Abstract: The present invention relates to an apparatus, which works according to galvanic principles, in particular to a lithium-ion accumulator or, respectively, a lithium-ion cell, with at least two electrode devices (10; 20), in particular, a cathode and an anode, in particular, a separator device (30), arranged between two electrode devices, the apparatus (2) comprises, according to the invention, at least one or a plurality of glass fibers (18, 28, 38) which are configured or, respectively, operable as temperature sensor. It can comprise a net (16, 26, 36) formed by glass fibers, or an arrangement of a plurality of glass fibers, which are arranged substantially in parallel to each other, wherein at least one glass fiber (18, 28, 38) is configured or operable as temperature sensor.

Abstract: A temperature detection device of the present invention is provided in a battery pack for electric power tool and detects a temperature inside the battery pack. The temperature detection device includes a signal output circuit and an output signal-based temperature detection unit. The signal output circuit is configured to output an output signal for use other than for indicating an ambient temperature thereof. A state of the output signal changes depending on the ambient temperature. The output signal-based temperature detection unit is configured to detect the temperature inside of the battery pack based on the state of the output signal from the signal output circuit.

Abstract: A system for wireless heat detection is disclosed. The system includes one or more heat sensors that convert sensed heat energy into electrical power for transmitting an alarm signals. A remote system may trigger an alarm based on the received alarm signals. The heat sensors may be placed at discrete locations within an interior of a building to monitor a condition of the infrastructure of the building. The remote system can include a communications module for receiving the signal and transmitting an alarm signal to an associated fire panel. The fire panel may analyze the signal, as well as signals generated from adjacent sensors, to determine whether a fire condition exists within a building. Appropriate notification devices may then be activated based on the determination. Other embodiments are disclosed and claimed.

Abstract: An accurate, cost-efficient temperature sensor may be integrated into an integrated circuit (IC) using common materials as the IC's interconnect metallization. The temperature sensor may include an impedance element having a length of metal made of the interconnect metal, a current source connected between a first set of contacts at opposite ends of the impedance element, and an analog-to-digital converter connected between a second set of contacts at opposite ends of the impedance element. The temperature sensor may exploits the proportional relationship between the metal's resistance and temperature to measure ambient temperature. Alternatively, such a temperature sensor may be used on disposable chemical sensors where the impedance element is made of a common metal as conductors that connect a sensor reactant to sensor contacts. In either case, because the impedance element is formed of a common metal as other interconnect, it is expected to incur low manufacturing costs.

Abstract: A system and method for monitoring batteries is disclosed. There is provided a plurality of sensors each adapted to communicate with one of the batteries, and to provide information concerning a characteristic of the battery in response to application of a stimulus to the battery. A controller that communicates with the sensors is also provided. In one embodiment, the sensor includes the battery.

Abstract: A portable RFID (Radio Frequency Identification) tag includes one or more sensors. Each sensor measures a condition of an environment within which the RFID tag is disposed. Circuitry obtains data from measurements provided by each sensor. A transceiver modulates a radio frequency (RF) signal carrying the obtained data. An antenna, electrically coupled to the transceiver, transmits the RF signal. The circuitry, transceiver, and antenna are potted in their entirety in a thermosetting plastic epoxy for purposes of enduring extreme environmental conditions. The one or more sensors can include a temperature probe. A portion of this temperature probe can serve as the antenna.

Abstract: Both a device-identification feature and a temperature-sensor feature are combined on a single integrated circuit. In various embodiments, both features are not operative simultaneously.

Abstract: An integrated circuit includes a device identification circuit and a temperature sensor diode connected in parallel from a common node. The device identification circuit includes a resistor connected to a diode-connected transistor. The device identification circuit and the temperature sensor diode are adapted to not be simultaneously operating in an ON state. A first voltage is applied to the common node to place the device identification circuit in an ON state and place the temperature sensor diode in an OFF state to identify the integrated circuit. A second voltage is applied to the common node to place the device identification circuit in an OFF state and place the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.

Abstract: A system for monitoring the forming of a solid object having a sensor string positionable in a forming structure before the curing process and a communication line extending along a string axis between a first and second end. The string further including a plurality of sensors joined to the communication line between the ends and each sensor being mounted at a set position on the line. Each sensor having a sensor body and a sensor housing and the sensor body including an electrical connecter to electrically join an electrical structure to the communication line at the set position. The electrical structure including a temperature sensor configured to monitor temperature near the set position and further including an electronic identification code corresponding to the set position of the sensor along the axis. The system further including a transmitting device for selectively communicating the temperature and identification code.

