Plural Spaced Temperature Function Patents (Class 374/110)
  • Patent number: 10084305
    Abstract: An electronic circuit device comprises an output part, which includes at least three phase parts and a first temperature sensor and a second temperature sensor, which output detection signals corresponding to temperatures of the output part. Each phase part includes two high-side and low-side switching elements. The first temperature sensor is located at a position between the first phase part and the second phase part. The second temperature sensor is located at a position between the second phase part and the third phase part. The electronic circuit device further comprises a control circuit part, which specifies a phase part of overheat among the phase parts based on the detection signals of the first temperature sensor and the second temperature sensor.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 25, 2018
    Assignee: DENSO CORPORATION
    Inventors: Yusuke Michishita, Nobuo Segawa
  • Patent number: 10072796
    Abstract: There is described herein methods and system for correcting steady state errors in propeller speed by calculating a leakage flow rate as a function of engine and propeller parameters.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: September 11, 2018
    Assignee: PRATT & WHITNEY CANADA CORP.
    Inventors: Reza Pedrami, James Robert Jarvo, Benjamin Renaud
  • Patent number: 9645191
    Abstract: A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: May 9, 2017
    Inventor: Darryl G. Walker
  • Patent number: 9603531
    Abstract: A system for in-place visualization of sensed data is provided. The system includes a formable sheet comprising a display and sensors embedded within the sheet underneath the display. The display will display information relating to sensed data on a portion of the display corresponding to locations of the sensors located underneath the display. As a result, the display displays the information above or directly above the sensors that output data.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: March 28, 2017
    Assignee: INDIAN INSTITUTE OF SCIENCE
    Inventor: Vijay Natarajan
  • Patent number: 9379539
    Abstract: A protection circuit includes: a temperature measuring unit which compares a voltage corresponding to a temperature at each of a plurality of sense points with a reference voltage, and generates a measurement result based on a result of comparison; a controller which generates a plurality of current control signals, which controls currents of a plurality of channels corresponding to the plurality of sense points, respectively, based on the measurement result from the temperature measuring unit; and a plurality of phase converter which outputs the currents of the plurality of channels based on the plurality of current control signals, wherein the controller generates the plurality of current control signals until the voltage corresponding to the temperature of each of the plurality of sense points is substantially equal to the reference voltage.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: June 28, 2016
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Byeong-Doo Kang, Weon-Jun Choe
  • Patent number: 9290261
    Abstract: An example adjustable linking member of a mounting assembly includes a first attachment portion and a second attachment portion. The first attachment portion connects a linking member to a first component. The second attachment portion connects the linking member to a second component. A variable portion of the adjustable linking member varies a distance between the first attachment portion and the second attachment portion in a first direction when heated. The variable portion varies the distance between the first attachment portion and the second attachment portion in a second direction when cooled. The first direction is opposite the second direction.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: March 22, 2016
    Assignee: United Technologies Corporation
    Inventors: Wendell V. Twelves, Kathleen E. Sinnamon
  • Patent number: 9183738
    Abstract: An apparatus and method for sensing body temperature and wirelessly communicating measured data to at least one electronic device. The device includes a sensor device having a housing base, a housing cover releasably mountable on the housing base, and components for sensing body temperature and wirelessly communicating the measured temperature, including a temperature sensor, a power supply, a microprocessor, and a transmitter and receiver. The electronic device can include an application that communicates with the sensor device and provides a user interface.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: November 10, 2015
    Assignee: IDEVICES, LLC
    Inventors: Christopher J. Allen, Sr., Shawn Monteith
  • Patent number: 9176010
    Abstract: An apparatus and method for measuring, collecting, and processing the temperatures of a number of hot junctions in a thermocouple sensor array simultaneously comprises means for measuring the temperature of one or more reference junctions and means for collecting, processing, storing, and transmitting data collected from an array of thermocouple temperature sensors. The measured temperature(s) of the one or more reference junctions is used to correct the measured voltage in each of a plurality of thermocouple circuits to obtain accurate hot junction temperature measurements. The apparatus and method are particularly useful for collecting and processing temperature data from various locations within engines such as turbine, rocket, and internal combustion engines.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: November 3, 2015
    Assignee: Streamline Automation, LLC
    Inventors: Alton Reich, James Shaw
  • Patent number: 9148057
    Abstract: A semiconductor apparatus includes a first structural body including a first temperature voltage generation unit configured to generate first and second temperature voltages which have different voltage level variations according to a temperature variation, in response to a temperature measurement command, and a first temperature information determination unit configured to generate first temperature information depending on a difference between levels of the first and second temperature voltages; and a second structural body including a second temperature voltage generation unit configured to generate a third temperature voltage and a fourth temperature voltage which have different voltage level variations according to a temperature variation, when a predetermined time elapses after the first and second temperature voltages are generated from the first structural body, and a second temperature information determination unit configured to generate second temperature information depending on a difference betwe
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: September 29, 2015
    Assignee: SK Hynix Inc.
