Aluminum Or Tantalum Patents (Class 361/529)
  • Patent number: 10347431
    Abstract: A solid electrolytic capacitor includes a capacitor element having an anode body that is a porous sintered body having a hexahedral shape, an anode lead, a dielectric layer, and a solid electrolyte layer. One end of the anode lead is embedded into the anode body from a first surface of the anode body. The anode body includes a second surface and a third surface which are opposite to each other. The anode body has a first region including the second surface, a second region including the third surface, and a third region interposed between the first region and the second region. The third region has lower density than each of the first region and the second region. An average thickness T3 of the third region and a thickness TL of the anode lead satisfy a relationship T3<TL. A surface of the anode lead is in contact with at least one of the first region and the second region.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: July 9, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takaya Tochio, Yasuhiko Kishinaga, Takuya Yamashita
  • Patent number: 10215791
    Abstract: A capacitor detection system and an active-type pin-diverging module thereof are disclosed. The active-type pin-diverging module is applied to two conductive pins of a capacitor, and active-type pin-diverging module includes a base structure and a swingable structure. The swingable structure is swingably disposed on the base structure, and the swingable structure includes two swingable elements. The two conductive pins of the capacitor respectively pass through two through holes of a seat board, and each conductive pin has a lateral contact surface. The two swingable elements concurrently slidably contact the two lateral contact surfaces of the two conductive pins of the capacitor so as to diverge the two conductive pins of the capacitor, and the seat board is held by the two diverged conductive pins so as to prevent the seat board from being separated from the capacitor.
    Type: Grant
    Filed: November 23, 2016
    Date of Patent: February 26, 2019
    Assignee: APAQ TECHNOLOGY CO., LTD.
    Inventors: Kuo-Chen Huang, Ming-Goo Chien, Ming-Tsung Liang
  • Patent number: 10181382
    Abstract: A solid electrolytic capacitor includes a capacitor element and a plated layer. The capacitor element has a predetermined surface and outer peripheral surface other than the predetermined surface. The capacitor element includes an anode body, an anode lead wire and a cathode layer. The predetermined surface is perpendicular to a predetermined direction. The anode lead wire extends from the anode body along the predetermined direction through the predetermined surface. The cathode layer includes a solid electrolyte layer and forms the outer peripheral surface and a part of the predetermined surface. The plated layer completely covers the outer peripheral surface and the part of the predetermined surface.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: January 15, 2019
    Assignees: TOKIN CORPORATION, KEMET ELECTRONICS CORPORATION
    Inventors: Kenji Araki, Takashi Kono, Takashi Mihara, Yoshihiko Saiki
  • Patent number: 10032567
    Abstract: A solid electrolytic capacitor having grooves provided in a valve-acting metal substrate that includes a porous surface part and a non-porous body part, the bottoms of the grooves being non-porous. The valve-acting metal substrate is divided into a plurality of unit regions by the grooves, and define cathode layer formation parts in the porous surface parts for each unit region. A dielectric layer covers the surfaces of the cathode layer formation parts of the valve-acting metal substrate and the grooves between the cathode layer formation parts. A solid electrolyte layer and a cathode extraction layer cover the surface of the dielectric layer, thereby providing a sheet in which a plurality of solid electrolytic capacitor elements are prepared integrally with the grooves interposed therebetween. The sheet is cut at the grooves, and a dielectric layer is formed on the cut surfaces located around the cathode layer formation parts.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: July 24, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Koji Fujimoto, Emi Matsushita, Hitoshi Kuromi, Taro Ueno, Yoshihiro Koshido
  • Patent number: 10028386
    Abstract: A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that a portion of the lead frame is exposed.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Heung Kil Park, Jong Hwan Park, Young Ghyu Ahn
  • Patent number: 10014119
    Abstract: A solid electrolytic capacitor includes: an insulating substrate; a capacitor element; a positive electrode lead-out structure; and a negative electrode lead-out structure. The positive electrode lead-out structure includes: a positive electrode terminal formed on the insulating substrate; a first positive electrode connection member formed on the insulating substrate; a second positive electrode connection member electrically connecting the first positive electrode connection member to the positive electrode terminal; and a pillow member configured to electrically connect the capacitor element to the first positive electrode connection member. The first positive electrode connection member has a recessed portion or a through hole. The recessed portion or the through hole overlaps an edge of a bottom surface of the pillow member having a first end of the recessed portion or the through hole disposed outside the edge and a second end of the recessed portion or the through hole disposed inside the edge.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: July 3, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Eizo Fujii
