Piezoelectric Or Ferroelectric Patents (Class 381/173)
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Patent number: 8555483Abstract: A vibrating element manufacturing method by which adhesion is stabilized and yield is improved, a vibrating element, a vibrating actuator, a lens barrel and a camera system. A vibrating element manufacturing method is provided with a first step of arranging an elastic body on a holding member, a second step of forming an electromechanical transducing element by injection molding on the surface of the elastic body, and a third step of sintering the electromechanical transducing element by heating and bonding the elastic body with the electromechanical transducer element.Type: GrantFiled: March 30, 2007Date of Patent: October 15, 2013Assignee: Nikon CorporationInventor: Takahiro Sato
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Patent number: 8553911Abstract: A diaphragm of an MEMS electroacoustic transducer including a first axis-symmetrical pattern layer is provided. Because the layout of the first axis-symmetrical pattern layer can match the pattern of the sound wave, the vibration uniformity of the diaphragm can be improved.Type: GrantFiled: November 1, 2012Date of Patent: October 8, 2013Assignee: United Microelectronics Corp.Inventor: Li-Che Chen
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Patent number: 8542852Abstract: An electro-mechanical transducer contains a vibrating electrode (15b), a vibrating-electrode-insulating film (15a) disposed at a bottom surface of the vibrating electrode (15b), an electret layer (13) facing to the vibrating electrode (15b), an electret-insulating layer (14e) joined to a top surface of the electret layer (13), and a back electrode 17 in contact with a bottom surface of the electret layer (13). A microgap between ten nanometers and 100 micrometers is established between the vibrating-electrode-insulating film (15a) and electret-insulating layer (14e). A central line average roughness Ra of the vibrating electrode (15b), including a bending, is 1/10 or less of a gap width measured between the bottom surface of the vibrating electrode (15b) and the top surface of the electret layer (13).Type: GrantFiled: April 7, 2009Date of Patent: September 24, 2013Assignee: National University Corporation Saitama UniversityInventor: Kensuke Kageyama
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Patent number: 8526642Abstract: Provided are a piezoelectric micro speaker and a method of manufacturing the same. The piezoelectric micro speaker includes: a substrate having a cavity therein; a diaphragm that is disposed on the substrate, the diaphragm including a vibrating membrane that overlaps the cavity; a piezoelectric actuator that is disposed on the vibrating membrane; and a weight that is disposed in the cavity and attached to a center portion of the vibrating membrane.Type: GrantFiled: January 26, 2010Date of Patent: September 3, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Seok-whan Chung, Dong-kyun Kim, Byung-gil Jeong, Jun-sik Hwang
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Patent number: 8520869Abstract: Provided is a piezoelectric type loudspeaker capable of reproducing a high sound pressure in a limited space, without increasing a voltage applied to a piezoelectric element in a bass range. A plurality of piezoelectric diaphragms are disposed in parallel, and coupled to one another in a thickness direction of the diaphragms via a coupling member, and a polarity of the piezoelectric element and the applied voltage are defined so as to cause deformations in opposite directions from each other. One diaphragm includes an edge on a periphery, and operates as a sound wave radiation surface. At least one diaphragm is fixed to a housing side via a fixing member. Series resistance is connected to the piezoelectric element on the piezoelectric diaphragm fixed to the housing side.Type: GrantFiled: March 28, 2011Date of Patent: August 27, 2013Assignee: Panasonic CorporationInventor: Akiko Fujise
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Patent number: 8509461Abstract: A bone conduction device, comprising: a sound input element configured to receive an acoustic sound signal; an electronics module configured generate an electrical signal representing said acoustic sound signal; and a transducer, comprising a mass configured to move in a rotational direction, configured to generate a vibrational force in a tangential direction with respect to a recipient's bone.Type: GrantFiled: January 15, 2010Date of Patent: August 13, 2013Assignee: Cochlear LimitedInventor: John L. Parker
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Patent number: 8509462Abstract: A piezoelectric micro speaker and a method of manufacturing the same are provided. The piezoelectric micro speaker includes a substrate having a cavity formed therein and a diaphragm that is disposed on the substrate that overlaps the cavity. A plurality of first vibrating membranes having concentric annular ring shapes are disposed in a first region of the diaphragm corresponding to a center of the cavity. A second vibrating membrane including a different material from that of the first vibrating membranes is formed in the second region of the diaphragm corresponding to an edge of the cavity. A piezoelectric actuator for vibrating the first vibrating membranes is formed on and between the concentric annular rings of the first vibrating membranes.Type: GrantFiled: February 11, 2010Date of Patent: August 13, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Byung-gil Jeong, Dong-kyun Kim, Seok-whan Chung, Jun-sik Hwang
