Abstract: A CPE device may include a plurality of CPE modules implemented in hardware. The plurality of CPE modules may include a first module and a second module. The first module and the second module may be arrangeable in a stacked configuration. The first module may include a first interconnection interface component disposed on a top surface of the first module. The second module may include a second interconnection interface component disposed on a bottom surface of the second module. The second interconnection interface component may be configured to complementarily couple to the first interconnection interface component when the first module and the second module are arranged in the stacked configuration.

Abstract: A package includes a first layer of molding material, a first metallization layer on the first layer of molding material, a second layer of molding material on the first metallization layer and the first layer of molding material, a second metallization layer on the second layer of molding material, through vias within the second layer of molding material, the through vias extending from the first metallization layer to the second metallization layer, integrated passive devices within the second layer of molding material, a redistribution structure electrically on the second metallization layer and the second layer of molding material, the redistribution structure connected to the through vias and the integrated passive devices, and at least one semiconductor device on the redistribution structure, the at least one semiconductor device connected to the redistribution structure.

Abstract: An electronic device includes a display, and a housing at least partially surrounding the display and comprising a first housing member defining a first portion of an exterior surface of the electronic device and a second housing member defining a second portion of the exterior surface of the electronic device and configured to function as an antenna. The electronic device also includes a joining structure positioned between the first housing member and the second housing member including a reinforcement plate and a molded element at least partially encapsulating the reinforcement plate and engaged with the first housing member and the second housing member, thereby retaining the first housing member to the second housing member.

Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

Abstract: An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

Abstract: A semiconductor package includes a redistribution layer having a first surface and a second surface opposite to each other, the redistribution layer including a plurality of first redistribution pads on the first surface, a semiconductor chip on the second surface of the redistribution layer, an active surface of the semiconductor chip facing the redistribution layer, a plurality of conductive structures on the second surface of the redistribution layer, the plurality of conductive structures being spaced apart from the semiconductor chip, and a plurality of external connection terminals on and coupled to the conductive structures, the plurality of first redistribution pads have a pitch smaller than a pitch of the plurality of external connection terminals.

Abstract: Electronic package structures and assembly methods are described. In an embodiment, an electronic package includes a die mounted face up on a bottom side of a package substrate, and a plurality of components on a top side of the package substrate. The plurality of components may be unmolded, and available for rework. Additional structures are included within the package substrate to provide mechanical rigidity and robustness to the package for warpage control.

Abstract: The disclosure relates to a portable terminal with a case and inside the case: an electronic or optoelectronic module for acquiring or processing information or data and a compartment for housing a battery pack, said battery pack configured to power said electronic or optoelectronic module. The portable terminal also includes: a cap for closing said compartment, said cap being movable between a closed position and an open position wherein said compartment is open to allow the insertion or extraction of said battery pack. The terminal also includes a locking/unlocking device configured to lock/unlock said cap from said case. The terminal also includes a holding device configured for holding said battery pack within said compartment, wherein said holding device can be deactivated when said cap is in said open position in order to allow said battery pack to be extracted from said compartment.

Abstract: A radiation protector is disclosed for protecting against radiation having a wavelength, which may include a front panel portion that includes a flexible carbon fiber layer having an outer edge and a back panel portion that includes a base layer mobile device having an outer edge. The outer edges of each of the flexible carbon fiber layer and base layer extend from edges of an electronic device having an antenna and removably positioned within a device housing on the base layer by a width w, wherein the width w is a fraction of a the wavelength of the radiation emitted by the antenna, and wherein the width w is between 0.5 and 2.5 centimeters from each of front, back, top and bottom sides of the electronic device.

Abstract: A package includes a first layer of molding material, a first metallization layer on the first layer of molding material, a second layer of molding material on the first metallization layer and the first layer of molding material, a second metallization layer on the second layer of molding material, through vias within the second layer of molding material, the through vias extending from the first metallization layer to the second metallization layer, integrated passive devices within the second layer of molding material, a redistribution structure electrically on the second metallization layer and the second layer of molding material, the redistribution structure connected to the through vias and the integrated passive devices, and at least one semiconductor device on the redistribution structure, the at least one semiconductor device connected to the redistribution structure.

Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.

Abstract: An example base cover for a lower housing of a convertible computing device includes a first metallic structure positioned in the lower housing, and a second metallic structure electrically isolated from the first metallic structure. The second metallic structure is positioned in the lower housing and directly below an antenna slot defined in an upper housing of the convertible computing device when the upper housing is positioned over and parallel to the lower housing.