  • Patent number: 9741494
    Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: August 22, 2017
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Peter Blais, Yanming Liu
  • Patent number: 9648753
    Abstract: The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using the same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290° C. to 420° C. to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process, such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: May 9, 2017
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Jong-Soo Kim, Kyung-Hoon Lee, Jeong-Sang Yu, O-Chung Kwon
  • Patent number: 9576743
    Abstract: A solid electrolytic capacitor with an integrated fuse assembly is provided. The fuse can be secured in a recess formed in a face of the porous anode body of the capacitor. When the fuse is secured in the recess, the fuse can be substantially flush with the face of the porous anode body in which the recess is formed. Further, the equivalent series resistance (ESR) of the fuse is reduced because the length of the connection between the fuse and the porous anode body is reduced. Further, because the fuse is integrated into the porous anode body, the capacitor can be assembled onto a circuit board via standard pick and place equipment.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: February 21, 2017
    Assignee: AVX Corporation
    Inventors: Michael Burke, Daniel Johnson
  • Patent number: 9484156
    Abstract: An improved capacitor and method of making an improved capacitor is set forth. The capacitor has planer anodes with each anode comprising a fusion end and a separated end and the anodes are in parallel arrangement with each anode in direct electrical contact with all adjacent anodes at the fusion end. A dielectric is on the said separated end of each anode wherein the dielectric covers at least an active area of the capacitor. Spacers separate adjacent dielectrics and the interstitial space between the adjacent dielectrics and spacers has a conductive material in therein.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: November 1, 2016
    Assignee: KEMET Electronics Corporation
    Inventors: Liancai Ning, Qun Ya, Xincheng Jin, Erik Karlsen Reed, Chris Stolarski
  • Patent number: 9466433
    Abstract: A refractory metal compound agglomerate powder having a product of a BET surface area in m2/g and a sliding coefficient of ? of 0.33 to 0.95, wherein the refractory metal compound agglomerate powder is selected from niobium agglomerate powder, niobium suboxide agglomerate powder, and tantalum agglomerate powder.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: October 11, 2016
    Assignee: H.C. STARCK GMBH
    Inventors: Christoph Schnitter, Holger Brumm
  • Patent number: 9275799
    Abstract: A wet electrolytic capacitor that includes a sintered porous anode body containing a dielectric layer, a fluid electrolyte, and a cathode is provided. At least one longitudinally extending channel is recessed into the anode body. The channel may have a relatively high aspect ratio (length divided by width), such as about 2 or more, in some embodiments about 5 or more, in some embodiments from about 10 to about 200, in some embodiments from about 15 to about 150, in some embodiments from about 20 to about 100, and in some embodiments, from about 30 to about 60.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: March 1, 2016
    Assignee: AVX Corporation
    Inventors: Tomas Karnik, Jan Petrzilek, Martin Biler
  • Patent number: 9236191
    Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: January 12, 2016
    Assignee: Kemet Electroncis Corporation
    Inventors: Antony P. Chacko, Yang Jin, Randolph S. Hahn, Yongjian Qiu, Philip M. Lessner, Keith R. Brenneman
  • Publication number: 20150131206
    Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.
    Type: Application
    Filed: March 4, 2014
    Publication date: May 14, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ho Kwak, Hun Chol Jung, Jeong Oh Hong, Sung Soo Cha, Hee Dong Myung, Hee Sung Choi
  • Patent number: 9030806
    Abstract: A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: May 12, 2015
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P Chacko, Yaru Shi, John Ols
  • Patent number: 9030807
    Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer wherein the conductive polymeric cathode comprises the coverage enhancement catalyst wherein the conductive polymeric layer has improved coverage of the corners and edges. Coverage enhancing catalyst is removed after coating and curing.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: May 12, 2015
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, Qingping Chen, Yang Jin, Philip M. Lessner, Randolph S. Hahn, Yongjian Qiu, Keith R. Brenneman
  • Publication number: 20150116909
    Abstract: There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame.