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Patent number: 8503700Abstract: A piezoelectric speaker includes: a chassis having a wall surface including an opening; a plurality of diaphragms including at least a first piezoelectric diaphragm and second piezoelectric diaphragms which vibrate in phases opposite to each other when a voltage is applied; and a joint member which connects the first and second piezoelectric diaphragms in a positional relationship such that the diaphragms are located at positions different from each other in a thickness direction. One of the diaphragms is provided, in the opening of the chassis, to have one surface facing an outside of the chassis and another surface facing an inside of the chassis. The diaphragm functions as a radiation plate which radiates a sound wave by vibrating at an amplitude generated by synthesizing amplitudes of the first and second piezoelectric diaphragms.Type: GrantFiled: February 22, 2011Date of Patent: August 6, 2013Assignee: Panasonic CorporationInventors: Akiko Fujise, Toshiyuki Matsumura
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Patent number: 8503693Abstract: A system and method for sensing acoustic sounds is provided having at least one directional sensor, each directional sensor including at least two compliant membranes for moving in reaction to an excitation acoustic signal and at least one compliant bridge. Each bridge is coupled to at least a respective first and second membrane of the at least two membranes for moving in response to movement of the membranes it is coupled to for causing movement of the first membrane to be related to movement of the second membrane when either of the first and second membranes moves in response to excitation by the excitation signal. The directional sensor is controllably rotated to locate a source of the excitation signal, including determining a turning angle based on a linear relationship between the directionality information and sound source position described in experimentally calibrated data.Type: GrantFiled: March 11, 2011Date of Patent: August 6, 2013Assignee: University of MarylandInventors: Miao Yu, Haijun Liu
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Patent number: 8492957Abstract: An apparatus for generating electric energy comprises a vibration plate, a supporting board, at least one side-wall unit and at least one piezoelectric substrate having a first- and a second end surfaces covered with a first- and a second electrodes, respectively. They all together form at least one cavity resonator. If a sound pressure from the outside arrives at the vibration plate, an acoustic vibration is excited in the vibration plate, and thereby a resonance vibration is induced in the cavity resonator. In this time, the piezoelectric substrate responds collectively to the resonance vibration. Thus, a resonance energy occurred in the cavity resonator is converted into an electric energy, which is delivered through the first- and second electrodes.Type: GrantFiled: March 23, 2010Date of Patent: July 23, 2013Inventor: Kohji Toda
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Patent number: 8433081Abstract: A bone conduction device, comprising: a sound input element configured to receive an acoustic sound signal; an electronics module configured generate an electrical signal representing said acoustic sound signal; and a transducer, comprising a mass configured to move in a rotational direction, configured to generate a vibrational force in a tangential direction with respect to a recipient's bone.Type: GrantFiled: March 5, 2009Date of Patent: April 30, 2013Assignee: Cochlear LimitedInventor: John L. Parker
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Patent number: 8401220Abstract: A micro speaker includes a substrate having a cavity formed therein, a diaphragm formed on the substrate overlapping the cavity. The diaphragm includes a first vibration membrane formed in a first area corresponding to a center portion of the cavity and a second vibration membrane formed in a second area corresponding to an edge portion of the cavity and formed of material different from that used for the first vibration membrane. A piezoelectric actuator is formed including a first electrode layer formed on the first vibration membrane, a piezoelectric layer formed on the first electrode layer, and a second electrode layer formed on the piezoelectric layer, and first and second curved lead wires, respectively connected to the first and second electrode layers across the second area, which are symmetrical to the center of the piezoelectric actuator.Type: GrantFiled: March 31, 2010Date of Patent: March 19, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Dong-kyun Kim, Byung-gil Jeong, Seok-whan Chung, Jun-sik Hwang
