With Particular Insulation Patents (Class 361/812)
  • Patent number: 10980140
    Abstract: An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: April 13, 2021
    Assignee: APPLE INC.
    Inventors: Lee E. Hooton, Michael B. Wittenberg, Andrew J. Meschke, Alexander W. Williams
  • Patent number: 8952271
    Abstract: There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: February 10, 2015
    Assignee: Fujitsu Limited
    Inventors: Masaharu Furuyama, Daisuke Mizutani, Seiki Sakuyama, Toshiya Akamatsu
  • Patent number: 8927881
    Abstract: Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: January 6, 2015
    Assignee: Apple Inc.
    Inventors: Michael B. Wittenberg, Sawyer I. Cohen, Jared M. Kole, Shayan Malek, David A. Pakula, Ashutosh Y. Shukla
  • Patent number: 8816852
    Abstract: Tamper-proof alarm components for detecting theft, for example, of copper, air conditioning component(s), and/or an air conditioning unit are disclosed. Methods of making and using tamper-proof alarm components are also disclosed.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: August 26, 2014
    Inventor: Dan L. Dunson
  • Patent number: 8780550
    Abstract: An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: July 15, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert Boyd Curtis, Robert W. Skoog, Christian L. Belady, Jeffrey N. Metcalf
  • Patent number: 8767411
    Abstract: During manufacture of an electronic device, an aerogel coating is applied to a first side of an IC substrate of a first IC. A bonding procedure is initiated, during which IC interconnects are either placed on the coated side of the substrate or on the opposite side of the substrate. The first IC is connected on a carrier to a second IC with the coated side of the first IC facing the second IC to reduce heat transmission to the second IC during operation of the first IC. The aerogel coating reduces thermal stress to the circuit board and surrounding components, reduces the risk of overheating of critical circuit components, provides chemical and mechanical insulation from contamination during subsequent wafer handling operations, and provides a thermal isolator between IC regions of dissimilar power dissipation, which isolator facilitates efficient thermal extraction from localized hotspots.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: July 1, 2014
    Assignee: International Business Machines Corporation
    Inventors: Martin P. Goetz, Gary E. O'Neil
  • Patent number: 8750551
    Abstract: A shielded microphone, and method for shielding a microphone, are provided for use in a communications device having a circuit board and a microphone. The microphone is provided in an electromagnetic shield and a resilient separator is provided over the shield. The device housing is stacked over the separator and shield, while the latter are stacked over the circuit board so that the separator and shield, with microphone there under, are sandwiched between the housing and the circuit board. By this sandwiching the separator is loaded onto the shield to drive the shield directly against the circuit board to make an electrical ground connection therewith, the microphone also being electrically connected to the printed circuit board. The resilience of the separator accommodates the variation in the stacking of the components.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: June 10, 2014
    Assignee: BlackBerry Limited
    Inventor: Robert W. Phillips
  • Patent number: 8720048
    Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: May 13, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Sun Hwang, Jae Joon Lee, Myung Sam Kang
  • Publication number: 20130286627
    Abstract: A display device includes a display panel having a display area and a bezel area formed around edges of the display area; a backlight unit disposed on a rear side of the display panel to provide light to the display panel; a supporting member to support the display panel and the backlight unit; and a top case having at least one joint and incorporated with a surface of the supporting member, wherein the top case has a main frame combined with the supporting member and a sub frame disposed on the bezel area and combined with the main frame.
    Type: Application
    Filed: November 12, 2012
    Publication date: October 31, 2013
    Applicant: LG DISPLAY CO., LTD.
