Reference Junction Compensation Patents (Class 374/181)
  • Patent number: 10500540
    Abstract: The invention relates to a process for dehumidifying a moist gas mixture. The invention further relates to an apparatus for dehumidifying a moist gas mixture and to the use of said apparatus in the process according to the invention.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 10, 2019
    Assignee: Evonik Degussa GmbH
    Inventors: Olivier Zehnacker, Xinming Wang, Benjamin Willy, Rolf Schneider, Marc-Christoph Schneider
  • Publication number: 20140369387
    Abstract: The present invention relates to a temperature-measuring system, comprising a temperature sensor and a reference body, wherein means for determining temperature changes of the reference body and/or for control of the temperature of the reference body are provided. When the temperature measuring-system is used in a vacuum, the reference body forms no substantial material thermal bridges to the temperature sensor and the reference body shields the temperature sensor with respect to the environment in such a way that only radiation that comes from the surfaces of the reference and from surfaces of which the temperature is to be determined reaches the surface of the temperature sensor.
    Type: Application
    Filed: September 7, 2012
    Publication date: December 18, 2014
    Applicant: OERLIKON TRADING AG, TRUBBACH
    Inventors: Siegfried Krassnitzer, Markus Esselbach
  • Patent number: 8864378
    Abstract: A process variable transmitter for measuring a temperature of an industrial process, includes a first electrical connector configured to couple to a first wire of a thermocouple, the first electrical connector includes a first electrode and a second electrode. The first and second electrodes are configured to electrically couple to the first wire of the thermocouple. A second electrical connector is configured to couple to a second wire of the thermocouple, the second electrical connector includes a third electrode and a fourth electrode. The third and fourth electrodes are configured to electrically couple to the second wire of the thermocouple. The second wire is of a different material than the first wire. Measurement circuitry is coupled to the first and second electrical connectors configured to provide an output related to a temperature of the thermocouple.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: October 21, 2014
    Assignee: Rosemount Inc.
    Inventors: Jason H. Rud, Clarence Holmstadt
  • Patent number: 8821014
    Abstract: A temperature detecting element is fixed reliably at an accurate position to enable improvement in a rising characteristic of a temperature and high-accuracy temperature control. Provided is a temperature sensor including a temperature detecting element detecting a temperature in a branch tube branched from a main tube and a positioning supporting mechanism positioning and supporting the temperature detecting element. Tension is applied to a cord of the temperature detecting element. The positioning supporting mechanism is supported by the tensioned cord to position and support the temperature detecting element. The positioning supporting mechanism includes a supporting tube supporting the temperature detecting element, a positioning member supporting the supporting tube and fixed at a set position, and a tensioner applying tension to the cord of the temperature detecting element.
    Type: Grant
    Filed: January 28, 2013
    Date of Patent: September 2, 2014
    Assignees: Tokyo Electron Limited, Fenwal Controls of Japan, Ltd.
    Inventors: Takanori Saito, Koji Yoshii, Tsutomu Kurihara, Tomoya Okamura
  • Patent number: 8794830
    Abstract: A temperature sensing catheter with improved accuracy is provided. The catheter includes a catheter shaft having a proximal end and a distal end, and a first pair of conductors extending through the catheter shaft. Each one of the first pair of conductors has a first end and a second end, and the first ends of the first pair of conductors are coupled to each other at the distal end of the catheter shaft to form a first thermocouple. A handle is coupled to the proximal end of the catheter shaft and receives the second ends of the first pair of conductors, and the handle includes a digitizing circuit coupled to the second ends of the first pair of conductors for digitizing a voltage signal of the first thermocouple.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: August 5, 2014
    Assignee: Biosense Webster, Inc.
    Inventors: Itzhak Fang, Thomas Selkee
  • Publication number: 20140050248
    Abstract: A thermocouple connection device for terminating a cold junction of a thermocouple includes a housing configured to receive a substrate including an isothermal block positioned within a hollow interior space. Each of a plurality of connection elements include a first portion coupled to a second portion at a cold junction. The cold junction is positioned within the isothermal block such that the first portion and the second portion extend through opposite ends of the substrate. The first portions and the second portions of the connection elements extend through the housing in opposite directions to each other. A first distal end of the first portion is connectable to a control device, and a second distal end of the second portion is connectable to a hot junction. A resistance temperature device (RTD) is coupled to the isothermal block adjacent the cold junctions for measuring a temperature in proximity of the cold junctions.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 20, 2014
    Applicant: BAE SYSTEMS CONTROLS INC.
