Vibrating Electrical Contract Patents (Class 381/178)
  • Patent number: 8989411
    Abstract: A vacuum sealed directional microphone and methods for fabricating said vacuum sealed directional microphone. A vacuum sealed directional microphone includes a rocking structure coupled to two vacuum sealed diaphragms which are responsible for collecting incoming sound and deforming under sound pressure. The rocking structure's resistance to bending aids in reducing the deflection of each diaphragm under large atmospheric pressure. Furthermore, the rocking structure exhibits little resistance about its pivot thereby enabling it to freely rotate in response to small pressure gradients characteristic of sound. The backside cavities of such a device can be fabricated without the use of the deep reactive ion etch step thereby allowing such a microphone to be fabricated with a CMOS compatible process.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: March 24, 2015
    Assignee: Board of Regents, The University of Texas System
    Inventors: Neal A. Hall, Michael Louis Kuntzman, Karen Denise Kirk
  • Patent number: 8948439
    Abstract: An acoustic conversion device includes: a driving unit including a pair of magnets disposed so as to face each other, a yoke to which the pair of magnets are attached, a coil to which driving current is supplied, a vibrating portion which vibrates when driving current is supplied to the coil, and an armature disposed between the pair of magnets with the vibrating portion being passed through the coil; and a diaphragm unit including a diaphragm, and a beam portion for propagating the vibration of the vibrating portion to the diaphragm; with a coil attachment portion to which the coil is attached, located in a state in parallel with the vibrating portion, being provided to the armature.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: February 3, 2015
    Assignee: Sony Corporation
    Inventors: Tsutomu Nagumo, Koji Matsuda, Koji Nageno, Takeshi Hara, Takahiro Suzuki, Takayuki Ishii, Kenji Hiraiwa
  • Publication number: 20140369534
    Abstract: A sound pickup system is disclosed. The sound pickup system includes a screen, an accelerometer attached to the screen, and a pre-processing module electrically connecting with the accelerometer. The screen is configured to detect a vibration caused by sound waves, the accelerometer is configured to receive the vibration detected by the screen and convert the vibration into an acceleration signal, and the pre-processing module is configured to receive the acceleration signal, and process the acceleration signal then convert the processed acceleration signal into a voice signal.
    Type: Application
    Filed: January 24, 2014
    Publication date: December 18, 2014
    Applicants: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD., AAC ACOUSTIC TECHNOLOGIES (CHANGZHOU) CO., LTD., AAC TECHNOLOGIES (NANJING) CO., LTD.
    Inventors: Chao Wang, Qi Tang
  • Patent number: 8787601
    Abstract: A condenser microphone includes a substrate having a cavity, first and second spacers defining an opening, a diaphragm having a rectangular shape positioned inside of the opening, and a plate having a rectangular shape positioned just above the diaphragm. Plate joint portions integrally interconnected with two sides of the plate are directly attached onto the second spacer. Supports, which are attached onto the second spacer across the opening and project inwardly of the opening, are connected to the prescribed portions of the diaphragm via third spacers relatively to the other two sides of the plate. The center portion of the diaphragm can be designed in a multilayered structure, and the peripheral portion can be bent outwardly. In addition, both ends of the diaphragm are fixed in position, while free ends of the diaphragm vibrate due to sound waves.
    Type: Grant
    Filed: February 21, 2007
    Date of Patent: July 22, 2014
    Assignee: Yamaha Corporation
    Inventors: Toshihisa Suzuki, Yukitoshi Suzuki, Nariyasu Yaguchi, Kazushi Sakurauchi
  • Patent number: 8755540
    Abstract: The instant development relates to utilizing the sonic motion generated by a speaker to move objects in various directions in response to the variation in the frequency and amplitude of the sonic vibrations. This can be used to move objects in a linear and/or rotating manner.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: June 17, 2014
    Assignee: Lund and Company Invention L.L.C.