    Inventors: Gyu-Ho LEE, Sang-Yeol KIM, Gee-Sung CHAE, Jung-Hee KIM, Eun-Behm KIM, Won-Bong JANG, Nam KI
  • Patent number: 8541096
    Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: September 24, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi Sun Hwang, Jae Joon Lee, Myung Sam Kang
  • Patent number: 8391022
    Abstract: A mezzanine board alignment and mounting device includes a multi-stage pin connected to a main board near a mezzanine board connector disposed on the main board. The multistage pin includes a base adapted to connect to the main board, a point distal to the base adapted to pass through an opening on a mezzanine board, and a support disposed between the base and the point. A diameter of the point widens towards the support. A diameter of the support is wider than a diameter of the opening. When the point is fully inserted through the opening in the mezzanine board, the mezzanine board is aligned properly to connect with the mezzanine board connector on the main board.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: March 5, 2013
    Assignee: Oracle America, Inc.
    Inventors: Timothy W. Olesiewicz, David W. Hartwell, Brett C. Ong
  • Publication number: 20120195003
    Abstract: A rectifier comprising an electrically conductive support 32, a first plurality of rectifier components 24 carried by the support 32 and having their anodes connected to a first bus bar 26, a second plurality of rectifier components 28 carried by the support 32 and having their cathodes connected to a second bus bar 30, the cathode of each of the first rectifier components 24 being connected to the anode of an associated one of the second rectifier components 28, and first and second resistance paths 40, 42 between the first and second bus bars 26. 30 and the support 32.
    Type: Application
    Filed: January 30, 2012
    Publication date: August 2, 2012
    Applicant: Goodrich Control Systems
    Inventors: Sepideh Ford, Lyndon Paul Fountain, Raymond Richard Bomford, Mark Wesley Bailey
  • Patent number: 8233290
    Abstract: A unified control switch module includes a printed circuit board, a waterproof pad, and one or more knobs. The printed circuit board includes switches and light-emitting elements mounted thereon. The waterproof pad is coupled to the printed circuit board, and is provided with first protrusions, which are formed at respective locations that correspond to the switches, and second protrusions having respective through-holes, which are formed at respective locations that correspond to the light-emitting elements. The knobs are located on the waterproof pad, and are provided with respective lower ends, which are formed to extend outwards from the through-holes.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: July 31, 2012
    Assignees: Kia Motors Corporation, Hyundai Motor Company
    Inventor: Won Seok Choi
  • Patent number: 8081425
    Abstract: A portable electronic device and a transferring method of a circuit element thereof are provided. The portable electronic device comprises a main body and a circuit element. The main body has a shell and a control element by a print way. The circuit element is integrated with the shell by transferring and is electrically connected with the control element.
    Type: Grant
    Filed: September 16, 2008
    Date of Patent: December 20, 2011
    Assignee: ASUSTek Computer Inc.
    Inventors: Hung-Hsiang Chen, Yang-Po Chiu
  • Patent number: 8031484
    Abstract: An IC package includes a substrate and a plurality of thermal dissipating vias perforating the substrate. The substrate includes a power plane, a ground plane, and a dielectric layer disposed between the power plane and the ground plane. The power plane includes a power region and a non-power region isolated from each other. The thermal dissipating vias are connected to the non-power regions of the power plane and to the ground plane.
    Type: Grant
    Filed: June 16, 2006
    Date of Patent: October 4, 2011
    Assignee: Hong Kong Applied Science and Technology Research Institute Co., Ltd.
    Inventors: Huili Fu, Man Lung Sham, Chang-Hwa Chung
  • Patent number: 8021928
    Abstract: An integrated circuit or chip includes a first die and a second die positioned on a lead frame of a package including a lead frame, such as a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame. The integrated circuit further includes a redistribution layer formed on the first die to couple selected bond fingers of the lead frame to selected bonding pads of the first and second die. The selected bond fingers may correspond to bond fingers that receive a first supply voltage or the first supply voltage and a second supply voltage.
    Type: Grant
    Filed: June 23, 2010
    Date of Patent: September 20, 2011
    Assignee: Marvell International Technology Ltd.