    Inventors: Daniel M. Boehme, Mark R. Snow
  • Patent number: 8550706
    Abstract: There is provided a temperature measuring device capable of achieving cost reduction even in the case where the same is a multichannel temperature measuring device. The temperature-measuring device comprises a thermocouple having two dissimilar metal wires, ends thereof, on one-side, being joined with each other, and the other ends thereof, being connected to one pair of contact terminals, respectively, a unit of a temperature-measurement set made up by joining together a plurality of the thermocouples, and a reference junction compensation circuit provided for every unit of the temperature-measurement set, wherein at least one of the reference junction compensation circuits of the temperature-measuring device is left out while the other reference junction compensation circuits of the temperature-measuring device are removed upon a plurality of the units of the temperature-measurement sets being disposed in series.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: October 8, 2013
    Assignee: Yokogawa Electric Corporation
    Inventor: Koji Ota
  • Patent number: 8485724
    Abstract: A mixed-signal integrated circuit comprises: 1) an analog front end having differential inputs adapted for directly connecting to at least one thermocouple, 2) an analog-to-digital (ADC) for converting the thermocouple voltages to digital representations thereof, 3) a linearization circuit capable of performing the multi-order polynomial equations for converting the thermocouple electromotive voltages (the digital representations) to linear temperature measurement units by using coefficients unique to each type of thermocouple from a coefficients table based upon the National Institute of Standards and Technology (NIST), 4) a integrated temperature sensor for measuring cold junction temperature, 5) optionally, an input multiplexer for selecting each of a plurality of thermocouples for measurement thereof, 6) optionally, registers for storing measured temperature values, high and low set points, alarm limits, etc., and 7) a communications interface for setting parameters and receiving temperature information.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: July 16, 2013
    Assignee: Microchip Technology Incorporated
    Inventor: Ezana Hailekiros Aberra
  • Patent number: 8411442
    Abstract: With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: April 2, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Walter Meinel, Kalin V. Lazarov
  • Patent number: 8328419
    Abstract: A temperature sensor, particularly a high-temperature sensor, is provided in which an MI line or a heat-decoupling wire is arranged between the measurement resistor (chip) and the supply-line cable. Springs are stuck on the strands of the MI line, whereby the contacting to the measurement resistor is realized, or the heat-decoupling wire is stretched on one side to the end facing the measurement resistor and is connected elastically on the other end to the supply-line cable.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: December 11, 2012
    Assignee: Heraeus Sensor Technology GmbH
    Inventors: Karlheinz Wienand, Mario Bachmann, Matthias Muziol, Thomas Loose
  • Publication number: 20120065923
    Abstract: An integrated cold junction compensation system for a thermocouple connection is disclosed. The system includes a temperature sensor integrated with a terminal at which the thermocouple wires terminate. The temperature sensor is integrated with the terminal proximal to a cold junction of a thermocouple, such that the temperature at the sensor location is substantially equal to that at the cold junction. The temperature sensor is further in electrical signal isolation from a circuit carrying voltage output by the thermocouple.
    Type: Application
    Filed: September 14, 2010
    Publication date: March 15, 2012
    Applicant: GENERAL ELECTRIC COMPANY
    Inventor: Joseph Lee Whiteley
  • Patent number: 8132963
    Abstract: The aim of the invention is to reduce the temperature gradient at the connection terminals of a connection unit to which lines can be joined. The inventive temperature compensation element is made of at least one first strip of thermally conducting material on which terminal lugs are arranged in a row at essentially right angles to the strip and are insulted in relation to each other and the strip. The terminal lugs are connected to the strip in a thermally conductive manner and can be respectively contacted to the lines with corresponding contact terminals of the connection unit.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: March 13, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Klumpp, Willi Maier, Wigand Schneiderheinze
  • Patent number: 8104956
    Abstract: A thermocouple measuring circuit for sensing a temperature at a measuring point is provided. The thermocouple measurement circuit (12) includes a thermocouple input for sensing a temperature at a measuring point, a compensation circuit (14) for compensating thermocouple effects of junctions of the thermocouple, and an instrumentation amplifier (16) for summing an output of the thermocouple and an output of the compensation circuit and outputting a voltage indicative of the temperature sensed, wherein the output of the compensation circuit is a reference voltage for the output of the instrumentation amplifier. Various embodiments of the thermocouple measurement circuit may be employed in electrosurgical generators for controlling output power dependent on temperature conditions.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: January 31, 2012
    Assignee: Covidien AG
    Inventor: Derek M. Blaha
  • Publication number: 20110299567
    Abstract: A process variable transmitter for measuring a temperature of an industrial process, includes a first electrical connector configured to couple to a first wire of a thermocouple, the first electrical connector includes a first electrode and a second electrode. The first and second electrodes are configured to electrically couple to the first wire of the thermocouple. A second electrical connector is configured to couple to a second wire of the thermocouple, the second electrical connector includes a third electrode and a fourth electrode. The third and fourth electrodes are configured to electrically couple to the second wire of the thermocouple. The second wire is of a different material than the first wire. Measurement circuitry is coupled to the first and second electrical connectors configured to provide an output related to a temperature of the thermocouple.