    Type: Application
    Filed: January 30, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Ho KWAK, Hun Chol JUNG, Jeong Oh HONG, Sung Soo CHA, Hee Dong MYUNG, Hee Sung CHOI
  • Publication number: 20150116910
    Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.
    Type: Application
    Filed: March 14, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Bum CHO, Kyoung Sup CHOI, Hong Kyu SHIN, Jeong Oh HONG, Wan Suk YANG, Hyun Sub OH
  • Patent number: 8992635
    Abstract: A process for producing anodes includes providing a foil comprising tantalum or niobium. A surface of the foil is oxidized so as to form oxides on the foil surface. The foil is heated so that the oxides formed on the foil surface diffuse into the foil. A paste comprising a powder selected from the group consisting of a tantalum powder, a niobium powder, a niobium oxide powder and mixtures thereof is applied to the foil. The foil with the applied paste is sintered.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: March 31, 2015
    Assignee: H. C. Starck GmbH
    Inventor: Ralph Otterstedt
  • Publication number: 20150077905
    Abstract: A solid electrolytic capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire formed on one end portion thereof; a mounting board formed on a lower surface of the capacitor body and including an insulating layer and wiring layers formed on an upper surface and a lower surface of the insulating layer; a side electrode contacting an end portion of the tantalum wire and connected to the wiring layers of the mounting board; and a molding part enclosing the capacitor body and the tantalum wire. The mounting board may have a via electrode penetrating through the insulating layer and electrically connecting the wiring layers formed on the upper surface and the lower surface of the insulating layer.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 19, 2015
    Inventors: Hong Kyu SHIN, Jae Bum CHO, Wan Suk YANG, Hyun Sub OH
  • Patent number: 8964358
    Abstract: Disclosed herein is a structural sheet includes an energy storage density that is greater than 10-mWh/ft2 and is capable of withstanding greater than 5-KPa stress under at least 5% strain. Further provided is an energy storing structural sheet comprising an electrically conducting current carrying layer that is print formed over a sub assembly that comprises a separator, a foundation, an electrode, and a current bus.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: February 24, 2015
    Assignee: The Paper Battery Co.
    Inventors: Robert J. Miller, Trevor J. Simmons, Marsha Grade, Frank Kovacs, Amber Brooks
  • Publication number: 20150043130
    Abstract: This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates.
    Type: Application
    Filed: October 23, 2014
    Publication date: February 12, 2015
    Inventors: Gregory J. Sherwood, Michael J. Root, Jay E. Daley, Eric Stemen
  • Publication number: 20150036265
    Abstract: There is provided a tantalum capacitor, including: a capacitor body including a tantalum powder and having a tantalum wire, a molding part formed to expose an end portion of the tantalum wire and enclose the capacitor body, an anode lead frame including an anode mounting part and an anode terminal part, the anode terminal part being connected to the tantalum wire, a thin plate electrode formed on a lower surface of the capacitor body and exposed through the other end surface of the molding part, and a cathode lead frame including a cathode mounting part and a cathode terminal part, the cathode terminal part being connected to the thin plate electrode.
    Type: Application
    Filed: December 5, 2013
    Publication date: February 5, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Kyu SHIN, Jae Bum CHO, Wan Suk YANG, Hyun Sub OH
  • Publication number: 20140368975
    Abstract: The present invention makes it possible to increase the thickness of a sintered body. Thus, the present invention provides a production method that is suitable for the production of anode electrode materials with high capacitance useful for medium- to high-voltage aluminum electrolytic capacitors, that does not involve an etching treatment, and that enables desired formation of the resulting electrode material for aluminum electrolytic capacitor into the desired shape. Specifically, the present invention provides a method for producing an electrode material for aluminum electrolytic capacitor, comprising the steps of: (1) forming, in a sintering mold, an unsintered laminate in which a substrate is held between compositions comprising a powder of at least one member selected from the group consisting of aluminum and aluminum alloys; and (2) sintering the unsintered laminate in the sintering mold, wherein the method does not comprise an etching step.
