With Plurality Of Capacitors Patents (Class 361/830)
  • Patent number: 8951322
    Abstract: A filter fan of a switch cupboard or of an electrical and/or electronic device placed in a casing with a blast producing an air flow and with a filter element (3) which is placed in the air flow and separates a clean side, on which the blast is placed, from an unclean side, wherein the filter element is held in a frame which can be fixed on the casing by covering the air passage opening penetrating through the casing wall and wherein a protective grid (4) is placed between the filter element (3) and the blast, the invention proposes that a bridging-free distance is provided between the filter surface of the filter element (3) and the protective grid (4), wherein this distance is dimensioned so as to make possible the discharge of water drops on the clean side surface of the filter element and to avoid a contact of the water drops with the protective grid.
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: February 10, 2015
    Assignee: Pfannenberg GmbH
    Inventors: Andreas Pfannenberg, Tobias Reutter, Wolfgang Lodweg
  • Patent number: 8929097
    Abstract: A power conversion apparatus includes electronic components configuring a power conversion circuit, a cooler for cooling at least part of the electronic components, and a case housing the electronic components and the cooler. The at least part of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The internal unit is fixed within the case through the frame. The frame has such a shape that the at least part of the electronic components is surrounded by the frame from four sides.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: January 6, 2015
    Assignee: Denso Corporation
    Inventors: Akira Nakasaka, Kenichi Oohama
  • Patent number: 8902612
    Abstract: A power conversion apparatus includes a switching circuit including semiconductor switches, and a main circuit capacitor connected between a DC power source and the switching circuit. The main circuit capacitor includes a capacitor element, first wiring members that connect the DC power source to the switching circuit, and second wiring members that connect the capacitor element to the switching circuit. The capacitor element, the first wiring members, and the second wiring members are received in a case.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: December 2, 2014
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventors: Aiko Inuduka, Toshio Nagao, Hidenori Hara
  • Patent number: 8717774
    Abstract: A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: May 6, 2014
    Assignee: Kemet Electronics Corporation
    Inventors: Michael S. Randall, Garry Renner, John D. Prymak, Azizuddin Tajuddin
  • Patent number: 8654527
    Abstract: This present invention provides a high power electronic device which is used for transforming the alternating current into the direct current, or transforming the direct current into the alternating current: a thyristor valve module, there are two same thyristor valve segments in the whole thyristor valve module; each segment includes saturated reactor, thyristor valve unit, direct current equalizing resistor unit, acquiring energy unit, damped resistor unit, damped capacitor unit, gate series unit and water cooling system. This device series connects the thyristor valves to meet different transmission powers and different voltage ranks. This device is the key element of the high voltage direct current transmission. It can be used for different voltage ranks AD transmission system and can also be used for different voltage ranks DC system, including the ultra-high voltage 800 kV and above system.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: February 18, 2014
    Inventors: Xiaoguang Wei, Guangfu Tang, Jialiang Wen, Sheng Zhang
  • Patent number: 8654545
    Abstract: The invention relates to an arrangement for holding a plurality of electric capacitor assemblies, particularly assemblies having live housings. The arrangement has a carrier having a through-passage for introducing one of the assemblies and further has at least one bearing ring for mounting an assembly. The bearing ring is matched to the dimensions of the through-passage and the assembly such that the assembly when extending through the through-passage, is in contact with the inner edge of the through-passage via the bearing ring, but not in direct contact with the inner edge of the through-passage.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: February 18, 2014
    Assignee: Bombardier Transportation GmbH
    Inventors: Manfred Zengerle, Tobias Leininger
  • Patent number: 8514590
    Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: August 20, 2013
    Assignee: Denso Corporation
    Inventors: Akira Nakasaka, Masaru Miyazaki, Kenichi Oohama
  • Patent number: 8149589
    Abstract: A holder for mounting multiple capacitors onto a circuit board includes a main structure and a plurality of latching member. The main structure has a top plate and a plurality of side plates. The top plate includes a plurality of holding slots, with the latching members off the side plates. Each latching member has an extension portion and an engaging member. The engaging member is located at the end of the extension under the bottom edge of the side plate. The capacitor includes a main body and a pair of electric leads at one end of the main body. At the opposite end of the electric leads, the main body is bounded on top by the top plate of the main structure, where the main body of each capacitor emerges partially above the upper surface of the top plate.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: April 3, 2012
    Assignee: Lien Chang Electronic Enterprise Co., Ltd.
