Abstract: A coupling and grounding structure of a plasma display device for grounding a circuit board effectively, and fixing the circuit board stably. The plasma display device includes a plasma display panel having a display area, on which images are displayed; a chassis base coupled to a back surface of the plasma display panel; at least one circuit board, on which at least one electronic element for driving the plasma display panel is mounted, the circuit board having a conductive portion and at least one coupling hole to be coupled to the chassis base by a bolt member penetrating the coupling hole; and at least a conductive member which contacts the conductive portion and the bolt member in the coupling hole.

Abstract: A position detecting switch fixture for cylinder, having a pair of clamping reinforced plates at both ends of a mounting band, and clamping/holding a position detecting switch between these plates by a clamping screw. A holder is installed between the pair of clamping reinforced plates to clamp the position detecting switch. The clamping screw has the following clamping positions: a first clamping position where, due to the clamping of the pair of clamping reinforced plates, the base ends of the clamping reinforced plates adjacent to a cylinder tube approach each other, whereby the mounting band is temporarily fixed to the cylinder tube but the switch is not fixed; a second clamping position where, due to subsequent clamping, the switch is fixed to the holder; and a third clamping position where, due to further clamping, clamping restriction sections provided in the holder abut against each other to restrict still further clamping.

Abstract: The invention provides a positioning member for a circuit board and a circuit board positioning mechanism having the positioning member, which is adapted to limit the latitude of a first direction of the printed circuit board installed on a housing. The circuit board positioning mechanism includes a plurality of first connecting portions disposed on the housing and a positioning member, wherein the positioning member consists of a body, a second connecting portion disposed on the body for movably connecting with the first connecting portions, and a propping portion disposed on one side of the body for propping against the circuit board when the body moves along a second direction, thereby further restricting the latitude of the circuit board in a first direction so as to prevent detachment of the circuit board caused by external force and also to assemble and disassemble the circuit board without having to use a tool.

Abstract: Circuit boards for lighting systems have identical LED landing zones printed on the board. Each zone includes at least two sets of LED contact pads. One pad set is configured to mate with contacts of an LED of a first structural type, e.g. from a first product line or manufacturer. The other pad set is configured to mate with contacts of an LED of a second type, e.g. from a different product line or manufacturer. The layout may enable an easy system re-design, e.g. to shift from one type of LED to another. Alternatively, the layout may enable one system to use LEDs of the two different types in a single LED set or array. Exemplary systems disclosed herein include an element for mixing light produced by LEDs mounted to the landing zones, such as an optical integrating cavity.

Abstract: An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a predetermined mating distance thereto. The anchoring member comprises an elongated body extending in a longitudinal direction and having a first coupling member on one end for coupling the first daughter board in a substantially perpendicular orientation to the longitudinal direction on a first side of the mother board. The elongated body also comprises a second coupling member at the opposite end from the elongated body from the first coupling member for coupling the second daughter board in a substantially perpendicular orientation to the longitudinal direction on a second side of the mother board.

Abstract: A screwing control device of a computer chassis is composed of a computer chassis, a panel of which is pre-built with a plurality of positioning holes; a screw element, a center of which is provided with a screw hole and which is able to be locked and fixed into one of the positioning holes; and a bolt, which is transfixed into a through-hole of a board element, and is then screwed into the screw hole of the screw element. Therefore, a quantity of the screw elements which are actually used for screwing can be effectively controlled, and pre-built projected bolts which are not necessarily used for screwing can be eliminated.

Abstract: A mounting apparatus for mounting a motherboard (10) includes a base (80), an operating member (40) and a supporting tray (20). The base has a plurality of first standoffs (82) formed thereon. The operating member is pivotably attached to the base. The operating member includes a driver (44). The supporting tray is adapted to be attached to the motherboard. The supporting tray defines an opening (291) for receiving the driver therein. The driver is pivoted to engage with the edge of the opening, so that the motherboard moves horizontally to be secured to the first standoffs of the base.

Abstract: Embodiments of the present invention provide a system for testing and mounting a PCB in a device. A PCB may be placed on one or more standoffs so that a head portion of the standoff protrudes from one or more apertures of the PCB. A push-pin type standoff cap may then be placed on the protruding heads to mechanically restrain the PCB to the standoffs. Furthermore, one or more cables may be coupled with the standoff caps to provide power or test signals to one or more connector pads on the PCB. Therefore, the standoff caps provide a system for aligning, retaining, connecting, terminating, and testing printed circuit boards.