    Type: Application
    Filed: February 7, 2013
    Publication date: December 18, 2014
    Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Toshifumi Taira, Masashi Mehata
  • Patent number: 8902566
    Abstract: A capacitor has a positive electrode, a negative electrode, and a solid electrolyte layer arranged between the electrode layers. At least one of the electrode layers of this capacitor has an Al porous body, and an electrode body held in this Al porous body to polarize the electrolyte. The oxygen content in the surface of the Al porous body is 3.1% by mass or less. The matter that the oxygen content in the surface of the Al porous body is 3.1% by mass or less is equal to the matter that a high-resistance oxide film is hardly formed on the surface of the Al porous body. Thus, this Al porous body makes it possible to make the current collector area of the electrode layer large so that the capacitor can be improved in capacity.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: December 2, 2014
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Nobuhiro Ota, Akihisa Hosoe, Masatoshi Majima, Koji Nitta, Tomoyuki Awazu, Kazuki Okuno, Masahiro Kato, Shoichiro Sakai, Shinji Inazawa
  • Patent number: 8896984
    Abstract: A solid electrolytic capacitor includes a capacitor element including a cathode portion and an anode portion, a cathode terminal bonded to the cathode portion, an anode terminal bonded to the anode portion, and an enclosure resin covering the capacitor element. The cathode terminal includes a cathode lower surface portion, a cathode connection portion, and a cathode support portion. The cathode connection portion is connected to an end portion of the cathode lower surface portion on an anode side and bonded to the cathode portion through a conductive adhesive. The cathode support portion is connected to a side portion of the cathode lower surface and brought into contact with a lower surface of the cathode portion on an end portion side of the cathode portion without involving the conductive adhesive therebetween.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: November 25, 2014
    Assignee: Panasonic Corporation
    Inventors: Kazuo Kawahito, Takashi Iwakiri
  • Patent number: 8896985
    Abstract: A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: November 25, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Antony P. Chacko, Randolph S. Hahn
  • Patent number: 8848343
    Abstract: An improved capacitor is described. The capacitor has an anode with an anode lead wire extending from a first face of the anode. A dielectric layer is on the anode and a cathode is on the dielectric. An anode lead with an anode base and a cavernous anode protrusion extending from the base is provided wherein the anode lead wire is in electrical contact with the anode protrusion. A cathode lead with a cathode base is provided wherein the cathode base is in electrical contact with the cathode on a side face wherein the side face is adjacent the first face and the cathode base and said anode base are coplanar.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: September 30, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: David Jacobs, Sheng Jie Xu, Shao Jian Chen, Xiao Juan Ye, Keith Lee Moore
  • Patent number: 8842418
    Abstract: Provided is a method for forming a capacitor. The method includes: providing an anode with a dielectric thereon and a conductive node in electrical contact with the anode; applying a conductive seed layer on the dielectric; forming a conductive bridge between the conductive seed layer and the conductive node; applying voltage to the anode; electrochemically polymerizing a monomer thereby forming an electrically conducting polymer of monomer on the conductive seed layer; and disrupting the conductive bridge between the conductive seed layer and the conductive node.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: September 23, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Jeffrey Poltorak, Brandon K. Summey, Yongjian Qiu
  • Publication number: 20140268503
    Abstract: A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: APAQ TECHNOLOGY CO., LTD.
    Inventors: MING-TSUNG CHEN, CHING-FENG LIN
  • Patent number: 8810997
    Abstract: A solid electrolytic capacitor with suppressed occurrence of short circuit is provided. The solid electrolytic capacitor includes an anode body having a surface on which a dielectric film is formed, and a conductive polymer layer formed on the dielectric film. The conductive polymer layer includes at least a first conductive polymer layer formed on the dielectric film and a second conductive polymer layer formed on the first conductive polymer layer. A silane compound in the first conductive polymer layer and the silane compound in the second conductive polymer layer have respective concentrations different from each other.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: August 19, 2014
    Assignees: SANYO Electric Co., Ltd., SAGA SANYO Industries Co., Ltd.
    Inventors: Nobuyuki Yamaguchi, Koji Fukuchi, Yasuhiro Tsunezumi
  • Publication number: 20140211375
    Abstract: An electrode material for an aluminum electrolytic capacitor, comprising, as constituent elements, sintered body of a powder of at least one member selected from the group consisting of aluminum and aluminum alloys, and an aluminum foil substrate supporting the sintered body thereon, wherein (1) the powder has an average particle size D50 of 0.5 to 100 ?m, (2) the sintered body is formed on one surface or both surfaces of the aluminum foil substrate and has a total thickness of 10 to 1,000 ?m, (3) the porosity of the sintered body is 35 to 49% by volume, and (4) the sintered body is obtained by applying a rolling process to a film made from a composition comprising a powder of at least one member selected from the group consisting of aluminum and aluminum alloys, and subsequently sintering the film.
