Using Microstructures (epo) Patents (Class 374/E7.023)
  • Patent number: 11771329
    Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: October 3, 2023
    Assignee: Apple Inc.
    Inventors: Paul Mansky, Xiaofan Niu, James C. Clements, Mahmut Tosun, Michael Vosgueritchian
  • Patent number: 10795148
    Abstract: A micromechanical component for a micromirror-based laser system for detecting an incident laser beam. Two sensor diodes are situated on a shared substrate in the micromechanical component, only one of the two sensor diodes being designed as a photodiode. The further sensor diode supplies an output signal independent of an incidence of light. By comparing the two output signals of the two diodes, an incidence of light in the micromechanical component may be inferred.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: October 6, 2020
    Assignee: Robert Bosch GmbH
    Inventor: Marko Rocznik
  • Patent number: 9784631
    Abstract: A modular platform unit comprising a plurality of sensors for the combined sensing of pressure, temperature and humidity. In particular, the sensors are composed of a layer of metallic-capped nanoparticles (MCNP) casted on a flexible substrate or a rigid substrate. Integration of the platform unit for artificial or electronic skin applications is disclosed.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: October 10, 2017
    Assignee: TECHNION RESEARCH & DEVELOPMENT FOUNDATION
    Inventors: Hossam Haick, Gregory Shuster, Meital Segev-Bar, Victoria Kloper, Sagi Gliksman
  • Patent number: 9625341
    Abstract: The present invention provides a modular platform unit comprising a plurality of sensors for the combined sensing of pressure, temperature and humidity. In particular, the sensors are composed of a layer of metallic-capped nanoparticles (MCNP) casted on a flexible substrate or a rigid substrate. Integration of the platform unit for artificial or electronic skin applications is disclosed.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: April 18, 2017
    Assignee: TECHNION RESEARCH & DEVELOPMENT FOUNDATION LIMITED
    Inventors: Hossam Haick, Gregory Shuster, Meital Segev-Bar, Victoria Kloper, Sagi Gliksman