    Inventor: Chul Kim
  • Patent number: 9069148
    Abstract: Provided is a method of manufacturing a downhole cable, the method including, forming a helical shape in an outer circumferential surface of a metal tube, the metal tube having a fiber element housed therein, and stranding a copper element in a helical space formed by the metallic tube. Also provided is a downhole cable including, a metallic tube having a helical space in an outer circumferential surface thereof, wherein the metallic tube has a fiber element housed therein, and a copper element disposed in a helical space formed by the steel tube. Double-tube and multi-tube configurations of the downhole cable are also provided.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: June 30, 2015
    Assignee: AFL Telecommunications LLC
    Inventor: Brian Herbst
  • Patent number: 9016939
    Abstract: Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: April 28, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Ho Chang, Jui-Cheng Huang, Yung-Chow Peng
  • Patent number: 9004751
    Abstract: A fault diagnosis device conducts a fault diagnosis in a temperature sensor. At starting an internal combustion engine, a thermal equilibrium condition may be established and temperature deviations of temperatures detected by at least two reference temperature sensors from each other may be equal to or less than a predetermined value, with the temperatures detected by the reference temperature sensors being greatly deviated from one detected by a temperature sensor being diagnosed. In this case, if the temperatures detected by the reference temperature sensors do not drop by a predetermined temperature or more from starting the engine until a predetermined time elapses, the fault diagnosis device determines that the temperature sensor being diagnosed is faulty.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: April 14, 2015
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Yamato Sakurada
  • Patent number: 8954288
    Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: February 10, 2015
    Assignee: Honeywell International Inc.
    Inventor: Mohammad A. Aljabari
  • Patent number: 8949066
    Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: February 3, 2015
    Assignee: Honeywell International Inc.
    Inventor: Mohammad A. Aljabari
  • Publication number: 20150010038
    Abstract: Devices and corresponding methods can be provided to measure temperature and/or emissivity of a target. Emissivity of the target need not be known or assumed, and any temperature difference between a sensor and the target need not be zeroed or minimized. No particular bandpass filter is required. Devices can include one or two sensors viewing the same target as the target views different respective viewed temperatures. The respective viewed temperatures can be sensor temperatures, and a single sensor can be set to each of the respective viewed temperatures at different times. An analyzer can determine the temperature and/or emissivity of the target based on the respective viewed temperatures and on plural net heat fluxes detected by the sensors and corresponding to the respective viewed temperatures.
