With Discrete Structure Or Support Patents (Class 361/809)
  • Patent number: 11023018
    Abstract: The present disclosure provides an electronic device and a screen, and the electronic device includes a screen and a light acquiring component. The screen includes a main screen, an auxiliary screen and an optical fiber structure. The main screen comprises a light transmitting hole, and the auxiliary screen and the light acquiring component are disposed under the main screen, and alternately overlap the light transmitting hole. The optical fiber structure includes a first end surface adjacent to the auxiliary screen and a second end surface opposite to the first end surface. When the auxiliary screen overlaps the light transmitting hole, the optical fiber structure transmits an image on the auxiliary screen to the second end surface. The second end surface is flush with an imaging surface of the main screen.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: June 1, 2021
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Jing Gao, Shaoxing Hu
  • Patent number: 11019737
    Abstract: Disclosed is a flexible display device, comprising a display panel, including a backside away from a display side; an elastic strip, fixed to the backside, wherein in a width direction of the elastic strip, the elastic strip comprises a pair of ends and a deformable section located between the pair of ends, and as the elastic strip is flattened in a longitudinal direction, the deformable section arches with respect to the pair of ends, and as the elastic strip is curled in the longitudinal direction, the deformable section is leveled with the pair of ends, and the elastic strip is used to flatten the display panel or curl the display panel. An initial state of the elastic strip is an elastic structure of a curled shape. The flexible display device can be automatically switched from a flattened state to a curled state by simply pressing the deformable section.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: May 25, 2021
    Assignee: HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Dehua Li
  • Patent number: 10976617
    Abstract: A display apparatus comprises: a display panel comprising driving elements to drive pixels and a first terminal group electrically connected to the driving elements; a supporting member comprising a surface on which the display panel is to be placed, and comprising wirings and a second terminal group connected to the wirings; and a holding member provided along an edge of the display panel. The holding member comprises a connector provided with contactors, and is adhered to the surface to hold the display panel. Each of the contactors is positioned in such a way as to face each terminal of the first terminal group. Each of the contactors is connected to each terminal of the second terminal group. The edge of the display panel is coupled with the connector. Each terminal of the first terminal group is electrically connected to each of the wirings via each of the contactors.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: April 13, 2021
    Assignee: SAKAI DISPLAY PRODUCTS CORPORATION
    Inventor: Katsuhiko Kishimoto
  • Patent number: 10724158
    Abstract: Weaving equipment may include warp strand positioning equipment that positions warp strands and weft strand positioning equipment that inserts weft strands among the warp strands to form fabric. The fabric may include insulating strands and conductive strands. Conductive strands may run orthogonal to each other and may cross at open circuit and short circuit intersections. The fabric may be formed using pairs of interwoven warp and weft strands. Conductive warp and weft strands may be interposed within the pairs of strands. The fabric may be a single layer fabric or may contain two or more layers. Stacked warp strands may be formed between pairs of adjacent insulating warp strands. The stacked warp strands may include insulating and conductive strands. Touch sensors and other components may include conductive structures that are formed from the conductive strands in the fabric.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: July 28, 2020
    Assignee: Apple Inc.
    Inventors: Daniel A. Podhajny, Daniel D. Sunshine, Kathryn P. Crews
  • Patent number: 10707540
    Abstract: A battery packing includes: a bare cell; a protective circuit module electrically connected to the bare cell; a first lead plate connecting the protective circuit module and a terminal of the bare cell; and a first cover at an upper portion of the bare cell, wherein a portion of the first cover protrudes outward and accommodates the protective circuit module.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: July 7, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Hyungshin Kim
  • Patent number: 10674617
    Abstract: A carrier apparatus is adapted to carry a flexible substrate. The carrier apparatus includes two carrier plates, two adhesive layers, and two supporting units. The carrier plates have a gap with respect to each other, and each of the carrier plates has a first region and a second region, wherein the second regions of the carrier plates are adjacent to each other and are located between the first regions. The adhesive layers are respectively disposed in the first regions of the carrier plates. The supporting units are respectively disposed in the second regions of the carrier plates and are coplanar with the adhesive layers, wherein the flexible substrate is fixed on the carrier plates through the adhesive layers, and the supporting units are detachably attached to a bending zone of the flexible substrate by attractive force. A display including the carrier apparatus and a flexible display panel is provided.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: June 2, 2020
    Assignee: E Ink Holdings Inc.
