method and apparatus for attenuating resonances in a flex circuit which interconnects a stationary element and a moveable element, such as a connector and a head stack assembly (HSA) in a data storage device. An intermediary portion of the flex circuit forms a dynamic loop between the stationary element and the moveable element. A damper member is attached to the flex circuit so as to continuously extend adjacent the stationary element and along less than an overall extent of the dynamic loop. The damper member attenuates resonances excited in the flex circuit during movement of the moveable element.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: May 1, 2012
    Assignee: Seagate Technology LLC
    Inventor: Aaron Steve Macpherson
  • Patent number: 8154827
    Abstract: An integrated lead suspension (ILS) or flexure has a connection scheme that allows for coplanar and interleaved conductive traces between read/write circuitry and a read/write head in a magnetic recording disk drive. At each end of the flexure there is an island of electrically conductive substrate material with vias in an insulator layer that permit electrical connection to the islands. Conductive traces on the insulator layer are grouped into two sets and extend generally parallel along the length of the flexure, with the traces from one set being interleaved with traces from the other set and each set carrying one of the positive or negative signals. At each of the ends, all of the traces from a set are connected through the vias to the island at that end.
    Type: Grant
    Filed: July 14, 2008
    Date of Patent: April 10, 2012
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: John Thomas Contreras, Luiz M Franca-Neto
  • Patent number: 8149543
    Abstract: A hard disk drive apparatus includes a magnetic head having a write head to record data on a disk and a read head to read the data recorded on the disk, at least one actuator arm on which the magnetic head is mounted, a voice coil motor to rotate the at least one actuator arm across the disk, a printed circuit board electrically connected to the write head, the read head, and the voice coil motor, and a flexible printed circuit having at least one write trace to electrically connect the write head and the printed circuit board, at least one read trace to electrically connect the read head and the printed circuit board, and a voice coil motor trace to electrically connect the voice coil motor and the printed circuit board. In the hard disk drive, the write trace is arranged between the read trace and the voice coil motor trace.
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: April 3, 2012
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventor: Jong Yoon Kim
  • Patent number: 8144431
    Abstract: A hard disk drive flex cable assembly conveys data between a connector to a host system and a head stack assembly. It comprises a flex cable which in part has a first end for coupling to the connector, and a second end for coupling to the head stack assembly; and a stiffener coupled to the second end. The stiffener comprises an end formed to approximate a J-shape. A filling material is applied to the concave surface of the J-shape, whereby a dynamic response frequency of the flex cable assembly is moved away from a dynamic response frequency of the head stack assembly upon which the flex cable assembly is coupled.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: March 27, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Jen-Yuan Chang, Robert C. Reinhart, Edgar D. Rothenberg, See C. Young
  • Patent number: 8144432
    Abstract: An actuator for selectively positioning a portion of a communication channel formed by a cable circuit having a protuberant component connected at a proximal end to a flexible base, whereby the actuator defines a heat transfer surface operably disposed in thermal conductivity with a distal surface of the protuberant component for sinking heat from the component to the actuator.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: March 27, 2012
    Assignee: Seagate Technology LLC
    Inventors: Rick Pfahl Freeman, Michael H. Lennard, Andy M. Motzko
  • Patent number: 8144435
    Abstract: An improved microactuator suspension is provided for use with high density storage media. The number of microactuator elements is reduced to one and placed perpendicularly to the longitudinal axis of the suspension arm to maximize the windage and resonance performance and minimize the microactuator's contribution to bending stiffness and the off track bending component. An improved electrical connection eliminates the requirement for a jumper. These improvements reduce cost by reducing part count and assembly complexity.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: March 27, 2012
    Assignee: Seagate Technology LLC
    Inventors: Michael Allen Greminger, John Stuart Wright, Michael Scott Bowers, Bradley Jay Ver Meer
  • Patent number: 8134807
    Abstract: A disk drive data storage system. The system comprises a data storage disk, a movable member positioned near the data storage disk, and a sensor assembly, supported and movable by the movable member, for writing data to and reading data from the data storage disk. The system also comprises an integrated circuit that is electrically coupled to the sensor assembly and that moves with the movable member when the movable member moves the sensor assembly. The integrated circuit comprises a face and a backside, and the integrated circuit is in a fixed physical position relative to the movable member such that the backside is oriented toward the movable member.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: March 13, 2012