    Inventors: Michael D. Cusack, Randall D. Briggs
  • Patent number: 7885080
    Abstract: A system component of a control device, especially for a transmission or engine controller of a motor vehicle, is provided as a closed system component for a control device which can be transported, thereby allowing decentralized manufacturing of the system component. The system component has a hybrid circuit, equipped with electronic components, which is embedded in a printed circuit board, recessed in the center, in such a manner that the hybrid circuit is completely enclosed by the printed circuit board. The hybrid circuit and the printed circuit board are mounted on a base element and connected to each other via contact elements. A cover element is positioned on top of the hybrid circuit and the contact elements in such a manner that the hybrid circuit is fully encapsulated by the base element, the cover element and the printed circuit board from environmental influences.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: February 8, 2011
    Assignee: Continental Automotive GmbH
    Inventors: Christian Janisch, Johannes Mehler, Walther Seiwerth, Peter Stetter, Christian Weigert, Stefan Wiesinger
  • Patent number: 7754975
    Abstract: A plastic component with a metal layer applied to the surface for electrical contacting of electrical elements ensuing in a thermal attachment method, particularly in a soldering method, has a layer composed of a duroplastic synthetic or a highly heat-resistant thermoplastic synthetic, on which layer a metal layer is applied, applied on the component carrier made of a thermoplastic synthetic, at least in the region of the contacting point or points. The duroplastic synthetic is a hardened resin, and the resin layer is generated by application of the liquid resin by serigraphy, roller coating or spraying, or the highly heat-resistant thermoplastic synthetic is applied in the form of a film.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: July 13, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Stefan Gloede, J├╝rgen Hagen
  • Patent number: 7738261
    Abstract: A functional device fabrication apparatus is provided for forming a wiring pattern or an electronic device on a substrate using paper or paper-based material by depositing solid content of a solution on the substrate. The functional device fabrication apparatus includes a jet head. The jet head jets the solution including electronic function material onto the substrate as dot patterns. The jet head includes a device for dispensing a droplet of the solution from the jet head. A drive signal applied to the device is configured to cause the droplet jetted by the device to have a specific shape before impacting a face of the substrate.
    Type: Grant
    Filed: November 16, 2007
    Date of Patent: June 15, 2010
    Assignee: Ricoh Company, Ltd.
    Inventor: Takuro Sekiya
  • Patent number: 7586754
    Abstract: The printed wiring board includes: a conductive wiring which is formed on a surface of a board and has a plurality of solder lands, to which components to be mounted are electrically connected by solder; and first and second electrically insulating layers formed on the conductive wiring, wherein the first insulating layer is formed on the conductive wiring in such a manner that the first insulating layer covers a portion of a peripheral part of one solder land and a central part of the one solder land is exposed, the portion of the peripheral part being situated on the side of another solder land, wherein the second insulating layer is piled up on the first insulating layer which covers the portion of the peripheral part of the one solder land.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: September 8, 2009
    Assignee: Yazaki Corporation
    Inventor: Yoshihiro Kawamura
  • Publication number: 20090154133
    Abstract: A unified control switch module includes a printed circuit board, a waterproof pad, and one or more knobs. The printed circuit board includes switches and light-emitting elements mounted thereon. The waterproof pad is coupled to the printed circuit board, and is provided with first protrusions, which are formed at respective locations that correspond to the switches, and second protrusions having respective through-holes, which are formed at respective locations that correspond to the light-emitting elements. The knobs are located on the waterproof pad, and are provided with respective lower ends, which are formed to extend outwards from the through-holes.
    Type: Application
    Filed: October 2, 2008
    Publication date: June 18, 2009
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Won Seok Choi
  • Publication number: 20090097222
    Abstract: The present invention relates to an electrical assembly (1) with an outer protective sheath (3). According to the invention, an inner sheath (4), which comprises a higher viscosity or elasticity than the outer protective sheath (3), is provided between the electrical assembly (1) and the outer protective sheath (3) at least at a partial area of the assembly (1).
    Type: Application
    Filed: June 27, 2005
    Publication date: April 16, 2009
    Inventors: Wilfried Babutzka, Dietmar Huber, Franz Foerg, Jakob Schillinger
  • Publication number: 20090027868
    Abstract: This structure for mounting an indicator unit on an electronic apparatus includes an indicator unit including a wiring board and a lens member having a first pressing portion pressing a first surface of the wiring board and a housing of an electronic apparatus, mounted with the indicator unit, including a second pressing portion pressing a second surface of the wiring board. The wiring board is so held between the first pressing portion of the lens member and the second pressing portion of the housing as to be fixed.
