Abstract: Systems and methods for read level tracking and optimization are described. Pages from a wordline of a flash memory device read and the raw page data read from the wordline may be buffered in a first set of buffers. The raw page data for each of the pages may be provided to a decoder for decoding and the decoded page data for each of the pages buffered in a second set of buffers. First bin identifiers may be identified for memory cells of the wordline based on the raw page data and second bin identifiers may be identified for the memory cells of the wordline based on the decoded page data. Cell-level statistics may be accumulated based on the first bin identifiers and the second bin identifiers, and a gradient may be determined for respective read levels based on decoding results for each of the pages and the cell-level statistics. Settings for the read levels may be configured in the flash memory device based on the determined gradients.

Abstract: Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

Abstract: Systems and methods for read level tracking and optimization are described. Pages from a wordline of a flash memory device read and the raw page data read from the wordline may be buffered in a first set of buffers. The raw page data for each of the pages may be provided to a decoder for decoding and the decoded page data for each of the pages buffered in a second set of buffers. First bin identifiers may be identified for memory cells of the wordline based on the raw page data and second bin identifiers may be identified for the memory cells of the wordline based on the decoded page data. Cell-level statistics may be accumulated based on the first bin identifiers and the second bin identifiers, and a gradient may be determined for respective read levels based on decoding results for each of the pages and the cell-level statistics. Settings for the read levels may be configured in the flash memory device based on the determined gradients.

Abstract: A resistive processing unit includes an analog memory element coupled to a read row line and a read column line, a first current subtraction field-effect transistor (FET) coupled to the read row line and the analog memory element, and a second current subtraction FET coupled to the read column line and the analog memory element. The analog memory element is configured to store a weight value as its conductance. Application of a gate pulse voltage to one of the first current subtraction FET and the second current subtraction FET during application of a read pulse voltage to one of the read row line and the read column line reduces a measured conductance of the analog memory element, and the reduction of the measured conductance of the analog memory element provides net current for the stored weight value.

Abstract: According to one embodiment, a variable resistance element includes first and conductive layers and first and second layers. The first conductive layer includes a first element including at least one selected from the group consisting of silver, copper, aluminum, nickel, and titanium. The second conductive layer includes at least one selected from the group consisting of platinum, gold, iridium, tungsten, palladium, rhodium, titanium nitride, and silicon. A first layer contacts the first conductive layer, and is provided between the first and second conductive layers. The first layer includes a first material. The first material is insulative. The second layer includes a second element and a second material and is provided between the first layer and the second conductive layer. The second element includes at least one selected from the group consisting of silver, copper, aluminum, nickel, and titanium. The second material is different from the first material.

Abstract: A method of operating a resistive memory device includes providing a resistive memory device including an array of resistive memory cells, where each of the resistive memory cells includes a resistive memory material having at least two different resistive states, performing a first mode read operation on a group of resistive memory cells within the array, determining a bit error rate for data generated by the first mode read operation, determining whether the determined bit error rate is below a predetermined limit, and performing a second mode read operation on the group of resistive memory cells within the array based on a threshold voltage if the determined bit error rate is above the predetermined limit.

Abstract: Systems and methods for read level tracking and optimization are described. Pages from a wordline of a flash memory device read and the raw page data read from the wordline may be buffered in a first set of buffers. The raw page data for each of the pages may be provided to a decoder for decoding and the decoded page data for each of the pages buffered in a second set of buffers. First bin identifiers may be identified for memory cells of the wordline based on the raw page data and second bin identifiers may be identified for the memory cells of the wordline based on the decoded page data. Cell-level statistics may be accumulated based on the first bin identifiers and the second bin identifiers, and a gradient may be determined for respective read levels based on decoding results for each of the pages and the cell-level statistics. Settings for the read levels may be configured in the flash memory device based on the determined gradients.

Abstract: According to an example, in a method for determining a resistance state of a cell in a crossbar memory array, a first read voltage may be applied across a cell to sense a first cell current. In addition, a second read voltage may be applied across the cell to sense a second cell current. A difference value between the first cell current and the second cell current may be identified and a resistance state of the cell may be determined based on the difference value.