    Assignee: Texas Instruments Incorporated
    Inventors: Priscilla Escobar-Bowser, Axel Alegre De La Soujeole, Indumini Wijayanayake Ranmuthu, Ramlah Razak
  • Patent number: 8130472
    Abstract: Embodiments of the present invention provide a magnetic disk device that can reduce an external force applied to the carriage. According to one embodiment, in a magnetic disk device, a bracket inserted between a carriage and a base is supported toward the base side by support portions owned by the bracket and by a band with a space provided between the bracket and the opposed side of the carriage (such as a top surface of the mounting stand). This configuration cannot apply an external force in the rotation direction to the carriage from the bracket even when the bracket is thermally expanded due to heat generated from a head amplifier or the like mounted on a flexible substrate.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: March 6, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Hirokazu Tanizawa, Osamu Beppu, Gentaro Nakamura, Takahisa Okada
  • Patent number: 8116041
    Abstract: An FPC holding mechanism of an actuator assembly of a hard disk drive (HDD) includes an FPC holder protruding from an arm-mold of the actuator assembly, and an FPC clip mounted to the FPC holder so as to be rotatable. The FPC holder defines a guide groove into which the FPC is inserted and a first side support plate facing one side surface of the FPC. The FPC clip includes a second side support plate juxtaposed with the first side support plate and facing the other side surface of the FPC, and at least two clip arms extending in a horizontal direction over upper and lower edges of the FPC, respectively. At least one of the clip arms has a hook hooked onto the first side support plate. The FPC holding mechanism thus prevents a portion of the FPC from moving in vertical and horizontal directions.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: February 14, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-pyo Hong, Byoung-gyou Choi, No-yeol Park
  • Patent number: 8116040
    Abstract: A soft or passive latch to control a position of a head relative to a data storage media is disclosed. In illustrated embodiments, the latch provides a dwell point or region along the flex circuit assembly. In illustrated embodiments, the dwell point or region corresponds to alignment of the head in a middle region of the media. In illustrated embodiment, the latch is formed of a lower or reduced bending stiffness region, which in illustrated embodiment is formed via a cut-out, contoured, or reduced width portion of a constraint layer damper or other layer(s) along the flex circuit assembly.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: February 14, 2012
    Assignee: Seagate Technology LLC
    Inventors: Hwa Liang Ng, Clifford Jayson B. Camalig
  • Patent number: 8111485
    Abstract: An actuator for supporting data transfer elements includes an arm, a flexible circuit assembly and a sensor. The flexible circuit assembly includes a stiffener having a mount feature and a turnaround feature. The flexible circuit assembly also includes a flexible cable having a plurality of conductive traces for electrically connecting the data transfer elements to circuitry. The flexible cable has a service loop portion, a mounting portion coupled to the mount feature of the stiffener and a turnaround portion coupled to the turnaround feature of the stiffener. The turnaround portion is configured to couple the mounting portion to the service loop portion. The sensor is in contact with a surface of the arm and is electrically coupled to the flexible cable.
    Type: Grant
    Filed: November 19, 2008
    Date of Patent: February 7, 2012
    Assignee: Seagate Technology LLC
    Inventors: Rick Pfahl Freeman, Neal Frank Gunderson, Andrew Robert Motzko, Erik Jon Lindquist
  • Patent number: 8098459
    Abstract: Connecting a preamplifier to a printed circuit board assembly on a hard disk drive. The disk includes a housing, a head stack assembly coupled with the housing, a printed circuit board assembly comprising via holes, a preamplifier coupled with the head stack assembly, and at least one deformable pogo pin configured to mechanically and communicatively connect the printed circuit board assembly to the preamplifier upon insertion into the via holes, further configured to comprise a tip and a shaft, and further configured to deform upon insertion into the via holes.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: January 17, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Yeow Yong Chan, Hongyan Jiang, Shaoyong Liu, Xiaomin Liu
  • Patent number: 8085507
    Abstract: An apparatus and method for forming an opening in a base-metal layer of an electrical lead suspension (ELS) to increase the impedance. The method provides a base-metal layer having at least one opening. A dielectric layer above the base-metal layer is also provided, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is aligned above the portion of the dielectric layer covering at least one of the openings in the base-metal layer. By aligning the at least one solder pad portion over the opening of the base-metal layer the solder pad to base-metal layer the impedance between the at least one solder pad portion and the base-metal layer is increased.