Abstract: Embodiments provide a splice closure and a method for installing an optical cable. The splice closure includes a closure body, a cable accommodating tray, a nut component, an abutting member, and an elastic member. The abutting member is located between an optical cable and the nut component, and the elastic member is located between the optical cable and an installation tube. When the nut component is screwed to an externally threaded section of the installation tube by using threads of an internally threaded section, the abutting member abuts the elastic member, so that the elastic member elastically deforms under an abutting effect of the abutting member, so as to cause an inner circumferential wall of the elastic member that elastically deforms to abut the optical cable, and an outer circumferential wall of the elastic member that elastically deforms to abut an inner circumferential wall of the installation tube.

Abstract: A semiconductor device package includes: (1) a first circuit layer including a first surface and a second surface opposite to the first surface; (2) at least one electrical element disposed over the first surface of the first circuit layer and electrically connected to the first circuit layer; (3) a first molding layer disposed over the first surface of the first circuit layer, wherein the first molding layer encapsulates an edge of the at least one electrical element; (4) first electronic components disposed over the second surface of the first circuit layer and electrically connected to the first circuit layer; and (5) a second molding layer disposed over the second surface of the first circuit layer and encapsulating the first electronic components, wherein the first molding layer and the second molding layer include different molding materials.

Abstract: Various molded chip combinations and methods of manufacturing the same are disclosed. In one aspect, a molded chip combination is provided that includes a first semiconductor chip that has a first PHY region, a second semiconductor chip that has a second PHY region, an interconnect chip interconnecting the first PHY region to the second PHY region, and a molding joining together the first semiconductor chip, the second semiconductor chip and the interconnect chip.

Abstract: An example carrier module may include a carrier board. The carrier board may include a storage drive interface and an adapter connector in electrical communication with the storage drive interface. The adapter connector may engage with a complementary adapter receiver. The adapter connector may include a plurality of signal pins, at least one ground pin that is longer than the signal pins, and at least one power pin that is longer than the signal pins. The plurality of signal pins, the at least one ground pin, and the at least one power pin may engage with the adapter receiver to facilitate electrical communication between the adapter receiver and the adapter connector.

Abstract: An interface device (12) is provided, adapted to wirelessly couple at least one hearing device to a cellular phone (10), wherein the interface device (12) is adapted to be mechanically coupled to the cellular phone (10) by means a cellular phone protection shell (14).

Abstract: A mobile information handling system comprising a chassis having a processor, a memory, and a wireless interface with a display screen operatively coupled to the chassis and the chassis and display screen having a spring, such as shape memory foam pads, internally mounted therein and compressed between the chassis and the display screen and a mechanical connector fittingly engaging an access side of the chassis with the display screen, wherein the mechanical connector maintains pressure on the spring by holding the display screen in a closed position and an access seam at the edge of the display screen is operable to open due to a counter force exerted by the spring when the mechanical connector is disengaged from the display screen.

Abstract: The present disclosure provides an electronic product metal shell with an antenna groove and a method of manufacturing the same. The electronic product metal shell includes a metal layer, a hard anodic oxidation layer, a step recess, an antenna groove and a non-conductive material filled in the antenna groove. The metal layer may have a first surface and a second surface. The hard anodic oxidation layer may be coated on the first surface and the second surface of the metal layer. The step recess may be formed through the hard anodic oxidation layer on the first surface of the metal layer and partially into the metal layer. The antenna groove may be formed within the step recess extending through the metal layer to expose an inner side of the hard anodic oxidation layer on the second surface of the metal layer.

Abstract: Novel tools and techniques are provided for implementing MediaLink Interconnection Boxes (“MIBs”). In some embodiments, a plurality of MediaLink Interconnection Boxes (“MIBs”) or media interconnection devices, which may be disposed throughout a recreational vehicle (“RV”) park or other bulk service provider application sites, or the like, may serve as demarcation units designed to each provide an accessible indoor or outdoor interface where long-term or temporary/transient customers can directly connect to land line service (e.g., POTS service), video or television service, and/or Ethernet or Internet services provided by one or more service providers. Fiber-to-Drop-Point (“FTDP”) and/or point-to-point fiber insertion within a passive optical network (“PON”) communications system may be implemented using apical conduit systems in conjunction with the MIBs.