    Type: Application
    Filed: June 7, 2010
    Publication date: December 8, 2011
    Inventors: Jason H. Rud, Clarence Holmstadt
  • Publication number: 20110243188
    Abstract: A mixed-signal integrated circuit comprises: 1) an analog front end having differential inputs adapted for directly connecting to at least one thermocouple, 2) an analog-to-digital (ADC) for converting the thermocouple voltages to digital representations thereof, 3) a linearization circuit capable of performing the multi-order polynomial equations for converting the thermocouple electromotive voltages (the digital representations) to linear temperature measurement units by using coefficients unique to each type of thermocouple from a coefficients table based upon the National Institute of Standards and Technology (NIST), 4) a integrated temperature sensor for measuring cold junction temperature, 5) optionally, an input multiplexer for selecting each of a plurality of thermocouples for measurement thereof, 6) optionally, registers for storing measured temperature values, high and low set points, alarm limits, etc., and 7) a communications interface for setting parameters and receiving temperature information.
    Type: Application
    Filed: August 6, 2010
    Publication date: October 6, 2011
    Inventor: Ezana Hailekiros Aberra
  • Patent number: 7994416
    Abstract: A set of electrical connector pins for a thermocouple includes two materially similar conductor pairs, each conductor pair having conductors composed of a different material, and carried by an electrically insulating connector housing. The different materials of the conductor pairs provide a partial compensation to the thermocouple EMF developed between the hot junction and the cold junction when engaged thereto for the different type thermocouples. The conductors of each pair are operable to engage with two thermoelement conductors that form a thermocouple of differing types. The thermocouples provide a hot junction electrical interconnection therebetween at one end and are coupled to a cold junction at another end.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: August 9, 2011
    Assignee: Watlow Electric Manufacturing Company
    Inventor: William C Schuh
  • Patent number: 7841771
    Abstract: Self-Validating Thermocouple (SVT) Systems capable of detecting sensor probe open circuits, short circuits, and unnoticeable faults such as a probe debonding and probe degradation are useful in the measurement of temperatures. SVT Systems provide such capabilities by incorporating a heating or excitation element into the measuring junction of the thermocouple. By heating the measuring junction and observing the decay time for the detected DC voltage signal, it is possible to indicate whether the thermocouple is bonded or debonded. A change in the thermal transfer function of the thermocouple system causes a change in the rise and decay times of the thermocouple output. Incorporation of the excitation element does not interfere with normal thermocouple operation, thus further allowing traditional validation procedures as well.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: November 30, 2010
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Jose M. Perotti, Carlos T. Mata, Josephine B. Santiago, Peter Vokrot, Carlos E. Zavala, Bradley M. Burns
  • Publication number: 20100246630
    Abstract: An assembly includes a thermocouple, a cold junction sensor, and a circuit. The thermocouple has a process end and a cold junction end. The cold junction end has first and second cold junction terminals. The cold junction sensor is supported near the cold junction end and configured to measure temperature at the cold junction end. The circuit is electrically connected to the cold junction sensor and to the first and second cold junction terminals. The circuit is configured to produce a thermocouple signal as a function of voltage across the first and second cold junction terminals and to produce a cold junction sensor signal as a function of temperature of the cold junction end as measured by the cold junction sensor. The circuit is further configured to calculate a correlation between the thermocouple signal and the cold junction sensor signal.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Applicant: Rosemount Inc.
    Inventors: Robert J. Kaszynski, Charles E. Goetzinger
  • Publication number: 20080304547
    Abstract: There is provided a temperature measuring device capable of achieving cost reduction even in the case where the same is a multichannel temperature measuring device. The temperature-measuring device comprises a thermocouple having two dissimilar metal wires, ends thereof, on one-side, being joined with each other, and the other ends thereof, being connected to one pair of contact terminals, respectively, a unit of a temperature-measurement set made up by joining together a plurality of the thermocouples, and a reference junction compensation circuit provided for every unit of the temperature-measurement set, wherein at least one of the reference junction compensation circuits of the temperature-measuring device is left out while the other reference junction compensation circuits of the temperature-measuring device are removed upon a plurality of the units of the temperature-measurement sets being disposed in series.