    Type: Application
    Filed: July 11, 2012
    Publication date: July 31, 2014
    Applicant: TOYO ALUMINIUM KABUSHIKI KAISHA
    Inventors: Toshifumi Taira, Kenji Muramatsu, Masashi Mehata
  • Patent number: 8792224
    Abstract: Disclosed herein is a hybrid capacitor including: a first structure including a cathode containing activated carbon and an anode containing lithium; and a second structure including activated carbon layers formed on both surfaces of a current collector. With the hybrid capacitor, characteristics of an LIC and characteristics of an EDLC are implemented in a single cell, thereby making it possible to increase energy density and improve output characteristics.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: July 29, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Kwan Kim, Dong Hyeok Choi, Bae Kyun Kim, Jun Hee Bae
  • Patent number: 8787002
    Abstract: A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: July 22, 2014
    Assignee: Apaq Technology Co., Ltd.
    Inventors: Ching-Feng Lin, Chi-Hao Chiu, Kun-Huang Chang
  • Patent number: 8780530
    Abstract: A capacitor assembly that includes an electrolytic capacitor that contains an anode body, dielectric overlying the anode, and a solid electrolyte overlying the dielectric is provided. An anode lead is also electrically connected to the anode body and extends therefrom, The capacitor and leadframe are enclosed and hermetically sealed within a ceramic housing in the presence of an inert gas. In this manner, the solid electrolyte (e.g., conductive polymer) is less likely to undergo a reaction in high temperature environments, thus increasing the thermal stability of the capacitor assembly.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: July 15, 2014
    Assignee: AVX Corporation
    Inventors: Stanislav Zednicek, Ladislav Vilc, Martin Biler
  • Patent number: 8780529
    Abstract: Provided is a method of manufacturing a solid electrolytic capacitor that suppresses spreading up of a solution. The method includes forming a porous sintered body made of a valve metal and having an anode wire sticking out therefrom; forming an insulating layer made of a fluorine resin, so as to surround the anode wire; and forming a dielectric layer on the porous sintered body; forming a solid electrolyte layer on the dielectric layer, after forming the insulating layer. The process of forming the insulating layer includes melting granular particles made of a fluorine resin.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: July 15, 2014
    Assignee: Rohm Co., Ltd.
    Inventor: Makoto Aoyama
  • Patent number: 8780531
    Abstract: An integrated capacitor assembly that contains at least two solid electrolytic capacitor elements electrically connected to common anode and cathode terminations is provided. The capacitor elements contain an anode, a dielectric coating overlying the anode that is formed by anodic oxidation, and a conductive polymer solid electrolyte overlying the dielectric layer. The capacitor elements are spaced apart from each other a certain distance such that a resinous material can fill the space between the elements. In this manner, the present inventors believe that the resinous material can limit the expansion of the conductive polymer layer to such an extent that it does not substantially delaminate from the capacitor element. In addition to possessing mechanical stability, the capacitor assembly also possesses a combination of good electrical properties, such as low ESR, high capacitance, and a high dielectric breakdown voltage.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: July 15, 2014
    Assignee: AVX Corporation
    Inventors: Jan Petrzilek, Miloslav Uher, Lotfi Djebara
  • Patent number: 8773843
    Abstract: Provided is a solid electrolytic capacitor which retains a high capacitance and a low ESR and has high heat resistance. The solid electrolytic capacitor (10) is obtained by winding a porous anode foil (11) having a dielectric layer formed thereon and a cathode foil (14) together with separators (15) each interposed therebetween, the separators (15) having a solid electrolyte (13) supported thereon. Each layer of the solid electrolyte comprises a conductive composite (a) of a cationized conductive polymer with a polymer anion, a first hydroxy compound (b) having four or more hydroxy groups, and a second hydroxy compound (c) having an amino group and one or more hydroxy groups, the content of the conductive composite (a), in terms of mass proportion, being lower than that of the first hydroxy compound (b) and higher than that of the second hydroxy compound (c).