Abstract: An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a predetermined mating distance thereto. The anchoring member comprises an elongated body extending in a longitudinal direction and having a first coupling member on one end for coupling the first daughter board in a substantially perpendicular orientation to the longitudinal direction on a first side of the mother board. The elongated body also comprises a second coupling member at the opposite end from the elongated body from the first coupling member for coupling the second daughter board in a substantially perpendicular orientation to the longitudinal direction on a second side of the mother board.

Abstract: A card coupling apparatus includes a first surface. A locating member extends from the first surface and includes a control surface that is oriented at an angle relative to the first surface and defines a securing channel that is located adjacent the control surface. A plurality of securing devices extend from the first surface in a spaced apart relationship from the locating member, each securing device including a locating post and a securing member located adjacent the locating post. A card may be coupled to the first surface by engaging the locating member and the securing devices with the card. The card may then be decoupled from the first surface by using one hand to disengage the securing members from the card and remove the card from the securing devices.

Abstract: A computer enclosure includes a base (10), a first retaining member (20) and a bracket (40). The base has a side panel (12) and a top panel (11) extending from one edge of the side panel. The first retaining member and a second retaining member are separately fixed on the side panel for securing a circuit board. The bracket is attached to the first retaining member. The top panel of the base and the first retaining member are shared with the bracket to form a cage for receiving a storage device.

Abstract: A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed on the first substrate and the second substrate, and have a wire which is formed on a side surface of the intermediate substrate. By formation of the intermediate substrate to be on an inner side than an edge surface of the substrates, a part of the two contact terminals respectively are exposed. One end of the wire is connected to an exposed portion of the first contact terminal, and the other end of the wire is connected to an exposed portion of the second contact terminal.

Abstract: A mounting apparatus for mounting two or more types of data storage devices that each defines a locking hole in a sidewall thereof includes a bracket for holding the data storage devices, a fixing member, and a locking member. The bracket includes a first side wall. The first side wall defines a locating hole therein. The locating hole has at least two locating positions. The fixing member is pivotably mounted to the first side wall of the bracket. The locking member is selectively mounted to at least two positions of the fixing member. The locking member includes a locking portion extending therefrom, for selectively being inserted through the at least two locating positions of the locating hole of the bracket to engage in the locking hole of a corresponding type of data storage device.

Abstract: A coupling mechanism mainly includes a coupling member and two bucking blades. The coupling member has two anchor ends on two sides to anchor a plugging main board on the coupling member, and a groove on an upper side and a lower side, to hold the bucking blades. The bucking blades are squeezed and deformed when the coupling member is moved and latched on a coupling interface of an electronic device to fill the tolerance between the two, thus can prevent electromagnetic waves from leaking out. The two anchor ends are made of metal and can also prevent the electromagnetic waves from leaking out from two sides. The coupling mechanism solves the interference problem during assembly occurring to conventional coupling mechanisms that use annular conductive-foamed plastics. The cost of the coupling mechanism also decreases.

Abstract: An integrated circuit assembly including a heat sink, a socket, a printed circuit board and a chassis to be held together under spring bias. The assembly may be secured together with less than 2 mm spanning between a printed circuit board and a chassis.

Abstract: A wired circuit board is provided that is formed by connecting a first wired circuit board and a second wired circuit board, which include a first connection terminal and a second connection terminal, respectively. A solder bump is provided to continuously extend over surfaces of the first connection terminal and the second connection terminal to mechanically couple the first wired circuit board and the second wired circuit board. Consequently, the solder bump is not interposed between opposed surfaces of the first connection terminal and the second connection terminal, thereby allowing the electrical connection provided by the solder bump to be confirmed by visual observation.

Abstract: A support member includes a support panel and a retention element for use in mounting an associated component to the support panel. The retention element defines a bore for receiving an associated threaded fixing element which mounts the component to the support panel. A protrusion extends into the bore from a sidewall thereof. The protrusion assists in positioning the fixing member on reinsertion of the fixing member into the bore, such that the frequency of stripping of a thread of the bore is reduced.

Abstract: An electronic unit includes a flexible printed circuit board that is mounted with plural electronic components, and forms a layered structure through folding, and a joint that electrically connects wiring parts on two end surfaces of the flexible printed circuit board, at least two of the plural electronic components being connected so that the at least two can communicate with each other through the wiring parts of the joint.

Abstract: In a multi-device holding structure for integrally holding two heat generative elements which are transistors having through-holes so as to be mounted on a base plate, and a heat sensitive element which is a temperature fuse sandwiched between the heat sensitive elements and is mounted on the base plate, the heat generative elements and the heat sensitive element are covered with a metallic holding member provided with first flat spring segments for urging the heat generative elements on both ends as well as inserting segments extending upward and inserted into the through-holes, and second flat spring segments for supporting the sides of the heat sensitive element.