    Inventors: Kuan-Yi Lin, Yu-Wen Chen, Yu-Chieh Hung, Chun-Yu Lu, Chia-Chun Yeh
  • Patent number: 10629580
    Abstract: A semiconductor package includes a package substrate. A redistribution structure is bonded to the package substrate. A bottommost surface of the redistribution structure is lower than a topmost surface of the package substrate. A conductive connector electrically couples the redistribution structure to the package substrate. The conductive connector physically contacts a sidewall of the redistribution structure. A first integrated circuit die is bonded to the redistribution structure through first bonding structures and is bonded to the package substrate through second bonding structures. The first bonding structures and the second bonding structures have different sizes.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: April 21, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Chen-Shien Chen, Ching-Wen Hsiao
  • Patent number: 10582103
    Abstract: A camera module includes a first camera module, a first flexible printed circuit, a second camera module, and a second flexible printed circuit. The first flexible printed circuit is connected to the first camera module. The second camera module is arranged side by side with the first camera module. The second flexible printed circuit is connected to the second camera module. At least one of the first flexible printed circuit and the second flexible printed circuit extends along an arrangement direction of the first camera module and the second camera module.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: March 3, 2020
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Yimei Tang, Yi Sun, Haijin Hu, Xinquan Zhou, Jingming Wan, Guangwei Zhang
  • Patent number: 10495327
    Abstract: An inverter apparatus variably controls an operation frequency of an electric motor provided in a refrigerating device, and includes: a printed wiring board; a power device attached to one surface of the printed wiring board, the power device including a converter circuit and an inverter circuit; a reactor arranged on a side of the one surface of the printed wiring board, at least a part of the reactor being arranged within a plane projection area of the printed wiring board; and a cooler for cooling the power device and the reactor, the cooler being arranged such that the power device and the reactor are interposed between the cooler and the printed wiring board.
    Type: Grant
    Filed: June 6, 2016
    Date of Patent: December 3, 2019
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirotaka Doi, Hiroshi Doumae, Nobuyasu Hiraoka, Sumio Kagimura, Keito Kotera
  • Patent number: 10439077
    Abstract: The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: October 8, 2019
    Assignee: PIXART IMAGING INC.
    Inventors: Yi-Chang Chang, Yen-Hsin Chen, Chi-Chih Shen
  • Patent number: 10361181
    Abstract: A semiconductor package includes a package substrate. A redistribution structure is bonded to the package substrate. A bottommost surface of the redistribution structure is lower than a topmost surface of the package substrate. A conductive connector electrically couples the redistribution structure to the package substrate. The conductive connector physically contacts a sidewall of the redistribution structure. A first integrated circuit die is bonded to the redistribution structure through first bonding structures and is bonded to the package substrate through second bonding structures. The first bonding structures and the second bonding structures have different sizes.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: July 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Chen-Shien Chen, Ching-Wen Hsiao
  • Patent number: 10347582
    Abstract: Embedded vialess bridges are provided. In an implementation, discrete pieces containing numerous conduction lines or wires in a 3-dimensional bridge piece are embedded where needed in a main substrate to provide dense arrays of signal, power, and electrical ground wires below the surface of the main substrate. Vertical conductive risers to reach the surface plane of the main substrate are also included in the discrete piece, for connecting to dies on the surface of the substrate and thereby interconnecting the dies to each other through the dense array of wires in the discrete piece. The discrete piece to be embedded may have parallel planes of conductors at regular intervals within itself, and thus may present a working surface homogeneously covered with the ends of vertical conductors available to connect surface components to each other and to ground and power at many places along the embedded piece.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 9, 2019
    Assignee: Invensas Corporation
    Inventor: Belgacem Haba
  • Patent number: 10347978
    Abstract: This document discloses one or more systems, apparatuses, methods, etc. for integrating coil antennas in a carbon fiber chassis portable device. More particularly, the carbon fiber chassis portable device containing unidirectional weave carbon fibers in its chassis—to support near field communications (NFC) related functions—is described.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: July 9, 2019
    Assignee: Intel Corporation
    Inventors: Anand S. Konanur, Ulun Karacaoglu
  • Patent number: 10163856
    Abstract: A semiconductor device, and a method of forming the device, are provided. The semiconductor device includes a first die having a first plurality of contact pads and a second die having a second plurality of contact pads. A substrate is bonded to a first contact pad of the first plurality of contact pads and a first contact pad of the second plurality of contact pads in a face-to-face orientation with the first die and the second die. A first through via extends through the substrate. Molding material is interposed between the first die, the second die and the substrate, the molding material extending along sidewalls of the first die, the second die, and the substrate. A second through via is positioned over a second contact pad of the first plurality of contact pads, the second through via extending through the molding material.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou, Wen Hsin Wei
