Having Electrostatic Element (e.g., Electret, Vibrating Plate) Patents (Class 381/191)
  • Patent number: 7352873
    Abstract: An electret-condenser microphone according to the present invention includes a vibrating diaphragm and a back electrode which compose a condenser; a cylindrical case which houses the vibrating diaphragm and the back electrode; a circuit board which is housed in an opening of the cylindrical case, is fixed to the opening by crimping a crimp edge formed by bending an opening end of the cylindrical case inward, and covers the opening; and a substrate fastened to an outer surface of the circuit board. A circular pattern and annular pattern are formed on the outer surface of the circuit board and a circular pattern and annular pattern are formed on that surface of the substrate which is farther from the circuit board. The circular pattern and annular pattern are connected with the circular pattern and annular pattern via thru-holes in the substrate, and that surface of the substrate on which and are formed serves as a reflow-soldering surface.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: April 1, 2008
    Assignee: Hosiden Corporation
    Inventors: Yasuhiro Shigeno, Mamoru Yasuda, Yasuo Sugimori, Naoki Toyoda
  • Patent number: 7346178
    Abstract: A silicon based microphone sensing element and a method for making the same are disclosed. The microphone sensing element has a diaphragm with a perforated plate adjoining each side or corner. The diaphragm is aligned above one or more back holes created in a conductive substrate wherein the back hole has a width less than that of the diaphragm. Perforated plates are suspended above an air gap that overlies the substrate. The diaphragm is supported by mechanical springs with two ends that are attached to the diaphragm at a corner, side, or center and terminate in a rigid pad anchored on a dielectric spacer layer. A first electrode is formed on one or more rigid pads and a second electrode is formed at one or more locations on the substrate to establish a variable capacitor circuit. The microphone sensing element can be embodied in different approaches to reduce parasitic capacitance.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: March 18, 2008
    Assignee: Silicon Matrix Pte. Ltd.
    Inventors: Wang Zhe, Miao Yubo
  • Patent number: 7343661
    Abstract: A method for making condenser microphones includes: forming a fixed electrode layer structure of a plurality of fixed electrode units; forming a sacrificial layer of a plurality of sacrificial units on one side of the fixed electrode layer structure; forming a diaphragm layer structure of a plurality of diaphragm units on the sacrificial layer; forming a patterned mask layer on an opposite side of the fixed electrode layer structure opposite to the sacrificial layer; forming a plurality of etching channels, each of which extends through the patterned mask layer and the fixed electrode layer structure; removing a portion of the sacrificial layer of each of the sacrificial units so as to form a spacer between a respective one of the fixed electrode units and a respective one of the diaphragm units; and removing the patterned mask layer.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: March 18, 2008
    Assignee: Taiwan Carol Electronics Co., Ltd.
    Inventors: Ray-Hua Horng, Zong-Ying Lin, Jean-Yih Tsai, Chao-Chih Chang
  • Publication number: 20080056515
    Abstract: An electro-acoustic transducer includes a first electro-acoustic transduction unit. The first electro-acoustic transduction unit includes an acoustic radiation plate which radiates a sound wave, a bending vibration plate including a vibrator, and a first coupling member which couples an edge portion of the acoustic radiation plate with an edge portion of the bending vibration plate together.
    Type: Application
    Filed: August 27, 2007
    Publication date: March 6, 2008
    Applicant: NEC CORPORATION
    Inventor: Yoshinori Hama
  • Patent number: 7327851
    Abstract: There is provided a surface mount parallelepiped condenser microphone. In the surface mount parallelepiped condenser microphone, a case has a rectangular box shape with an opening, a backplate has a circular shape with a sound hole, a spacer has thin ring shape, an insulation ring has a hollow cylindrical shape with top and bottom openings, a diaphragm faces the backplate with disposing the spacer therebetween, and a PCB has a rectangular shape with a sound hole at a center portion, the PCB being electrically connected with the diaphragm through a conductive ring, wherein a metal ring, the backplate, the spacer, the insulation ring, the diaphragm, the conductive ring, and the PCB are sequentially disposed in the case, and the case is curled at the opening. Therefore, the direction of the surface mount condenser microphone can be easily detected when mounting on a main PCB.