    Type: Application
    Filed: July 24, 2008
    Publication date: January 29, 2009
    Applicant: FUNAI ELECTRIC CO., LTD.
    Inventor: Tomokazu SUGAMURA
  • Publication number: 20080259585
    Abstract: An electronic apparatus includes a substrate, electronic components mounted on the substrate, an antenna mounted on the substrate, and a resin material containing a dielectric constant adjusting material added therein, and sealing the electronic components and the antenna.
    Type: Application
    Filed: August 30, 2007
    Publication date: October 23, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Tomoharu Fujii
  • Patent number: 7420818
    Abstract: A memory module includes: one or more semiconductor memory devices; a plurality of module tabs configured to transmit and receive signals between the one or more semiconductor memory devices and external devices; a data bus configured to transfer signals between data input/output pins of the one or more semiconductor memory devices and the plurality of module tabs; and impedance-matching capacitive elements, each coupled between a line of the data bus and a reference voltage. Accordingly, the memory module and a memory system employing such a module can achieve improved impedance matching, thereby also improving signal integrity.
    Type: Grant
    Filed: March 6, 2006
    Date of Patent: September 2, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang-Soo Park, Jae-Jun Lee
  • Publication number: 20080089048
    Abstract: A substrate with built-in electronic components includes a substrate on which a first conductive pattern is formed; an electronic component mounted on the substrate; an insulting layer which is formed by stacking a plurality of resin layers including indifferent additive ratios an additive material for adjusting hardness; a second conductive pattern formed on the insulating layer; and a conductive post for connecting the first conductive pattern to the second conductive pattern.
    Type: Application
    Filed: October 10, 2007
    Publication date: April 17, 2008
    Inventors: Takaharu Yamano, Yoshihiro Machida
  • Patent number: 7132735
    Abstract: The specification describes a leadframe that is aimed at high-performance digital IC devices with high-pin counts, and packaged using wire bond technology. According to the invention the configuration of the paddle is modified to add a new dimension to the leadframe design. In a preferred embodiment, one or more slots are formed in the paddle to allow the length of selected wire bonds to be reduced. This reduces the susceptibility of these selected leads to parasitic capacitances. The selected leads are typically those that carry very high-speed signals.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: November 7, 2006
    Assignee: Agere Systems Inc.
    Inventors: Michael F. Diberardino, Lawrence Wayne Golick, Xingling Zhou
  • Patent number: 7031170
    Abstract: An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: April 18, 2006
    Assignee: Infineon Technologies AG
    Inventors: Frank Daeche, Franz Petter
  • Patent number: 7002813
    Abstract: An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with connecting sections. The printed conductor structures are situated in parallel planes. The connecting sections are rigid electrical conductor sections and are bent out from the planes of the printed conductor structures of the connection unit and the module. The connecting sections of the connection unit are situated corresponding to the arrangement of the connecting sections of the module so that for the connection unit connected to the module each connecting section of the module is electrically connected to a respective connecting section of the connection unit and these adjoin one another in one section situated in a different spatial position than that of the planes of the printed conductor structures.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: February 21, 2006
    Assignees: Leopold Kostal GmbH & Co. KG, Solarworld AG
    Inventors: Eduard Bergmann, Herwig Rilling, Peter Westermayr, Clemens Hofbauer, Boris Klebensberger, Karsten Wambach
  • Patent number: 6958528
    Abstract: A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane and another portion of the plurality of lead fingers of the lead frame located substantially in the same horizontal plane as the active surface of the semiconductor device. Both pluralities of lead fingers of the lead frame having their ends being located substantially adjacent the peripheral sides of the semiconductor device, rather than at the ends thereof.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: October 25, 2005
    Assignee: Micron Technology, Inc.