    Type: Application
    Filed: February 26, 2014
    Publication date: January 8, 2015
    Applicant: Exergen Corporation
    Inventor: Jason N. Jarboe
  • Patent number: 8905633
    Abstract: A combination fire detection and fire suppression system may include a fire detection system configured to detect an undesirably high temperature associated with an area. The fire detection system may include a temperature sensor including a temperature sensor array and a fire alerting system associated with the temperature sensor. The fire alerting system may be configured to receive information from the temperature sensor and generate a warning signal based on an undesirably high temperature associated with the area. The fire detection system may include a fire control panel configured to receive the warning signal. The system may also include a fire suppression system including a fire suppressant delivery system configured to provide at least one fire suppressant agent to the area associated with the undesirably high temperature.
    Type: Grant
    Filed: August 27, 2009
    Date of Patent: December 9, 2014
    Assignee: Federal Express Corporation
    Inventors: James B. Popp, Arthur J. Benjamin
  • Patent number: 8858072
    Abstract: The present invention is directed to, inter alia, systems and methods for calculating a temperature associated with an analyte measurement component of a biosensing instrument (such as a blood glucose monitor), with a test strip that is inserted in a biosensing instrument, or both. The present systems and methods may employ at least two temperature sensors, and the acquired temperature information may be used to modulate data regarding an analyte in a biological sample, thereby providing a more accurate measurement of the analyte.
    Type: Grant
    Filed: October 16, 2012
    Date of Patent: October 14, 2014
    Assignee: Lifescan, Inc.
    Inventors: Thomas Jetter, Klaus Neubert, Thomas M. Weber, Mahyar Z. Kermani
  • Patent number: 8847586
    Abstract: A magnetic sensor inspection apparatus has a rectangular frame including a stage, a probe card, and a plurality of magnetic field generating coils. A wafer-like array of magnetic sensors is mounted on the stage, which is movable in horizontal and vertical directions. The probe card includes a plurality of probes which are brought into contact with a plurality of magnetic sensors encompassed in a measurement area. The magnetic field generating coils are driven to generate a magnetic field toward the stage. A plurality of magnetic field environment measuring sensors is arranged in the peripheral portion of the probe card surrounding the probes. A magnetic field controller controls magnetic fields generated by the magnetic field generating coils based on the measurement result of the magnetic field environment measuring sensors. Thus, it is possible to concurrently inspect a wafer-like array of magnetic sensors with the probe card.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: September 30, 2014
    Assignee: Yamaha Corporation
    Inventor: Takashi Suzuki
  • Patent number: 8836517
    Abstract: A method and system are implemented for monitoring the thermal dissipation from a computer processing unit. The system comprises a temperature sensor, and a temperature controller. The temperature controller is configured to set a temperature observation window in a first temperature range, gradually narrow the observation window from the first temperature range after a monitored temperature of the processing unit has entered the observation window, and issue an alert signal when the monitored temperature exits the observation window.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: September 16, 2014
    Assignee: NVIDIA Corporation
    Inventor: Yi-Peng Chen
  • Publication number: 20140233604
    Abstract: A thermometer includes first and second surface temperature measurement units, first and second reference temperature measurement units, a storage unit, a temperature correction unit, and a temperature calculation unit. The first reference temperature measurement unit measures a temperature at an opposite side of the first surface temperature measurement unit as a first reference temperature through a first heat insulating portion having a first thermal resistance value. The second reference temperature measurement unit measures a temperature at an opposite side of the second surface temperature measurement unit as a second reference temperature through a second heat insulating portion having a second thermal resistance value. The temperature correction unit corrects the first surface temperature and the first reference temperature based on the second surface temperature and the second reference temperature.
