Abstract: In an embodiment a capacitor includes a winding element arranged in a case, a mounting plate which has a non-conductive material and which is fixed to the case and a metal element arranged between the case and the mounting plate, wherein the metal element includes a protruding part protruding through the mounting plate.

Abstract: An electronic control device includes: a circuit board including a substrate and an electrolytic capacitor connected to the substrate; a heat sink including a recess that houses the electrolytic capacitor; and heat dissipation material provided in the recess. The electrolytic capacitor has an end surface facing a bottom surface of the recess, and the heat dissipation material is in contact with the end surface and the bottom surface.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate that spans in an X-direction and a Y-direction that is orthogonal to the X-direction. The semiconductor device includes an interconnect structure formed over the substrate in a Z-direction that is orthogonal to both the X-direction and the Y-direction. The interconnect structure includes a plurality of metal lines interconnected together in the Z-direction by a plurality of vias. The interconnect structure contains a capacitor that includes an anode component and a cathode component. The anode component includes an array of elongate anode stack elements extending in the Z-direction. The cathode component includes an array of elongate cathode stack elements extending in the Z-direction. The array of anode stack elements are interdigitated with the array of cathode stack elements in both the X direction and the Y direction.

Abstract: An apparatus for supplying power to a motor vehicle, in particular a passenger vehicle or motorcycle, has a plurality of electrochemical storage cells. At least one of the electrodes respectively situated in the storage cells is made of metal or is provided with a metal layer essentially over its entire surface. The metal electrode or the metal layer, in particular a metal foil, is connected in an electrically conductive manner via a connecting element to a terminal provided outside the storage cell. To provide a reliable apparatus for supplying power, in particular for the intermittent electric motor drive of a motor vehicle, a thermally conductive cooling plate, which is in thermal contact with essentially each of the terminals of the storage cells, is provided. The cooling plate dissipates the thermal energy which is supplied by the metal electrodes or the metal layers on the electrodes to the terminal via the connecting element.

Abstract: According to one embodiment of a capacitor module, the capacitor module includes a substrate having a metallization on a first side of the substrate, a plurality of connectors electrically coupled to the metallization and a plurality of capacitors disposed on the metallization. The plurality of capacitors includes a first set of capacitors electrically connected in parallel between a first set of the connectors and a second set of the connectors. The capacitor module further includes a housing enclosing the plurality of capacitors within the capacitor module.

Abstract: A liquid crystal display device includes a panel, a heater, and a temperature detector. The panel includes substrates, electrodes and liquid crystal. The electrodes and the liquid crystal are disposed between the substrates. The heater has a transparent heating member, and the heating member emits heat by being supplied with electricity. At least a part of the heating member of the heater is located to overlap with a display area of the panel in a thickness direction of the substrates. A temperature detecting portion of the temperature detector and the heating member of the heater are located adjacent to each other.

Abstract: A fan speed control circuit for controlling the rotation speed of a fan motor unit. The speed control circuit includes a resistor, a voltage stabilizing unit, a transistor and a thermal resistor. The resistor is connected to a power source of the fan motor unit, the voltage stabilizing unit is connected between the resistor and ground. The collector of the transistor is connected to the fan motor unit, the base is connected to a node between the resistor and the voltage stabilizing unit. The thermal resistor is connected between an emitter of the transistor and ground.

Abstract: An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

Abstract: An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

Abstract: A mobile terminal is provided that may conduct heat generated from a print circuit board when a mobile terminal is in operation to a wider area by use of a heat releasing member having excellent conductivity. This may release unpleasantness that a user feels when using the terminal by lowering a temperature of a key pad. The mobile terminal may include a main body including a plurality of key pads for receiving information from a user; a print circuit board mounted in the main body; a battery provided at the main body; a folder coupled to the main body; a display provided at the folder for displaying a text and other image information; a speaker unit provided at the folder; a microphone unit provided at the main body; and a heat releasing member for releasing heat generated from the print circuit board.

Abstract: An electrode sheet of an electric double layer capacitor is produced by using granules for formation of an electrode of an electric double layer capacitor which are obtained by kneading and then crushing materials including an activated material, a conductive filler, and a binder at 50 to 97 mass-%, 1 to 30 mass-%, and 2 to 20 mass-%, respectively, and which are essentially granules whose diameter is in a range of 47 to 840 ?m. A method for manufacturing a sheet-like electrode by mixing and kneading materials including an activated carbon, carbon black, and PTFE into a kneaded material, producing a forming material by converting the kneaded material into granules, and forming and rolling the forming material.