    Inventor: David J. Corisis
  • Patent number: 6890629
    Abstract: A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: May 10, 2005
    Inventors: Michael D. Casper, William B. Mraz
  • Patent number: 6806561
    Abstract: An electronic apparatus of the present invention comprises an electronic circuit board; an electrically conductive casing for encasing the electronic circuit board; a semiconductor element module electrically connected to the electronic circuit board; and a resin fixture intervening between the electrically conductive casing and the semiconductor element module, the resin fixture mounted with the semiconductor element module and fitted to the electrically conductive casing. As a result, the resin fixture can suppress a transfer of heat generated in the electronic circuit board to the semiconductor element module.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: October 19, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Akihiro Kondoh
  • Patent number: 6771517
    Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: August 3, 2004
    Assignee: Silicon Graphics, Inc.
    Inventors: Thomas Alex Crapisi, Jeffrey Scott Cogner, Stephen Cermak, III, Stephen A. Bowen, Rodney Ruesch, David Paul Gruber, Bonnie Kay Dobbs
  • Patent number: 6761963
    Abstract: A system and method for the fabrication of high reliability capacitors (1011), inductors (1012), and multi-layer interconnects (1013) (including resistors (1014)) on various thin film hybrid substrate surfaces (0501) is disclosed. The disclosed method first employs a thin metal layer (0502) deposited and patterned on the substrate (0501). This thin patterned layer (0502) is used to provide both lower electrodes for capacitor structures (0603) and interconnects (0604) between upper electrode components. Next, a dielectric layer (0705) is deposited over the thin patterned layer (0502) and the dielectric layer (0705) is patterned to open contact holes (0806) to the thin patterned layer. The upper electrode layers (0907, 0908, 1009, 1010) are then deposited and patterned on top of the dielectric (0705).
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: July 13, 2004
    Inventors: Michael D. Casper, William B. Mraz
  • Patent number: 6730854
    Abstract: A resin-formed substrate is provided which has a component side for mounting an electronic component thereon, and a solder side for soldering thereto a lead extending from the electronic component, which is the reverse to the component side, the resin-formed substrate comprising a metal frame forming an electronic circuit pattern; and a resin covering the metal frame, the resin having an aperture formed therein, for exposing a portion of the metal frame, wherein the portion of the metal frame exposed through the aperture serves as an electrode portion for mounting of the electronic component, wherein the resin has a rib integrally formed on the component side, thereby suppressing warp of the resin-formed substrate due to a temperature difference made between a component side and a solder side during soldering.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: May 4, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventor: Yukio Yokoyama
  • Patent number: 6613984
    Abstract: An insulator electrically insulates a bolster plate. The insulator preferably includes a sheet of insulating material sized and shaped to insulate the bolster plate and at least one hole through the sheet of insulating material for accommodating a fastener for securing the sheet of insulating material to the bolster plate.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: September 2, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: James Hensley
  • Publication number: 20030076666
    Abstract: An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.
    Type: Application
    Filed: September 30, 2002
    Publication date: April 24, 2003
    Inventors: Frank Daeche, Franz Petter
  • Patent number: 6531810
    Abstract: The electric load comprises a carrier plate (1) of a synthetic resin material, at a first side (2) of which, synthetic resin projections (30) are present, which serve as a means for coupling the electric load to a holder. The projections (30) have a leg (31) with a disc, which faces away from the plate (1), and a channel (33) accommodating a current conductor (5) of a load element (4), which is present at a first side (3) of the plate (1). The disc has a circumferential side face (35), which is covered with an electric conductor (20) as a contact, to which a respective current conductor (5) is connected. The electric load, for example a fluorescent lamp switch, is of a simple construction that can be manufactured at low costs.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: March 11, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Rene Vincentius Bult, Filip Jozef Suzanne Vereecken
  • Patent number: 6492599
    Abstract: In a multilayer wiring board comprising: an insulating board (for example, a glass board 1); and a wiring layer (for example, wiring patterns 2a, 5a and 8a) superimposed on the insulating board through an insulating film (for example, insulating films 3 and 6), a sum (total film thickness) d (&mgr;m) of the thickness of the insulating films 3 and 6 and the internal stress f (MPa) of the insulating film satisfy the following relational expression (1): d×<700(MPa·&mgr;m)  (1)
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: December 10, 2002
    Assignee: Hoya Corporation
    Inventor: Osamu Sugihara
  • Publication number: 20020163789
    Abstract: A dust filtering apparatus for a computer system comprising computer housing and a dust filtering apparatus, wherein the computer housing is used to accommodate the computer components of the computer system. The computer housing has a panel. The dust filtering apparatus has an area approximate to the area of that panel. The dust filtering apparatus comprises a first dust filtering member and a second dust filtering member. The first dust filtering member and the second dust filtering member of the dust filtering apparatus are bonded together. The dust filtering apparatus is magnetically attached to the panel of the computer housing and thereby forms a seamless protection to prevent computer components from being contamination by dust particles.