    Type: Grant
    Filed: February 24, 2005
    Date of Patent: February 5, 2008
    Assignee: BSE Co., Ltd.
    Inventor: Chung Dam Song
  • Patent number: 7317234
    Abstract: A means of integrating a microphone on the same integrated circuit die as other electronics in the system is disclosed. The structure uses solder bump technology to form a gap between an electrode on the silicon and another electrode. Charge is stored on the capacitor so when pressure from sound waves causes one electrode to flex, the capacitance and therefore the charge changes, causing signal current. The structure allows for area efficiency by allowing placement of active silicon circuitry under the microphone.
    Type: Grant
    Filed: July 20, 2005
    Date of Patent: January 8, 2008
    Inventors: Douglas G Marsh, Apparajan Ganesan
  • Patent number: 7316289
    Abstract: An electro-acoustic transducer includes a tone generator, a vibrator, and a case. The tone generator includes a diaphragm, and a voice coil joined to the diaphragm. The vibrator includes a magnetic circuit having a magnetic gap at which the voice coil is positioned, and a suspension made of metal and having a first end joined to the magnetic circuit to suspend the magnetic circuit for allowing the magnetic circuit to vibrate. The case is joined to a periphery of the diaphragm, and includes a metal plate joined to a second end of the suspension. The metal plate is joined to the suspensions reliably, hence allowing the electro-acoustic transducer to be manufactured stably.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: January 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenichi Ajiki, Kimihiro Ando, Masashi Kawabe
  • Patent number: 7316290
    Abstract: A loudspeaker includes a frame, a magnet coupled to the frame and a diaphragm secured to the frame. An acoustic lens may be positioned in front of the diaphragm. An aperture extends through the acoustic lens. The acoustical directivity pattern of the loudspeaker may be modified by the acoustic lens to improve the uniformity of the off axis vs. on axis sound pressure level.
    Type: Grant
    Filed: January 29, 2004
    Date of Patent: January 8, 2008
    Assignee: Harman International Industries, Incorporated
    Inventors: Steven W Hutt, John F Steere, D. B Keele, Jr.
  • Patent number: 7308750
    Abstract: In a rolling process, the level of rolling performed by a rolling mill for one operation is set to 1 ?m to 20 ?m. A magnesium substrate is rolled by rollers while being heated by a thermostatic chamber. As a result, there is manufactured a high-quality magnesium sheet which is less susceptible to influence of oxidation, which realizes a high internal loss, prevention of a drop in sensitivity, and low distortion, and which has a thickness of 30 ?m to 100 ?m. Further, as a result of the magnesium sheet being formed into a semi-dome shape or a dome shape, the sheet can be inexpensively manufactured as a speaker for high-tone playback. In particular, in the case of a magnesium diaphragm into which a dome section and an edge section are integrally formed, high-quality sound can be played back in a high frequency range without involvement of a drop in sensitivity.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: December 18, 2007
    Assignees: Pioneer Corporation, Tohoku Pioneer Corporation
    Inventors: Hiroyuki Tomiyama, Masatoshi Sato, Yoshimi Kudo, Yuichi Kasahara
  • Patent number: 7305750
    Abstract: A loudspeaker and method of assembly according to this invention provides for precise alignment between the frame and motor structure before they are connected to one another, and employs a fixture to form the moving assembly of the speaker, i.e. the voice coil, upper and lower suspensions and diaphragm, outside of the frame so that concentric tolerance stack-up is minimized. The moving assembly, once formed, is mounted as a unit to the frame and motor structure to facilitate assembly and repair of the speaker.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: December 11, 2007
    Assignee: JL Audio, Inc.