Abstract: A semiconductor memory device includes: a temperature sensor configured to select first and second selection reference voltages selected in a test mode as an input reference voltage according to first and second counting signals which are sequentially counted, compare the selected input reference voltage with a level of a variable voltage which changes according to internal temperature, and generate a temperature flag signal containing information on the internal temperature; and a temperature test circuit configured to output the first and second counting signals at a time point where a level of the temperature flag signal changes.

Abstract: A temperature measurement system capable of operating in harsh environments including a temperature sensor having an antenna, diode, and dielectric layer disposed on the object of interest is provided, wherein the antenna includes a buried portion that extends through and is electrically coupled to the object of interest, and an exposed portion disposed upon an outer surface of the dielectric layer and the diode is coupled between the object of interest and the exposed portion of the antenna. The antenna is configured to receive interrogating signals from a transmitter, and to transmit response signals corresponding to the resonant frequency of the temperature sensor and its harmonics, which are indicative of the measured temperature of the object of interest. A receiver detects the response signals and correlates the frequency to a known temperature response of the dielectric material. Methods of making and using the temperature measurement system are also provided.

Abstract: A semiconductor device including a temperature sensor includes a pull up circuit, a pull down circuit, a first additional current path, and a second additional current path. The pull up circuit is configured to generate a pull up current that contributes to generation of a first output current. The pull down circuit is operably coupled to the pull up circuit at an output node and configured to generate a pull down current that contributes to generation of a second output current. The first additional current path, when enabled, is configured to combine a first additional current with the pull up current to comprise the first output current. The second additional current path, when enabled, is configured to combine a second additional current with the pull down current to comprise the second output current. Respective enablement of the first additional current path and the second additional current path is complementary.

Abstract: Adjusting current based on temperature. A change in temperature of a connection between a first device and a second device may be measured. The change in temperature may be performed while the first device provides current to the second device over the connection. If the change in temperature is above a threshold, the current being provided from the first device to the second device may be reduced. The change in temperature may be performed by the first device and/or the second device, e.g., by measuring the temperature of a connector of the connection.

Abstract: A mechanism of a monitoring unit of an electric rotating machinery covered in a housing that intercepts photoelectron transmission, the mechanism has: a monitoring window penetrating a part of the housing and configured to allow passage of photoelectrons and not to allow passage of gas; a camera arranged outside the monitoring window and configured to receive radiated photoelectron generated in the housing and passing through the monitoring window and to generate image data from the radiated photoelectron; and a computing unit configured to process the image data. The computing unit has reference image data storage means for storing image data resulting from blackbody radiation occurring in a reference state in the housing, as reference image data, and temperature calculating means for comparing the image data with the reference image data, thereby to calculate the temperature in the housing.

Abstract: Disclosed is an apparatus for measuring temperature coefficients of a concentrator photovoltaic module. The apparatus includes a solar simulator for providing a radiant source, a environment chamber, a concentrator photovoltaic module, a temperature control unit for controlling the temperature of environment chamber, a circuit-voltage curve measurement unit for measuring current-voltage characteristics of a photovoltaic device and a reference cell for measuring the irradiation of the solar simulator.

Abstract: There are provided an electrically-conductive connecting plate that connects electrode terminals of a plurality of battery cells; a fastening member that fastens the connecting plate and each of the electrode terminals together; temperature-detecting means that is placed near a fastened portion between the connecting plate and the corresponding electrode terminal which are fastened together with the fastening member, and detects temperature around the fastened portion; and abnormality-judging means that judges abnormality in the battery cells or the fastening member on the basis of temperature detected by the temperature-detecting means.

Abstract: A system for testing electrical devices under varying thermal conditions is disclosed. The system includes a fixture that comprises two vertically arranged rails, into which horizontally arranged electrical devices are inserted. The rails are in contact with two thermal plates whose temperatures are controlled by controller or controllers. Target temperatures for the two thermal plates are communicated to the controller or controllers, and the electrical output of the electrical devices under test are monitored under varying thermal conditions.