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Publication number: 20130051586Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated microphones. In one aspect, a glass-encapsulated microphone may include a glass substrate, an electromechanical microphone device, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may define an aperture for the electromechanical microphone device at an edge of the glass-encapsulated microphone. In some configurations, the cover glass may define a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical microphone device.Type: ApplicationFiled: August 30, 2011Publication date: February 28, 2013Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Philip Jason STEPHANOU, David William BURNS
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Patent number: 8368153Abstract: A wafer level package of micro electromechanical system (MEMS) microphone includes a substrate, a number of dielectric layers stacked on the substrate, a MEMS diaphragm, a number of supporting rings and a protective layer. The MEMS diaphragm is disposed between two adjacent dielectric layers. A first chamber is between the MEMS diaphragm and the substrate. The supporting rings are disposed in some dielectric layers and stacked with each other. An inner diameter of the lower supporting ring is greater than that of the upper supporting ring. The protective layer is disposed on the upmost supporting ring and covers the MEMS diaphragm. A second chamber is between the MEMS diaphragm and the protective layer. The protective layer defines a number of first through holes for exposing the MEMS diaphragm. The wafer level package of MEMS microphone has an advantage of low cost.Type: GrantFiled: April 8, 2010Date of Patent: February 5, 2013Assignee: United Microelectronics Corp.Inventors: Chien-Hsin Huang, Li-Che Chen, Ming-I Wang, Bang-Chiang Lan, Hui-Min Wu, Tzung-I Su
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Patent number: 8369544Abstract: A microphone component that may be used in many types of enclosures for making contact with a living body for picking up body sounds. Piezoelectric transflexural diaphragm elements (3, 5, 6) are known; however, they are only useful as microphone elements when the manner of creating electrical contact does not influence their mechanical properties. A microphone component has been developed, which is both rugged and amenable to very inexpensive manufacture. This is obtained using a laminated construction in which a special layer is placed between the piezoelectric transflexural diaphragm element and the electrical interface element.Type: GrantFiled: September 29, 2004Date of Patent: February 5, 2013Assignee: 3M Innovative Properties CompanyInventor: Bjoern Knud Andersen
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Patent number: 8327521Abstract: Methods are provided for production of pre-collapsed capacitive micro-machined ultrasonic transducers (cMUTs). Methods disclosed generally include the steps of obtaining a nearly completed traditional cMUT structure prior to etching and sealing the membrane, defining holes through the membrane of the cMUT structure for each electrode ring fixed relative to the top face of the membrane, applying a bias voltage across the membrane and substrate of the cMUT structure so as to collapse the areas of the membrane proximate to the holes to or toward the substrate, fixing and sealing the collapsed areas of the membrane to the substrate by applying an encasing layer, and discontinuing or reducing the bias voltage. CMUT assemblies are provided, including packaged assemblies, integrated assemblies with an integrated circuit/chip (e.g., a beam-steering chip) and a cMUT/lens assembly. Advantageous cMUT-based applications utilizing the disclosed pre-collapsed cMUTs are also provided, e.g.Type: GrantFiled: September 17, 2008Date of Patent: December 11, 2012Assignee: Koninklijke Philips Electronics N.V.Inventors: Peter Dirksen, Anthonie Van Der Lugt
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Patent number: 8325963Abstract: A bone-conduction microphone built-in headset comprises: an ear pad; an ear cup capable of covering an ear; a piezoelectric element composing a bone-conduction microphone; a buffer material forming the ear pad; a baffle board provided between the ear pad and the ear cup; a wire laid from the piezoelectric element, in which the ear pad is provided on an opening end side of the ear cup, the piezoelectric element is provided inside the ear pad and supported by the buffer material to be pressed against a skin around the ear, the ear pad is detachably attached to the baffle board, and the baffle board has a connecter to which the wire is connected.Type: GrantFiled: December 8, 2009Date of Patent: December 4, 2012Assignee: Kabushiki Kaisha Audio-TechnicaInventor: Tominori Kimura
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Patent number: 8311247Abstract: In order to miniaturize a piezoelectric body module, in which a rhombus-shaped electronic part 4 and a polygonal-shaped electronic part 5 are arranged on a rectangular substrate 2: the rhombus-shaped electronic part 4 is arranged on the substrate 2 such that a side 105 of the substrate 2 and a side 101 of the rhombus-shaped electronic part 4 are parallel to each other; and the polygonal-shaped electronic part 5 is arranged on the substrate 2 such that a side 104 of the rhombus-shaped electronic part 4 and a side 109 of the polygonal-shaped electronic part 5 are parallel to each other.Type: GrantFiled: November 12, 2009Date of Patent: November 13, 2012Assignee: Panasonic CorporationInventors: Atsuhito Mizutani, Hideki Kojima, Katuhiro Makihata