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: July 8, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Sachiko Ode, Tailu Ning
  • Patent number: 8767378
    Abstract: An electrically conductive paste composition comprises: (a) silver powders comprising spherical silver powders having a mean particle size (D50) of over 0.1 ?m and no more than 5 ?m and flake-shaped silver powders having a mean particle size of no more than 10 ?m; and (b) binder resins comprise (b-1) aliphatic thermoplastic resin and (b-2) self-polymerizing thermosetting resin; wherein the content of the silver powders is no more than 60 wt % based on the total weight of the paste composition, wherein the weight ratio of the aliphatic thermoplastic resin for the self-polymerizing thermosetting resin ((b-1)/(b-2)) is 99/1-67/33 and wherein the weight ratio of the silver powders for the binder resins ((a)/(b)) is 94/6-85/15.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: July 1, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventor: Toshiaki Ogiwara
  • Patent number: 8760852
    Abstract: A capacitor containing a solid electrolytic capacitor element having a porous anode body and an anode lead assembly is provided. At least one wire of the lead assembly is electrically connected to the anode body for connection to an anode termination. The lead assembly contains first and second lead wires embedded within the anode body and extending therefrom in a longitudinal direction. The first and second wires are bonded/fused together during sintering of the anode body (i.e., “sinter bonded”). The bond may be metallurgical, covalent, electrostatic, etc. Sinter bonding of the wires reduces the path length and resistance for current flow within the anode body, thus reducing ESR. This is particularly useful for anode bodies formed from powders of a high specific charge, which tend to shrink away from the wires after sintering. The sinter bonded wires also result in a lead assembly that is more robust and mechanically stable.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: June 24, 2014
    Assignee: AVX Corporation
    Inventors: Lotfi Djebara, Ludek Kubes, Pavel Bosak
  • Publication number: 20140168856
    Abstract: An asymmetric electrochemical capacitor positive electrode composition including activated carbon and an electrolyte salt which is a reaction product of an alkali metal halide and an aluminum halide is provided. Asymmetric electrochemical capacitor cells and energy storage devices comprising the asymmetric electrochemical capacitor positive electrode composition are also provided.
    Type: Application
    Filed: December 18, 2012
    Publication date: June 19, 2014
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Michael Alan VALLANCE, David Charles BOGDAN, JR., Brandon Alan BARTLING
  • Patent number: 8749955
    Abstract: A capacitor comprising a capacitor element including a substrate having first and second faces, a porous first rough surface layer formed on the first face and having pores, a first inner conductive polymer layer formed in the pores, a first outer conductive polymer layer formed on the inner conductive polymer layer, a porous second rough surface layer formed on the second face and having pores, a second inner conductive polymer layer formed in the pores, a second outer conductive polymer layer formed on the second inner conductive polymer layer, and a dielectric layer formed on surfaces of the first and the second rough surface layer. A surface area of the second rough surface layer is smaller than that of the first rough surface layer. The second outer conductive polymer layer is thicker than the first outer conductive polymer layer. This structure enables to eliminate warpage of a capacitor element.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: June 10, 2014
    Assignee: Panasonic Corporation
    Inventors: Mitsuru Iwai, Hiroki Kamiguchi, Akiyoshi Oshima, Yuta Moriura
  • Patent number: 8741214
    Abstract: A method of making a sintered article in which a solid object is embedded includes forming a green body of compressed particles with the solid body is partially embedded. The green body includes an opening across which the solid body extends. The green body is sintered to form a sintered body and the opening permits deformation of the solid body in response to stress applied during the sintering process. A sintered article in which a solid body is at least partially embedded includes an opening. The solid body extends across the opening so that the solid body can deform within the opening. The opening in the solid body prevents distortion of the sintered body from a planar configuration during sintering, even when the green body is relatively thin.
    Type: Grant
    Filed: October 17, 2011
    Date of Patent: June 3, 2014
    Assignee: Evans Capacitor Company
    Inventor: David A. Evans
  • Patent number: 8711546
    Abstract: A method of fabricating a solid electrolytic capacitor of an aspect includes the steps of preparing an anode element with a dielectric layer formed on a surface thereof, forming a solid electrolytic layer on the dielectric layer, forming a carbon layer on the solid electrolytic layer, bringing an aqueous polymer into contact with the carbon layer, and forming a silver paste layer on the aqueous polymer. A method of fabricating a solid electrolytic capacitor and a solid electrolytic capacitor that can be improved in characteristics can thus be obtained.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: April 29, 2014
    Assignee: SANYO Electric Co., Ltd.