Abstract: A charging device having a coil for inductive electric charging of a device, in particular of a battery, including a control unit having a temperature sensor for detecting a temperature, the temperature sensor being situated in the area of application for applying the device, and is connected to the control unit, the temperature sensor being situated laterally next to the coil and adjacent to the coil.

Abstract: A device for measuring gas temperature in a casing box having different heat-generating units disposed therein. The device includes a temperature-measuring arrangement disposed substantially in a plane above the different heat-generating units. The temperature-measuring arrangement includes a matrix of uniformly distributed temperature sensors configured to measure a temperature of rising gas.

Abstract: A method of calibrating a thermal sensor includes setting a wafer to a control temperature. The wafer includes the thermal sensor and other chip logic. The method also includes applying power exclusively to a thermal sensor circuit, calibrating the thermal sensor, and storing a calibration result. The method also includes retrieving the calibration result upon application of power to the other chip logic.

Abstract: Disclosed herein, among other things, is a stator winding temperature sensor. According to an embodiment, the sensor includes at least one sensing wire coil adapted to be connected to a stator. The sensor also includes a body, including a core material surrounding at least a portion of the sensing wire coil, and a laminate material over the core material. The body has a thickness adapted to protect the sensing wire coil. The sensor includes a lead wire adapted to connect to an external monitoring device. The sensing wire coil is electrically connected to the lead wire at a lead step portion of the sensor. In addition, the sensor includes a tab extending from the lead wire and encompassing the lead step. The tab protects the lead step and the sensing wire coil in a region where the sensor extends over an end of the stator.

Abstract: An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.

Abstract: A temperature monitoring circuit includes a negative temperature coefficient (NTC) resistor, a zener diode, an alarm, a silicon controlled rectifier. A first terminal of the NTC resistor is connected to a power supply through a first resistor. A second terminal of the NTC resistor is grounded. A cathode of the zener diode is connected to a node between the NTC resistor and the first resistor. An anode is grounded through a second resistor. A first terminal of the alarm is connected to the cathode of the zener diode, and is grounded through a third and fourth resistors in series. A cathode of the silicon controlled rectifier is connected to the anode of the zener diode. An anode of the silicon controlled rectifier is connected to a second terminal of the alarm. A control terminal of the silicon controlled rectifier is connected to a node between the third and fourth resistors.

Abstract: A semiconductor device, memory device, system, and method of using a stacked structure for stably transmitting signals among a plurality of semiconductor layers is disclosed. The device includes at least a first semiconductor chip including a first temperature sensor circuit configured to output first temperature information related to the first semiconductor chip, and at least one through substrate via.

Abstract: A sensor device is provided with a voltage detection type sensor unit for converting a physical quantity into a voltage value and outputting a voltage signal indicating the voltage value; a chopper amplifier unit for generating a modulation signal by chopping the voltage signal output from the sensor unit with a predetermined chopping frequency, amplifying the modulation signal into an amplification signal, then demodulating the amplification signal and outputting it as an output signal; an integration unit including an operational amplifier, an input resistor connected to the inverting input terminal of the operational amplifier and a capacitor connected between the inverting input terminal and an output terminal of the operational amplifier; and a digital conversion unit for converting the output signal integrated by the integration unit into a digital signal.

Abstract: A communications device with integrated case temperature measurement includes a case having at least one thermally conductive wall and a circuit board at least partially disposed within the case. At least one electronic component is mounted on the circuit board and a temperature sensor is mounted on the circuit board. At least one thermally conductive protrusion extends from the wall and is thermally coupled to the temperature sensor.

Abstract: An electronic clinical thermometer for connecting to an electronic device includes a sensing portion comprising and a controlling portion. The sensing portion includes a first audio connecting member and the controlling portion includes a second audio connecting member. The second audio connecting member is assembled with the first audio connecting member to connect the sensing portion and the controlling portion. Thereby, the second audio connecting member is used for connecting to the electronic device and achieving bidirectional communication when the first audio connecting member and the second audio connecting member are separated.

Abstract: An alternating current impedance-estimating section (106) estimates an alternating current impedance (Rh) of the secondary battery based on electric current (I) and voltage (V) of the secondary battery detected when a ripple generating section causes a ripple current to flow in the secondary battery. A temperature estimating section (108) estimates the temperature (T) of the secondary battery based on the alternating current impedance (Rh) estimated by the alternating current impedance-estimating section (106) with the use of the relation, obtained in advance, between the temperature (T) of the secondary battery and the alternating current impedance (Rh) of the secondary battery at a ripple frequency.