  • Patent number: 10121989
    Abstract: A flexible display device includes a cover member having a bending area and a non-bending area. The non-bending area is disposed on opposite sides of the bending area. The bending area is bent or folded about a bending axis. A display panel is disposed under both the bending area and the non-bending area of the cover member. The display panel has a smaller area than that of the cover member. An auxiliary member is disposed alongside the display panel, and under the bending area of the cover member, such that a width of the cover member is substantially equal to a width of the display panel plus a width of the auxiliary member.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: November 6, 2018
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Changmin Park
  • Patent number: 10083909
    Abstract: Embedded vialess bridges are provided. In an implementation, discrete pieces containing numerous conduction lines or wires in a 3-dimensional bridge piece are embedded where needed in a main substrate to provide dense arrays of signal, power, and electrical ground wires below the surface of the main substrate. Vertical conductive risers to reach the surface plane of the main substrate are also included in the discrete piece, for connecting to dies on the surface of the substrate and thereby interconnecting the dies to each other through the dense array of wires in the discrete piece. The discrete piece to be embedded may have parallel planes of conductors at regular intervals within itself, and thus may present a working surface homogeneously covered with the ends of vertical conductors available to connect surface components to each other and to ground and power at many places along the embedded piece.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: September 25, 2018
    Assignee: Invensas Corporation
    Inventor: Belgacem Haba
  • Patent number: 10031591
    Abstract: According to one aspect, embodiments herein provide a pointing device system including an elongate base member, a sleeve disposed to fit over a portion of the elongate base member, the sleeve configured to rotate about the elongate base member in a first direction and slide about the elongate base member in a second direction substantially orthogonal to the first direction, a first support disposed at a first end of the elongate base member, a second support disposed at a distal second end of the elongate base member, and a plurality of support rails interposed between the first support and the second support, wherein the first support includes a first angular extension and the second support includes a second angular extension, the first angular extension and second angular extension configured to support depression of the elongate base member.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: July 24, 2018
    Assignee: CONTOUR DESIGN, INC.
    Inventors: Steven Wang, HanNing Lu, ChangJun Zhao, ZhiJian Huang
  • Patent number: 10011125
    Abstract: There is provided a recording system including: a first linking portion which regulates a position of a housing with respect to the other housing and links the housing and the other housing; and a second linking portion which regulates a position of the housing with respect to the other housing, applies a load received from the other housing to the housing, and links the housing and the other housing to each other.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: July 3, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Yuichi Segawa, Hirohisa Adachi
  • Patent number: 9935558
    Abstract: To achieve reduction in size and reduction in cost of a DC-DC converter apparatus. Rectifier elements and are installed onto a metal base, and a drive circuit board is installed to an upper part of the rectifier element. Each terminal of the rectifier elements and is soldered to the drive circuit board. Three terminals of the rectifier elements are soldered, respectively, to a drive signal wiring pattern, a high-potential-side main current wiring pattern, and a low-potential-side main current wiring pattern of the board. A pair of output terminals of a transformer is connected to at least the pair of high-potential-side main current wiring patterns using high-potential-side metal conductors.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: April 3, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Tatsuya Nakazawa, Yuji Sobu, Hidenori Shinohara, Yoshiharu Yamashita
  • Patent number: 9936577
    Abstract: The present disclosure illustrates a dual-channel flexible circuit bridge connector and a dual graphics card system using the same. The dual-channel flexible circuit bridge connector includes a dual-channel flexible circuit board, a first connection interface and a second connection interface. The dual-channel flexible circuit board includes, in a sequential order, a first insulating layer, a first circuit layer, a second insulating layer, a ground layer, a third insulating layer, a second circuit layer and a fourth insulating layer. The first connection interface and the second connection interface can be used to link two graphics cards spaced apart by a non-fixed distance, thereby forming a bridging status. Therefore, the dual graphics card system can manipulate two graphics cards to perform parallel computation, so as to achieve better efficiency in computing process and graphics display.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: April 3, 2018
    Assignee: WIESON TECHNOLOGIES CO., LTD.