    Type: Grant
    Filed: January 13, 2005
    Date of Patent: December 27, 2011
    Assignee: Hitachi Global Storage Technologies, Netherlands, B.V.
    Inventors: Satya Prakash Arya, Xinzhi Xing
  • Patent number: 8068314
    Abstract: A novel head stack assembly (HSA) is disclosed and claimed. The HSA includes an actuator including an actuator body and an actuator arm extending from the actuator body, and a flexible printed circuit (FPC) adjacent the actuator body. The FPC includes a slit therethrough. A head gimbal assembly (HGA) is attached to the actuator arm. The HGA includes a load beam, a laminated flexure attached to the load beam, and a head attached to the laminated flexure. The laminated flexure has a flexure tail that includes an intermediate region that is disposed adjacent the actuator arm, and a terminal region that is electrically connected to the FPC. The terminal region is substantially orthogonal to the intermediate region. The intermediate region of the flexure tail extends into the slit, interferes with the slit, and contacts and deforms the FPC adjacent the slit.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: November 29, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Tzong-Shii Pan, Shufun Ho, Gregory Tran, Fernando A. Magsombol
  • Patent number: 8064170
    Abstract: A novel method and device to align a flexure tail of a head gimbal assembly (HGA) to a flex cable of a head stack assembly (HSA) is disclosed. An alignment pin is passed through a first alignment hole in the flex cable, and a second alignment hole in the flexure tail. The second alignment hole is disposed in a region of the flexure tail that lies in a flexure tail plane that is approximately parallel to the flex cable plane adjacent the first alignment hole. A novel head gimbal assembly (HGA) has a flexure tail that includes a first bend line. The flexure tail is bent out-of-plane about the first bend line to create a residual bend angle in the range 10° to 80°. The first alignment tab is abutted against a first guide surface of an alignment fixture.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: November 22, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventor: Tzong-Shii Pan
  • Patent number: 8018688
    Abstract: A head stack assembly of a disk drive unit includes a head arm assembly (HAA) having a head gimbal assembly, a drive arm to be connected with the head gimbal assembly; wherein the drive arm comprises a securing portion, a connection portion and a spacer connecting the securing portion with the connection portion. At least one undercut is formed on the spacer of the drive arm to strengthen the drive arm.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: September 13, 2011
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Takehiro Kamigama, Yiu Sing Ho, Canhua Chen
  • Patent number: 8018687
    Abstract: A novel disk drive includes a flex cable having a first end portion fixed to an actuator assembly, a second end portion fixed to a flex cable bracket, and a free portion between the first and second end portions. The free portion joins the second end portion at a flex exit location. The flex cable bracket includes a flex alignment post that protrudes into a corresponding hole in a disk drive base. A distance between the flex exit location and the actuator pivot axis is at least 4 times greater than a distance between the flex exit location and the flex alignment post.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: September 13, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Aaron D. Little, Gregory G. Foisy
  • Publication number: 20110216445
    Abstract: An electronic substrate includes: a flexible printed circuit comprising a head connecting portion being provided with a first terminal to be electrically connected to a magnetic head, and a board connecting portion being provided with a second terminal to be electrically connected to a main printed board; a first reinforcing member provided on the head connecting portion of the flexible printed circuit, the first reinforcing member reinforcing the head connecting portion; and a second reinforcing member provided on the board connecting portion of the flexible printed circuit, the second reinforcing member reinforcing the board connecting portion, wherein the second reinforcing member includes a additional enhancement portion formed with a sterically enhanced shape.