Abstract: The present invention provides a heat spreader with a bypass capacitor to provide substantially instant power and/or to control simultaneous switching noise (SSN). The present invention also provides a semiconductor device package incorporating this heat spreader. In addition, fabrication methods for such heat spreaders and packages are provided. Generally, the heat spreaders and packages of the present invention include an embedded bypass capacitor that can provide decoupling capacitance in order to deliver near instant power to the die and/or minimize SSN. In a preferred embodiment, the embedded bypass capacitor is connected to terminals integrated with the heat spreader (e.g., lid; stiffener) and/or to a package plane (e.g., power plane or ground plane) in the package substrate for connection via the flip chip package's power delivery system to a power source and/or component.

Abstract: A printed circuit board assembly adapted for immersion cooling is disclosed. The assembly includes a first circuit board having a first device side with a first portion configured to mount a first plurality of semiconductor devices. A second circuit board having a second device side with a second portion configured to mount a second plurality of semiconductor devices is disposed in confronting parallel relationship to the first circuit board. The assembly further includes a border element interposed between the first and second boards and disposed around the respective first and second portions. The border element cooperates with the first and second boards to form a liquid-tight container. An inlet formed in the border receives an electrically nonconducting liquid that is subsequently discharged through an outlet.

Abstract: An electrolytic capacitor with several conductive layer portions, including some anode layers and some cathode layers in alternating arrangement. A set of insulator layers is interleaved with the conductive layers, and the conductive and insulator layers are laminarly stacked with an anode layer being outermost on one surface. The stack is positioned adjacent a metal heat sink, with an outer insulator layer positioned between and closely contacting the stack and the heat sink. The cathode layers may be connected to the heat sink.

Abstract: A power storage device such as a capacitor, a battery or the like having a power storage element and a case, and a power converter using the power storage device in combination with an invertor circuit. The power storage device including a capacitor, a battery or the like is constructed of a power storage element having an anode foil, a cathode foil and an insulating material, and a highly thermally conductive and electrically conductive case, where an electrode foil of the power storage element is thermally insulated from the case by an insulating material and is in thermal contact with the case. The power storage device and the invertor circuit are arranged in close proximity and in thermal contact with a cooling unit. With this configuration, it is possible to prevent a leak current from flowing into the case to eliminate the generation of noise, maintain the security, and accomplish a longer effective life, a reduced size and a higher capacitance.

Abstract: An electronic device (220) includes a component (105), such as a microprocessor, that generates heat and an electrochemical capacitor (200) used for thermal management. The electrochemical capacitor (200) has a first region, preferably the perimeter region, including electroactive material (160) and an electrolyte (165) and also has a second region, preferably the inner region, including heat sink material (170). When the component (105) and the electrochemical capacitor (200) are mounted within the device (220), the heat sink material (170) of the capacitor (200) is aligned with the component (105).

Abstract: The invention provides a method of constructing an electrolytic capacitor with a heat sink, which includes attaching a surface area of the heat sink in intimate contact with a surface area of the capacitor. The invention also provides a method of constructing an electrolytic capacitor with a heat sink which includes the steps of (i) selecting a surface area of the electrolytic capacitor and a surface area of the heat sink for intimate contact, and (ii) attaching the surface area of the heat sink in intimate contact with and the surface area of the electrolytic capacitor. Moreover, the invention provides for an electrolytic capacitor constructed in accordance with the methods described above and also for a device including an electrolytic capacitor having a surface area in intimate contact with a surface area of a heat sink.

Abstract: An electrolytic capacitor with several conductive layer portions, including some anode layers and some cathode layers in alternating arrangement. A set of insulator layers is interleaved with the conductive layers, and the conductive and insulator layers are laminarly stacked with an anode layer being outermost on one surface. The stack is positioned adjacent a metal heat sink, with an outer insulator layer positioned between and closely contacting the stack and the heat sink. The cathode layers may be connected to the heat sink.

Abstract: A film capacitor element produced from a metallized polyester film is described. In the metallized polyester film, the adhesion between a vapor-deposited metal layer and a polyester substrate is improved by providing a coating layer comprising a specific water soluble or water dispersible resin. The film capacitor produced by the use of the metallized polyester film has good moist heat resistance and long term stability in performance.

Abstract: A cooling system for an electrical wound electrolyte capacitor wherein the capacitor winding 4 is mounted in a metallic cylindrical-shape housing 5 and the winding 4 has electric foils 7 and 9 which project from both ends with one of the foils being in thermic contact with the floor of the housing 6 and the other foil 9 being in thermal contact with a metallic plate 16. The heat bridges thus formed by faster and greater heat removal for high alternating currents because the temperature within the capacitor is reduced by the two separate bridges.