    Inventors: Bruce D Lunc, Michael D Starrick, Guruge Weerauppulige
  • Patent number: 8542852
    Abstract: An electro-mechanical transducer contains a vibrating electrode (15b), a vibrating-electrode-insulating film (15a) disposed at a bottom surface of the vibrating electrode (15b), an electret layer (13) facing to the vibrating electrode (15b), an electret-insulating layer (14e) joined to a top surface of the electret layer (13), and a back electrode 17 in contact with a bottom surface of the electret layer (13). A microgap between ten nanometers and 100 micrometers is established between the vibrating-electrode-insulating film (15a) and electret-insulating layer (14e). A central line average roughness Ra of the vibrating electrode (15b), including a bending, is 1/10 or less of a gap width measured between the bottom surface of the vibrating electrode (15b) and the top surface of the electret layer (13).
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: September 24, 2013
    Assignee: National University Corporation Saitama University
    Inventor: Kensuke Kageyama
  • Patent number: 8498433
    Abstract: The instant development relates to utilizing the sonic motion generated by a speaker to move objects in various directions in response to the variation in the frequency and amplitude of the sonic vibrations. This can be used to move objects in a linear and/or rotating manner. This is accomplished by the utilization of directionality oriented members.
    Type: Grant
    Filed: July 6, 2009
    Date of Patent: July 30, 2013
    Assignee: Lund and Company Invention, LLC
    Inventors: Bruce D. Lund, Michael D Starrick, Guruge Weerauppulige
  • Patent number: 8351625
    Abstract: Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A back chamber 45 is vertically opened in a silicon substrate 42. A thin film-like diaphragm 43 to serve as a movable electrode plate is formed on the top surface of the substrate 42 so as to cover the back chamber 45. The back plate 48 is fixed to the top surface of the substrate 42 so as to cover the diaphragm 43, and a fixed electrode plate 49 is provided on the under surface of the back plate 48. Further, the diaphragm 43 is divided into a plurality of areas by the slit 47, and the respective plurally divided diaphragms 43a, 43b and the fixed electrode plate 49 constitute a plurality of parallelly connected capacitors (acoustic sensing sections 60a, 60b).
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: January 8, 2013
    Assignee: OMRON Corporation
    Inventor: Takashi Kasai
  • Patent number: 8311246
    Abstract: A microphone includes: a needle-like electrode; an opposite electrode facing the needle-like electrode; a discharge section formed between the needle-like electrode and the opposite electrode; a high-frequency oscillating circuit including the discharge section and producing a high-frequency discharge at the discharge section; a sound wave introduction section through which a sound wave is introduced to the discharge section; and a modulated signal extracting unit that extracts a signal modulated, according to the sound wave oscillated by the high-frequency oscillating circuit and introduced to the discharge section. The high-frequency discharge is produced at the discharge section as the high-frequency oscillating circuit performs high-frequency oscillation with the discharge section between the needle-like electrode and the opposite electrode as a return path, and a frequency modulation is performed as an equivalent impedance of the discharge section changes according to the sound wave.
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: November 13, 2012
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 8265309
    Abstract: A condenser microphone is disclosed. The condenser microphone includes a substrate having a cavity, a supporting member connected to the substrate, and a diaphragm isolated to the supporting member. The supporting member has a periphery portion and a plurality of stationary electrodes extending from the periphery portion to a center of the supporting member. The diaphragm has a vibrating member and a sustaining member connected to the vibrating member and the vibrating member defines a plurality of movable electrodes protruding from a periphery of the vibrating member. Each of the movable electrodes is located between two adjacent stationary electrodes and each of the stationary electrodes is located between two adjacent two movable electrodes.
    Type: Grant
    Filed: September 26, 2009
    Date of Patent: September 11, 2012
    Assignees: AAC Acoustic Technologies (Shenzhen) Co. Ltd., American Audio Components Inc.
    Inventor: Rui Zhang
  • Patent number: 8218796
    Abstract: A microphone unit includes a substrate. The substrate includes a first face formed with a first recess, a second face opposite to the first face, and a through hole communicating the second face to a bottom part of the first recess. A diaphragm unit includes a diaphragm, and at least a part of which is disposed in the first recess so that the diaphragm opposes the through hole.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: July 10, 2012
    Assignees: Funai Electric Advanced Applied Technology Research Institute Inc., Funai Electric Co., Ltd.