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Publication number: 20120269366Abstract: To suppress the transverse displacement of a ribbon due to an impact to a level smaller than that achieved by electromagnetic damping. The switch 150 breaks a path between the piezoelectric element 140 and the secondary winding 132 so as to be non-conductive when a power plug is connected (the microphone is in use), and completes a path between the piezoelectric element 140 and the secondary winding 132 so as to be conductive when a power plug is not connected (the microphone is not in use), in order to generate a driving force in the direction opposite to the displacement direction of the ribbon 10 by causing a current corresponding to power generated in the piezoelectric element 140 to flow in the ribbon 10.Type: ApplicationFiled: March 30, 2012Publication date: October 25, 2012Applicant: KABUSHIKI KAISHA AUDIO-TECHNICAInventor: Hiroshi AKINO
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Patent number: 8295512Abstract: An integrated circuit configured to provide a microphone output signal, comprising: a preamplifier coupled to receive an input signal, generated by either a first microphone member or a second microphone member, where one of the members is movable relative to the other microphone member; a voltage pump to output a pumped voltage; and a low-pass filter coupled to filter the pumped voltage from the voltage pump and to provide a bias voltage to either microphone member.Type: GrantFiled: May 19, 2008Date of Patent: October 23, 2012Assignee: Analog Devices, Inc.Inventors: Michael Deruginsky, Claus Erdmann Fuerst, Mohammad Shajaan, Daifi Sassene
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Patent number: 8290184Abstract: A MEMS microphone has a cover, a base and a MEMS chip. The cover has a contact voice receiving unit which is disposed on the base, and a space is formed between the cover and the base. The MEMS chip is disposed in the space and electrically connected to the base and the contact voice receiving unit. The MEMS microphone enhances the quality of voice transmission by reducing interferences from ambient noises.Type: GrantFiled: February 11, 2011Date of Patent: October 16, 2012Inventor: Fan-En Yueh
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Patent number: 8280080Abstract: A device includes a first wafer, a second wafer, a gasket bonding the first wafer to the second wafer to define a cavity between the first wafer and the second wafer, and an acoustic transducer disposed on the first wafer and disposed within the cavity between the first wafer and the second wafer. One or more apertures are provided for communicating an acoustic signal between the acoustic transducer and an exterior of the device. An aperture may be formed in the cavity itself, or the cavity may be hermetically sealed. An aperture may be formed completely through the first wafer and located directly beneath at least a portion of the acoustic transducer.Type: GrantFiled: April 28, 2009Date of Patent: October 2, 2012Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Joel Philliber, John Choy, David Martin
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Patent number: 8280079Abstract: Provided are a piezoelectric microspeaker and a method of fabricating the same. In the piezoelectric microspeaker, a diaphragm includes a first region and a second region. The first region may be formed of a material capable of maximizing an exciting force, and the second region may be formed of a material having less initial stress and a lower Young's modulus than the first region.Type: GrantFiled: April 27, 2009Date of Patent: October 2, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Seok-whan Chung, Dong-kyun Kim, Byung-gil Jeong
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Patent number: 8280081Abstract: An electrode connection structure of a speaker unit is provided. The speaker unit includes at least one electrode layer, which is made of a conductive material, or made of a non-conductive material with a conductive layer formed on a surface thereof. The electrode connection structure includes a conductive electrode and an adhesive material. The conductive electrode is used for providing power supply signals for the speaker unit to generate sounds. The adhesive material adheres the conductive electrode in parallel with a surface of the electrode layer. The adhesive material has adhesive characteristics, so as to electrically connect the conductive electrode and the electrode layer, in which the adhesive material is adhered to a side of the surface of the electrode layer closely adjacent to the conductive electrode with a certain area.Type: GrantFiled: December 25, 2008Date of Patent: October 2, 2012Assignee: Industrial Technology Research InstituteInventors: Yu-Min Lin, Chang-Ho Liou, Yu-Wei Huang, Ming-Daw Chen, Rong-Shen Lee
