Abstract: What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A display device and a method for starting up at a low temperature utilizing a heating unit of the display device or an external heating unit to increase the environmental temperature of the display device are disclosed. After the environmental temperature inside the display device reaches a starting-up temperature, the display device can be started up in the low-temperature environment.

Abstract: An apparatus and method for testing thermal switches is disclosed including modulating the temperature of a receiver in thermal contact with a thermal switch at a first rate within a range containing the nominal switch temperature of the thermal switch. A first temperature at which the switch changes state is recorded. The temperature is then modulated at a second rate and a second temperature at which the switch again changes state is recorded. The temperature may be modulated at a third rate slower than the second rate to determine a third temperature. The first, second, and third switch temperatures are then processed and output to an operator. The first, second, and third rates may be determined according to an exponentially decreasing function.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.

Abstract: The invention relates to a thermal erosion test device for testing thermal protection materials for use in a solid propellant thruster. The device comprises a support for holding a plate made of the thermal protection material for testing so that its faces a face of a block of solid propellant, the space between the plate and the face of the propellant block defining a combustion chamber of substantially rectangular shape, said chamber extending along said plate and opening out into a nozzle.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: A test system and method of analyzing a pin to circuit connection on a substrate is provided. The method includes applying thermal energy to the pin or the substrate at a location outside of the pin to circuit interface, and measuring infrared radiation near the pin to circuit interface. The method also includes the step of analyzing the measured infrared radiation to determine thermal energy distribution near the pin to circuit interface resulting from thermal conductivity at the interface. The method further includes the step of determining sufficiency of the pin to circuit electrical and mechanical connection based on the determined thermal energy distribution.

Abstract: Heating value P[W] generated at an IGBT is calculated, and a temperature difference ?T?j [° C.] between a temperature Tw [° C.] of cooling water circulating in a cooling system and a temperature Tj [° C.] of an IGBT is calculated based on thermal resistance R [° C./W] of the cooling system. A temperature rise ?Tj [° C.] with transient influences eliminated is then calculated based on the calculated temperature difference ?T?j [° C.], and the temperature Tj [° C.] (=Tw [° C.]+?Tj [° C.]) of the IGBT is calculated.

Abstract: A method for identifying types of flaws in a composite object includes: a) rapidly heating the surface of the object; b) recording pixel intensities in a sequence of IR images; c) determining temperature-versus-time data for each of the pixels from the IR images; and d) determining what type of flaw if any corresponds to each of the pixels using the temperature-versus-time data determined in step (c). A contrast curve derived from the temperature-versus-time data may be used in determining what type of flaws if any corresponds to each of the pixels. The contrast curve may be determined by subtracting a synthetic reference curve from a temperature time curve from the temperature-versus-time data. The types of flaws may be determined from size and/or shapes of peaks in the contrast curves. Some flaws are delaminations, layers of porosity, and uniformly distributed porosity.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.

Abstract: Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

Abstract: The invention provides an apparatus and method for detecting flaws in an object. The method includes the step of heating a portion of a surface of an object wherein the surface is defined by a plurality of individual surface elements. The method also includes the step of recording a plurality of thermal images of the portion over time with a thermal imaging device. Each of the plurality of thermal images is defined by a plurality of pixels. Each of the plurality of pixels has an individual pixel address and corresponds to one of the plurality of individual surface elements. The method also includes the step of determining a pixel intensity for each of the plurality pixels in each of the plurality of thermal images. The method also includes the step of integrating the pixel intensity of each of the plurality of pixels having the same individual address from respective thermal images to establish elements within an array of integrated pixel intensity.

Abstract: The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Abstract: Heat transfer test assemblies for monitoring and recording fouling of aqueous systems are disclosed. The heat transfer test assemblies include an outer tube member, a heating rod positioned within the outer tube member, a ribbed tube sleeve fitted over the heating rod and thermocouples for sensing the wall temperature of heating rod. The disclosed heat transfer test assemblies enable improved monitoring of systems employing enhanced heat exchanger tubes. Monitoring and recording apparatuses including the heat transfer test assemblies are also disclosed.

