Abstract: A solid electrolyte capacitor cell includes a cathode contact layer, a cathode layer of carbon and RbAg.sub.4 I.sub.5 surrounded by a peripheral portion of the cathode contact layer, a larger electrolyte layer of RbAg.sub.4 I.sub.5 attached to the cathode layer, and an anode layer of carbon and RbAg.sub.4 I.sub.5, an anode contact layer, and an insulative, annular silver barrier extending between and contacting peripheral portions of the cathode contact layer, the anode contact layer, and edges of the cathode, electrolyte, and anode layers to prevent silver migration. A composite capacitor includes a plurality of the series-connected solid electrolyte cells stacked in an elastic housing that maintains isostatic internal pressure throughout the electrolyte layers of all of the cells, making them resistant to formation of minute cracks in all of the electrolyte layers. This prevents deposition of silver in such cracks during charge/discharge cycling and therefore prevents cathode-to-anode shorts.

Abstract: Ultracapacitor and supercapacitor designs wherein two discrete metal film current collectors of the prior art, one for each of the cathode and anode, are replaced by a single thin polymer film. The polymer film is typically several microns thick and metallized on both sides. The thickness of the metallization is varied from several hundred to several thousand .ANG.ngstroms depending upon the particular application. This metallization serves as the positive and negative electrodes (current collectors) which are spatially separated by the polymer dielectric film. The resulting reduction of volume increases the volumetric energy density and the reduction of mass increases the gravimetric energy density. The electrolyte solvent/salt system can be selected to provide useful individual cell voltages as high as 5 volts. The voltage is limited only by the electrolytic stability of the solvent and salt.

Abstract: A package-type solid electrolytic capacitor is provided which comprises a pair of capacitor elements, a pair of diodes associated with the capacitor elements, a pair of leads associated with the capacitor elements and the diodes, and a resin package enclosing the capacitor elements, the diodes and part of the leads. The leads may be exchangeably connectable to a positive and a negative electrodes of a circuit pattern. In one state of lead connection, one of the diodes passes a current only for one of the capacitor elements. In the other state of lead connection, the other diode passes a current only for the other capacitor element. Thus, the capacitor is non-polar and therefore can be mounted without paying any attention to the polarity.

Abstract: A method of manufacturing solid state capacitors involves providing an elongate band of solid state forming metal, folding the band into a trough-like U-shaped configuration, introducing a layer of solid state metal powder into the trough, sintering the powdered metal to thereby bond the metal to the foil, partially severing the foil and sintered powder to define a multiplicity of individual units which are thereafter processed to convert the units into capacitors by sequential dielectric forming and counterelectrode depositing steps. The individual capacitors are terminated and preferably also may be tested while still interconnected by portions of the foil, following which individual capacitors are separated by cuts which register with the initial cuts which defined the individual units. The disclosure further teaches a novel solid state capacitor fabricated in accordance with the method, the capacitor exhibiting high volumetric efficiency and being particularly adapted for surface mounting.

Abstract: An electrochemical capacitor is prepared by assembling a stacked assembly of at least two bipolar electrodes, where each of the bipolar electrodes includes a metal foil electrode substrate having a porous, electronically conductive substrate coating, preferably porous platinum, on each surface. The stacked assembly further has a porous separator layer between each of the electrodes, made of a material that is electronically non-conductive. An ionic conductor electrolyte, preferably a polyoxometalate, that wets both the substrate coating and the separator layer at temperatures above the melting point of the solid ionic conductor electrolyte is provided, the ionic conductor electrolyte having a melting point above about 30.degree. C. The ionic conductor electrolyte is introduced into the stacked assembly, as by external infiltration with an optional applied pressure to assist the infiltration.

Abstract: A stacked type solid electrolytic capacitor has a plurality of single plate capacitors each constituted by a dielectric oxide film, a solid electrolytic film and a negative electrode layer sequentially laminated on a surface of a positive electrode member having a positive electrode section. A metal spacer which has a thickness corresponding to each of spaces between the positive electrode sections is placed in each of the spaces. The metal spacers and the positive electrode sections are mechanically and electrically interconnected by welding. The invention may be embodied in a stacked electrolytic capacitor of a lead type or that of a chip type. The invention provides capacitor in which the size is reduced and the capacity is increased, the possibility of deterioration in electrical characteristics during the fabrication process is eliminated, and the process of fabrication is made easy.

Abstract: A solid electrolytic capacitor comprises a capacitor element including a chip body and an anode wire projecting from the chip body, an anode lead electrically connected to the anode wire, a cathode lead paired with the anode lead, a fuse wire having a first end electrically connected to the cathode lead and a second end electrically connected to the chip body, and a resin package enclosing the capacitor element, part of the anode lead, part of the cathode lead, and the fuse wire. The first end of the fuse wire has a nail head form for bonding to the cathode lead with a sufficient adhesion area without increasing the length of the first end.

Abstract: A method for making an electrochemical capacitor is disclosed. A plurality of bipolar electrodes having porous conductive oxide coatings on opposite sides of a thin metal foil are first produced in a fixture assembly using sol-gel processing techniques. A dielectric oxide coating is then applied to one or both conductive coatings using the sol-gel process. A stack of a plurality of the bipolar electrodes with adjacent electrodes separated by a predetermined amount of a solid electrolyte is assembled. The stacked assembly is heated to a temperature above the electrolyte melting point allowing the molten electrolyte to infiltrate the porous coatings. Pressure is applied to the stacked assembly sufficient to produce intimate contact between adjacent surfaces of the bipolar electrodes while expelling excess liquid from between the electrode surfaces. The stacked assembly is cooled in a controlled fashion to produce a laminate structure.

Abstract: The present invention provides a process which is particularly suited for mass-producing solid electrolytic capacitors. The process utilizes a combination of a mold and a presser member. The mold has a series of molding recesses, and a lead receiving groove extending along and through the series of molding recesses. The presser member has a corresponding series of pressing projections. A portion of a continuous lead wire is placed in the groove, and powdered electrode material is loaded in the molding recesses. The presser member is then moved toward the mold, so that the powdered material is compacted within the molding recesses by the pressing projections. The resulting compacts are removed from the mold together with the wire. The same process steps are repeated with respect to other portions of the wire.

Abstract: A plurality of electrolytic capacitor sections are sealed within a common cube-like case. An internal wall divides the case into isolated chambers. Upon sealing of the case, the assembly takes up substantially no more space on a circuit board than an individual capacitor of the prior art. Each capacitor chamber has its own vent located in the case at the junction of a side wall (parallel to the internal wall) and the top wall by means of a bevel which reduces the walls to the desired vent thickness.