    Inventors: Qiang-Long Hu, Wen-Sheng Liu
  • Patent number: 9758907
    Abstract: Embodiments disclosed herein provide approaches for attaching scan control and other electronic chips to textiles, e.g., on a loom as part of a real-time manufacturing process.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: September 12, 2017
    Assignee: Intel Corporation
    Inventors: David Graumann, David Bruneau
  • Patent number: 9735524
    Abstract: A connecting arrangement for a three-level converter arrangement includes a first to third connection rail which are each in the form of a shaped metal body. The respective connection rail has a line section and a connection section which has a connection means. The respective connecting rail has a line section and a connecting section which, for its part, has an associated respective connecting means. The respective connection means forms, with the connecting means, a force-fitting, electrically conductive connection. The connection rails are connected to the connecting rails with the correct polarity.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: August 15, 2017
    Assignee: SEMIKRON ELEKTRONIK GmbH & CO. KG
    Inventor: Ingo Rabl
  • Patent number: 9606579
    Abstract: Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic device can be portable and in some cases handheld.
    Type: Grant
    Filed: August 15, 2013
    Date of Patent: March 28, 2017
    Assignee: APPLE INC.
    Inventors: David Pakula, Richard Hung Minh Dinh, Scott Myers, Tang Yew Tan
  • Patent number: 9419164
    Abstract: A solar cell module having an interconnector and a method of fabricating the same are disclosed. The solar cell module includes a plurality of solar cells and an interconnector including a first area electrically connected to one of two adjacent solar cells of the plurality of solar cells, a second area electrically connected to the other of the two adjacent solar cells, and a third area connecting the first area to the second area. At least one of the first area and the second area of the interconnector has at least one uneven surface, and the third area of the interconnector has a substantially planarized surface.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: August 16, 2016
    Assignee: LG ELECTRONICS INC.
    Inventors: Jongdae Kim, Jongkyoung Hong, Giwon Lee
  • Patent number: 9293398
    Abstract: In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: March 22, 2016
    Assignee: Amkor Technology, Inc.
    Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
  • Patent number: 9274568
    Abstract: Disclosed herein is a mobile device comprising a plate; the plate being adapted to accommodate a printed circuit board; a ring bonded to the plate; a seal disposed between the ring and the plate, the plate and ring and seal forming a mid-plate structure; wherein the seal comprises a platform; and a housing unit bonded to the platform.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: March 1, 2016
    Assignee: BlackBerry Limited
    Inventors: Albert Murray Pegg, Li Huang, Enliang Wang, Timothy Kyowski, Steven Prsa
  • Patent number: 9107306
    Abstract: A hybrid substrate includes a core layer composed of a glass woven cloth as a reinforcing material, and a glass-ceramic sintered body which at least has a glass component and a metal oxide component. The glass woven cloth and the glass-ceramic sintered body formed by an impregnation with respect to the glass woven cloth are in a form of sintering integration with each other.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: August 11, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiichi Nakatani, Koji Kawakita
  • Publication number: 20150146403
    Abstract: Provided is a display device capable of reducing a bezel space. The display device includes: a display panel; a lower chassis receiving the display panel; and a metal line fixed to one edge of the display panel and the lower chassis.
    Type: Application
    Filed: May 7, 2014
    Publication date: May 28, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventors: Chung Hui LEE, Seung-Won KUK, Jee Su PARK
  • Patent number: 9042118
    Abstract: According to one embodiment, a television receiver includes: a housing; a circuit board arranged in the housing; an electronic component mounted on the circuit board; a reinforcing member comprising a first surface in contact with the circuit board, and a second surface located on an opposite side of the first surface and exposed to an inside of the housing; a component contained in the housing, the component comprising a first supported area located at a distance from a surface of the circuit board; and a support member configured to support the component, the support member comprising a first end portion fixed to the first supported area of the component, and a second end portion fixed to the second surface of the reinforcing member.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: May 26, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koichiro Takeguchi, Shigeo Hayashi
  • Publication number: 20150138747
    Abstract: A mounting plate and a security device using the same are provided. The mounting plate is for being fixed to a surface, wherein a mounting device is hanged up on the mounting plate, and the mounting plate comprises a first conductive sheet and a second conductive sheet electrically connected to a first electrode of an exterior power and a second electrode of the exterior power respectively. When the mounting device is hanged up on the mounting plate, the exterior power is electrically connected to the mounting device through the first conductive sheet and the second conductive sheet.