    Inventors: Fuminori Tanaka, Ryusuke Horibe, Takeshi Inoda, Rikuo Takano, Kiyoshi Sugiyama, Toshimi Fukuoka, Masatoshi Ono
  • Patent number: 8090125
    Abstract: A contact type electret condenser pickup to deliver high anti noise, top talking quality, and comprehensive range of applications includes a casing provided with an accommodation chamber to contain an O-ring, a vibration part, an insulation packing, a back plate retaining ring containing a back plate, a conductive connection ring, and a circuit board horizontally placed in sequence; vibration of a sound of a user is transmitted to the vibration part; then an inertia vibration of the metal sheet changes capacitance between the vibration part and the back plate; the changed vibration is converted through the circuit board set into voltage of alternating signals for output variable according to changes of vibration.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: January 3, 2012
    Assignee: Transound Electronics Co., Ltd.
    Inventors: Hu-Ming Zheng, Zhi-Jian He, Yi Ouyang
  • Patent number: 8073179
    Abstract: A micro-electro-mechanical-system microphone package includes a substrate, a micro-electro-mechanical-system microphone chip mounted on the substrate, and a cover attached to the substrate to cover the micro-electro-mechanical-system microphone chip. The cover is provided with a sound inlet through which the micro-electro-mechanical-system microphone receives external sound. The micro-electro-mechanical-system microphone chip includes a conductive base connected to a constant voltage, a shielding layer supported by the conductive base and connected to the constant voltage, a diaphragm disposed between the conductive base and the shielding layer, and a back plate also disposed between the conductive base and the shielding layer.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: December 6, 2011
    Assignee: Fortemedia, Inc.
    Inventors: Li-Te Wu, Chia-Jen Hsu
  • Patent number: 7881489
    Abstract: An ultrasonic transducer includes: a fixed electrode having corrugations on the surface; a vibrating film having an electrode layer and disposed on the surface of the fixed electrode; and a holding member which holds the fixed electrode and the vibrating film. The ultrasonic transducer is driven by applying an AC signal between the electrode layer of the vibrating film and the fixed electrode, and generates a sound pressure of at least 120 dB within a frequency range from 20 kHz to 120 kHz.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: February 1, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Kinya Matsuzawa, Hirokazu Sekino, Yoshiki Fukui, Shinichi Miyazaki
  • Publication number: 20100195850
    Abstract: A microphone includes: a needle-like electrode; an opposite electrode facing the needle-like electrode; a discharge section formed between the needle-like electrode and the opposite electrode; a high-frequency oscillating circuit including the discharge section and producing a high-frequency discharge at the discharge section; a sound wave introduction section through which a sound wave is introduced to the discharge section; and a modulated signal extracting unit that extracts a signal modulated, according to the sound wave oscillated by the high-frequency oscillating circuit and introduced to the discharge section. The high-frequency discharge is produced at the discharge section as the high-frequency oscillating circuit performs high-frequency oscillation with the discharge section between the needle-like electrode and the opposite electrode as a return path, and a frequency modulation is performed as an equivalent impedance of the discharge section changes according to the sound wave.