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Patent number: 8275155Abstract: A method for fabricating a micro speaker is provided, including forming a package wafer and a device wafer by batch processing, bonding the package wafer and the device wafer to each other, and forming a diaphragm by isotropic-etching a back surface of the device wafer using a xenon difluoride (XeF2). As a result, a micro-electronic-mechanic system (MEMS) technology-based piezoelectric micro speaker having a wide frequency response range is realized, by batch processing, thereby providing simplified structure and processing and reducing fabricating cost.Type: GrantFiled: August 6, 2008Date of Patent: September 25, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Byung-gil Jeong, Hyung-jae Shin, Seok-whan Chung, Dong-kyun Kim
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Patent number: 8256093Abstract: An acoustic mirror of alternately arranged layers of high and low acoustic impedances is manufactured in that a basic material having a first layer of the layer sequence is initially provided, on which a second layer of the layer sequence is created on the first layer such that the second layer of the layer sequence partially covers the first layer. Subsequently, a planarization layer is applied onto the layer sequence, and the planarization layer is removed in an area which in the common layer plane projects laterally beyond the second layer so as to result in a residual planarization layer. Finally, a termination layer is applied onto the layer sequence and the residual planarization layer.Type: GrantFiled: January 11, 2010Date of Patent: September 4, 2012Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventor: Gernot Fattinger
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Patent number: 8241201Abstract: A method and device for connecting a bone conductor transducer contained in a housing to the skull bone for the transmission of vibrations characterized by, that the housing has at least one surface, which is placed against the bottom plane of a recess shaped in the temporal bone with a static force exceeding the dynamic signal forces.Type: GrantFiled: February 19, 2009Date of Patent: August 14, 2012Assignee: Osseofon ABInventor: Bo Hakansson
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Patent number: 8165324Abstract: A cost-effective technology for implementing a micromechanical component is provided, whose layer construction includes at least one diaphragm on the upper side and at least one counter-element, a hollow space being formed between the diaphragm and the counter-element, and the counter-element having at least one through hole to a back volume. This back volume is formed by a sealed additional hollow space underneath the counter-element and is connected to the upper-side of the layer construction by at least one pressure equalization opening. This component structure permits the integration of the micromechanical sensor functions and evaluation electronics on one chip and is additionally suitable for mass production.Type: GrantFiled: April 2, 2007Date of Patent: April 24, 2012Assignee: Robert Bosch GmbHInventors: Ando Feyh, Marco Lammer
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Patent number: 8150094Abstract: An electroacoustic transducer comprises an electric sound conversion section that vibrates a mechanical device based on an electric signal so as to emit a sound wave; and an electromagnetic wave radiation section that generates and emits an electromagnetic wave from the electrical signal.Type: GrantFiled: July 8, 2008Date of Patent: April 3, 2012Inventor: Yukihiro Ando
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Patent number: 8121317Abstract: Provided is a piezoelectric microphone. The piezoelectric microphone includes a plurality of cells each having a lower electrode, a piezoelectric layer, and an upper electrode. The cells can be arranged on a protection layer in various patterns. Since the piezoelectric microphone includes the plurality of cells, the voltage level of a piezoelectric signal of the piezoelectric microphone can be easily increased to a desired level by adjusting the number of the cells. Thus, the sensitivity of the piezoelectric microphone can be increased.Type: GrantFiled: July 13, 2007Date of Patent: February 21, 2012Assignee: Mems Solution Inc.Inventor: Jaemyoung Jhung
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Patent number: 8114697Abstract: A piezoelectric microphone, a speaker, a microphone-speaker integrated device and a manufacturing method thereof are provided. The microphone-speaker integrated device includes a silicon substrate and an insulating layer deposited on the silicon substrate; a piezoelectric plate formed on the insulating layer; and a mating electrode formed on the piezoelectric plate. The mating electrode is patterned with a polarity arrayed in series.Type: GrantFiled: August 20, 2008Date of Patent: February 14, 2012Assignee: Electronics and Telecommunications Research InstituteInventors: Hye Jin Kim, Sung Q Lee, Sang Kyun Lee, Jae Woo Lee, Kang Ho Park, Jong Dae Kim