    Inventors: Chun-Kong Chan, Chi-Ching Chen
  • Patent number: 8149577
    Abstract: The present invention relates to a self-cooled thyistor device for ultra-high voltage fault current limiter. a self-cooled thyristor valve, it adopts horizontal structure consisted by frames, frames is divided into upper and below two spaces by crossbeams, the bottom of frames is supported by insulators. There is a cross plate between two vertical said frames, the cross plate mounts resistors connect with a high potential plate and capacitor through two wires. There is a thyistor string in said frame upper space, which is constituted of thyistors and cooler series. The thyistor string is compressed tightly by press-fit mechanism, thyistor string crosses current transformers. There are high potential plates on both sides of the thyistor, the number of the potential plates is equal to that of thyistor. One side of the high potential plates links frames, said current transformers connects with high potential plates.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: April 3, 2012
    Assignee: China Electric Power Research Institute
    Inventors: Guangfu Tang, Yuanliang Lan, Huafeng Wang, Hongzhou Luan, Zhiqi Li, Haiyu Yu, Huaxin Wang, Jing Zhang
  • Publication number: 20110222261
    Abstract: The invention relates to an arrangement for holding a plurality of electric capacitor assemblies, particularly assemblies having live housings. The arrangement has a carrier having a through-passage for introducing one of the assemblies and further has at least one bearing ring for mounting an assembly. The bearing ring is matched to the dimensions of the through-passage and the assembly such that the assembly, when extending through the through-passage, is in contact with the inner edge of the through-passage via the bearing ring, but not in direct contact with the inner edge of the through-passage.
    Type: Application
    Filed: September 17, 2009
    Publication date: September 15, 2011
    Applicant: BOMBARDIER TRANSPORTATION GMBH
    Inventors: Manfred Zengerle, Tobias Leininger
  • Publication number: 20100232105
    Abstract: An energy storage cell pack cradle assembly for holding multiple rows of energy storage cells oriented along a dominant axis of vibration includes a first cradle member including a plurality of energy storage cell body supporting structures including respective holes; a second cradle member including a plurality of energy storage cell body supporting structures including respective holes; and one or more fasteners connecting the first cradle member and the second cradle member together. The energy storage cell body supporting structures are configured to structurally support the energy storage cells, with the energy storage cells oriented along a dominant axis of vibration, by energy storage cell bodies of the energy storage cells with respective electrically conductive terminals extending through the respective holes without structural support of the electrically conductive terminals by the cradle members.
    Type: Application
    Filed: June 2, 2010
    Publication date: September 16, 2010
    Applicant: ISE CORPORATION
    Inventors: Vinh-duy Nguyen, Alexander J. Smith, Kevin T. Stone, Alfonso O. Medina
  • Publication number: 20100136461
    Abstract: A power storage device includes a fuel cell (33), a battery holder (1) and an end plate (40) for sandwiching and binding the fuel cell, and an interposed member (11) disposed between the end plate (40) and the fuel cell (33). The battery holder (1) and the end plate (40) are made of resin, and have a positive coefficient of thermal expansion at a temperature lower than a predetermined temperature. The interposed member (11) is formed to have a substantially negative coefficient of thermal expansion at a temperature lower than the predetermined temperature.
    Type: Application
    Filed: April 3, 2008
    Publication date: June 3, 2010
    Inventors: Akira Tsujiko, Koji Takahata, Hironori Harada, Hideyasu Kawai, Hideyuki Yamamura
  • Publication number: 20100061074
    Abstract: An electrical platform includes a support structure for bearing electrical equipment; two or more legs extending from the support structure; a brace extending between at least two of the legs; and a damper arranged on the brace.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Inventors: Brian D. Lumpkin, JR., Paul J. Datka, William E. Gundy, Geoffrey A. Ruddell
  • Publication number: 20100053927
    Abstract: There is provided a capacitor unit including plural capacitors, each including end face electrode at one end face and side face electrode having a polarity different from end face electrode at a side face, arranged side by side; bus bar connected to end face electrode of capacitor, and partially connected to side face electrode of adjacent capacitor unit; and a circuit substrate arranged at the one end face sides or the other end face sides of plural capacitors; wherein bus bar and the circuit substrate are electrically connected through conductive portion arranged from bus bar towards the circuit substrate.
    Type: Application
    Filed: February 15, 2008
    Publication date: March 4, 2010
    Inventors: Tatehiko Inoue, Shusaku Kawasaki, Kimiyasu Kakiuchi
  • Publication number: 20090273916
    Abstract: A capacitor apparatus, i.e. a PCU, includes a resin mold provided to surround capacitor elements and integrating the plurality of capacitor elements, and a case body for containing the resin mold. A wave structure is provided at least partially on a wall surface of the case body. With such a configuration, a capacitor apparatus capable of suppressing the transmission of the vibration to the vehicle body and improving the cooling efficiency is provided.