Abstract: A system for certifying provenance of an alcoholic beverage includes a radio-frequency identification tag and a server. The radio-frequency identification tag, associated with a bottle containing an alcoholic beverage, periodically measures a plurality of values of an environmental condition of the bottle. The radio-frequency identification tag stores the plurality of measured values. The server receives the plurality of measured values for analysis. The server provides, via a user interface, a description of a provenance of the alcoholic beverage, the description generated responsive to an analysis of the plurality of measured values.

Abstract: A method and apparatus is provided for determining when a battery, or one or more batteries within a battery pack, undergoes an undesired thermal event such as thermal runaway. The system uses an optical fiber mounted in close proximity to, or in contact with, an external surface of the battery or batteries to be monitored. A source of light is optically coupled to the input facet of the optical fiber and a detector optically coupled to the output facet of the optical fiber. Battery health is determined by monitoring the light transmitted through the optical fiber.

Abstract: Provided is a method and a device for measuring a temperature which can recognize the temperature of a semiconductor layer directly with high precision when the semiconductor layer is formed by deposition. The quantity of laser light transmitted a semiconductor layer is monitored by a photodetector by using laser light having a wavelength As at which the transmittance of light changes abruptly when the temperature of the semiconductor layer reaches Ts during or after deposition. When heat being given to the semiconductor layer is changed, the quantity of laser light monitored by the photodetector changes abruptly when the temperature of the semiconductor layer reaches Ts at a time A, B or C. Consequently, the fact that the temperature of the semiconductor layer reached Ts at a time A, B or C can be recognized exactly, and an error in temperature information observed by a device for measuring temperature variations can be calibrated, for example.

Abstract: A flexible circuit configured to electrically couple circuit boards is provided. The flexible circuit includes opposite circuit board mating ends and a flexible body extending therebetween. Conductive pathways extend along the body of the flexible circuit to electrically couple the circuit boards. The flexible circuit also includes a temperature sensing circuit including leads having a distal end coupled to a temperature sensor and a temperature contact located proximate to one of circuit board mating ends. The temperature sensor is located at an intermediate position along the body between the circuit board mating ends. The temperature contact is configured to deliver temperature signals from the temperature sensor representative of a local flexible circuit temperature.

Abstract: A semiconductor chip includes a semiconductor body having an upper surface. At least one power semiconductor component is integrated in the semiconductor chip together with other circuitry. Two or more vertically spaced metallization layers are arranged on the surface of the semiconductor body. The top metallization layer includes terminals establishing an electrical connection to load terminals of the power semiconductor component. A current measurement resistor is formed by a portion of the top metallization layer for sensing a load current of the power semiconductor component. A temperature measurement resistor is formed by a portion of at least one of the vertically spaced metallization layers, electrically isolated from current measurement resistor but thermally coupled thereto such that the current measurement resistor and the temperature measurement resistor have the same temperature.

Abstract: An apparatus that allows for the testing of multiple wraps of cable in environments of varying temperature, pressure, and in different fluids in a single apparatus, and can be tested against the varying loads the cable may encounter is disclosed. In the illustrative embodiment of the present invention, the multiple wraps of cable are simulated by layering electrically-insulated portions of the cable on top of one another inside an environmentally controlled container. This container has two parts: a thermally-insulated container and a pressure container.

Abstract: A testing system for testing a temperature characteristic of a first motor includes a second motor, a controller, a driver, a load, a temperature sensor, and a temperature recorder. The controller provides a drive command for the driver to drive the second motor. The second motor drives the first motor via a coupling. A current of the first motor is determined by adjusting the resistance of the load. The temperature sensor senses the temperatures of the first motor every a determined time and sends the temperatures to the temperature recorder. The temperature recorder records and transmits the temperatures to the controller for the temperature characteristic test of the first motor.