Abstract: The present disclosure concerns a MRAM cell comprising a first tunnel barrier layer comprised between a soft ferromagnetic layer having a free magnetization and a first hard ferromagnetic layer having a first storage magnetization; a second tunnel barrier layer comprised between the soft ferromagnetic layer and a second hard ferromagnetic layer having a second storage magnetization; the first storage magnetization being freely orientable at a first high predetermined temperature threshold and the second storage magnetization being freely orientable at a second predetermined high temperature threshold; the first high predetermined temperature threshold being higher than the second predetermined high temperature threshold. The MRAM cell can be used as a ternary content addressable memory (TCAM) and store up to three distinct state levels. The MRAM cell has a reduced size and can be made at low cost.

Abstract: A resistive switching element can be used in a nonvolatile digital Schmitt trigger circuit or a comparator circuit. The Schmitt trigger circuit can include a resistive switching circuit, and a reset circuit. The resistive switching circuit can provide a hysteresis behavior suitable for Schmitt trigger operation. The reset circuit can be operable to reset the resistive switching circuit to a high resistance state. The comparator circuit can include a resistive switching circuit, a reset circuit, and a threshold setting circuit. The resistive switching circuit can include a resistive switching element, and can be operable to provide a signal comparing an input voltage with the set or reset threshold voltage of the resistive switching element. The threshold setting circuit can be operable to modify the set or reset threshold of the resistive switching element, effectively changing the reference voltage for the comparator circuit.

Abstract: A non-volatile variable capacitive device includes a capacitor defined over a substrate, the capacitor having an upper electrode and a resistive memory cell having a first electrode, a second electrode, and a switching layer provided between the first and second electrodes. The resistive memory cell is configured to be placed in a plurality of resistive states according to an electrical signal received. The upper electrode of the capacitive device is coupled to the second electrode of the resistive memory cell. The resistive memory cell is a two-terminal device.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array include the memory cells each including a variable resistance element in which a reset current flowing in a reset operation is smaller than a set current flowing in a set operation by not less than one order of magnitude. The control circuit performs the reset operation and the set operation for the memory cells. The control circuit performs the reset operation for all memory cells being in the low resistance state and connected to selected first interconnections and selected second interconnections.

Abstract: An electronic device includes a first electrode, a second electrode and a solid electrolyte having a base of an ion conducting material. The device remains in the highly resistive state for as long as a first threshold voltage between the first electrode and the second electrode is not reached. The device switches from the state of high resistance to the state of low resistance when the potential difference between the first electrode and the second electrode is equal to or greater than the first threshold voltage. The device switches from the state of low resistance to the state of high resistance when the potential difference between the first electrode and the second electrode equal to or greater than this first threshold voltage is removed and as it decreases it reaches a second positive voltage threshold strictly lower than the first threshold voltage.

Abstract: A method of forming a circuitry includes providing a substrate comprising a plurality of die. Each die includes a plurality of resistive random access memory (RRAM) storage cells. The method further includes concurrently initializing substantially all of the RRAM storage cells on the same wafer. Initializing can include applying a voltage potential across the RRAM storage cells.

Abstract: The present technology relaxes the precision (or full data-correctness-guarantees) requirements in memory operations, such as writing or reading, of MLC memories so that an application may write and read a digital data value as an approximate value. Types of MLCs include Flash MLC and MLC Phase Change Memory (PCM) as well as other resistive technologies. Many software applications may not need the accuracy or precision typically used to store and read data values. For example, an application may render an image on a relatively low resolution display and may not need an accurate data value for each pixel. By relaxing the precision or correctness requirements is a memory operation, MLC memories may have increased performance, lifetime, density, and/or energy efficiency.

Abstract: In one embodiment of the present invention, a memory cell includes a first resistive switching element having a first terminal and a second terminal, and a second resistive switching element having a first terminal and a second terminal. The memory further includes a three terminal transistor, which has a first terminal, a second terminal, and a third terminal. The first terminal of the three terminal transistor is coupled to the first terminal of the first resistive switching element. The second terminal of the three terminal transistor is coupled to the first terminal of the second resistive switching element. The third terminal of the three terminal transistor is coupled to a word line.