Abstract: A mobile information handling system comprising a chassis having a processor, a memory, and a wireless interface with a display screen operatively coupled to the chassis and the chassis having a spring, such as shape memory foam pads, internally mounted thereon and compressed between the chassis and the display screen and a mechanical connector fittingly engaging an access side of the chassis with the display screen, wherein the mechanical connector maintains pressure on the spring by holding the display screen in a closed position and an access seam at the edge of the display screen is operable to open due to a counter force exerted by the spring when the mechanical connector is disengaged from the display screen.

Abstract: An example carrier module may comprise a carrier board, which may include a storage drive interface. The storage drive interface may engage with a storage drive so the storage drive can electrically communicate with the storage drive interface. The carrier board may further include an adapter connector in electrical communication with the storage drive interface. The adapter connector may removably engage with a complementary adapter receiver and may include multiple signal pins, and a ground pin and a power pin which are longer than the signal pins. The pins may facilitate electrical communication between the adapter receiver and the adapter connector. The carrier board may also include a power storage component in electrical communication with the storage drive interface and the adapter connector. The power storage component may receive and store a power input from the adapter receiver and may provide the power input to the storage drive interface.

Abstract: The invention relates to a frame device (18) for accommodating storage cells (12) of an energy storage module (10), in particular a battery module, comprising—two plate-like closure elements (20) which form two ends (22, 24) of the frame device (18) that are opposite one another along an axis (14), —connection elements (30) which are arranged on mutually opposite sides (26, 28) of the frame device (18) and which extend from one end (22) to the other end (24) of the frame device (18) and mechanically connect the two closure elements (20) over a distance. For connection to the two closure elements (20), provision is made for each of the connection elements (30) to be provided at each of the ends thereof with a pin (42) which is oriented transversely to the axis (14) and which respectively engages in a cutout (40) in one of the closure elements (20) and is releasably fixed there by means of a respective latch-type securing element (32). The invention further relates to a corresponding energy storage module (10).

Abstract: A housing having a port for reducing wind-induced noise in a communication device. The housing includes a first channel, a second channel, and a ridge between the first and second channels. The housing further includes a tunnel extending through the ridge, which tunnel connects the first and second channels. The housing further includes a microphone port beneath the ridge, which microphone port is connected to the tunnel and connects the tunnel to a microphone cavity in the housing.

Abstract: Provided herein are methods, devices, and systems that relate to electromagnetic interference (EMI) filters that, in certain embodiments, comprise: (a) a housing comprising a substantially enclosed first compartment and a substantially enclosed second compartment; (b) a first circuit card located in the first compartment of the housing that converts a signal transmitted on a conductive based medium to a signal transmitted on a non-conductive based medium; (c) a second circuit card located in the second compartment of the housing that converts a signal transmitted on a non-conductive based medium to a signal transmitted on a conductive based medium; (d) at least one non-conductive based medium that transmits a signal from the first circuit card to the second circuit card; and (e) at least one waveguide through which the non-conductive based medium passes from the first compartment to the second compartment.

Abstract: An assembled structure includes a metal plate having a first main surface and a second main surface, and having a through hole, as well as a resin member assembled with the metal plate and disposed on the second main surface side so as to have a portion fitted within the through hole. Assuming that an opening when the through hole is viewed in a plan view has a first width at a point along the opening and a second width measured in parallel to the first width at a point shifted toward the outer side of the opening, a combination of the first width and the second width can be determined such that the second width is larger than the first width.

Abstract: An ultrathin speaker module, comprising: a casing provided with a sound hole thereon; a speaker unit comprising a diaphragm; a first separating wall provided with a diaphragm accommodating hole, wherein the diaphragm is fixed in the diaphragm accommodating hole, and the first separating wall and the diaphragm separate the internal space of the casing into an upper space and a lower space; and a second separating wall, which separates the upper space into one first upper cavity and at least one second upper cavity, wherein the first upper cavity comprises the diaphragm and forms a front acoustic cavity, and the front acoustic cavity is in communication with the outside through the sound hole on the casing; and the at least one second upper cavity is in communication with the lower space through a through hole on the first separating wall, and forms a rear acoustic cavity.

Abstract: An electronic device is provided comprising: a display screen; a sensing unit for sensing a respective state of each one of a plurality of sub-covers, the plurality of sub-covers being part of a cover for protecting the display screen; and a controller configured to perform an operation based on the respective state of each one of the plurality of sub-covers.