    Type: Application
    Filed: April 30, 2014
    Publication date: August 21, 2014
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Sakiko SHIMIZU
  • Patent number: 8783946
    Abstract: A temperature measurement device includes a first surface temperature measurement part performing a measurement to be used as a first surface temperature; a first reference temperature measurement part performing a measurement to be used as a first reference temperature; a first external air temperature measurement part performing a measurement to be used as a first external air temperature; a second surface temperature measurement part performing a measurement to be used as a second surface temperature; a second reference temperature measurement part performing a measurement to be used as a second reference temperature; a second external air temperature measurement part performing a measurement to be used as a second external air temperature; a deep-part temperature computation part computing the deep-part temperature of a subject to be measured; and an external air temperature computation part computing the external air temperature of the external air.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: July 22, 2014
    Assignee: Seiko Epson Corporation
    Inventor: Kenji Goto
  • Patent number: 8757870
    Abstract: A method for calibrating distributed temperature sensing (DTS) systems is disclosed. The method includes: receiving temperature data associated with one or more locations along a length of an optical fiber; calculating a set of unique calibration coefficients specific to each of the one or more locations along the fiber length; and applying the set of calibration coefficients specific to each of the one or more locations along the fiber length to the temperature data for calibrated correction thereof. Also disclosed is a system for calibrating DTS data and a wellbore for providing calibrated DTS data.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: June 24, 2014
    Assignee: Baker Hughes Incorporated
    Inventors: Travis S. Hall, Brooks A. Childers
  • Patent number: 8725444
    Abstract: A thermometer includes a first surface temperature measurement unit; a first reference temperature measurement unit; a second surface temperature measurement unit; a second reference temperature measurement unit; a temperature correction unit that calculates a mounting positional difference between the first and second surface temperature measurement units from a measurement subject and a mounting positional difference between the first and second reference temperature measurement units from the measurement subject in terms of temperature differences that compensate for temperature dependence, thus correcting the first surface temperature and first reference temperature, or the second surface temperature and second reference temperature; and a core temperature calculation unit that calculates a core temperature of the measurement subject using the first surface temperature and first reference temperature or the second surface temperature and second reference temperature corrected by the temperature correction
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: May 13, 2014
    Assignee: Seiko Epson Corporation
    Inventor: Sakiko Shimizu
  • Patent number: 8641617
    Abstract: A system for in-place visualization of sensed data is provided. The system includes a formable sheet comprising a display and sensors embedded within the sheet underneath the display. The display will display information relating to sensed data on a portion of the display corresponding to locations of the sensors located underneath the display. As a result, the display displays the information above or directly above the sensors that output data.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: February 4, 2014
    Assignee: Indian Institute of Science
    Inventor: Vijay Natarajan
  • Patent number: 8556502
    Abstract: An exemplary embodiment of a temperature probe comprises an elongated shaft having a first portion and a second portion, the first portion being configured for insertion into a unit of food and the second portion being configured to extend outside of the unit of food. The probe further comprises at least two temperature sensors positioned at different longitudinal locations along the first portion of the shaft that are configured to measure temperatures of the unit of food at different locations within the unit of food while the unit of food is being processed thermally. The probe further comprises at least one ambient temperature sensor coupled to the shaft and configured to measure ambient temperature adjacent to the unit of food.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: October 15, 2013
    Assignee: Electronic Controls Design, Inc.
    Inventors: Paul M. Austen, Rex L. Breunsbach
  • Patent number: 8550707
    Abstract: A device for detecting temperature variations of the substrate of an integrated circuit chip, including, in the substrate, implanted resistors connected as a Wheatstone bridge, wherein each of two first opposite resistors of the bridge is covered with an array of metal lines parallel to a first direction, the first direction being such that a variation in the substrate stress along this direction causes a variation of the unbalance value of the bridge.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: October 8, 2013
    Assignee: STMicroelectronics (Rousset) SAS
    Inventor: Christian Rivero
  • Patent number: 8517601
    Abstract: An ice detection system, in particular to a system for detecting icing conditions and a system for detecting the presence of ice formed on a structure, and the methods for doing the same. Two heaters of the ice protection system (experiencing substantially the same environmental conditions) are driven to different temperatures (the first greater than or equal to 0° C., and the second less than 0° C.). The difference in the powers required to drive the two heaters indicates the prevailing environmental conditions. A heater of the ice protection system is driven and the rate of change of surface temperature is measured over several periods. A substantial deviation from a rate of change of surface temperature, which indicates the presence of ice on the surface of the structure, is detected.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: August 27, 2013
    Assignees: Ultra Electronics Limited, The Boeing Company, Boeing Commercial Airplanes Group
    Inventors: Ian McGregor Stothers, Hosam E. El-Gabalawy
  • Patent number: 8520929
    Abstract: A method of sensing defects in the application of hot melt adhesive to a structure. An infrared sensor is used to capture an infrared image of at least the location of the structure where the adhesive is supposed to have been applied. Different areas of the image are separately interrogated by reviewing each area to detect the presence or absence of adhesive. The interrogation is used to determine whether or not the application of the adhesive is of acceptable quality.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: August 27, 2013
    Assignee: Nypro Inc.