    Type: Application
    Filed: February 13, 2007
    Publication date: November 5, 2009
    Applicant: Toyota Jidosha Kabushiki Kaisha
    Inventor: Ryoji Hironaka
  • Publication number: 20090226804
    Abstract: A cell binder includes a frame body and a frame body. A storage portion of a electric storage cell are pressed/clamped by the bottom of an accommodating portion of the frame body and the bottom of an accommodating portion of the frame body. Also, a sealing portion of the electric storage cell is accommodated in a gap between the bottom of a fitting concave portion of the frame body 16 and the front end of a projecting portion of the other frame body, in a state of being deflected by bending, and the sealing portion is clamped between an inner wall of the fitting concave portion and an outer wall of the projecting portion, thereby fitting the frame bodies to each other. This makes it possible to reduce the size for clamping the sealing portion and to achieve the downsizing of the entire package. In addition, providing the sealing portion with deflections allows movements of the electric storage cell to be accommodated when vibrations are applied.
    Type: Application
    Filed: November 24, 2005
    Publication date: September 10, 2009
    Applicant: FUJI JUKOGYO KABUSHIKI KAISHA
    Inventor: Masaki Komuro
  • Patent number: 7345889
    Abstract: A method and system for reducing the release of high frequency electromagnetic energy into the environment is disclosed, wherein local regions of distributed capacitance are embedded within a printed circuit board (PCB) and adjacent the PCB conductive traces act as low pass filters and thus increase the rise and/or fall times occurring on such traces. The present invention increases very short rise and/or fall times (e.g., 200 picoseconds or less) without degrading or detrimentally affecting other signal characteristics. The present invention does not substantially affect the voltage amplitude and does not affect the bit period when lengthening the rise and/or fall time. Also, the present invention does not induce any timing jitter that may cause synchronization problems within the system.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: March 18, 2008
    Assignee: Avaya Technology Corp.
    Inventor: David Norte
  • Patent number: 7127809
    Abstract: An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: October 31, 2006
    Assignee: Northrop Grumman Corporation
    Inventors: Cynthia W. Berry, Alex E. Bailey, Robert Fisher, Tapan K. Gupta, Daniel Brosey, Steve M. Smalley, William A. Thomas
  • Publication number: 20040252477
    Abstract: A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.
    Type: Application
    Filed: June 11, 2003
    Publication date: December 16, 2004
    Inventors: Dirk D. Brown, John D. Williams
  • Patent number: 6680123
    Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: January 20, 2004
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Hiroki Takeuchi, Toshifumi Kojima, Kazushige Obayashi, Hisahito Kashima
  • Patent number: 6665195
    Abstract: The invention relates to a capacitor module for a converter. The capacitor module contains a capacitor which can be fastened to a base frame or to a cooling body by means of lateral, mechanical holding devices. In addition, the capacitor comprises at least one additional mechanical holding device for fastening at least one electronic terminal of the converter and of at least one measuring sensor, especially of a current transformer and/or of a voltage transformer. The inventive capacitor module makes it possible to realize a construction of a converter which is compact and has a reduced weight.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: December 16, 2003
    Assignee: Bombardier Transportation GmbH
    Inventors: Rodscha Drabon, Manfred Zengerle, Johannes Scholten
  • Patent number: 6430059
    Abstract: An integrated circuit package substrate. At least one insulating layer is formed between every two neighboring patterned wiring layers for isolation. At least a via is formed to penetrate through the insulating layers to electrically connect the patterned wiring layers. A capacitor is formed within at least one of the insulating layer. The capacitor has two electrodes insulated by a dielectric layer. One of the electrodes is connected to a power source, while the other is connected to ground.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: August 6, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Pin Hung, Jung-sheng Chiang
  • Patent number: 6410184
    Abstract: The power source holds a plurality of parallel oriented power modules in a holder-case. The holder-case is provided with cover-casings on both sides and intermediate-casings between them. Holder ribs project from the insides of cover-casings and from both sides of intermediate-casings for arranging power modules in a plurality of rows and retaining them in fixed positions. Cover-casings on both sides and intermediate-casings are joined to sandwich and hold the plurality of rows of power modules in fixed positions via the holder ribs.
    Type: Grant
    Filed: January 27, 2000
    Date of Patent: June 25, 2002
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Tatsuhito Horiuchi, Yoshiharu Takasaki
  • Patent number: 6320758
    Abstract: An integrated circuit (IC) mounting board is provided for use to mount an IC module and as least one bypass capacitor thereon. The IC mounting board allows the layout of the wiring between the IC module and the circuit lines on the IC mounting board to be more convenient to carry out. Moreover, the IC mounting board allows the bypass capacitor to provide the bypass effect more effectively.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: November 20, 2001
    Assignee: Via Technologies, Inc.
