Abstract: A temperature sensor includes a plurality of temperature coefficient voltage generators, one or more converters and at least one variable voltage or current source. The temperature coefficient voltage generators are used for generating multiple temperature coefficient voltages. The converters, coupled to the temperature coefficient voltage generators, are used for converting the temperature coefficient voltages to digital values. The at least one variable voltage or current source, each coupled to at least one of the temperature coefficient voltage generators, includes a first variable voltage or current source for outputting a first voltage or current in a first time period, and outputting a second voltage or current in a second time period, wherein the second voltage or current is different from the first voltage or current such that there exists a shift between a first voltage-temperature curve in the first time period and a second voltage-temperature curve in the second time period.

Abstract: A method, consisting of acquiring signals, indicative of temperatures at respective locations in a biological tissue, from a plurality of thermal sensors mounted on a probe in contact with the tissue, interpolating between the temperatures so as to produce a temperature distribution map, and displaying the temperature distribution map on a screen. The method also includes determining that at least one of the thermal sensors is a malfunctioning thermal sensor, and that remaining thermal sensors of the plurality are correctly operating. The at least one malfunctioning thermal sensor is assigned a first arbitrary temperature and the correctly operating thermal sensors are assigned second arbitrary temperatures.

Abstract: The invention relates to a method and device for thermal simulation of electronic systems involving breaking down the system into parts being in a single material and represented as a detailed model, to form a plurality of detailed models each including at least a mesh, a heat admittance system, a heat transfer interface, a connection interface, a power multi-source interface, and a temperature measurement interface; reducing each of the detailed models into a compact model by controlling the maximum of a heat flow frequency; interpolating nodes of the heat transfer interface, connection interface, power multi-source interface, or temperature measurement interface of at least one of the detailed models and the coupling of at least two of the compact models into a macromodel; and reducing the macromodel to form a compact and flexible thermal model.

Abstract: A front-end converter circuit may allow devices, e.g. oscilloscopes and digitizers, to receive input signals having a wide range of possible amplitudes while maintaining a high standardized input impedance. The converter may selectively couple, using low-voltage switches, a selected input network of two or more input networks to a virtual ground node, and a selected feedback network of two or more feedback networks to a transconductance stage input. The selected input network and selected feedback network together define a respective input signal amplitude range. The converter may also controllably adjust an AC gain of the converter to match a DC gain of the converter, and selectively couple non-selected input networks to signal ground. Output referred integrated resistor thermal noise may be reduced to a desired value by lowering the value of the transconductance stage coupled across the input of the converter (through an input resistance) and the virtual ground node.

Abstract: Provided are an ultrasound system and method for providing change information of a target object by performing image registration on a reference image acquired before radiofrequency ablation (RFA) and an ultrasound image acquired during the RFA and comparing the reference image and the ultrasound image that have undergone the image registration with each other.

Abstract: Systems and methods are provided for simulations of printed circuit boards (PCBs). Geometry data related to a PCB is determined from layout data associated with the PCB. A finite element mesh is generated based at least in part on the geometry data related to the PCB, the finite element mesh including one or more mesh components. One or more conductors passing through the one or more mesh components are identified. A volume fraction of the one or more conductors within the one or more mesh components is computed. One or more physical properties of the one or more mesh components are adjusted based at least in part on the volume fraction.

Abstract: A head-mounted display device for enabling a user to simultaneously visually recognize a virtual image and an outside scene includes a warning-information generating unit configured to generate warning information, which is an image for calling the user's attention and an image display unit configured to cause the user to visually recognize the warning information as the virtual image.