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Patent number: 8107646Abstract: In an acoustic vibration generating element, a piezoelectric bimorph element or unimorph element is covered with a covering member of a flexible material at least on two surfaces perpendicular to a thickness direction. The covering member may be provided with a plurality of V-shaped grooves so as to improve a generated vibrating force. Alternatively, the covering member may be provided with an air chamber in the vicinity of a surface of one side so as to prevent sound leakage. Further, the covering member and an earhook may be integrally formed by the flexible material so as to achieve a light-weight acoustic vibration generating element suitable for a bone conduction speaker.Type: GrantFiled: December 20, 2007Date of Patent: January 31, 2012Assignee: NEC TOKIN CorporationInventor: Mitsuo Tamura
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Patent number: 8103025Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.Type: GrantFiled: December 30, 2005Date of Patent: January 24, 2012Assignee: Epcos PTE Ltd.Inventors: Matthias Mullenborn, Jochen F. Kuhmann, Peter Scheel
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Patent number: 8094844Abstract: A micro acoustic transducer and manufacturing method are provided. Firstly, a substrate having one first and second cavities is provided. Then, a backplate with a plurality of acoustic holes is formed on the substrate, and a diaphragm is formed on the backplate. An air gap is formed between the backplate and the diaphragm. The air gap, second cavity, and first cavity are communicated with each other through the acoustic holes. A plurality of rings is formed around the diaphragm. These rings are used to hitch pillars formed on the substrate or fasteners can be formed on the substrate for fastening the diaphragm on fastener holes. Through the arrangement of the rings or fasteners used as the boundary structure of the diaphragm, the mechanical sensitivity of the diaphragm is improved. Moreover, the backplate is supported by a single crystal structure formed by etching the substrate such that the stability is promoted.Type: GrantFiled: January 4, 2007Date of Patent: January 10, 2012Assignee: Industrial Technology Research InstituteInventor: Po-Hsun Sung
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Patent number: 8090125Abstract: A contact type electret condenser pickup to deliver high anti noise, top talking quality, and comprehensive range of applications includes a casing provided with an accommodation chamber to contain an O-ring, a vibration part, an insulation packing, a back plate retaining ring containing a back plate, a conductive connection ring, and a circuit board horizontally placed in sequence; vibration of a sound of a user is transmitted to the vibration part; then an inertia vibration of the metal sheet changes capacitance between the vibration part and the back plate; the changed vibration is converted through the circuit board set into voltage of alternating signals for output variable according to changes of vibration.Type: GrantFiled: August 17, 2007Date of Patent: January 3, 2012Assignee: Transound Electronics Co., Ltd.Inventors: Hu-Ming Zheng, Zhi-Jian He, Yi Ouyang
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Patent number: 8068806Abstract: A portable terminal apparatus where a talking can be speedily switched to that using a bone conduction speaker even in the talking. In this device, an upper housing (101) has a cutout section (106) for clearing a step section (103). Installation sections (107) are arranged so as to set the cutout section (106) between them and are combined with a hinge provided in the step section (103). The upper housing (101) can be pivoted and folded relative to a lower housing (102). The lower housing (102) has a keypad (110) and also has the step section (103) formed higher by one step than a panel surface (112) of the lower housing (102). The step section (103) receives a bone conduction speaker (104) and has at its top section a vibration surface (105).Type: GrantFiled: December 1, 2005Date of Patent: November 29, 2011Assignee: Panasonic CorporationInventors: Koji Taniguchi, Katsumasa Yamaguchi, Akitoshi Mori
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Patent number: 8059842Abstract: A capacitor microphone is constituted by a plate having a fixed electrode, a diaphragm including a center portion and at least one near-end portion that is fixed to the outer periphery, in which the center portion having a vibrating electrode, which is positioned relative to the fixed electrode and which vibrates in response to sound waves, is increased in rigidity in comparison with the near-end portion; and a spacer that is fixed to the plate and the near-end portion of the diaphragm and that has an air gap formed between the plate and the diaphragm. Alternatively, a diaphragm electrode is horizontally supported by extension arms extended from a circular plate thereof and is vertically held in a hanging state being apart from a fixed electrode with a controlled distance therebetween.Type: GrantFiled: September 7, 2006Date of Patent: November 15, 2011Assignee: Yamaha CorporationInventors: Yukitoshi Suzuki, Tamito Suzuki