    Inventors: Shu-Hui Chen, Nai-Shung Chang
  • Patent number: 6313991
    Abstract: A thermally cooled power electronics system. A cooling housing has a body with a coolant cavity formed in one surface and a capacitor bus assembly potting cavity formed in an opposite surface. A bus bar passthrough opening is formed through the body, along with a coolant inlet and outlet manifolds having a coolant cavity inlet outlet that are coupled to respective ends of the coolant cavity. An environmental sealing gasket surrounds the coolant cavity. A plurality of laminated copper bus bars are disposed through the bus bar passthrough opening. A laminated horizontal bus bar assembly extends along the length of the housing above the coolant cavity and has horizontal bus bars that are coupled to the laminated copper bus bars. A battery input connector is coupled by way of a vertical bus bar assembly to the horizontal bus bar assembly. A plurality of power switching devices are coupled to the laminated horizontal bus bar assembly.
    Type: Grant
    Filed: July 24, 2000
    Date of Patent: November 6, 2001
    Assignee: General Motors Corporation
    Inventors: James M. Nagashima, Terence G. Ward, Scott D. Downer
  • Patent number: 5940263
    Abstract: A device is disclosed for connecting a plurality of capacitors between a first and a second terminal. The device includes a plurality of bus bars located in a parallel spaced apart relationship. A plurality of fasteners fasten the plurality of capacitors between adjacent bus bars. A plurality of shims are interposed between selected bus bars and the first and second terminal for electrically connecting the plurality of capacitors between the first and second terminals.
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: August 17, 1999
    Inventor: Albert Jakoubovitch
  • Patent number: 5812365
    Abstract: The device is disclosed for the mounting and cooling of a capacitor. The device comprises of a pair of metal bars made of a thermally and electrically conductive material. The capacitor is fastened to the pair of metal bars. Water is circulated through channels defined in the pair of metal bars for cooling the capacitor.
    Type: Grant
    Filed: August 7, 1996
    Date of Patent: September 22, 1998
    Inventor: Albert Jakoubovitch
  • Patent number: 5804761
    Abstract: A hybrid vehicle includes a power unit communicating power between a turbine alternator, flywheel and traction motor. The power unit stores power in capacitors and places the power on a dc bus. The dc bus comprises an electrical bus assembly comprising a first conducting plate establishing a positive signal, a second conducting plate establishing a negative signal, and an insulation layer sandwiched between the first and second conducting plates and fixedly secured therewith. At least one of the conducting plates includes fluid passages extending within the plate allowing fluid to circulate therein.
    Type: Grant
    Filed: August 8, 1996
    Date of Patent: September 8, 1998
    Assignee: Chrysler Corporation
    Inventors: Kevin J. Donegan, Dennis E. Hartzell, Gary P. Millas
  • Patent number: 5736681
    Abstract: There are provided conductive bumps arranged at predetermined positions penetrated through an insulating layer during a press integration stage to ensure electrical and thermal conductivities between a wiring pattern and a conductive metal as well as electrical connections between the wiring patterns. More specifically, the sharp tip of the conductive bump is subjected to plastic deformation to form the interconnections between the wiring patterns or between the wiring pattern and the conductive metal. Also provided is a method of manufacturing a printed wiring board. A synthetic resin sheet is sandwiched by the surface on which conductive bumps are formed into a laminate. The laminate is heated until the resin component of the synthetic resin sheet in a plastic state or up to a temperature not lower than the glass transition temperature of that resin. At that time, the conductive bumps are forced against the synthetic resin sheet and are penetrated therethrough.
    Type: Grant
    Filed: August 31, 1994
    Date of Patent: April 7, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuichi Yamamoto, Yoshizumi Sato, Tomohisa Motomura, Hiroshi Hamano, Yasushi Arai
  • Patent number: 5694301
    Abstract: A hybrid vehicle includes a power unit communicating power between a turbine alternator, flywheel and traction motor. The power unit stores, dc power in capacitors and places power on a dc bus for use in driving the induction machines. The dc bus includes two spaced buses, each of the bus members include a positive plate and a negative plate electrically insulated from one another. A conducting strap member interconnects the first and second bus members. The conducting strap member includes first and second strap plates electrically insulated from one another and secured to one another. A first of the strap plates is connected to the positive plates and a second of the strap plates is connected to the negative plates. Also included is a capacitor bank for storing DC power. The capacitor bank is connected to the DC bus by laminated brackets carrying positive and negative signals.
    Type: Grant
    Filed: May 2, 1996
    Date of Patent: December 2, 1997
    Assignee: Chrysler Corporation
    Inventors: Kevin J. Donegan, Dennis E. Hartzell, Gary P. Millas