Abstract: A substrate has an electrical wiring pattern formed thereon, one or a plurality of electrical parts provided thereon, a first contacting part and a second contacting part provided thereon and electrically connected to the electronic parts, and one or a plurality of electrical connecting bodies. The electrical connecting bodies are different from the electrical wiring pattern, and electrically connect the first contacting part and the second contacting part.

Abstract: A modular electronics enclosure for one or more circuit card assembly includes top and bottom lids formed substantially the same with at least one intermediate circuit card support member disposed therebetween. At least one spring clip clamps the top and bottom lids together around the intermediate support member.

Abstract: A circuit board is mounted within a housing in a resilient manner to minimize the introduction of stresses warping the circuit board as the housing is warped or as a circuit board warped during its manufacture is mounted within the housing. The housing includes spaced apart mounting pads between which screw inserts extend as rigid columns through mounting holes within the circuit board. The surfaces of the mounting holes slide on the surfaces of the screw inserts, with the circuit board being resiliently held by resilient pads between its surfaces and the mounting pads.

Abstract: A method of selectively assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. A plurality of different mounting hardware for a PCB are provided for enabling the selective enhancement of the thermal characteristics of the module. One embodiment provides a conversion kit comprising a PCB having a circuit mounted thereon, lead frames, a baseplate, and open frame and baseplate mounting hardware that, when selectively attached to the PCB, result in an open frame or a baseplate module. The manufacturer of power conversion or other modules can thus manufacture and pretest the board's electronics before assembly into either an open frame or baseplate module, while also providing a conversion kit that includes inexpensive mounting hardware to enable a user to select between assembling a module as either an open frame or a baseplate module.

Abstract: An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package tolerance and ensure uniform contact pressure across the package because they are designed based on the application of elasto-plasticity theory. An elasto-plastic stiffener shares the pressure from heat sink to package substrate and semiconductor. A cutting edge subsystem assembly for Land or Ball Grid Array package integrates L/BGA socket, L/BGA package and heat sink with a frame on top of PCB to increase the stiffness. The methods of post manufacturing including post forming and post age hardening used for testing socket application can increase the durability.

Abstract: A circuit board clamping device is applied to at least two spaced and stacked circuit boards, wherein the two circuit boards are spaced apart and fixed by a plurality of spacing posts. The circuit board clamping device includes a securing member, a pressing member and a forcing member. The securing member can be disposed on one of the circuit boards and adjacent to the spacing posts. The pressing member can be disposed on the securing member and is used to press the spacing posts. The forcing member is disposed on the pressing member and is engaged with the pressing member. The two circuit boards are securely stacked and coupled to each other by the pressing member pressing the spacing posts.

Abstract: A multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and couples one or both of the chips to underlying conductors on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities. The first chip, e.g., an ASIC chip, is solder bonded to the carrier while the second chip, e.g., a memory chip, is secured to the first chip's upper surface and coupled to the carrier using a plurality of wirebond connections.

Abstract: An apparatus and method for supporting a circuit board within a computer chassis is disclosed. The apparatus comprises a standoff support mounted in a channel so that the standoff can be positioned along the length of the channel by moving or sliding the standoff within the channel. This movable standoff facilitates the mounting of a variety of circuit boards within the same computer chassis.

Abstract: A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

Abstract: In a drive circuit for an electric motor, there is provided a circuit board, at least one semiconductor device mounted to the circuit board and a spacer. The semiconductor device has a semiconductor chip, a chip package incorporating therein the semiconductor chip and comprising a mounting member for mounting on the circuit board, and terminals for connections of the semiconductor chip to the circuit board. The spacer is interposed between the circuit board and the mounting member of the chip package so as to provide a space between the circuit board and the chip package.

Abstract: A motherboard mounting apparatus (10) includes a chassis (50) having a bottom panel (51), a support plate (40) attached to a solder side of a motherboard (60), and a clip (30) mounted to the support plate for fastening the support plate to the bottom panel. The bottom panel defines a plurality of catch slots (52) each having a locking portion (524), and forms two blocks (54). The support plate includes a plurality of catches (44) engaging in the locking portions respectively. An opening (46) is defined in the support plate. The clip includes two recessed portions (34) disposed below the opening. When the support plate is slid forwardly, the recessed portions snappingly engage with the blocks respectively, so that the catches are retained in the locking portions. The support plate is securely attached to the bottom panel. The motherboard is thus securely mounted to the chassis.