    Inventors: Brent A. Murray, William D. Knick, Jr.
  • Patent number: 8517600
    Abstract: A system and method are disclosed wherein differential heat transfer resistances are used to effectively and efficiently detect the early onset of deposit accumulation in industrial fluid processes and fluid transport vehicles. According to one embodiment, a probe is provided in conjunction with a heat source, a water source and a probe. The probe is comprised of a heat transfer surface, a first part of which is covered only by a thin metal layer. The second or remaining portion of the heat transfer surface is covered by a heat flux sensor and a thin metal layer. The metal layers of both the first and second areas of the probe are connected, and water flows across the full heat transfer surface. Deposition forms on a portion of the heat transfer surface as a result of slow water flow and elevated water temperature. The temperatures of the heat source, water source, and heat flux are measured. The deposition rate as a rate of change of heat transfer resistance is measured.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: August 27, 2013
    Assignee: General Electric Company
    Inventors: Zhaoyang Wan, Caibin Xiao
  • Patent number: 8517602
    Abstract: A method of using a temperature sensor to determine the temperature of an object is described. The method comprises bringing the temperature sensor into thermal contact with the object to be measured. The temperature sensor is then used to acquire a plurality of temperature readings, the plurality of temperature readings being acquired prior to the temperature sensor reaching thermal equilibrium with the object. At least some of the plurality of temperature readings are then used to determine a pseudo-stable temperature at which the rate of change of temperature readings with time is less than a predetermined rate. The actual temperature of the object may then be predicted from the pseudo-stable temperature.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: August 27, 2013
    Assignee: Renishaw PLC
    Inventor: Christian Courtois
  • Patent number: 8480300
    Abstract: A device for analyzing a beam profile of a laser beam includes a carrier plate, a plurality of first temperature-sensitive measuring elements, in particular diodes, which are arranged in a preferably matrix-like arrangement on a first side of the carrier plate at a plurality of measuring locations, and a plurality of second temperature-sensitive measuring elements, in particular diodes, which are arranged in another preferably matrix-like arrangement on a second side of the carrier plate. One of the first measuring elements is arranged in each case opposite one of the second measuring elements and is thermally coupled to the first measuring element using strip conductors which extend through the carrier plate. Such a device can be included in a laser processing machine and used in an associated method for analyzing a beam profile of a laser beam.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: July 9, 2013
    Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventors: Wolfgang Scholich-Tessmann, Marcelo Cabaleiro Martins
  • Publication number: 20130128919
    Abstract: An exemplary embodiment of a temperature probe comprises an elongated shaft having a first portion and a second portion, the first portion being configured for insertion into a unit of food and the second portion being configured to extend outside of the unit of food. The probe further comprises at least two temperature sensors positioned at different longitudinal locations along the first portion of the shaft that are configured to measure temperatures of the unit of food at different locations within the unit of food while the unit of food is being processed thermally. The probe further comprises at least one ambient temperature sensor coupled to the shaft and configured to measure ambient temperature adjacent to the unit of food.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Inventors: Paul M. Austen, Rex L. Breunsbach
  • Patent number: 8444315
    Abstract: The invention is related to methods for determining thermophysical properties of solid bodies, particularly, to methods for determining thermal conductivity and volumetric heat capacity. In accordance with the method, a reference sample and sequentially located samples of solid bodies are heated by a thermal energy source moving at a constant speed relative to the reference sample and the samples being studied. Excessive temperatures of the surfaces of the reference sample and the studied samples at points on a line of heating are measured and the thermophysical properties of the reference sample and the samples being studied are determined. Arbitrary shape samples are used and thermal conductivity and volumetric heat capacity of the samples are determined by solving an inverse coefficient problem of thermal conductivity.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: May 21, 2013
    Assignee: Schlumberger Technology Corporation
    Inventors: Alexander Petrovich Skibin, Yury Anatolievich Popov, Daria Aleksandrovna Mustafina, Valery Vasilievich Shako
  • Patent number: 8388224
    Abstract: An assembly for sensing temperature in a gas turbine engine includes a first array of RTDs connected in parallel, a second array of RTDs connected in parallel, and a circuit electrically connected to the first and second arrays. The circuit determines an approximate temperature of a medium as a function of resistance of the first and second arrays.