    Type: Application
    Filed: November 1, 2001
    Publication date: November 7, 2002
    Inventors: Wang Yu-che, Kao Ming-hui
  • Publication number: 20020135989
    Abstract: An intrinsically safe portable programmer for communicating with the electronic process control equipment over a wireless communication link. The portable programmer comprises a microprocessor controlled electronic circuit housed in an enclosure formed from a polymers polystyrene having a low surface resistivity. The electronic circuit is mounted inside the enclosure with a low voltage battery supply and encased in epoxy to prevent sparking. The electronic circuit includes an infrared transmitter and a keypad. In response to keypad inputs, the electronic circuit generates control signals which are transmitted to the electronic process control equipment via the infrared transmitter.
    Type: Application
    Filed: March 20, 2001
    Publication date: September 26, 2002
    Inventors: Nigel Ashley Preston, Robert William Gray
  • Patent number: 6373720
    Abstract: A module with electronic components mounted on a carrier and electrically interconnected in accordance with a predefined circuit. Such a module, distinguished by particular variability, ease of assembly, compactness and applicability for high currents, is characterized in that the carrier is an injection molded plastic part (1), into which flat connectors (3) for receiving the components may be inserted.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: April 16, 2002
    Assignee: Alcatel
    Inventors: Helmut Fechtig, Heinz Neukum
  • Publication number: 20020036899
    Abstract: A module with electronic components mounted on a carrier and electrically interconnected in accordance with a predefined circuit. Such a module, distinguished by particular variability, ease of assembly, compactness and applicability for high currents, is characterized in that the carrier is an injection molded plastic part (1), into which flat connectors (3) for receiving the components may be inserted.
    Type: Application
    Filed: April 19, 1999
    Publication date: March 28, 2002
    Inventors: HELMUT FECHTIG, HEINZ NEUKUM
  • Patent number: 6233140
    Abstract: An electrically conductive vibration dampener is formed from an electrically conductive base, such as a piece of stamped metal, with at least one tab projecting from the base, and a dampening material member coupled to the base so that the tab can be oriented to provide electrical continuity between other conductors when the electrically conductive vibration dampener is installed into a device. The dampening material member is molded to the base, attached to the base with adhesive, or mechanically attached by for example, registering an edge of the base to a groove formed in the dampening material member. Additionally, the electrically conductive vibration dampener can include an aperture through which a fastener can pass, so that the electrically conductive vibration dampener can be used much like a grommet or washer when fastening components together.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: May 15, 2001
    Assignee: Dell U.S.A., L.P.
    Inventors: John A. Cummings, Susan A. Yeager
  • Patent number: 6191955
    Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.