    Type: Application
    Filed: February 4, 2011
    Publication date: September 8, 2011
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kosuke AWAGA, Kengo Saruta, Takao Ohmi
  • Patent number: 8004798
    Abstract: A disk drive flexure has a pattern of voids in the ground plane in the area directly underneath the read and write bond pads, in order to adjust the respective impedances of the read and write bond pad pairs to match the impedances of the read and write transducers and the signal trace pairs to and from the transducers. The resulting impedance matched bond pads increase the effective signal bandwidth of the flexure and its electrical connections, decreasing the probability of error at high signal speeds and increasing the maximum data rate through the suspension.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: August 23, 2011
    Assignee: Magnecomp Corporation
    Inventor: Christopher Gene Dunn
  • Patent number: 7961436
    Abstract: A disk drive has a novel head stack assembly that includes a flex cable having a width, an actuator body, and a clip. A top portion of the clip includes a first top slot and a second top slot, forming a non-zero acute angle. The bottom portion of the clip includes a first bottom slot that is substantially aligned to face and oppose the first top slot, and a second bottom slot that is substantially aligned to face and oppose the second top slot. A first maximum distance between the first top slot and the first bottom slot equals or exceeds the width. A second maximum distance between the second top slot and the second bottom slot equals or exceeds the width. The slots retain the flex cable. The top portion and the bottom portion are a single monolithic piece.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: June 14, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Lidu Huang, Seungman Chang
  • Patent number: 7952834
    Abstract: In accordance with various embodiments, a printed structure of a flex circuit assembly includes a plurality of adjacent land portions formed on a heat conductive stiffener member and which support electrically conductive paths for connection to an integrated circuit. A corresponding plurality of separation channels are formed between the adjacent electrically conductive paths, and thermal energy generated by operation of the integrated circuit is transferred through the separation channels to the stiffener member. In some embodiments, the separation channels retain a fluid, such as air or a low density inert gas, which flows through the separation channels in response to rotation of a rotatable member adjacent the flex circuit assembly. In other embodiments, a dielectric, thermally conductive material fills the separation channels.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: May 31, 2011
    Assignee: Seagate Technology LLC
    Inventors: Rick Pfahl Freeman, Andrew R. Motzko
  • Patent number: 7921542
    Abstract: Certain example embodiments relate to a manufacturing method for a disk drive unit. At least one head gimbal assembly having first terminal pads is provided. A controlling circuit for controlling the at least one head gimbal assembly is provided, with the controlling circuit having second terminal pads to connect with the first terminal pads. The at least one head gimbal assembly is disposed in a motor base. The controlling circuit is disposed in the motor base. The at least one head gimbal assembly and the controlling circuit are tightened to the motor base such that the first and second terminal pads are face-to-face and have an electrical touch contact therebetween.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: April 12, 2011
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: YiuSing Ho, GuoHong Lu, CanHua Chen
  • Patent number: 7911742
    Abstract: A novel head stack assembly is disclosed. The novel head stack assembly includes a stamped actuator arm and a head gimbal assembly attached to the stamped actuator arm. The head gimbal assembly includes a trace suspension flex having a metal base layer and a plurality of conductors supported by the metal base layer. The stamped actuator arm includes an actuator arm side surface that extends longitudinally along the stamped actuator arm. The stamped actuator arm also includes two or three longitudinally spaced-apart stamped protrusions. The stamped protrusions are in contact with the trace suspension flex, and each stamped protrusion extends from the actuator arm side surface.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: March 22, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventors: Ken L. Chang, John L. Rauen
  • Patent number: 7907369
    Abstract: A novel method and device to align a flexure tail of a head gimbal assembly (HGA) to a flex cable of a head stack assembly (HSA) is disclosed and claimed. An alignment pin is passed through a first alignment hole in the flex cable, and a second alignment hole in the flexure tail. The second alignment hole is disposed in a region of the flexure tail that lies in a flexure tail plane that is approximately parallel to the flex cable plane adjacent the first alignment hole. A novel head gimbal assembly (HGA) has a flexure tail that includes a first bend line. The flexure tail is bent out-of-plane about the first bend line to create a residual bend angle in the range 10° to 80°. The first alignment tab is abutted against a first guide surface of an alignment fixture.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: March 15, 2011
    Assignee: Western Digital Technologies, Inc.