Abstract: A temperature measurement system capable of operating in harsh environments including a temperature sensor having an antenna, diode, and dielectric layer disposed on the object of interest is provided, wherein the antenna includes a buried portion that extends through and is electrically coupled to the object of interest, and an exposed portion disposed upon an outer surface of the dielectric layer and the diode is coupled between the object of interest and the exposed portion of the antenna. The antenna is configured to receive interrogating signals from a transmitter, and to transmit response signals corresponding to the resonant frequency of the temperature sensor and its harmonics, which are indicative of the measured temperature of the object of interest. A receiver detects the response signals and correlates the frequency to a known temperature response of the dielectric material. Methods of making and using the temperature measurement system are also provided.

Abstract: The disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices, preferably under transient conditions. An apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system; a processor in communication with the thermocouple and programmed with instructions to: construct an initial curve for the solid state system, the initial curve having a shape; obtain a plurality of theoretical temperature curves for the solid state system; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature.

Abstract: A temperature measuring and identification (TMID) device obtains identification information and temperature information of a connected device having a temperature sensing circuit (TSC). The TSC includes a temperature sensing element (TSE) connected in parallel with a voltage clamping network (VCN) that limits the voltage across the TSE to an identification voltage within an identification voltage range when the voltage is greater than or equal to a lower voltage of the identification voltage range. When a voltage below the lower range is applied to the TSC, the VCN appears as an open circuit and the resistance of the TSC corresponds to temperature. A translation circuit within the TMID shifts TSC voltages within the identification voltage range to a normalization voltage range. Accordingly, voltages corresponding to temperature as well as voltages corresponding to identification are within the normalization voltage range.

Abstract: The present invention relates to a computer and a method of monitoring wind resistance changes. The computer comprises a wind resistance change monitoring device, the device comprising: one or more first temperature sensors, located at one or more positions inside the computer where an actual ambient temperature can be monitored, and configured to sense one or more ambient temperatures as first temperature; one or more heaters, located at the front end of a cooling duct of the computer, and configured to work at a rated power; one or more second temperature sensors, located corresponding to the one or more heaters, and configured to sense one or more temperatures of the one or more heaters as second temperature; and a control module configured to determine whether the wind resistance of the computer has changed or not based on a comparison of the relationship between the first and second temperature with the relationship between a predetermined ambient temperature and a predetermined heater temperature.

Abstract: A temperature sensing device is configured for sensing a temperature of electrical elements disposed on a printed circuit board (PCB) and includes a fixing frame, two guiding rails, a sliding rail, a temperature sensor, a driving device, and a processor. The fixing frame is configured for framing the PCB. The guiding rails are parallelly disposed on the fixing frame. The sliding rail is perpendicularly and slidably disposed between the two guiding rails. The temperature sensor is movably disposed on the sliding rail and configured for sensing the temperature of the electrical elements. The driving device is configured for driving the sliding rail and the temperature sensor to slide along the guiding rails and the sliding rail correspondingly. The processor is connected with the temperature sensor and the driving device and configured for storing positions of the electrical elements and controlling the driving device based on the stored positions.

Abstract: An uninterruptible power supply (UPS) is configured to be coupled to a power source at an input node and to a load at an output node. The UPS is synthetically loaded (e.g., to a maximum rated load) by transferring current from the output node to the input node. Concurrent with synthetically loading the UPS, a temperature of an electrical conductor of the UPS is monitored. The monitoring of the temperature of the electrical conductor may include receiving a temperature sensor signal representative of the temperature of the electrical conductor from a temperature sensor (e.g., a self-powered wireless temperature sensor) mounted on the electrical conductor. The invention may be embodied as methods, apparatus and computer-readable media.

Abstract: A thermometer without power switch is constituted by a body member without battery, battery cover or power switch and a tip member with a thermal contact surface secured to the body member. A thermal sensor mounted on the inside of the tip member is adapted for sensing a thermal contact surface and producing a temperature signal. A set of leas wires is coupled to the thermal sensor for transmission of the temperature signal. A tubular cylinder is disposed in the body member and a magnetic core is free to slide within the tubular cylinder. A coil of wire is wrapped around the tubular cylinder so that the magnetic core moves through the coil of wire when sliding through the tubular cylinder from one end to an opposite end. A capacitor is electrically connected to the coil of wire. A processor is electrically connected to the capacitor and the set of lead wires.