Abstract: A device and fabrication techniques are described that employ wafer-level packaging techniques to fabricate semiconductor devices that include an embedded integrated circuit chip device and an embedded passive device on a semiconductor wafer device. In implementations, the wafer-level package device includes a semiconductor wafer device, an embedded integrated circuit chip, an embedded passive device, an encapsulation structure covering at least a portion of the semiconductor wafer device, the embedded integrated circuit chip, and the embedded passive device, at least one redistribution layer structure, and at least one solder bump for providing electrical interconnectivity to the devices. Once the wafer is singulated into semiconductor devices, the semiconductor devices may be mounted to a printed circuit board, and the solder bumps may provide electrical interconnectivity through the backside of the device that interface with pads of the printed circuit board.

Abstract: A package for active electronics is provided. The package includes a housing structure configured to house the active electronics, a connector element and an interposer element disposed to define a tie point between the housing structure and the connector element such that the tie point is remote from respective edges of the housing structure and the connector element.

Abstract: A computerized method of customizing hardware for a mobile phone is provided. The method includes receiving shell selection information from a user input device, identifying a set of hardware components, the set of hardware components generated based on a compatibility between the hardware components and the shell selection information, and outputting the identified set of compatible hardware components.

Abstract: A portable electronic device that provides compact configurations for audio elements are disclosed. The audio elements can be drivers (e.g., speakers) or receivers (e.g., microphones). In one embodiment, an audio element can be mounted on or coupled to an intermediate structure (e.g., a flexible electrical substrate) having an opening therein to allow audio sound to pass there through. In another embodiment, an audio chamber can be formed to assist in directing audio sound between an opening an outer housing and a flexible electronic substrate to which the audio element is mounted or coupled thereto. In still another embodiment, a barrier, such as a mesh barrier, can be provided in an opening of an outer housing so that undesired foreign substances can be blocked from further entry into the opening in the outer housing.

Abstract: An electronic module includes a housing, a back and a front, wherein the back is configured with a retainer for latchment in a support system and a movable cover connected to the housing is disposed at the front, a receptacle is disposed in a top region of the front of the housing, the receptacle is configured to receive a first hinge piece of a hinge, with a latching mechanism, connecting the housing and the cover, the cover is configured at a first end as a second hinge piece of the hinge, a first opening is disposed perpendicular to a longitudinal axis of the cover at the first end in an enclosure of the cover into which an axial casing is inserted, and the first hinge piece has a second opening into which a partial region of the axial casing is inserted to form an axis of rotation of the hinge.

Abstract: A compact proximity sensor for use in a portable computing device is described. In particular various embodiments of a proximity sensor which fits in an extremely small portion of a cellular phone, and accurately determine the presence of a user's head in close proximity to a surface of the cellular phone. In particular, a high yield assembly process for installing the compact proximity sensor is described.

Abstract: A telecommunication distribution box includes a housing and an electrical component mounted in the housing. A cover plate is movably connected to the housing and is movable between open and closed positions. A lip extends outwardly from the cover plate. The lip covers the electrical component when the cover plate is in the closed position to prevent accessing and removing the electrical component.

Abstract: A wireless module includes a wireless signal transceiver and a transferring unit. The wireless module is assembled to a connector unit after the wireless signal transceiver is assembled to the transferring unit. Therefore, the connector unit transmits and receives wireless signals through the wireless module.

Abstract: A remote controller is arranged for selecting a light source among a plurality of light sources. The remote controller has an omnidirectional transmitter and is arranged to instruct, by means of the omnidirectional transmitter, the light sources to transmit a directional signal comprising a code, which is unique for each light source. Further, the remote controller has a directional signal receiver, and is arranged to receive the directional signals from the light sources, and signal comparison circuitry connected with the directional signal receiver. The remote controller is arranged to select one of the light sources on basis of the received directional signals. Furthermore, the remote controller comprises a transmission indicator, which is arranged to generate an indication signal, indicative of a successful omnidirectional transmission, and it is arranged to initiate the selection of one of the light sources by means of the indication signal.

Abstract: The present invention relates to an EMI shielding material that has a mixture that constitutes 70 wt % to 98 wt % of the EMI shielding material, wherein the mixture has: 1) a dendritic copper filler having copper dendritic crystals of lengths ranging from 0.1 ?m to 50 ?m, 2) a flaky copper filler having copper flakes of diameters ranging from 0.1 ?m to 50 ?m, 3) a resin binder, and 4) a diluent. The present invention also relates to an EMI shielding device made by applying the EMI shielding material on a surface of an electronic unit and by a following heating. The EMI shielding device has a volume resistivity of 10?5 to 10?3 acm. The invention also provides a method for making the EMI shielding device, a package module employing the foregoing EMI shielding device for shielding electromagnetic interference and an appliance employing the foregoing EMI shielding device.