    Type: Grant
    Filed: August 19, 2010
    Date of Patent: March 5, 2013
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Thaddeus J. Zebrowski
  • Patent number: 8388223
    Abstract: A method for measuring the temperature at various locations in a furnace adapted to heat-treat a metal part commences by placing one or more devices at various location within the furnace. Each device is an inorganic/metallic skeletal structure residual from firing a mixture of binder and one or more of inorganic or metallic particles at a temperature that chars the binder to form the inorganic/metallic skeletal structure of a determined shape. A physical parameter of the skeletal structure determined shape is monitored after firing of the furnace. Then, the monitored physical parameter is compared to a plot of temperature versus the physical parameter to determine the temperature of the furnace at the various locations.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: March 5, 2013
    Assignee: The Edward Orton Jr. Ceramic Foundation
    Inventors: Gary Childress, James Litzinger, Thomas McInnerney
  • Publication number: 20130039383
    Abstract: The present invention is directed to, inter alia, systems and methods for calculating a temperature associated with an analyte measurement component of a biosensing instrument (such as a blood glucose monitor), with a test strip that is inserted in a biosensing instrument, or both. The present systems and methods may employ at least two temperature sensors, and the acquired temperature information may be used to modulate data regarding an analyte in a biological sample, thereby providing a more accurate measurement of the analyte.
    Type: Application
    Filed: October 16, 2012
    Publication date: February 14, 2013
    Applicant: LIFESCAN, INC.
    Inventors: THOMAS JETTER, KLAUS NEUBERT, THOMAS M. WEBER, MAHYAR Z. KERMANI
  • Patent number: 8371750
    Abstract: A physical quantity detecting apparatus includes a plurality of physical quantity conversion circuits, an output selection circuit and a signal conversion circuit. Each of the plurality of physical quantity conversion circuits converts a physical quantity to be detected into a voltage corresponding to the physical quantity and outputs the voltage. The output selection circuit is electrically connected to the plurality of physical quantity conversion circuits to select a maximum voltage from among the voltages outputted from the plurality of physical quantity conversion circuits. The signal conversion circuit is electrically connected to the output selection circuit to convert the voltage outputted from the output selection circuit into a pulse signal having a pulse width or frequency corresponding to the voltage and output the pulse signal.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: February 12, 2013
    Assignee: Denso Corporation
    Inventors: Yoshiyuki Hamanaka, Tsuneo Maebara
  • Patent number: 8333506
    Abstract: A temperature sensor is formed from three initially unfired (or green) ceramic substrates. The first substrate has a temperature sensitive means printed on a first surface. Additionally first and second conducting elements are also printed thereon. The third substrate has a temperature sensitive means in the form of a resistor printed on a first surface. Additionally first and second conducting elements and are also printed thereon. The second substrate is provided with a conducting via in the form of a hole extending through the substrate, the hole being filled with conductive material. The via is adapted to be aligned with the ends of conducting elements. To construct the sensor the first surfaces of substrates are aligned with substrate such that via is aligned with conducting elements. The substrates are then pressed together. Subsequently the substrates are fired to provide the completed sensor.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: December 18, 2012
    Assignee: MELEXIS NV Microelectronic Integrated Systems
    Inventors: Chavdar Kamenov, Petar Mitsev, Peter Tilmans, Jos Rennies
  • Patent number: 8313237
    Abstract: The present invention is directed to, inter alia, systems and methods for calculating a temperature associated with an analyte measurement component of a biosensing instrument (such as a blood glucose monitor), with a test strip that is inserted in a biosensing instrument, or both. The present systems and methods may employ at least two temperature sensors, and the acquired temperature information may be used to modulate data regarding an analyte in a biological sample, thereby providing a more accurate measurement of the analyte.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: November 20, 2012
    Assignee: Lifescan, Inc.