    Type: Application
    Filed: May 6, 2008
    Publication date: December 11, 2008
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventor: Koji OTA
  • Publication number: 20080165827
    Abstract: A compensation method for cold junction of temperature controlling console is used to compensate the temperature difference of cold junctions when a plurality of temperature controlling consoles are connected in series, where one temperature controlling console is master temperature controlling console and others are slave temperature controlling consoles. Each of the consoles has a serial input end, a serial output end and a master/slave communication end, where the serial output end of one slave console is connected to the serial input end of next slave console to form serial connection. The master/slave communication ends of all consoles are connected parallel. When the master temperature controlling console at end of the series sends a communication protocol data to all slave consoles, the slave consoles set their communication protocol to judge the positions thereof and then set the temperature compensation according to their position and their built-in program for cold junctions.
    Type: Application
    Filed: January 5, 2007
    Publication date: July 10, 2008
    Inventor: Ching-Yi Lin
  • Patent number: 7144155
    Abstract: A cold junction compensation system for a temperature measurement device having a processing circuit is disclosed. The cold junction compensation system includes a cold junction temperature sensor arranged in signal communication with the processing circuit, a thermal coupler in thermal communication with the cold junction temperature sensor, and first and second contacts each in thermal communication with the thermal coupler and in electrical isolation with each other, each contact arranged for signal communication with the processing circuit and arranged for signal communication with a hot junction temperature sensor.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: December 5, 2006
    Assignee: General Electric Company
    Inventors: William Barry Underwood, Christopher Charles Weston, Harbanse Deogan, Roderick Gordon Brown
  • Patent number: 6888397
    Abstract: A temperature sensor circuit which includes: an adjustment circuit which generates a first divided voltage obtained by dividing a reference voltage; a current generation circuit which has a transistor element and generates a current corresponding to a gate voltage of the transistor element, the first divided voltage being supplied to a gate terminal of the transistor element; a voltage generation circuit which includes a diode element to which the current is supplied, an analog voltage being generated between both ends of the diode element; and an analog/digital (A/D) conversion circuit which compares a second divided voltage obtained by dividing the reference voltage with the analog voltage and converts the analog voltage into a digital value.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: May 3, 2005
    Assignee: Seiko Epson Corporation
    Inventor: Masahiko Tsuchiya
  • Patent number: 6565254
    Abstract: An infrared sensing element of the present invention includes a base including a thin film portion and a thick wall portion arranged around the thin film portion, and a thermopile including a plurality of thermocouples connected in series so that cold junctions are located on the thick wall portion and hot junctions are located on the thin film portion, wherein a thermosensitive portion is provided in contact with the thick wall portion so that a reference temperature with high accuracy can be used for determining temperature based on output from the thermopile. A PN junction formed on a semiconductor substrate serves as the thermosensitive portion, and it is used to provide for a compact infrared sensing element with high performance at low cost.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: May 20, 2003
    Assignee: Seiko Epson Corporation
    Inventors: Shigemi Sato, Osamu Iwamoto, Yasuhiro Shiohara, Yuji Oda
  • Publication number: 20020167990
    Abstract: The invention relates to a device for measuring the temperature of a gas, especially air, said temperature (so-called effective temperature) being measured at least according to speed (wind intensity) and humidity. The inventive device comprises a housing (4) having a wall (6), which essentially separates the inside (4c) of the housing (4) from the outside environment. The device also comprises a temperature sensor (14) arranged inside the housing (4), and has a heating device (10), which is also arranged inside, said housing (4).
    Type: Application
    Filed: April 11, 2001
    Publication date: November 14, 2002
    Inventors: Detlef Rengshausen, Bodo Rengshausen-Fischbach
  • Patent number: 6425687
    Abstract: A system for measuring average temperature including a plurality of measurement thermocouples (10,12,14) connected in parallel to measurement apparatus (24) by two signal wires (22) of a material different to that of the measurement thermocouples (10,12,14). Compensation thermocouples (26,28,30) are located at the cold junctions (16,18,20) of the measurement thermocouples (10,12,14) and connected to the measurement apparatus (24).
    Type: Grant
    Filed: December 16, 1999
    Date of Patent: July 30, 2002
    Assignee: Solartron Group Limited
    Inventor: Wojciech K. Kulczyk
  • Patent number: 6293700
    Abstract: A calibrated isothermal assembly for a thermocouple thermometer is provided to obviate a calibration step after manufacture of the instrument. A compact isothermal block is fabricated on a specialized printed circuit board which includes a thick metal plate to establish sufficient thermal mass and good heat conductivity. A temperature sensor is mounted at the thermocouple reference junction on the printed circuit board to track the reference junction temperature. The calibrated isothermal assembly also includes a current source for the temperature sensor, and a memory device containing stored calibration data specific to the temperature sensor.