Abstract: A resistive memory cell includes a switch and a resistive switching device. The switch includes a first terminal connected to a select line and a gate terminal connected to a word line. The resistive switching device is connected between a second terminal of the switch and a bit line. The resistive switching device is resettable by having a positive bias applied to the word line and a negative bias applied to the bit line.

Abstract: Hybrid resistive memory devices and methods of operating and manufacturing the same, include at least two resistive memory units. At least one of the at least two resistive memory units is a resistive memory unit configured to operate in a long-term plasticity state.

Abstract: The present disclosure provides one embodiment of a method for operating a resistive random access memory (RRAM) cell. The method includes performing a forming operation to the RRAM cell with a forming voltage; performing a number of set/reset operation cycles to the RRAM cell; and performing a recreating process to the RRAM cell to recover RRAM resistance by applying a recreating voltage. Each of the number of set/reset operation cycles includes a set operation with a set voltage. The recreating voltage is greater than the set voltage.

Abstract: A nonvolatile memory element includes a variable resistance layer located between a lower electrode and an upper electrode and having a resistance value that reversibly changes based on electrical signals applied between these electrodes. The variable resistance layer includes at least two layers: a first variable resistance layer including a first transition metal oxide; and a second variable resistance layer including a second transition metal oxide and a transition metal compound. The second transition metal oxide has an oxygen content atomic percentage lower than an oxygen content atomic percentage of the first transition metal oxide, the transition metal compound contains either oxygen and nitrogen or oxygen and fluorine, and the second transition metal oxide and the transition metal compound are in contact with the first variable resistance layer.

Abstract: A nonvolatile memory element includes: a first electrode; a second electrode; and a variable resistance layer comprising a metal oxide positioned between the first electrode and the second electrode. The variable resistance layer includes: a first oxide layer having a resistivity ?x, on the first electrode; a second oxide layer having a resistivity ?y (?x<?y), on the first oxide layer; a third oxide layer having a resistivity ?z (?y<?z), on the second oxide layer; and a localized region that is positioned in the third oxide layer and the second oxide layer to be in contact with the second electrode and not to be in contact with the first oxide layer, and is, in resistivity, lower than the third oxide layer and different from the second oxide layer.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array include the memory cells each including a variable resistance element in which a reset current flowing in a reset operation is smaller than a set current flowing in a set operation by not less than one order of magnitude. The control circuit performs the reset operation and the set operation for the memory cells. The control circuit performs the reset operation for all memory cells being in the low resistance state and connected to selected first interconnections and selected second interconnections.

Abstract: A variable resistance nonvolatile memory device includes: bit lines in layers; word lines in layers formed at intervals between the layers of the bit lines; a memory cell array including basic array planes and having memory cells formed at crosspoints of the bit lines in the layers and the word lines in the layers; global bit lines provided in one-to-one correspondence with the basic array planes; and sets provided in one-to-one correspondence with the basic array planes, and each including a first selection switch element and a second selection switch element, wherein memory cells connected to the same word line are successively accessed in different basic array planes, and memory cells are selected so that voltages applied to the word line and bit lines are not changed and a direction in which current flows through the memory cells is the same.

Abstract: A resistive random access memory (RRAM) device and operating method are disclosed herein. The RRAM device includes at least one RRAM cell and a control circuit. The RRAM cell includes a bottom electrode, an amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) layer, a Ti layer and a top electrode. The a-IGZO layer is disposed on the bottom layer. The Ti layer is disposed on the a-IGZO layer. The top electrode is disposed on the Ti layer. The control circuit is configured to provide at least one electrical signal to the RRAM cell, so as to change the resistance value of the RRAM cell.