    Inventors: Thomas Jetter, Klaus Neubert, Thomas M. Weber, Mahyar Z. Kermani
  • Patent number: 8308349
    Abstract: A heat flux probe uses a thermoelectric module to heat a relatively large sensing surface while cooling a substantially smaller one that is connected to the thermoelectric module by an elongated thermal conductor. A temperature difference between either the two sensing surfaces or the heated sensing surface and the cooled end plate of the thermoelectric module is controlled to have a selected value. Then the temperature change along the elongated thermal conductor is used as a measure of heat flux. This approach reduces inaccuracies arising from the thermal characteristics of the thermoelectric module and allows for in situ compensation for drift errors.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: November 13, 2012
    Inventor: Murray F Feller
  • Patent number: 8280673
    Abstract: A mechanism for indicating ambient temperature of an enclosure from temperatures determined within the enclosure. The temperatures may be obtained from two or more sensors at each of two or more locations within the enclosure. The enclosure may include an apparatus inside such as electronics of which power consumption may be determined. Data including temperatures of two locations within the enclosure at various electronics power consumption levels may be entered into a 2-D plot. An approximation of the 2-D plot may be effected with an appropriate equation to be solved for ambient temperature. The data of the dimensional 2-D plot plus temperatures of a third location and air flow levels in the enclosure may be entered into a 3-D plot. An approximation of the 3-D plot may be effected with an appropriate equation to be solved for ambient temperature.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: October 2, 2012
    Assignee: Honeywell International Inc.
    Inventor: Mohammad A. Aljabari
  • Patent number: 8235593
    Abstract: A method judging a temperature of a chip including using a limited set of temperature sensors and using a knowledge of a power dissipation, estimating a temperature on a surface of a chip and predicting a future temperature of the chip knowing the instruction stream characteristics to be processed by the chip.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: August 7, 2012
    Assignee: International Business Machines Corporation
    Inventors: Sri M. Sri-Jayantha, Hien P. Dang, Arun Sharma
  • Patent number: 8231268
    Abstract: A screening device and a method are described herein which can automatically handle and measure (interrogate) a plurality of sensor carriers (i.e., multiwell plates, microplates) with multi-dimensionally arranged, temperature-compensated or temperature-compensatable optical sensors, while maintaining a substantially constant temperature gradient for a relatively long period of time around the optical sensors where temperature compensation has been performed on the sensor carriers.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 31, 2012
    Assignee: Corning Incorporated
    Inventors: Mark F. Krol, Thomas C. Moore, David A. Pastel, Gordon M. Shedd
  • Publication number: 20120114011
    Abstract: A fast response temperature probe which may be used for a method for measuring an instantaneous temperature of a periodically changing fluid flow within a gas turbine is proposed. The temperature probe includes a substrate and a resistive element arranged at a surface of the substrate. Therein, at least at a surface of the substrate contacting the resistive element, the substrate comprises an insulating material having a thermal product of less than 1.5 kJ/(m2K sqrt(s)). The substrate or at least its surface is made from polyamide-imide such as for example fibre-reinforced Torlon© 5030. The temperature probe may allow measurements of instantaneous local temperatures of very fast fluctuations of more than 50 kHz at high spatial resolutions of, e.g., less than 0.5 mm2. The instantaneous temperature of a periodically changing fluid flow may be determined by correlating first and second sets of temperature measurements taking into account the periodicity of the periodically changing fluid flow.