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Patent number: 8041065Abstract: The acoustic resistance inside the microphone of the present invention can be adjusted mechanically by a simple electrical operation from the outside, and thereby directivity can be changed easily without adversely affecting the acoustic characteristic, even if the microphone is a single directivity dynamic type microphone. The microphone has a front acoustic terminal and a rear acoustic terminal, and makes directivity variable by having an acoustic resistance changing unit of the rear acoustic terminal. The acoustic resistance changing unit has a piezoelectric element arranged in opposition to the rear acoustic terminal with an air layer in between, and makes the acoustic resistance of the rear acoustic terminal variable by varying a voltage to be applied to the piezoelectric element.Type: GrantFiled: October 26, 2007Date of Patent: October 18, 2011Assignee: Kabushiki Kaisha Audio-TechnicaInventor: Hiroshi Akino
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Patent number: 7992283Abstract: A differential microphone having a perimeter slit formed around the microphone diaphragm that replaces the backside hole previously required in conventional silicon, micromachined microphones. The differential microphone is formed using silicon fabrication techniques applied only to a single, front face of a silicon wafer. The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication. This secondary operation adds complexity and cost to the micromachined microphones so fabricated. Comb fingers forming a portion of a capacitive arrangement may be fabricated as part of the differential microphone diaphragm.Type: GrantFiled: January 31, 2006Date of Patent: August 9, 2011Assignee: The Research Foundation of State University of New YorkInventor: Ronald N. Miles
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Patent number: 7971337Abstract: The production of a hearing aid device can be simplified by the use of a microphone module with a plurality of microphones. To attach and electrically contact the microphones, the invention provides a microphone carrier with three-dimensionally directed conductor traces in MID technology. In a complicated microphone arrangement with a plurality of microphones, a single microphone module can thereby be used on which all microphones of the hearing aid device are attached and electrically connected.Type: GrantFiled: July 2, 2007Date of Patent: July 5, 2011Assignee: Siemens Audiologische Technik GmbHInventors: Holger Kral, Joseph Sauer, Markus Trautner
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Patent number: 7944118Abstract: A system for generating electrical power supply signals includes at least one heat engine that undergoes heating/cooling cycles and corresponding temperature variations. A thermoacoustic element is thermally coupled to the chamber. The temperature variations of the heat engine induce thermoacoustic oscillations of the thermoacoustic element which form a pressure wave. At least one piezoelectric transducer is deformed by the pressure wave. A power converter can be used to transform the electric signals generated in response to deformation of the at least one piezoelectric transducer to a desired electrical power supply signal. The heat engine preferably uses a geothermal source of cold and an ambient source of hot (typically used in the summer months), or vice-versa (typically used in the winter months).Type: GrantFiled: October 4, 2007Date of Patent: May 17, 2011Inventor: Kimberly Peacock
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Patent number: 7905006Abstract: Provided is a faceplate for an In-The-Ear (ITE) hearing aid and a method of manufacturing a faceplate for an In-The-Ear (ITE) hearing aid in which the faceplate can be manufactured in a compact size, using a foldable flexible printed circuit board (PCB), while maintaining the quality, enabling mass-production, and reducing the manufacturing cost.Type: GrantFiled: September 25, 2006Date of Patent: March 15, 2011Inventor: You Jung Kwon
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Patent number: 7894618Abstract: An apparatus and method for discriminating a directional component of a propagating pressure wave using an array of operatively-coupled displacement sensors are disclosed. In accordance with the illustrative embodiment, each displacement sensor in the array comprises two parallel layers, at least one of which is movable. The output signal of each displacement sensor is based on the separation of the layers. The displacement sensors are operatively-coupled through a compressible fluid such that the response of one of the sensors to an input can cause an output signal in at least one of the other sensors. The operative-coupling of the displacement sensors amplifies relative phase information between their respective output signals, which results in improved directionality. Some embodiments of the present invention are particularly well-suited for use in microphones.Type: GrantFiled: July 28, 2006Date of Patent: February 22, 2011Assignee: Symphony Acoustics, Inc.Inventor: Dustin Wade Carr