Abstract: The present technology relaxes the precision (or full data-correctness-guarantees) requirements in memory operations, such as writing or reading, of MLC memories so that an application may write and read a digital data value as an approximate value. Types of MLCs include Flash MLC and MLC Phase Change Memory (PCM) as well as other resistive technologies. Many software applications may not need the accuracy or precision typically used to store and read data values. For example, an application may render an image on a relatively low resolution display and may not need an accurate data value for each pixel. By relaxing the precision or correctness requirements is a memory operation, MLC memories may have increased performance, lifetime, density, and/or energy efficiency.

Abstract: With a combination of a transistor including an oxide semiconductor material and a transistor including a semiconductor material other than an oxide semiconductor, a semiconductor device with a novel structure in which data can be retained for a long time and does not have a limitation on the number of writing can be obtained. When a connection electrode for connecting the transistor including a semiconductor material other than an oxide semiconductor to the transistor including an oxide semiconductor material is smaller than an electrode of the transistor including a semiconductor material other than an oxide semiconductor that is connected to the connection electrode, the semiconductor device with a novel structure can be highly integrated and the storage capacity per unit area can be increased.

Abstract: A variable resistance memory device has memory cells that are operated by Joule's heat and which are highly thermally efficient. Conductive patterns are formed on a substrate; sacrificial patterns exposing a portion of the top surface of each of the conductive patterns are formed on the conductive patterns, lower electrodes are formed by etching upper portions of the conductive patterns using the sacrificial patterns as an etching mask, then mold patterns are formed on the lower electrodes and cover exposed sidewall surfaces of the sacrificial patterns, and then the sacrificial patterns are replaced with variable resistance patterns.

Abstract: Apparatus, devices, systems, and methods are described that include filamentary memory cells. Mechanisms to substantially remove the filaments in the devices are described, so that the logical state of a memory cell that includes the that includes the removable filament can be detected. Additional apparatus, systems, and methods are described.

Abstract: A memory device having a plurality of cells, each of which stores a value, where the values of the cells are mapped to discrete levels and the discrete levels represent data, is programmed by determining a maximum number of cell levels in the memory device, and determining the set of values that are associated with each of the cell levels. The maximum number of cell levels for the memory device is determined by an adaptive programming system connected to the memory device, based on a plurality of cell values attained by at least one cell of the memory device, in response to voltage applied by the adaptive programming system to the cells of the memory device. The adaptive programming system associates, for each of the cell levels, a different set of cell values of the plurality of cell values attained by the cells to which voltage is applied.

Abstract: Subject matter disclosed herein relates to a memory device, and more particularly to a self-aligned cross-point phase change memory-switch array and methods of fabricating same.

Abstract: A magnetic detecting element includes a laminated structure where a fixed magnetic layer and a free magnetic layer are laminated through a non-magnetic material layer, wherein the fixed magnetic layer is a self-pinned type where a first magnetic layer and a second magnetic layer are laminated through a non-magnetic intermediate layer and the first magnetic layer and the second magnetic layer are antiparallelly magnetization-fixed, and the second magnetic layer is in contact with the non-magnetic material layer. The first magnetic layer is formed using FeCo serving as a material having a higher coercive force than the second magnetic layer. The film thickness of the first magnetic layer falls within a range greater than or equal to 10 ? and less than or equal to 17 ?, and is thinner than the film thickness of the second magnetic layer. The non-magnetic intermediate layer is formed using Rh.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: In a semiconductor device including a memory cell array formed of memory cells using a storage element by a variable resistor and a select transistor, a buffer cell is arranged between a sense amplifier and the memory cell array and between a word driver and the memory cell array. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided.

Abstract: A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured.

Abstract: An RRAM at an STI region is disclosed with a vertical BJT selector. Embodiments include defining an STI region in a substrate, implanting dopants in the substrate to form a well of a first polarity around and below an STI region bottom portion, a band of a second polarity over the well on opposite sides of the STI region, and an active area of the first polarity over each band of second polarity at the surface of the substrate, forming a hardmask on the active areas, removing an STI region top portion to form a cavity, forming an RRAM liner on cavity side and bottom surfaces, forming a top electrode in the cavity, removing a portion of the hardmask to form spacers on opposite sides of the cavity, and implanting a dopant of the second polarity in a portion of each active area remote from the cavity.

