Abstract: A vehicle lamp having a light assembly and reflector assembly is provided. The light assembly has a light emitting diode (LED) mounted on a substrate to emit first and second solid angles. A reflective recycling surface is mounted on the substrate adjacent to the LED. The reflector assembly has a first reflector having a macro-focal reflective surface extending at the first solid angle relative to the LED and defines an output light pattern along an output optical axis. A second reflector has an ellipsoid reflective surface extending at the second solid angle relative to the LED and has a first focal point oriented at the LED and a second focal point oriented at the recycling surface. The second reflector reflects light emitted from the LED in the second solid angle back to the recycling surface. The recycling surface reflects light from the second reflector to be incident the first reflector.

Abstract: The present invention relates to a lamp and a vehicle having the same, the lamp including: a housing; a substrate arranged on the housing; a first light source and a second light source arranged on one side surface and the other side surface of the substrate, respectively; and a light guide arranged on a path of light emitted from the second light source. Accordingly, the lamp can both realize stereoscopic lighting and improve the design-related degree of freedom when installed on a vehicle.

Abstract: The present invention features a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly thereto. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed-up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a motherboard or similar structure. A thermal control structure may be placed in the memory module, cooling the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.