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Patent number: 7873176Abstract: An electrostatic microphone has a capsule housing and a diaphragm, a rigid electrode, and an electrical circuit on a printed circuit board arranged in the capsule housing. The diaphragm is connected to a ring shoulder provided on the front side of the capsule housing. Preferably, the capsule housing is divided into a housing bottom and a capsule lid, and the ring shoulder is provided on the capsule lid.Type: GrantFiled: April 18, 2008Date of Patent: January 18, 2011Assignee: AKG Acoustics GmbHInventors: Gino Pavlovic, Richard Pribyl
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Patent number: 7860259Abstract: A piezoelectric acoustic element 1 of the present invention comprising a hollow casing 5 having a opening 3, a piezoelectric element 7 that is disposed in said casing 5 and bends when a voltage is applied thereto, and diaphragm 8 provided at the opening 3 of said casing 5; wherein said piezoelectric element 7 and said diaphragm 8 are joined through a vibration transmitting member 9.Type: GrantFiled: December 20, 2004Date of Patent: December 28, 2010Assignee: NEC CorporationInventors: Yasuharu Onishi, Yasuhiro Sasaki, Nozomi Toki
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Patent number: 7710402Abstract: An information display device (1A) comprises a touch panel (TP), an information display panel (LCD) located under the touch panel (TP) and four strip-like piezoelectric elements (E), which are caused to be vibrated and displaced by a pressing force generated when the touch panel (TP) is pressed, being disposed at the outer peripheral portion of the touch panel (TP), wherein both end portions of each strip-like piezoelectric element (E) are supported by surface-like holders (112A, 112B) with twist resilient deformation structures and a rotary shaft (113) so that each strip-like piezoelectric element (E) may not be disturbed from being vibrated and displaced. In this touch panel type information device, both end portions of a plurality of strip-like piezoelectric elements are supported by the supporting member having the holders with the twist resilient deformation structure which do not disturb both end portions of the strip-like piezoelectric elements from being vibrated and displaced.Type: GrantFiled: August 26, 2004Date of Patent: May 4, 2010Assignee: Sony CorporationInventors: Mikio Takenaka, Shigeaki Maruyama
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Patent number: 7688988Abstract: It is detected whether or not a face image is included in an image represented by applied image data. When the face image is detected, an image area including the detected face image is cut out. A plurality of rectangular projection information creating windows are set radially from the center of the cut image. With respect to each of image portions within the plurality of projection information creating windows, projection information is created and the projection information is converted into data representing the distance from an ideal skin color. With respect to each of the image portions within the plurality of projection information creating windows, a boundary position between a skin color image and an image other than the skin color image is determined on the basis of the distance data for each unit pixel position.Type: GrantFiled: March 28, 2006Date of Patent: March 30, 2010Assignee: FUJIFILM CorporationInventor: Toshihiko Kaku
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Patent number: 7669310Abstract: An acoustic mirror of alternately arranged layers of high and low acoustic impedances is manufactured in that a basic material having a first layer of the layer sequence is initially provided, on which a second layer of the layer sequence is created on the first layer such that the second layer of the layer sequence partially covers the first layer. Subsequently, a planarization layer is applied onto the layer sequence, and the planarization layer is removed in an area which in the common layer plane projects laterally beyond the second layer so as to result in a residual planarization layer. Finally, a termination layer is applied onto the layer sequence and the residual planarization layer.Type: GrantFiled: October 18, 2006Date of Patent: March 2, 2010Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventor: Gernot Fattinger
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Publication number: 20090285418Abstract: An acoustic-electric transducer for a microphone may include a cavity delimited by a wall and having an opening; a diaphragm having an outer boundary, said diaphragm extending across said opening so that an air gap is provided transversely outwards of the diaphragm between said outer boundary of said diaphragm and said cavity wall; and an actuator configured to adjust a size of said air gap.Type: ApplicationFiled: May 15, 2008Publication date: November 19, 2009Applicant: Sony Ericsson Mobile Communications ABInventor: Gunnar KLINGHULT
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Patent number: 7579753Abstract: An electronic device and transducer structures are described.Type: GrantFiled: November 27, 2006Date of Patent: August 25, 2009Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: R. Shane Fazzio, Walter Dauksher, Atul Goel