    Type: Grant
    Filed: September 24, 1999
    Date of Patent: September 25, 2001
    Assignee: Fluke Corporation
    Inventors: John M. Lund, Jonathan J. Parle, Monte R. Washburn
  • Patent number: 6203194
    Abstract: The invention is directed to a thermopile sensor and in particular to a radiation thermometer or a motion detector with a thermopile sensor. The thermopile sensor includes a thermopile supported in a housing. The thermal capacity of the cold and hot junctions of the thermopile including its supporting structure and the thermal conductivity of the supporting structure are mutually coordinated such that a change in the housing's temperature produces a change of equal magnitude in the cold and hot junctions' temperature, that is, no temperature gradients occur within the thermopile.
    Type: Grant
    Filed: November 16, 1998
    Date of Patent: March 20, 2001
    Assignee: Braun GmbH
    Inventors: Frank Beerwerth, Bernhard Kraus
  • Patent number: 6158885
    Abstract: The invention relates to a device for correcting error in temperature readings caused by thermocouple-to-extension wire ambient temperature fluctuations. The device creates an isothermal mass which raises the temperature of terminals to higher than ambient temperature. The isothermal mass consists of a self heating thermistor surrounded by thermal conductive epoxy inside an isothermal mass which contains the terminals. The isothermal mass is enclosed within insulating discs using a closure casing to complete the assembly. Using these higher than ambient temperature terminals for the connection between a thermocouple and extension wires, any error due to ambient temperature fluctuations is minimized.
    Type: Grant
    Filed: June 18, 1998
    Date of Patent: December 12, 2000
    Assignee: Integrated Control Concepts, Inc.
    Inventor: Donald G. Landis
  • Patent number: 6074089
    Abstract: A thermoelectric cold junction compensator connector module, for use with a thermoelectric device such as a thermistor, thermocouple, or resistance-temperature device, has within a housing a cold junction compensator circuit which has means for linearization of voltage output of the circuit relative to input to the circuit. Preferably the circuit also includes potentiometer means for adjustment of at least one parameter of the circuit, and means for adjustment of its voltage output to correspond to degrees Centigrade and degrees Fahrenheit.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: June 13, 2000
    Assignee: Omega Engineering, Inc.
    Inventors: Milton Bernard Hollander, William Earl McKinley, Michael A. Macchiarelli, Jr., Shahin Baghai
  • Patent number: 6072165
    Abstract: A thin film thermocouple having junctions (2, 7) of metal and semiconducting metal oxides such as tin oxide/silver, and used as surface temperature sensors in conjunction with thin film heating elements (1) to control temperature.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: June 6, 2000
    Assignee: Thermo-Stone USA, LLC
    Inventor: Bernard Feldman
  • Patent number: 5998767
    Abstract: An apparatus for processing a substrate wafer wherein the apparatus includes a reaction chamber, a wafer holder intended to hold the substrate wafer, and a susceptor. A temperature sensor, preferably a thermocouple with two junctions, is provided for measuring the difference between the temperatures at the site of the susceptor and at a site between the susceptor and the substrate wafer.
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: December 7, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alfred Kersch, Thomas Schafbauer
  • Patent number: 5887978
    Abstract: A self-verifying temperature sensor and method for measuring and verifying the true thermodynamic temperature of a system. The sensor is constructed of various combinations of the following temperature-dependent elements: thermoelements, resistive elements, capacitive elements and other inductive elements. In the preferred embodiment, the sensor is constructed of resistive element connected between four thermoelement wires. A fifth thermoelement wire is connected to the resistive element. The sensor produces a data signature from various voltage, resistance, inductance, and capacitance measurements. Measurement electronics collect and condition the data signature. A computer analyzes the data signature and provides the system operator with a verified sensor temperature, thus, allowing the system operator to recognize and account for drift or decalibration of the sensor.