    Type: Application
    Filed: November 13, 2014
    Publication date: May 21, 2015
    Inventors: Chin-Chang Chiang, Chin-Liang Wang
  • Publication number: 20150138746
    Abstract: Double-sided reworkable pressure sensitive adhesive tape joins electronic device structures. The reworkable pressure sensitive adhesive tape has a pair of polymer carrier layers that are attached to each other using a thermoplastic adhesive. Opposing outer surfaces of the carrier layers are coated with pressure sensitive adhesive. The thermoplastic material that is used in attaching the carriers to each has a softening temperature that allows the thermoplastic material to be softened without significantly softening the carrier layers. When the thermoplastic material is softened, the structures that have been joined using the tape may be separated from each other. This divides the tape into two tape remnants. After cooling the tape remnants to restore cohesive strength to the pressure sensitive adhesive, the tape remnants can be cleanly peeled away from the structures. Additional reworkable tape may then be used to reattach the structures.
    Type: Application
    Filed: July 17, 2014
    Publication date: May 21, 2015
    Inventor: James R. Krogdahl
  • Patent number: 9025338
    Abstract: A fixing fitting includes a solder connecting plate part soldered and fixed to a surface of the circuit board by using a cream solder and a parts fixing part which is fixed to a connector to be mounted on the circuit board. On a solder connected surface of a lower surface of the solder connecting plate part, V grooves are formed which suck up the cream solder applied on the surface of the circuit board in accordance with a capillary phenomenon. Further, a plurality of communicating holes which communicate with tapered parts of the V grooves and can suck up the cream solder by the capillary phenomenon are bored from an upper surface to the lower surface of the solder connecting plate part with prescribed spaces provided between them in the direction where the V grooves extend.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: May 5, 2015
    Assignee: Yazaki Corporation
    Inventor: Takashi Muro
  • Publication number: 20150116975
    Abstract: A frame member includes a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein the lengths of the first portion and the second portion in a circumferential direction are longer than the length of the third portion in the circumferential direction, and a Young's modulus of the third portion is lower than the Young's moduli of the first portion and the second portion.
    Type: Application
    Filed: October 21, 2014
    Publication date: April 30, 2015
    Inventor: Takanori Suzuki
  • Patent number: 9019720
    Abstract: Components within a portable device are arranged around a perimeter of a display component to reduce the height of the portable device. Components such as a battery, a main logic board, a wireless networking interface, and so forth may be distributed around a display component such as an electrophoretic display. Distribution of components around the perimeter of the display component rather than behind the display component reduces the height. Furthermore, the placement of components in the perimeter provides a structure for a user to grip the portable device or for placement of user actuable controls.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: April 28, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: David C. Buuck, Chris T. Li
  • Patent number: 9019713
    Abstract: A portable electronic apparatus includes a first body, a rotating structure, a supporting element, and a second body. The first body includes an upper surface. The rotating structure combines with the first body and rotates relative to the first body around a first axis which is substantially perpendicular to the upper surface. The supporting element combines with the rotating structure and rotates relative to the rotating structure around a second axis which is substantially parallel to the upper surface. The supporting element includes a main structure and at least one sliding portion disposed at the main structure. The second body includes at least one corresponding sliding portion disposed corresponding to the at least one sliding portion. The second body movably combines with each sliding portion of the supporting element through each of the corresponding sliding portions, such that the second body slides relative to the supporting element.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: April 28, 2015
    Assignee: Wistron Corporation
    Inventor: Jing-Tang Wu
  • Publication number: 20150109752
    Abstract: The present invention is related to a microwave component packaging technique which ensures that there is no space between component and pocket after inserting the component into pocket. The continuity of ground connections at the microwave gates of the components is provided just compressing the component without using electrically conductive epoxy material.