    Type: Application
    Filed: June 10, 2009
    Publication date: May 10, 2012
    Applicant: UNIVERSITAT STUTTGART
    Inventors: Martin Rose, Björn Weigel, Christian Eichler, Stephan Staudacher
  • Patent number: 8142071
    Abstract: Thermal transfer measurements are useful for measuring either a mass flow rate or the specific heat of a fluid. Thermoelectric devices are desirable for this because of their ability to simultaneously heat one portion of the sensor while cooling another. However, the internal thermal resistance of thermoelectric devices has limited the accuracy of thermoelectric thermal transfer sensors. This problem is solved by using separate temperature sensors to measure selected temperature differences established by the thermoelectric portion of a thermal transfer sensor.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: March 27, 2012
    Inventor: Murray F Feller
  • Patent number: 8128278
    Abstract: A method for measuring a metal film thickness is provided. The method initiates with heating a region of interest of a metal film with a defined amount of heat energy. Then, a temperature of the metal film is measured. Next, a thickness of the metal film is calculated based upon the temperature and the defined amount of heat energy. A chemical mechanical planarization system capable of detecting a thin metal film through the detection of heat transfer dynamics is also provided.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: March 6, 2012
    Assignee: Lam Research Corporation
    Inventors: Yehiel Gotkis, Mikhail Korolik
  • Patent number: 8057093
    Abstract: A double temperature sensor with a receiving element for measuring a near-surface temperature of the ambient air and the skin surface. The double temperature sensor with a receiving element includes an insulating block, two temperature sensors and a receiving element. At least the receiving element (8) and/or the insulating block (4) are designed in terms of the material structure such that the horizontal heat conduction is low compared to the vertical heat conduction.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: November 15, 2011
    Assignee: Dräger Medical Center
    Inventor: Frank Sattler
  • Patent number: 8039729
    Abstract: A thermocouple mounting assembly is provided. A plurality of retainers includes portions that are interengageable, some portions carried by a body and some portions carried by a thermocouple assembly to effect releasable mounting of a thermocouple assembly to a body. The retainers are constructed and shaped to provide for their formation by a molding process such as die-casting or investment casting, eliminating or substantially eliminating the need for machining of the retainer components. Preferably, there is an audible sound, e.g., click, present to signify when the retainers are interengaged.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: October 18, 2011
    Assignee: Robertshaw Controls Company
    Inventor: Can Trong Nguyen
  • Patent number: 7981046
    Abstract: A device for non-invasive measurement of the internal temperature of a physical body or thermal resistivity, the body comprising a thermally conductive medium between an internal region with a substantially constant internal temperature and an external surface with a surface temperature. The device comprises: a patch comprising one or more contact components for attachment to the external surface and an insulating cover for substantially thermally insulating the contact component from ambient thermal conditions; a reader for acquiring one or more thermal magnitudes on the patch; a processing unit for processing the thermal magnitudes to derive the internal temperature of the internal region or the thermal resistivity of the conductive medium.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: July 19, 2011
    Assignee: Medisim Ltd
    Inventors: Moshe Yarden, Menashe Barak
  • Patent number: 7891865
    Abstract: Disclosed is a design structure for an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: February 22, 2011
    Assignee: International Business Machines Corporation
    Inventors: William F. Clark, Jr., Edward J. Nowak