Abstract: A tightness testing method for a MEMS or small encapsulated component, the MEMS or small component being housed in a cavity of a carrier. The cavity being sealed and containing a gas having a different density to the density it would have if subjected to the pressure of the medium outside the cavity. The method measures the density of the gas contained in the cavity.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: First and second thermal sensors measure the respective temperatures of portions of a surface of a structure such as an aircraft component. An alert signal is emitted if the temperatures of the surface portions are substantially different. An energy source causes heat flow within the structure. Subsurface irregularities such as disbanded areas between composite layers and foreign materials obstruct heat flow within the structure and cause proximate surface portions to exhibit different temperatures. A non-alert signal may be emitted if the temperatures of proximate surface portions are essentially the same.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement the movable portion relative to the immovable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.

Abstract: Methods and apparatus for wafer temperature measurement and calibration of temperature measurement devices may be based on determining the absorption of a layer in a semiconductor wafer. The absorption may be determined by directing light towards the wafer and measuring light reflected from the wafer from below the surface upon which the incident light impinges. Calibration wafers and measurement systems may be arranged and configured so that light reflected at predetermined angles to the wafer surface is measured and other light is not. Measurements may also be based on evaluating the degree of contrast in an image of a pattern in or on the wafer. Other measurements may utilize a determination of an optical path length within the wafer alongside a temperature determination based on reflected or transmitted light.

Abstract: An apparatus for measuring insulation thermal performance is provided, particularly between ambient and cryogenic temperatures. A warm-temperature boundary has a continuous sample contact surface that is divided into a metered central zone and a boundary guard zone. Each zone is independently heated, and the power necessary to maintain the central zone at constant temperature is directly equated to heat flux through the insulation at the temperature boundary conditions. Methods for measuring insulation thermal performance are also disclosed.

Abstract: A wire disconnection inspecting device includes a vehicle position recognition unit for detecting that a vehicle has reached an inspection position; a preparation timing recognition unit for detecting that a step preceding by one is reached; a terminal for transmitting an operation signal to an ECU so as to make an electrical connection to a heating conductor; an infrared camera for imaging a rear shield of the vehicle; and a main processing unit for acquiring thermal image data from the infrared camera and inspecting disconnection of the heating conductor. The main processing unit recognizes that the vehicle has reached a step preceding by one according to the preparation timing recognition unit and makes electrical connection to the heating conductor via the terminal. The main processing unit acquires the image data from the infrared camera when the vehicle has reached the inspection position.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is telescopically mounted in at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion. The least a temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: A method and apparatus is described for enabling the testing and evaluation of industrial machine components and, in particular, gas turbine engine components, under simulated in-situ thermal operating conditions for effectively evaluating new component designs and repair techniques. A specimen machine component/part is placed in a test chamber and cyclically heated and cooled while being monitored to obtain information regarding the initiation and propagation of a crack within the structure of the component. Information regarding the number of heating and cooling cycles sustained by the component until crack initiation and information indicating the rate of crack propagation are acquired and compared over multiple heating-cooling cycles to evaluate components and repair techniques.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for ensuring the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein to provide a thermally stable environment for the heat pipe during test.

Abstract: A system and method for detecting structural damage in a layered structure, the method compromising: providing an array of optical fibers attached to the layered structure; providing a laser source for emitting light into the optical fibers; providing a thermal imaging device; transferring laser light beam through each of the optical fibers of the array; acquiring at least one thermal image of an external surface of the layered structure; and detecting existence of one or more hot spots on the external surface indicative of a location of damage in the layered structure.