    Type: Application
    Filed: February 4, 2010
    Publication date: August 5, 2010
    Inventor: Hiroshi Akino
  • Patent number: 7630506
    Abstract: The present invention provides a condenser microphone unit that enables stabilization of the conduction between an impedance converter (FET) and a rear pole plate constituting a condenser section. A condenser microphone unit 11 includes a rear pole plate 14 forming a condenser section 12 together with a diaphragm 13, an impedance converter 43 mounted on a printed circuit board 42, and a relay terminal member 32 placed between the rear pole plate 14 and the impedance converter 43 to electrically connect the rear pole plate 14 to the impedance converter 43 via the relay terminal member 32. The rear pole plate 14 and the impedance converter 43 are accommodated in a metal case 52. The conductive elastic material 32 is formed of a combination of a first conductive elastic material 33 that contacts the impedance converter 43 and a second conductive elastic material 34 that contacts the rear pole plate 14. This stabilizes the connection between the rear pole plate 14 and the second conductive elastic material 34.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: December 8, 2009
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 7590252
    Abstract: The outer face of a case which accommodates a whole microphone is coated by a material having a heat conductivity which is lower than that of a metal, and a material transforming temperature which is higher than the charge dissipating temperature of a dielectric layer for forming an internal electret, and which is higher than 260° C., so that the internal temperature rise can be mitigated by the thermal resistance and the thermal capacity of the whole interior. When a microphone is attached to an application equipment, particularly, the microphone may be passed through a reflow solder bath for a short time period. A heat-resistant structure which can prevent the function from being impaired by a high temperature in the period is provided.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: September 15, 2009
    Assignee: Panasonic Corporation
    Inventors: Katsuhiro Makihata, Hiroshi Ogura, Yoshinobu Yasuno
  • Publication number: 20080085020
    Abstract: A vibration unit includes a sound ring and a membrane attached to the sound ring. The membrane includes a rim for attachment to a shell of an acoustic device, a convex-concave annular region, a first non-planar connective region between the convex-concave annular region and the rim, a convex-concave circular region and a second non-planar connective region between the convex-concave circular region and the convex-concave annular region.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 10, 2008
    Inventors: Chi-Yi Tsai, Yu-Lun Lin
  • Publication number: 20070230722
    Abstract: An electret condenser microphone (ECM) forms an air-gap capacitor structure in which an upper electrode and a lower electrode are opposed to each other with its hollow portion interposed therebetween, and an electret film made of a charge retention material is formed between the electrodes. The ECM is formed continuously with a semiconductor substrate, and the electret film is made of an amorphous perfluoropolymeric resin. The electret film made of such a material can be formed on the substrate by spin coating. This facilitates reducing the thickness of the electret film. In addition, the film can be easily etched by a fluorine based gas used in a semiconductor process. This permits fine patterning, resulting in the reduced area of a condenser.
    Type: Application
    Filed: January 9, 2007
    Publication date: October 4, 2007
    Inventors: Mitsuyoshi Mori, Daisuke Ueda
  • Publication number: 20030003945
    Abstract: A speaker includes a first magnet; a second magnet provided so as to surround the first magnet; a yoke for connecting the first magnet and the second magnet; a first voice coil; a second voice coil; a first diaphragm connected to the first voice coil; a second diaphragm oppositely provided to the first diaphragm with respect to the first magnet and connected to the second voice coil; a first magnetic plate provided between the first diaphragm and the first magnet; and a second magnetic plate provided between the second diaphragm and the first magnet. The first voice coil is provided in a first magnetic gap between the first magnetic plate and the yoke. The second voice coil is provided in a second magnetic gap between the second magnetic plate and the yoke.
    Type: Application
    Filed: May 7, 2002
    Publication date: January 2, 2003
    Inventors: Shuji Saiki, Sawako Usuki
  • Patent number: 6438243
    Abstract: A vibration wave detector having a first diaphragm for receiving vibration waves, such as sound waves and so on, to be propagated in a medium, a resonant unit having a plurality of cantilever resonators each having such a length as to resonate at an individual predetermined frequency, a retaining rod for retaining the resonant unit, a second diaphragm positioned on the opposite side of the first diaphragm with respect to the retaining rod, and a vibration intensity detector for detecting the vibration intensity, for each predetermined frequency, of each of the resonators, by the vibration waves received by the first diaphragm and propagated to the resonant unit through the retaining rod.
    Type: Grant
    Filed: May 27, 1998
    Date of Patent: August 20, 2002
    Assignee: Sumitomo Metal Industries Ltd.
    Inventors: Naoki Ikeuchi, Muneo Harada, Shoichi Fukui, Takahiko Oasa, Shigeru Ando, Kenji Tanaka