Abstract: A magnetic random access memory (MRAM) cell including a magnetic tunnel junction including a tunnel barrier layer between a first magnetic layer having a first magnetization direction, and a second magnetic layer having a second adjustable magnetization to vary a junction resistance of the magnetic tunnel junction from a first to a second junction resistance level; said magnetic tunnel junction further including a switching resistant element electrically connected to the magnetic tunnel junction and having a switching resistance switchable from a first to a second switching resistance level when a switching current is passed through the switching resistant element, such that a resistance of the MRAM cell can have at least four different cell resistance levels depending of the resistance level of the junction resistance and the switching resistance. The disclosed MRAM cell achieves improved read margin and allows for writing at least four different cell resistance levels.

Abstract: Provided is a spin valve element capable of performing multi-value recording, which includes a pair of ferromagnetic layers having different coercivities from each other, and sandwiching an insulating layer or a non-magnetic layer. The ferromagnetic layer having the smaller coercivity has a substantially circular in-plane profile, and a plurality of island-shaped non-magnetic portions IN, IE, IW, and IS are included. In addition, a storage device is manufactured by using such a spin valve element.

Abstract: A memory array includes a plurality of magneto-resistive changing memory cells. Each resistive changing memory cell is electrically between a source line and a bit line and a transistor electrically between the resistive changing memory cell and the bit line. The transistor has a gate electrically between a source region and a drain region and the source region being electrically between the r magneto-resistive changing memory cell and the gate. A word line is electrically coupled to the gate. A bit line charge accumulation sensing for magneto-resistive changing memory is also disclosed.

Abstract: In one aspect, a method of operating a memory cell includes using different electrodes to change a programmed state of the memory cell than are used to read the programmed state of the memory cell. In one aspect, a memory cell includes first and second opposing electrodes having material received there-between. The material has first and second lateral regions of different composition relative one another. One of the first and second lateral regions is received along one of two laterally opposing edges of the material. Another of the first and second lateral regions is received along the other of said two laterally opposing edges of the material. At least one of the first and second lateral regions is capable of being repeatedly programmed to at least two different resistance states. Other aspects and implementations are disclosed.

Abstract: A method of adjusting a resistive change element using a reference is disclosed. The method comprises inspecting a resistive change element to determine a first state; comparing the first state to a reference wherein said reference provides stimulus parameters corresponding to a transition from the first state to a second state; and applying the stimulus parameters to the resistive change element. A resistive change memory cell array is also disclosed.

Abstract: A memory array includes a plurality of memory cells, each of which receives a bit line, a first word line, and a second word line. Each memory cell includes a cell selection circuit, which allows the memory cell to be selected. Each memory cell also includes a two-terminal switching device, which includes first and second conductive terminals in electrical communication with a nanotube article. The memory array also includes a memory operation circuit, which is operably coupled to the bit line, the first word line, and the second word line of each cell. The circuit can select the cell by activating an appropriate line, and can apply appropriate electrical stimuli to an appropriate line to reprogrammably change the relative resistance of the nanotube article between the first and second terminals. The relative resistance corresponds to an informational state of the memory cell.

Abstract: According to one embodiment, a nonvolatile memory device includes a word line interconnect layer, a bit line interconnect layer, and a pillar. The word line interconnect layer includes a plurality of word lines extending in a first direction. The bit line interconnect layer includes a plurality of bit lines extending in a second direction. The pillar is disposed between each of the word lines and each of the bit lines. The pillar includes a current selection film and a plurality of variable resistance films stacked on the current selection film. One variable resistance film includes a metal and either oxygen or nitrogen. Remainder of the variable resistance films include the metal, either oxygen or nitrogen, and a highly electronegative substance having electronegativity higher than electronegativity of the metal. A concentration of highly electronegative substance in the remainder of the variable resistance films is different among the variable resistance films.