    Type: Application
    Filed: January 25, 2013
    Publication date: April 23, 2015
    Applicant: ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI
    Inventors: Galip Kecelioglu, Taylan Eker, Mustafa Incebacak
  • Patent number: 9013887
    Abstract: A display device includes a panel module, a frame, and a fixing device, wherein the panel module has a panel connecting part. The frame has a frame connecting part whose location corresponds to the location of the panel connecting part. The fixing device includes a joint unit and a fixing unit. The joint unit is used for accommodating the panel connecting part and the frame connecting part. The fixing unit is connected to the joint unit such that the frame can be fixed on the panel module.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: April 21, 2015
    Assignee: Wistron Corporation
    Inventors: Chih-Sheng Chou, Chia-Lun Yeh
  • Patent number: 9001526
    Abstract: An electronic device includes a first body, a second body and a hinge structure. The hinge structure includes a first pivot component, a second pivot component, a first connecting component and a torsion adjusting assembly. The first pivot component is fixed on the first body. The second pivot component is fixed on the second body and pivoted to the first pivot component. The first connecting component is fixed on the first pivot component. The torsion adjusting assembly is movably disposed at the second body. When the torsion adjusting assembly is moved to a first position, the first connecting component and the torsion adjusting assembly are separated and the hinge structure has a first torsion. When the torsion adjusting assembly is moved to a second position, the first connecting component is connected to the torsion adjusting assembly and the hinge structure has a second torsion larger than the first torsion.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: April 7, 2015
    Assignee: Acer Incorporated
    Inventor: Kim Yeung Sip
  • Patent number: 8993901
    Abstract: An inverter stack includes an inverter main body housing an inverter circuit inside, and a fan block disposed on the inverter main body through an engagement device and housing a plurality of fans. The engagement device includes a bolt member penetrating through a slot formed in the inverter main body, wherein a body portion of the bolt member is screwed into a nut fixed to a plate member, and having a stopper nut, and an engagement hole formed in the fan block, the engagement hole having an attachment hole portion and a clamping hole portion formed continuously. When the bolt member is tightened in which the body portion passes through the clamping hole portion, the fan block is engaged with the inverter main body, and when the bolt member is released, the fan block is pulled out to the front side to be disengaged from the inverter main body.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: March 31, 2015
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Toshihiro Yoshida
  • Patent number: 8995149
    Abstract: The invention discloses a keyboard device including a keyboard and a support for protecting the keyboard or accommodating a portable information processing device. The support of the invention is capable of rotate in a direction away from the keyboard to be at a supporting state. The support of the invention is also capable of rotate in a direction toward the keyboard to cover whole of the top of the keyboard.
    Type: Grant
    Filed: March 10, 2013
    Date of Patent: March 31, 2015
    Assignees: Darfon Electronics (Suzhou) Co., Ltd., Darfon Electronics Corp.
    Inventor: Chih-Hao Chen
  • Patent number: 8982571
    Abstract: Electronic equipment includes a first water cutoff member and a second water cutoff member on the periphery of a hole communicating from outside with a space in which an electric component such as an electric circuit board is provided. This can prevent liquid, dust, and the like, which enter a first housing from outside, from entering the space. Thus, the electric component, etc. placed in the space can be prevented from being damaged due to an electric short-circuit.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: March 17, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Reiji Matsumura, Takeshi Mori, Masato Murakata, Kenichi Shindo
  • Publication number: 20150070867
    Abstract: A dual-functioning drawer for a case piece of furniture that can transition from an enclosed drawer to an open media shelf for storing electronic components or devices. The drawer front is affixed to the drawer sides with brackets that rotate about a pivot point to rotate the drawer front from a vertical position to a horizontal position such that the drawer front rests on top of the drawer sides and is receded in the case piece. The drawer may also include an angled display panel for storing and charging electronic devices and cutouts for managing cords within the drawer.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 12, 2015
    Inventor: Gene Head
  • Publication number: 20150055317
    Abstract: An access port cover system, including a housing for an item, the housing defining interior and exterior regions and including an access port through which access to the item from the exterior region is provided, a cover inhibiting access through the access port from the exterior region to the interior region, and a fastener connectable to the housing and the cover. The fastener has an actuation portion for disconnecting the housing and the cover to permit access through the access port from the exterior region to the interior region, the actuation portion being inaccessible from the exterior region when the fastener is connected to the housing and the cover.