Abstract: A shielding module is used for shielding an electrical device. In this case, the shielding module includes a heat-dissipating component, a casing and a connection component. The heat-dissipating component has a contacting portion to contact with the electrical device. The electrical device is located in the casing, which has an opening. The heat-dissipating component is disposed in the opening. The connection component and the casing fasten the heat-dissipating component on the electrical device. Furthermore, an electrical apparatus is provided and includes an electrical device, a heat-dissipating component, a casing, and a connection component. In this case, the electrical device is fastened on a circuit board. The heat-dissipating component has a contacting portion adjacent to the electrical device. The electrical device is disposed in the casing, which has an opening. The heat-dissipating component is disposed in the opening.

Abstract: An integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard. A south bridge/north bridge chipset is located next to the CPU socket towards the front of the motherboard, and a memory module is located next to the south bridge/north bridge chipset towards the front of the motherboard. One or more PCI slots are located on one side of the CPU socket, and a power module is located on the other side of the CPU socket.

Abstract: An electrical interconnect apparatus has a mounting member with a plurality of sides. The mounting member is formed from an insulator as a cuboid. Moreover, the mounting member also may be formed from a flexible circuit. Among other things, the plurality of sides includes an interface side. At least two of the plurality of sides are in electrical communication with the interface side.

Abstract: A cable support arm for a rack mount system. The cable support arm may have first and second arm sections, which are rotatably coupled one over the other at a hinge. The first and second arm sections also may have hinges, which are coupleable to a rack and a rack mounted device of the rack mount system.

Abstract: A foolproof polarity indication for poled electronics parts or devices to be mounted to a printed circuit board assures that the poled electronics parts and/or devices are correctly mounted with respect of their polarities to meet occasional requirements dependent on different specifications. Each pair of terminal holes is allotted to a given poled electronics part or device. Two symbols representative of such electronics part or device are arranged side by side on either side of a line drawn from one terminal hole to the other terminal hole. The poled electronics part or device symbols are of reversed polarities. This dual symbol arrangement is effective to draw a worker's attention in the mounting of electrode components in terms of their polarities. When extra components or dummy components are combined with such a poled component, they are encircled by a boundary line, thereby showing the correct polarity direction of the poled component with respect to whether it is enclosed or not.

Abstract: A retention system is provided for a printed circuit assembly. The retention system comprises a structural wall having a wall edge that defines a slot. A printed circuit assembly is disposed proximate the slot, and a retainer plug is slidably disposed in the slot, such that appropriate movement of the retainer plug locks the retainer plug at a desired location along the slot to limit movement of the printed circuit card.

Abstract: A circuit board assembly includes a circuit board which defines circuit board pads, a set of surface mount electronic components soldered to a first set of the circuit board pads using a surface mount soldering process, and a set of surface mount coupling devices soldered to a second set of the circuit board pads using the surface mount soldering process. Each surface mount coupling device is configured to couple at least a portion of an object to the circuit board. Each surface mount coupling device includes a set of surface mount pads connected to the second set of the circuit board pads by solder joints resulting from the surface mount soldering process, a set of legs extending from the set of surface mount pads, and a body portion connected to the set of legs, the body portion providing a fixed structure relative to the circuit board for securing the object.

Abstract: A housing 20 for electrical lighting fixtures with improved ballast mounting is disclosed. The ballast 10 is mounted such that it tightly engages two walls 30,40 of the housing. The housing is a heat sink and heat from the ballast is efficiently transferred to the two walls. The ballast is preferably mounted to one of the two walls. The wall to which the ballast is mounted preferably includes a channel 33 and the ballast preferably includes a bore 12, such that a rod 50 passing through the bore and positioned in the channel mounts the ballast to the wall. A method of mounting a ballast to a housing for electrical lighting fixtures such that the ballast tightly engages two walls of the housing is also disclosed. Such mounting is preferably performed by a single mount.

Abstract: The present invention comprises a shim assembly for supporting a hardware module flush with a bottom side of a printed circuit board. A bottom side of the shim assembly is attached to a top side of the printed circuit board and generally conforms to the shape of a slot in the printed circuit board into which the hardware module is inserted. The shim assembly is of sufficient thickness to fill a gap between the hardware module and the top side of the printed circuit board such that the hardware module does not materially extend past a bottom side of the printed circuit board when inserted in the slot.