Abstract: A method of selecting a light source among a plurality of light sources by means of a remote controller includes the remote controller: instructing, by omnidirectional transmission, the light sources to each transmit a directional signal comprising a code, which is unique for each light source; —receiving the directional signals from the light sources; and selecting one of the light sources on basis of the received directional signals. Furthermore, the method includes: generating, remotely of the light sources, codes to be transmitted by the light sources; and—the remote controller instructing each one of the light sources which one of the remotely determined codes to transmit.

Abstract: Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.

Abstract: The present disclosure provides a pouch for a mobile terminal and a mobile terminal having the same. The pouch includes a base defining a space for receiving at least part of a terminal body therein, a slide unit disposed within the base, and relatively slidable with respect to the base along a lengthwise direction of the terminal body, the slide unit supporting the terminal body, an elastic unit disposed between the base and the slide unit to apply an elastic force, a guide unit configured to guide the relative sliding of the slide unit, and a locking unit configured to lock and unlock the slide unit at and from a preset position of the base.

Abstract: An integrated audio device, such as, for example, a table-top radio, including a housing, a speaker disposed within the housing, a switching power supply disposed within the housing, and audio circuitry disposed within the housing and coupled between the digital switching power supply and the speaker.

Abstract: A device for consolidating cables is provided, along with a method of consolidating Other embodiments are also described herein.

Abstract: A printed circuit board (PCB) assembly includes a main PCB, a body PCB and a cover PCB. The main PCB has a first electronic component mounted thereon. The body PCB is mounted on the main PCB and includes a cavity therethrough. The first electronic component is positioned within the cavity when the body PCB is mounted on the main PCB. The cover PCB is aligned and mounted on the body PCB to cover the cavity. The cover PCB has a second electronic component mounted on a surface thereof. When the cover PCB is mounted on the body PCB, the second electronic component is positioned within the cavity and faces the main PCB. A method of fabricating the PCB assembly and a mobile terminal including the PCB assembly are also provided.

Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Abstract: A portable electronic device including a first body and a second body is provided. The first body has a first operating surface. The second body covers the first operating surface and includes a back cover and a main body. The back cover is slidably disposed on the first body along a first axis. The back cover is suitable for sliding relative to the first body, such that the first operating surface is exposed by the second body. The main body is pivoted to the back cover along a second axis and has a second operating surface. The main body is suitable for pivoting relative to the back cover to change a relative position between the first operating surface and the second operating surface. The first axis is parallel to the second operating surface, and the second axis is perpendicular to the second operating surface.

Abstract: A Bluetooth receiving device with a decorative function includes a Bluetooth body and a decorative cover coupled to the Bluetooth body to form an ornament. The ornament may be a facial ornament, a brooch, a wristlet, a tie clip or an ornament retained to a user's personal belonging.

Abstract: A replacement radio which can be used to replace a wide range of older automobile radios and fit into an almost unlimited number of dashboard configurations comprises an interchangeable radio display assembly having a radio display sized to fit into an original automobile dashboard radio display opening and a separate radio case having radio electronics therein. The separate radio display assembly is operatively connected to the radio electronics in the radio case, such as by a cable extending between the two. Separate control knob shafts and associated controls can also be provided which are operatively connected to the radio, such as by cables. With a separate radio display assembly and separate control knob shafts, there is no limit to where the radio case can be placed with respect to the dashboard mounting the display and controls and a radio display assembly that fits the particular radio display opening can be used with the radio case.

Abstract: Methods and apparatus are disclosed for a package or a package-on-package (PoP) device. An IC package or a PoP device may comprise an electrical path connecting a die and a decoupling capacitor, wherein the electrical path may have a width in a range from about 8 um to about 44 um and a length in a range from about 10 um to about 650 um. The decoupling capacitor and the die may be contained in a same package, or at different packages within a PoP device, connected by contact pads, redistribution layers (RDLs), and connectors.

Abstract: A mobile phone that is an electronic device includes a bottom housing including a first bottom subhousing. On the first bottom subhousing a rib is provided so as to surround a position where an earphone jack is to be provided and be in with a substrate on which the earphone jack is to be provided. This rib prevents liquid from infiltrating into the bottom housing. Connection terminals of the earphone jack are each connected with other components of the mobile phone such as a CPU via an inner layer of the substrate.