Abstract: A thermometer is constituted by a body member and a tip member secured to the body member. A thermal sensor is mounted on the inside of the tip member, adapted for sensing a temperature and producing a temperature signal. A set of leas wires is coupled to the thermal sensor for transmission of the temperature signal. A display unit is disposed on the body member and a processor is disposed to electrically connect the set of lead wires to receive the temperature signal and drive the display unit for display of a corresponding temperature reading. A rear cover is secured to the body member. A mechanical selector is disposed between the processor and the rear cover and the type of temperature scale displayed in the display unit is selected by pushing the mechanical selector from the rear cover.

Abstract: A motion powered thermometer is constituted by a body member and a tip member with a thermal contact surface secured to the body member. A thermal sensor mounted on the inside of the tip member is adapted for sensing a thermal contact surface and producing a temperature signal. A set of leas wires is coupled to the thermal sensor for transmission of the temperature signal. A tubular cylinder is disposed in the body member and a magnetic core is free to slide within the tubular cylinder. A coil of wire is wrapped around the tubular cylinder so that the magnetic core moves through the coil of wire when sliding through the tubular cylinder from one end to an opposite end. A capacitor is electrically connected to the coil of wire. A processor is electrically connected to the capacitor and the set of lead wires.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature-sensing circuits include an amplifier, a transistor, a temperature threshold resistance and a hysteresis resistance, and a latch. The amplifier includes a positive input and a negative input where the negative input is configured to be driven by a temperature-independent signal. The transistor is electrically coupled to the positive input where the transistor is configured to be controlled by a temperature signal. The temperature threshold resistance and a hysteresis resistance is electrically coupled in series to the positive input, wherein the hysteresis resistance is configured to be controlled, at least in part, by an output of the amplifier. The latch is configured to latch the output of the amplifier after a time delay initiated by a transition of a temperature detect signal.

Abstract: A system for monitoring the forming of a solid object having a sensor string positionable in a forming structure before the curing process and a communication line extending along a string axis between a first and second end. The string further including a plurality of sensors joined to the communication line between the ends and each sensor being mounted at a set position on the line. Each sensor having a sensor body and a sensor housing and the sensor body including an electrical connecter to electrically join an electrical structure to the communication line at the set position. The electrical structure including a temperature sensor configured to monitor temperature near the set position and further including an electronic identification code corresponding to the set position of the sensor along the axis. The system further including a transmitting device for selectively communicating the temperature and identification code.

Abstract: A spark plug includes a ground electrode, a center electrode and a thermosensor for detecting a temperature, the thermosensor being situated on a combustion chamber-side end of the spark plug near the combustion chamber, and an end area of the thermosensor being situated so that it is exposed on the spark plug. In addition, an internal combustion engine having a spark plug is provided.

Abstract: A semiconductor device includes a semiconductor chip including an active area. A temperature sensor arrangement provides a measurement signal dependent on the temperature in or close to the active area. An evaluation circuit is configured to compare the measurement signal with a first threshold and to signal an over-temperature when the measurement signal exceeds the first threshold. The evaluation circuit is also configured to count the number of exceedances of the first threshold and to signal when a maximum number of exceedances is reached.

Abstract: A power supply temperature sensor and system includes a power supply housing configured to receive at least one power supply unit, such as a battery cell. The power supply housing includes an aperture which provides communication between the battery cell and an ambient environment outside the power supply housing. A sensor having a sensing element is configured to sense a temperature of the battery cell, and a sensor housing surrounds at least a portion of the sensor, including at least a portion of the sensing element. This electrically isolates the sensing element from the battery cell. A portion of the sensor housing is configured to be disposed through the aperture in the power supply housing to make contact with the battery cell to facilitate conductive heat transfer between the battery cell and the sensor housing, thereby facilitating an accurate measurement of the temperature of the battery cell.

Abstract: Apparatus for detecting an overheating condition at an electrical power device and automatically breaking the circuit when the temperature exceeds a setpoint value. In various configurations the device is a receptacle adapted to be used in a wall mounted box or a receptacle unit that is plugged into an existing receptacle. A temperature sensor is wired parallel to a normally open test switch on a ground fault circuit interrupter or other circuit interrupting device. The temperature switch is responsive to the temperature local to the receptacle, such as is caused by poor connections to or in the receptacle or a near-overload condition. The temperature setpoint is less than the melting temperature of the insulation of the electrical wiring. The temperature sensor is a thermistor with a negative temperature coefficient that allows current to flow thereby latching the interrupting device in a tripped position until the device is reset for reuse.