    Type: Grant
    Filed: September 15, 1997
    Date of Patent: March 30, 1999
    Assignee: AccuTru International Corporation
    Inventors: James G. Lunghofer, C. Tom Brannon, Bernard L. Conner, Lee Transier, Collins P. Cannon
  • Patent number: 5803604
    Abstract: A loop transmitter is connected between a thermocouple and a loop detector circuit. The transmitter has a circuit mounted on an elongated circuit board within a cylindrical housing with thermocouple leads and output leads extending from opposite ends of the cylinder. The circuit is potted in high conductivity epoxy, with an adjustment screw left exposed. After amplifier offset adjustment, the housing is completely filled with a lower conductivity epoxy.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: September 8, 1998
    Assignee: Exergen Corporation
    Inventor: Francesco Pompei
  • Patent number: 5713668
    Abstract: A self-verifying temperature sensor and method for measuring and verifying the true thermodynamic temperature of a system. The sensor is constructed of various combinations of the following temperature-dependent elements: thermoelements, resistive elements, capacitive elements and other inductive elements. In the preferred embodiment, the sensor is constructed of resistive element connected between four thermoelement wires. A fifth thermoelement wire is connected to the resistive element. The sensor produces a data signature from various voltage, resistance, inductance, and capacitance measurements. Measurement electronics collect and condition the data signature. A computer analyzes the data signature and provides the system operator with a verified sensor temperature, thus, allowing the system operator to recognize and account for drift or decalibration of the sensor.
    Type: Grant
    Filed: August 23, 1996
    Date of Patent: February 3, 1998
    Assignee: AccuTru International Corporation
    Inventors: James G. Lunghofer, C. Tom Brannon, Bernard L. Conner, Lee Transier, Collins P. Cannon
  • Patent number: 5484206
    Abstract: An improved method and apparatus for sensing a cold junction temperature, wherein two sensors are located near the cold junction temperature, the temperatures at the two sensors are measured, the heat flow between the two sensors and one of the two sensors and the cold junction is constrained to be equal, and the thermal impedances between each of the two sensors and the cold junction is maintained constant. The cold junction temperature is a weighted difference of the two temperatures at the two sensors and the weighting factor depends on the ratio of the thermal impedance between the two sensors and the thermal impedance between the first sensor and the cold junction.
    Type: Grant
    Filed: December 28, 1993
    Date of Patent: January 16, 1996
    Inventor: John Houldsworth
  • Patent number: 5328264
    Abstract: A cold junction compensation device for a thermocouple, comprising a thermostatically interface casing (1) receiving directly the wires (3, 3') of the thermocouple (2) and ensuring the interconnection of these latter with an extension cord (4). The interface casing (1) contains moreover a cold junction compensation circuit (5).
    Type: Grant
    Filed: February 19, 1993
    Date of Patent: July 12, 1994
    Assignee: Sadis Bruker Spectrospin, Societe Anonyme de Diffusion de L'Instrumentation Scientifique, Bruker Spectrospin
    Inventors: Patrick Krencker, Jean-Luc Weishaar
  • Patent number: 5246293
    Abstract: The invention relates to a reference junction for thermocouple measuring, comprising two reference temperature blocks (5) connected with one another heat conductively but dielectrically, one block for each thermocouple conductor and each block provided with a contact surface (4) for receiving the thermocouple conductor, and means (1) for retaining the thermocouple conductors or their attached contacts in contact with the contact surfaces (4) of the respective reference temperature blocks (5). To enable rapid fixing and detachment of the thermocouple conductors or their attached contacts, the means for retaining the thermocouple conductors in contact with their contact surfaces (4) comprise a single unitary retention block (1) pressed by spring-biased action against the contact surfaces.
    Type: Grant
    Filed: February 19, 1992
    Date of Patent: September 21, 1993
    Assignee: Oy Beamex AB
    Inventors: Osmo Luotsinen, Jorma Savolainen, Markku Laitinen
  • Patent number: 5167519
    Abstract: A universal connector including a housing of molded thermoplastic having a pair of slots in a side thereof for receiving therein plugs or wires of various shapes and sizes for connection with the connector and a slot for receiving therethrough a stud. A pair of copper blocks are positioned adjacent each other with a pair of beryllia washers and a temperature sensor therebetween. One block includes a pair of plain apertures extending entirely through the block. The other block includes a pair of threaded apertures extending entirely through that block. These apertures are aligned with the washers. The blocks also include opposing grooves which, together, form an aperture. A pair of nylon screws are threaded into the threaded apertures to secure the blocks into tight frictional engagement against the washers and the temperature sensor. A copper wire is secured to the block and a copper wire is secured to the block to provide electrical connection between the blocks and an external device.
    Type: Grant
    Filed: November 12, 1991
    Date of Patent: December 1, 1992
    Assignee: Transmation, Inc.
    Inventors: Arthur B. Jones, David R. Peterson
  • Patent number: 5163755
    Abstract: A temperature regulator is provided which includes a temperature sensor, a temperature regulating unit, a cold junction temperature measuring device and a double-wall insulating partition. Temperatures measured by the temperature sensor are compensated with the temperatures measured by the cold junction temperature measuring device. Since the double-wall insulating partition insulates the cold junction measuring device from the heat generated inside the temperature regulating unit, the cold junction measuring device can correctly measure the temperature of the cold junction.