Abstract: A system for locating a failure event in a sample is disclosed. The system includes at least one sensor configured to detect acoustic energy corresponding to the failure event in the sample. The system also includes an infrared camera configured to detect a thermal release of energy corresponding to the failure event in the sample.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: Disclosed herein is a temperature monitoring system including a circuit board and a thermochromic coating covering at least a portion of the circuit board, wherein the thermochromic coating is capable of indicating a temperature gradient on the circuit board. The thermochromic coating may comprise a color forming leuco dye, an activator, and optionally a deprotecting agent.

Abstract: The induction thermography test stand has at least two inductors arranged angled relative to one another, at least in sections, and at least one alternating current source for powering the inductors with alternating currents which differ in terms of their frequency and/or phase such that a current with a temporally changing direction can be induced in a test module. With a method for determining flaws in test modules using induction thermography, a current with a temporally changing direction is induced in the test module.

Abstract: This invention provides an apparatus for nondestructive residential inspection and various methods for using a thermal imaging apparatus to inspect residential building components. More specifically, this invention provided a method to rapidly inspect a residential building for moisture in basement walls, uninsulated building components, misaligned structural members or small animal intestation.

Abstract: To detect a defect without being limited to the current path of a sample. The presence or absence of a defect in a sample is detected by allowing said sample to stand for a predetermined period of time after heating said sample with a heat source and by observing the temperature distribution formed on said sample by an observation unit.

Abstract: A hand-held thermography system (8). A generator (10) supplies current to a transformer (15) in a handle (16). An induction coil (20) connected to the transformer (15) extends from the handle (16). The induction coil (20) induces eddy currents in a test object (50), producing a thermal topography on a surface (52) of the object (50) that reveals structural features including defects in the object. An infrared camera (24) mounted on the transformer (16) digitizes images of the thermal topography. A controller (12) processes the images, displays them on a monitor (14), and stores them in a digital memory (11) for evaluation. Digitized positional data relating the position of the image to the surface may also be stored. An operator (40) presses a trigger (17), signaling the controller (12) to start current to the induction coil (20) and simultaneously to acquire and process one or more images from the camera (24).

Abstract: Methods and apparatus for testing the actual glass parts that are to be used in electronic devices are disclosed. According to one aspect of the present invention, method for qualifying a glass part includes obtaining the glass part, and applying at least one thermal shock to the glass part. Once the thermal shock is applied, it is determined if the glass part qualifies for use in a device, e.g., a portable electronic device. If it is determined that the glass part qualifies for use in the device, the glass part is identified as qualifying for use in the device.

Abstract: This invention provides an apparatus for nondestructive residential inspection and various methods for using a thermal imaging apparatus coupled to inspect exterior residential components, interior residential component, for mold. More specifically, this invention provided a computerized method to facilitate inspecting a residential building.

Abstract: Nondestructive examination is performed on a composite aircraft component including a composite body and a conductive medium. The conductive medium is substantially more conductive than the composite body. The nondestructive examination includes applying an electromagnetic field that penetrates the composite body and heats the conductive medium, and creating a thermal image of the conductive medium to reveal conductivity information about the conductive medium.

Abstract: This invention provides an apparatus for nondestructive residential inspection and various methods for using a thermal imaging apparatus coupled to inspect exterior residential components, interior residential components, a pitched roof and basement of a residential building and the electrical system of a residential building.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion and avoids the movable portion from deviating from the immovable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion to detect the temperature of the evaporating section of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: In a method and system for testing the integrity of pressure vessels, or welds on flanges or the like, at elevated temperatures, a pressurized mixture of a gaseous environmentally safe composition is formed within an indicator chamber in a housing receiving a pressurized gas and containing a surface in the chamber upon which is placed an indicator composition including a marker component, whereby the marker component is carried by the carrier gas from within the chamber and through a conduit to the pressure vessel or weld area. The carrier gas and the indicator or marker component are injected in an area between the inner and outer weld of a terminal flange welded to a tubular pipe section or casing. The pressurized composition includes a marker component or sub-composition which is detected by a detection apparatus which scans the pressure vessel area to be tested, or weld area.