    Inventor: Tzong-Shii Pan
  • Patent number: 7903377
    Abstract: A hard disk drive has a flexible cable and a flexible cable damper positioned adjacent to but separate from the flexible cable. The damper is a thin film loop with a damper patch that is completely independent of the flexible cable. The damper strip is a non-signal carrying substrate and has the constraint layer attached to it opposite the flexible cable. Both the damper and flexible cable extend in an arcuate configuration from the base to an integrated lead suspension tail extending from the actuator.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: March 8, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Fu-Ying Huang, Jr-Yi Shen, Jifang Tian
  • Patent number: 7891079
    Abstract: A bending apparatus of a head gimbal assembly includes a suction unit configured to attract the head gimbal assembly, a movement unit configured to move a long tail connected to a terminal part, a stopper against which the moved long tail is butted, a transmission type optical sensor configured to detect that the long tail is positioned to the stopper, a tail holder configured to hold a part of the long tail on a work table, a roller configured to compress the terminal part against the tail holder and to bend the terminal part relative to the long tail at a right angle, and a controller configured to control, based on a detection result of the transmission type optical sensor, a movement of the tail holder to the work table and a movement of the roller to the tail holder.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: February 22, 2011
    Assignee: Toshiba Storage Device Corporation
    Inventors: Hiroshi Nozawa, Yukio Kato
  • Patent number: 7881016
    Abstract: A latching mechanism for a flex cable bracket. The latching mechanism includes a position limiter. The position limiter prevents movement of an actuator assembly installed thereon. The latching mechanism also includes a spring clip. The spring clip has spring functionality and a cantilever beam to retain the actuator assembly when installed thereon. The latching mechanism further includes an orientation position limiter. The orientation position limiter prevents a rocking motion of the actuator assembly. The position limiter and the spring clip and the orientation position limiter are integrated into structure of the flex cable bracket.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: February 1, 2011
    Assignee: Hitachi Global Storage Technologies, Netherlands, B.V.
    Inventors: Jen-Yuan Chang, Ta-Chang Fu, Edgar D. Rothenberg, Russell D. Moates
  • Patent number: 7869164
    Abstract: A flexible printed circuit board has a flexible dynamic region, and relatively rigid static regions between which the dynamic region extends. Portions of a base layer, a patterned conductive layer extending on the base layer, and a cover layer covering the conductive layer make up the dynamic region. Extensions of the base layer, the conductive layer, and the cover layer, and portions of a metal layer to which the base layer is attached make up each of the static regions. The metal layer enhances the rigidity of the flexible printed circuit board at the static regions. The metal layer also has rounded corners at sides of each of the boundaries between the dynamic region and each of the static regions to minimize stress concentrations at the boundaries. The conductive layer is made up of real traces through which electrical signals are transmitted, and dummy traces.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: January 11, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Sang-chul Shin
  • Patent number: 7859796
    Abstract: A disk drive and an arm coil support assembly are to be provided which enables a trace to be disposed with a simple construction without the need of machining arms. In one embodiment, a trace for connection between a head and an FPC is disposed on an opposite surface of each of arms and opposite to a confronting surface of each of the arms which confronts a recording surface of a disk. The trace is bent nearly vertically in the vicinity of a connection between a coil support which supports the arms, and holds a VCM coil and the arm and is connected to the FPC. The coil support includes a force mechanism having a gap for insertion therein of the trace and also having a pressure portion spaced through the gap from the surface on which the trace is disposed. The force mechanism prevents wafting of the trace from the opposite surface of the arm caused by the bending of the trace.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: December 28, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Takaaki Deguchi, Kohichi Suzuki
  • Patent number: 7855855