    Type: Grant
    Filed: April 22, 1991
    Date of Patent: November 17, 1992
    Assignee: Omrom Tateisi Electronics Co.
    Inventors: Tooru Shimomura, Kazutomo Naganawa, Toshiya Tanamura
  • Patent number: 5161893
    Abstract: Temperature measurement with thermocouples is made more accurate, and the cost of disposable thermocouples is reduced by locating the cold junction close to the hot junction, utilizing a thermistor in thermal communication with the cold junction in developing a compensating voltage which varies with temperature as does the voltage produced by the cold junction, and applying the compensating voltage to cancel the cold junction voltage. The presence of radio frequency fields in the region of the thermocouple is detected and utilization of the thermocouple voltage is interrupted in intervals when the interference is greater than some preselected intensity. Further, the thermocouple voltage information is utilized to simulate the resistance a thermistor would have at the temperature represented by the thermistor voltage information and that simulated resistance is applied to instrumentation designed to measure temperature with a thermistor.
    Type: Grant
    Filed: August 29, 1991
    Date of Patent: November 10, 1992
    Assignee: Respiratory Support Products, Inc.
    Inventors: Gordon Y. Shigezawa, Anthony V. Beran
  • Patent number: 5088835
    Abstract: A reusable cable apparatus for interfacing disposable temperature probes with a patient monitor. One reusable cable connects a thermocouple probe to the patient monitor and has a phone plug connection wherein a cold junction and cold junction compensation is located. A second reusable cable connects a thermistor probe to the patient monitor through a similar phone plug. Circuit means in the patient monitor receives either phone plug and produces an output signal which is substantially the same regardless of whether the thermocouple and first reusable cable or thermistor and second reusable cable are connected. The effect of secondary thermocouple junctions in interconnecting connector shells is substantially eliminated by connecting lead wires to contact pins such that the secondary junctions are physically close to one another.
    Type: Grant
    Filed: December 31, 1990
    Date of Patent: February 18, 1992
    Inventors: Gordon Shigezawa, Anthony V. Beran
  • Patent number: 5056929
    Abstract: A temperature compensation type infrared sensor includes a substrate having a central pit and functioning as a heat sink with an insulation film formed on the top face of the substrate and defining a diaphragm located above the pit, a plurality of thermocouples disposed on the insulation film and connected in series with each of said thermocouples having a hot junction on said diaphragm and a cold junction on the heat sink, and a thermopile element including a black body on the central portion of the diaphragm in the insulation film for absorbing infrared rays with the thermopile element being placed on a thermistor chip for compensating temperature.
    Type: Grant
    Filed: January 30, 1991
    Date of Patent: October 15, 1991
    Assignee: Citizen Watch Co., Ltd.
    Inventors: Sigeru Watanabe, Kenji Kamiya, Takanori Nanya
  • Patent number: 5046858
    Abstract: A multi-channel remote-temperature-sensing system has a reference temperature assembly for the reference junctions of a plurality of temperature sensors for determining temperatures at remote points. The assembly comprises an array of components each adapted to make thermal contact with a reference junction of a remote-temperature-sensing thermocouple, an absolute reference thermometer situated within the array for measuring an absolute reference temperature, a thermocouple for sensing a temperature difference between the absolute reference thermometer and a component of the array, and data processing means for calculating the temperature of the component of the array from the absolute reference temperature and the temperature difference.
    Type: Grant
    Filed: June 20, 1990
    Date of Patent: September 10, 1991
    Assignee: Schlumberger Technologies Limited
    Inventor: Roger L. R. Tucker
  • Patent number: 5038303
    Abstract: A method and apparatus accurately measures temperature even if a temperature difference exists between cold junctions of the main thermocouple. An auxiliary thermocouple is connected to one leg of the main thermocouple to provide cold junction compensation. Extension leads are connected to both cold junctions to take thermo emf from the thermocouple. The leads are made from a material having a thermoelectromotive characteristic in agreement with the thermoelectromotive characteristic of the other leg at low temperatures at which the cold junction compensation is provided. A converter converts the thermo emf of the composite thermocouple into temperature. The converter can separately set interpolations for converting the thermo emf of the auxiliary thermocouple into thermo emf of the main thermocouple and for coverting the sum of the converted thermo emf and the thermo emf of the main thermocouple into temperature.