Abstract: The invention provides a casing, equipment unit, fan unit and electronic equipment capable of easily implementing assembling, disassembling, attaching and so forth without using fixture components, tools, and so forth. The structure is made up of casing sections, hinge parts and a coupling part. The casing sections are made up of not less than two sections and enclosing a hosing space, and members for securing the housing space thereby. The hinge parts are members coupled with the casing sections and supporting each casing section. That is, not less than two casing sections couple the edge parts of each casing section, and bendably support each casing section. The coupling part is a member for restraining the casing sections positionally and maintaining and fixing the housing space. That is, the coupling parts detachably couple each casing section to hold the housing space on each casing section.

Abstract: An electronic device (1) has an information processor (3) including a circuit board (31) and an integrated circuit element (32). The integrated circuit element is mounted on the circuit board for controlling input and output of information. Further, the circuit board is provided with a cover member (33A) having thermal conductivity and electrical conductivity and covering the integrated circuit element. The cover member, which is electrically connected to ground patterns (G) formed on the circuit board, includes an electromagnetic radiation suppressor (5) for suppressing radiation of electromagnetic waves generated from the integrated circuit element.

Abstract: A surface mounted electronic component includes a case and a board mounting part. The board mounting part includes a leg bent in parallel with a printed circuit board at its tip, an outer frame soldered to a land of a mounted part on the board, and a projection disposed in the outer frame and inserted into a hole in the mounted part. The electronic component is mounted on a surface of the printed circuit board in various electronic instruments, and can keep to be mounted on the board tightly even when an external force is applied.

Abstract: An apparatus for improved shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays to provide electrical connection to a printed circuit board. The CGA integrated package includes a substrate and a package lid. A support frame is attached at an attachment point to the substrate or the package lid of the CGA integrated package and at a second attachment point to the printed circuit board. An isolation material, such as Styrofoam or Sorbathane is located at the attachment point of the support frame to the substrate or the package lid, or located at the second attachment point of the support frame to the circuit board such that a vibration or shock to the circuit board must travel through the isolation material at the attachment point prior to reaching the integrated circuit. A method of supporting an integrated circuit on a circuit board and improving the isolation of an integrated circuit from any vibration and shock to the circuit board is also provided.

Abstract: A housing case that houses a fuel cell is provided with mounts for fixing two ends of a lower surface of an end plate that retains stacked unit cells of the fuel cell, and a mount for fixing a central portion of a lower surface of another end plate. Using these three mounts, the fuel cell is fixed to the housing case.

Abstract: Integrated electronic container, composed by a rack containing electronic circuits, it presupposes the integration in the previously mentioned structure of a heat sink element and the modular assembly of the remaining components: main connection elements and electronic components, electronic printed boards, and heat dissipation area.

Abstract: An integrated motherboard for a small form factor computer comprises a CPU socket located in a central region of the motherboard. A south bridge/north bridge chipset is located next to the CPU socket towards the front of the motherboard, and a memory module is located next to the south bridge/north bridge chipset towards the front of the motherboard. One or more PCI slots are located on one side of the CPU socket, and a power module is located on the other side of the CPU socket.

Abstract: A method and apparatus are provided for preventing warpage of printed circuit boards (PCBs) for the purpose of maintaining proper shape and alignment. A PCB is placed on a base of matching shape and slightly larger size. The PCB is secured to the base by a single fastener, preferably through approximately its center. Inwardly curving brackets are mounted along the outer edges of the base in such a way that their central portions rest on top of the PCB. The brackets are constructed of a solid yet flexible non-conducive material and are fastened to the base and, optionally, to each other. The PCB placed in between the base and the brackets is able to expand without warping significantly. This method is especially effective when used to maintain the shape and alignment of the PCB for an antenna.

Abstract: The present invention provides a connection device connecting a first shell of a first electronic product to a second shell of a second electronic product. The connection device includes a rivet pin having a first part and a second part, a bolt head between them, and a rivet body for engaging with the second shell. The first part of the rivet pin is provided with threads for gripping the wall of the first shell. The rivet body is provided with a slot allowing the second part of the rivet pin to pass through and engage with the rivet body to connect the second shell to the first shell.

Abstract: A microelectronic package includes a flexible substrate and is adapted to be installed onto a support structure, which is preferably a nonplanar support structure. The package includes a frame that is affixed to a perimeter of a first portion of the flexible substrate and forms the substrate into a shape corresponding to the support structure. The package is installed so that the obverse surface of the flexible substrate is intimately against the support structure, so that the support structure not only reinforces the package to prevent damage, but also extracts heat generated during operation of the electronics.

Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.