    Abstract: A recording apparatus including a recording head having an actuator and operable to perform recording on a recording medium by an operation of the actuator, a head holder holding the recording head, a circuit board having a heat-conductive substrate and provided on the head holder, a drive circuit operable to drive the actuator, a flexible wiring member on which the drive circuit is mounted and which connects the circuit board and the actuator such that a signal outputted from the circuit board is transmitted to the actuator via the drive circuit, and a radiator plate provided on the head holder, held in heat conductive contact with the drive circuit, and also held in heat conductive contact with the circuit board.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: December 21, 2010
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Isao Kobayashi
  • Patent number: 7787219
    Abstract: An airflow diverter is used to overcome the adverse effect of flow-induced vibration of a disk drive pivot actuator. The diverter may be formed as a separate component or as an integral portion of the flex stiffener or the actuator itself. The invention streamlines the actuator to the incoming airflow and helps reduce the torque disturbance to the actuator as it reduces the sail or parachute effect. This helps reduce power consumption due to a lower drag from the actuator assembly. The contour of the flow deflector is designed to conform closely to the curvature of the disk boundaries when the actuator is rotated to the ID position on the disk. This design serves as a shroud around the disk stack which further helps to reduce power by preserving flow momentum.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: August 31, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Andre S. Chan, Manoj B. Keshavan
  • Patent number: 7782572
    Abstract: An integrated lead flexure for a disk drive head suspension of the type having a plurality of stacked leads disposed on separate layers, the plurality of stacked leads extending between terminal connector pads and head connector pads, comprising stacked lead pairs having opposing and regularly alternating wider and narrower portions, respectively.
    Type: Grant
    Filed: May 4, 2007
    Date of Patent: August 24, 2010
    Assignee: Hutchinson Technology Incorporated
    Inventor: John D. Pro
  • Patent number: 7760470
    Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: July 20, 2010
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Li Xing Wu, Yiu Sing Ho, Jeffery L. Wang, Liu Jun Zhang
  • Patent number: 7733609
    Abstract: A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: June 8, 2010
    Assignee: Sae Magnetics (H.K.) Ltd.
    Inventors: Jeffery L. Wang, Takehiro Kamigama, Chi Hung Yuen, Kai Wu
  • Patent number: 7729091
    Abstract: A method and system or mounting a flex cable within a head stack assembly is disclosed. The flex cable has a width. The method and system include providing a top portion and a bottom portion coupled to the top portion. The top portion includes a first top slot and a second top slot therein. The first top slot and the second top slot form a non-zero acute angle. The bottom portion includes a first bottom slot and a second bottom slot therein. The first bottom slot is substantially aligned with the first top slot. The second bottom slot is substantially aligned with the second top slot. A maximum first distance between the first top slot and the first bottom slot equals or exceeds the width. A second maximum distance between the second top slot and the second bottom slot equals or exceeds the width.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: June 1, 2010
    Assignee: Western Digital Technologies, Inc.
    Inventors: Lido Huang, Seungman Chang
  • Patent number: 7724478
    Abstract: Terminals of a flexible printed circuit board and terminals of a wiring trace in a head suspension assembly are to be connected with each other by soldering without causing a soldering defect. In an embodiment, a terminal structure of a multi-connector in a wiring trace which includes an insulating layer and a conductor pattern portion formed on a surface of the insulating layer is provided with exposed portions of terminals exposed from apertures formed in part of the insulating layer and is also provided with lining portions adjacent to the exposed portions in a longitudinal direction of the conductor pattern portion and bonded to the insulating layer. Even if terminals of the multi-connector are cracked when soldered, not only conductivity is ensured, but also it is possible to strengthen the terminals, because the lining portions of the terminals are bonded to the insulating layer.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: May 25, 2010
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Takaaki Deguchi, Toshiyuki Katoh, Katsumi Kiguchi, Nobuo Sasaoka, Kohichi Suzuki, Shingo Tsuda