Abstract: A nonvolatile semiconductor memory device according to an embodiment includes a memory cell array configured by plural memory cells each including a variable resistor and each provided between first and second lines. A control circuit applies to a memory cell through the first and second lines a writing voltage for writing data or a reading voltage for reading data. A sense amplifier circuit senses data retained in a memory cell based on a current flowing through the first line. In a data writing operation, the control circuit applies a writing voltage to each of n number of memory cells configuring one unit such that the memory cells may be supplied with different resistance values. In a data reading operation, the sense amplifier circuit compares level relationship of the resistance values of n number of memory cells configuring one unit and reads out n! patterns of data from the one unit.

Abstract: A semiconductor memory device in accordance with an embodiment includes a plurality of first word lines, a plurality of bit lines, a resistance varying material, a plurality of second word lines and an insulating film. The bit lines intersect the first word lines. The resistance varying material is disposed at respective intersections of the first word lines and the bit lines. The second word lines intersect the bit lines. The insulating film is disposed at respective intersections of the second word lines and the bit lines. One of the first word lines and one of the second word lines are disposed so as to sandwich the bit lines. The second word lines, the bit lines, and the insulating film configure a field-effect transistor at respective intersections of the second word lines and the bit lines. The field-effect transistor and the resistance varying material configure one memory cell.

Abstract: A nonvolatile memory element of the present invention comprises a first electrode (103), a second electrode (108); a resistance variable layer (107) which is interposed between the first electrode (103) and the second electrode (107) and is configured to switch a resistance value reversibly in response to an electric signal applied between the electrodes (103) and (108), and the resistance variable layer (107) has at least a multi-layer structure in which a first hafnium-containing layer having a composition expressed as HfOx (0.9?x?1.6), and a second hafnium-containing layer having a composition expressed as HfOy (1.8<y<2.0) are stacked together.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: The present disclosure relates to a secure device having a physical unclonable function. The device includes an integrated circuit having a semiconducting material in at least one via in a backend of the integrated circuit. The present disclosure also relates to a method for manufacturing a secure device having a physical unclonable function. The method includes providing an integrated circuit and adding a semiconducting material to at least one via in a backend of the integrated circuit. In some instances a property of the semiconducting material in the at least one via is measured to derive a signature.

Abstract: A memory device comprising a first electrode, a second electrode, metal-chalcogenide material between the first and second electrodes and chalcogenide glass between the first and second electrodes. The chalcogenide glass comprises a material with the chemical formula AxB100-x, wherein A is a non-chalcogenide component and B is a chalcogenide component, and A has a bonding affinity for B relative to homopolar bonds of A. The memory device further comprises a conducting channel in the chalcogenide glass comprising bonds formed between A and a component of the metal chalcogenide material.

Abstract: Provided is a current steering element that can prevent write didturb even when an electrical pulse with different polarities is applied and that can cause a large current to flow through a variable resistance element. The current steering element includes a first electrode (32), a second electrode (31), and a current steering layer (33). The current steering layer (33) comprises SiNx (where 0<x?0.85) added with hydrogen or fluorine. When D (D=D0×1022 atoms/cm3) represents a density of hydrogen or fluorine, d (nm) represents a thickness of the current steering layer (33), and V0 (V) represents a maximum value applicable to between the first electrode (32) and the second electrode (31), D, x, d, and V0 satisfy the following Formulae. (ln(10000(C·exp(?·d)exp(?·x))?1)?)2?V0 (ln(1000(C·exp(?·d)exp(?·x))?1)?)2?(ln(10000(C·exp(?·d)exp(?·x))?1)?)2/2?0 wherein C=k1×D0k2, and ?, ?, ?, k1, and k2 are constants.

Abstract: Selecting bins in a memory by receiving a target cost for performing writes at an analog memory that is capable of storing a range of values. Possible bins that may be created in the range of values and a cost associated with each possible bin are determined. Each possible bin includes one or more of the values. A group of bins are identified, the group of bins are among the possible bins with associated costs that are within a threshold of the target cost. A maximum number of bins are selected from the group of bins that have non-overlapping values. The selected bins are stored along with the values of the selected bins utilized to encode and decode contents of the analog memory.