    Type: Application
    Filed: October 30, 2014
    Publication date: February 26, 2015
    Inventors: Bradley D. Chamberlin, Steve Burton
  • Publication number: 20150055316
    Abstract: Display device and method for fabricating the same are provided. In one aspect of the inventive concept, there is provided a display device comprising a display panel having a side portion, and a panel fixing member attached to the side portion of the display panel using adhesives interposed between the display panel and the panel fixing member, wherein the panel fixing member has a shape that corresponds to a shape of the side portion of the display panel.
    Type: Application
    Filed: January 14, 2014
    Publication date: February 26, 2015
    Applicant: Samsung Display Co., Ltd.
    Inventors: Sang Heon YE, Jae Hyun CHAE, Won Jin KIM, Dong Hyeon LEE
  • Publication number: 20150049452
    Abstract: An equipment box assembly includes an open-ended housing and a support plate. The housing has a back wall and opposed sidewalls defining a cavity in the housing. The back wall includes a plurality of mounting features for mounting electronic components to the back wall. The housing is configured to be positioned in an installed position in a mounting surface such that the cavity is recessed in the mounting surface. The support plate includes a plurality of mounting features for mounting electronic components to the support plate. The support plate is releasably mounted in the housing cavity in a first position with the support plate generally parallel to and spaced apart a first distance from the back wall.
    Type: Application
    Filed: August 14, 2013
    Publication date: February 19, 2015
    Applicant: WirePath Home Systems, LLC d/b/a SnapAV
    Inventors: Christopher Glenn Franck, Jamie Lee Quinlan, William Jacob Kozlowski, JR., Galen Paul Hess, JR.
  • Patent number: 8947890
    Abstract: A fixing component fixes a detachable component to a housing of an electronic apparatus. The fixing component includes a first operating portion, a first engaging portion and a second operating portion. The first operating portion is configured to receive a movement operation in a first direction and to permit movement in a second direction intersecting the first direction. The first engaging portion is connected to the first operating portion and is configured to release engagement with the detachable component when the first operating portion is moved in the second direction. The second operating portion is connected to the first engaging portion and is configured to receive a movement operation in the second direction.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: February 3, 2015
    Assignee: Fujitsu Limited
    Inventors: Tadanori Tachikawa, Hideki Watanabe
  • Patent number: 8942008
    Abstract: An electronic device includes a chassis, a mounting assembly, and an assisting member. The mounting assembly is secured to the chassis and includes a circuit board and a connector secured to the circuit board. The signal module is secured to the chassis and includes a signal card, and the signal card is engaged with the connector. The assisting member is secured to a first end of the mounting assembly and includes an assisting corner. The assisting corner abuts the signal module. The connector is located between the assisting corner and a second end of the mounting assembly, which is opposite to the first end. The second end rotates about the assisting corner, and the connector disengages from the signal card when the second end is rotated about the assisting corner.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: January 27, 2015
    Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
    Inventors: Yu-Wei He, Wen-Da Zhang
  • Patent number: 8937815
    Abstract: A monitor support for use in multiple configurations including a base portion; a monitor; and a multilink arm coupling the monitor to the base portion is provided. The multilink arm includes a first beam coupled to the base portion by a first pivot; a second beam coupled to the base portion by a second pivot; the first and second beams move in parallel as they rotate about the first and second pivots. The multilink arm may include a connector coupling the monitor to the arm, having a connector axis for rotating the monitor by approximately 180° about the connector axis. Also provided is a cart for carrying instrumentation including a monitor support as above, and a method for using it. The cart includes a bottom portion for holding a desktop instrument, the bottom portion including wheels for rolling the cart; and a top portion for holding the monitor support.
    Type: Grant
    Filed: April 10, 2013
    Date of Patent: January 20, 2015
    Assignee: Volcano Corporation
    Inventors: Duane De Jong, Aaron J. Cheline
  • Patent number: 8936217
    Abstract: A method for interconnecting electronic equipment within an aircraft includes installing a multi-dimensional backplane within the aircraft across a plurality of frame bays associated with the aircraft, the backplane including a plurality of connectors mounted thereon, contacts associated with the connectors interconnected by electrical conductors formed within the backplane, attaching shipside wiring to a first portion of the connectors on the backplane, and attaching electrical connectors of the electronic equipment to corresponding connectors on the backplane.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: January 20, 2015
    Assignee: The Boeing Company
    Inventors: Mark Stephen Shander, Robert Thomas Johnson