    Type: Grant
    Filed: January 21, 1998
    Date of Patent: February 20, 2001
    Assignee: Dallas Semiconductor Corporation
    Inventors: Joe Guillot, Michael Quan Dinh, Bill Roberts, Linda M. McLemore
  • Patent number: 6154118
    Abstract: A circuit protective device with a positive temperature coefficient element is provided, which includes: a positive temperature coefficient (hereinafter "PTC") element, made of a conductive composition having a PTC characteristics, provided for shutting off an electric circuit; a circuit board having the PTC element and electrodes to be connected with the PTC element; and a slot formed on the circuit board so as to prevent a low resistance conductive passage from being formed between the electrodes, the low resistance conductive passage being made of powder of the conductive composition released from the PTC element. And also an electric junction box with the above circuit protective device is provided. Thus, the circuit protective device or the electric junction box with the circuit protective device wherein a low resistance conductive passage made of a carbonaceous powder to be released from the PTC element is not formed between the electrodes of the PTC element can be realized.
    Type: Grant
    Filed: May 28, 1999
    Date of Patent: November 28, 2000
    Assignee: Yazaki Corporation
    Inventors: Satoshi Ishikawa, Osamu Soda
  • Patent number: 6094354
    Abstract: A chip component mounting board includes a chip mounting portion and a first groove. A chip component is mounted on the chip mounting portion. The chip mounting portion has a connection pad electrically connected to the chip component. The first groove is formed in the chip mounting portion to extend from a center of the chip mounting portion to one side of the chip mounting portion while gradually increasing its width. A method of manufacturing a chip component mounting board is also disclosed.
    Type: Grant
    Filed: December 1, 1997
    Date of Patent: July 25, 2000
    Assignee: NEC Corporation
    Inventors: Toshiaki Nakajoh, Kenichi Tokuno
  • Patent number: 5959846
    Abstract: First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the joining face, and a plurality of through holes along outer and inner peripheries of the annular groove. An annular core is mounted in the annular groove. A cylindrical connection is formed in each through hole, and a radial connection is formed on an outer surface of each insulating substrate so as to connect opposite cylindrical connections. A toroidal coil is formed by serially connecting cylindrical connections and radial connections. An IC chip is mounted on the outer surface of the first insulating substrate, and connected to the toroidal coil and electronic part. The toroidal coil and the electronic part are coated with an electrically insulating material.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: September 28, 1999
    Assignee: Citizen Electronics, Co., Ltd.
    Inventors: Kathuhiko Noguchi, Masashi Miyashita, Yosio Murano
  • Patent number: 5892417
    Abstract: A method for packaging an acoustic wave filter die, and an acoustic wave filter die packaged by the method. The method includes steps of providing an acoustic wave filter die having an active area disposed on a first surface thereof, providing a leadframe including a die flag and sealing the first surface to the die flag. The method also includes steps of molding a plastic package body about the die and the die flag and singulating the plastic body, the die and the die flag. The molding step desirably includes substeps of placing the acoustic wave filter die sealed to the leadframe in a mold, applying a thermosetting plastic material at a suitable temperature less than the glass transition temperature and at a suitable pressure to the acoustic wave filter die sealed to the leadframe in the mold and maintaining the suitable temperature for a suitable period of time.
    Type: Grant
    Filed: December 27, 1996
    Date of Patent: April 6, 1999
    Assignee: Motorola Inc.
    Inventors: Gary Carl Johnson, Michael J. Anderson, Gregory Jon Kennison, Jeffrey Eanes Christensen, Mark Phillip Popovich
  • Patent number: 5818699
    Abstract: An approximately lead-free mounting pad is formed on a first surface of a substrate having wiring circuits, and an electronic element having an approximately lead-free electrode is face-down mounted on the first surface. An approximately lead-free bump is formed on the approximately lead-free electrode of an electronic element. Mounting pads and approximately lead-free bumps are electrically and mechanically connected to each other by approximately lead-free conductive resin. An approximately lead-free sealing pattern is formed at the area which encloses the electronic element mounted area, of the first surface of the substrate. A weld ring made of Kovar is brazed onto the sealing pattern with approximately lead-free solder. The opening edge of a sealing cap made of Kovar disposed opposite to the weld ring and the weld ring are bonded at the deposited zone by welding.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: October 6, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yoshitaka Fukuoka