    Type: Grant
    Filed: December 28, 1989
    Date of Patent: August 6, 1991
    Assignee: Yamari Industries, Limited
    Inventor: Hideo Kimura
  • Patent number: 4936690
    Abstract: A transmitter generates an output signal, which represents temperature, based on potential across thermocouple leads from a main thermocouple. A housing has first and second terminals extending through a wall which separates first and second cavities in the housing. The terminals are connected to the thermocouple leads in the first cavity to form terminal cold junctions. A converter has converter leads which are connected to the terminals in the second cavity. The converter senses a combined signal which represents main thermocouple potential and terminal cold junction potential. The converter also provides the output signal. A conductor has a first end coupled to the first terminal and a second end coupled to the converter forming a correction thermocouple. The correction thermocouple provides a first correction signal representing a difference between a terminal temperature and a converter temperature.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: June 26, 1990
    Assignee: Rosemount Inc.
    Inventor: Charles E. Goetzinger
  • Patent number: 4924212
    Abstract: A threshold temperature detection is made by measuring the reverse saturation current of a transistor subjected to the temperature to be measured. It is shown that, for temperatures close to the ambient temperature, the sensitivity of this detector is very high. Furthermore, in making a circuit that measures the relative variations of the reverse saturation current, a temperature detector is made which is independent of variations in characteristics resulting from manufacturng tolerances for integrated circuits. This circuit is particularly designed to be implanted in the same substrate as a memory circuit of the type with memory cells, provided with floating gate transistors.
    Type: Grant
    Filed: August 23, 1988
    Date of Patent: May 8, 1990
    Assignee: SGS-Thomson Microelectronics S.A.
    Inventors: Serge Fruhauf, Eric Mattera
  • Patent number: 4863283
    Abstract: Disclosed herein is an electrical connector for a repeating immersion thermocouple lance for molten metal baths which includes a temperature sensor in the connector for sensing the temperature of the lance to detect temperature build up at the cold junction of the thermocouple which could provide a false EMF reading to distort the bath temperature reading of the thermocouple.
    Type: Grant
    Filed: October 13, 1987
    Date of Patent: September 5, 1989
    Inventor: Richard A. Falk
  • Patent number: 4804272
    Abstract: A cold junction compensation apparatus utilizes a block of thermally conductive material, such as copper, having a mounting flange extending radially outwardly which is attached to a terminal strip by a machine screw to maintain the screw temperature substantially at the temperature of the block of thermally conductive material. The temperature of the block is sensed by means of a temperature sensor inserted into a hole extending through the block. The sensor is supported on a printed circuit board and is inserted through the hole in the block during assembly of an apparatus using the cold junction temperature compensation. The block is covered by an exterior insulating sleeve to prevent electrical shorts and rapid temperature changes in the block.
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: February 14, 1989
    Assignee: Honeywell Inc.
    Inventor: Robert Schmitz
  • Patent number: 4776706
    Abstract: A connector and compensating terminal apparatus for use with temperature responsive instruments is adapted to accommodate sensing devices such as thermocouples and RTDs having a wide plurality of lead connectors. The apparatus includes a temperature compensating block assembly having first and second conductive blocks coupled together at opposing surfaces by means of a thermally conductive and electrically insulative material, a corresponding surface of each block is adapted to receive one lead of a thermocouple sensor or RTD which lead is held in contact on the surface of the block by a holding block having a corrugated holding surface and which holding block is movably mounted with respect to the conductive block to provide a variable spacing to enable the apparatus to accommodate the different types of thermocouple or RTD lead connectors. Additionally, there are two outside conducting blocks for two of the 3 or 4 RTD leads which leads are also held in place by the respective holding blocks.
    Type: Grant
    Filed: August 10, 1987
    Date of Patent: October 11, 1988
    Assignee: Thermo Electric Instruments
    Inventors: Robert Loiterman, Randolph Klein
  • Patent number: 4718777
    Abstract: In a temperature measurement system using a thermocouple connected to a pair of circuit wires coupled to a voltmeter for providing an output reading, an isothermal block (48) formed of alumina ceramic contains a series of openings (58-66) in linear juxtaposition. Metal connectors (68) located in two of the openings to interconnect the thermocouple and printed circuit wires of a circuit board (52) establish a reference junction. A temperature sensor (50), preferably a transistor, in a third opening measures the temperature of the isothermal block (48) to compensate the output reading for error created by the reference junction. The connectors (68) are in resilient contact with the interior wall of the isothermal block (48) to maintain good heat conductivity between the connectors and the temperature sensor (50). Portions of the connectors (68) extending outside the isothermal block (48) retain the isothermal block (48) to the circuit board (52).
    Type: Grant
    Filed: February 28, 1986
    Date of Patent: January 12, 1988
    Assignee: John Fluke Mfg. Co., Inc.
    Inventors: Steven T. Mydynski, John M. Redfield, Jr., Bryan L. Sparrowhawk, Alfred T. Volberding