    Inventor: Keiko Matsuoka
  • Patent number: 8681476
    Abstract: A solid electrolytic capacitor comprises an insulating substrate in which an anode terminal and a cathode terminal are formed. The anode terminal comprises a first anode section formed on a first surface of the insulating substrate, and a second anode section formed on a second surface of the insulating substrate, which are electrically connected to each other. The cathode terminal comprises a first cathode section formed on the first surface and a second cathode section formed on the second surface, which are electrically connected to each other. A distance between the first anode section and the first cathode section is smaller than a distance between the second anode section and the second cathode section. And an anode section and a cathode section of a capacitor element are electrically connected to the first anode section and the first cathode section respectively.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: March 25, 2014
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Yasuko Ibata, Hiroya Nishimoto, Takeshi Takamatsu
  • Patent number: 8675349
    Abstract: An improved capacitor and method of making an improved capacitor is set forth. The capacitor has planer anodes with each anode comprising a fusion end and a separated end and the anodes are in parallel arrangement with each anode in direct electrical contact with all adjacent anodes at the fusion end. A dielectric is on the said separated end of each anode wherein the dielectric covers at least an active area of the capacitor. Spacers separate adjacent dielectrics and the interstitial space between the adjacent dielectrics and spacers has a conductive material in therein.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: March 18, 2014
    Assignee: Kennet Electronics Corporation
    Inventors: Liancai Ning, Chris Stolarski, Qun Ya
  • Patent number: 8675348
    Abstract: A capacitor for an implantable medical device is presented. The capacitor includes an anode, a cathode, a separator therebetween, and an electrolyte over the anode, cathode, and separator. The electrolyte includes ingredients comprising acetic acid, ammonium acetate, phosphoric acid, and tetraethylene glycol dimethyl ether. The capacitor has an operating voltage ninety percent or greater of its formation voltage.
    Type: Grant
    Filed: July 26, 2010
    Date of Patent: March 18, 2014
    Assignee: Medtronic, Inc.
    Inventors: Mark E. Viste, John D. Norton, Joachim Hossick-Schott, Anthony W. Rorvick
  • Patent number: 8665581
    Abstract: Electrical devices having electrodes containing carbon nanotubes infused to a substrate are described herein. The electrical devices contain at least a first electrode material containing a first plurality of carbon nanotubes infused to a first substrate and a second electrode material containing a second plurality of carbon nanotubes infused to a second substrate. The first electrode material and the second electrode material are wound in a spiral configuration about a central axis. The electrical devices can be supercapacitors, which also contain at least an electrolyte in contact with the first electrode material and the second electrode material, and a first separator material disposed between the first electrode material and the second electrode material. Methods and apparatuses for making the electrical devices are also disclosed herein.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: March 4, 2014
    Assignee: Applied Nanostructured Solutions, LLC
    Inventors: Corey Adam Fleischer, Tushar K. Shah, Lawrence P. Hetzel, Harry C. Malecki
  • Publication number: 20140043730
    Abstract: There is provided a tantalum capacitor including: a capacitor body containing a tantalum powder and having a tantalum wire; a molded portion surrounding the tantalum wire and the capacitor body; an anode lead frame electrically connected to the tantalum wire; an cathode lead frame including a mounting portion having the capacitor body mounted thereon and a step formed on a lower surface thereof, and an cathode terminal portion bent at the mounting portion to be closely adhered to one end surface of the molded portion; and an adhesive layer formed between the one end surface of the molded portion and the cathode terminal portion.
    Type: Application
    Filed: March 4, 2013
    Publication date: February 13, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Kwang KIM, Wan Suk YANG, Hyun Sub OH
  • Publication number: 20140036416
    Abstract: An electrode foil including a substrate made of metal material, a first layer made of metal oxide and formed on the substrate, a second layer made of TiNxOy (x>y>0) and formed on the first layer, and a third layer made of TiNxOy (0<x<y) and formed on the second layer.
    Type: Application
    Filed: May 14, 2012
    Publication date: February 6, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Hitoshi Ishimoto, Masashi Shoji, Hiroki Kamiguchi