    Inventor: Lucio Proni
  • Patent number: 7305096
    Abstract: A dynamic pressure sensing structure used in a condenser microphone includes an upper electrode plate, a lower electrode plate, a spacer and a substrate, wherein the upper and lower electrode plates are separated by the spacer and form a resonance cavity with the substrate. The upper electrode plate comprises a flat vibration area and a surrounding flexible area connected thereto. The lower electrode plate comprises a sensible electrode and an actuation electrode surrounding the sensible electrode. The plate is in connection with the flexible area so that a capacitor is formed between the sense area and the flat vibration area. The actuation electrode provides a polarization voltage to generate an electrostatic force, thereby attract the flexible vibration area to curve downwards so that the flat vibration area moves in a flat state and a distance between the flat vibration area and the sensible electrode is varied correspondingly.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: December 4, 2007
    Assignee: Industrial Technology Research Institute
    Inventors: Mao-Shun Su, Tsung-ter Kuo, Yu-Kon Chou, Yii-Tay Chiou
  • Publication number: 20070274545
    Abstract: An electrostatic speaker capable of relaxing a restriction on the allowable amplitude of a diaphragm while maintaining the linearity of a force acting on the diaphragm. The electrostatic speaker mainly includes electrodes opposed to each other, a diaphragm, and elastic members interposed between the diaphragm and the electrodes. The elastic members have an elastic characteristic that generates a restorative force corresponding to higher order terms of an electrostatic force generated by the electrodes and acting on the diaphragm.
    Type: Application
    Filed: May 23, 2007
    Publication date: November 29, 2007
    Applicant: YAMAHA CORPORATION
    Inventors: Takao Nakaya, Yasuaki Takano, Takashi Yamakawa
  • Patent number: 7302077
    Abstract: The invention relates to an electromagnetic driver comprising a soft magnetic core in the form of an E with three legs and a back, an alternating field driver, magnetically coupled to the soft magnetic core, for generating an alternating magnetic field in the soft magnetic core, depending upon a sound signal, a constant field driver magnetically coupled to the soft magnetic core for generation of a constant magnetic field in the soft magnetic core, a soft magnetic element for coupling to the plate of the planar diaphragm loudspeaker, lying opposite the back and magnetically closing the legs across at least one small induction gap, whereby the constant field and the alternating field are asymmetrically superimposed such that a resulting force, or a resulting torque on the soft magnetic element, is proportional to the sound signal.
    Type: Grant
    Filed: November 16, 2006
    Date of Patent: November 27, 2007
    Assignee: Harman/Becker Automotive Systems GmbH
    Inventors: Wolfgang Bachmann, Hans-Jürgen Regl, Gerhard Krump, Andreas Ziganki
  • Patent number: 7289638
    Abstract: An electroacoustic capsule or electroacoustic transducer for an electroacoustic device has electrostrictive or magnetostrictive elements connected to a controllable power supply. Dimensional changes of the electrostrictive or magnetostrictive elements cause changes of the inner geometry of the electroacoustic capsule or electroacoustic transducer. This allows the adjustment of the capsule or transducer to the electroacoustic device in which it is mounted so that individual and dynamic adjustments are possible.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: October 30, 2007
    Assignee: AKG Acoustics GmbH
    Inventors: Gino Pavlovic, Kurt Nell
  • Patent number: 7287327
    Abstract: A method for producing an electret capacitor microphone high in sensitivity and stable in acoustic characteristic. A PET film stretched with predetermined tension is bonded to a diaphragm support ring to perform stretch and fixation of a diaphragm to produce a diaphragm sub-assembly. The diaphragm sub-assembly is heated at a predetermined temperature (e.g. 200° C.) higher than a second order transition point of PET. Then, the diaphragm sub-assembly is packed in a housing. Because the diaphragm sub-assembly is heated at the predetermined temperature before packed in the housing, the stiffness of the diaphragm is reduced. Because the stiffness of the diaphragm 26 is reduced in such a manner, the tension at the time of stretch and fixation of the diaphragm can be set to a large value to prevent the diaphragm from being crinkled.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: October 30, 2007
    Assignee: Star Micronics Co., Ltd.
    Inventors: Motoaki Ito, Kentaro Yonehara
  • Patent number: 7286680
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: October 23, 2007
    Assignee: Sonion Nederland B.V.
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
  • Publication number: 20070242844
    Abstract: An acoustic transducer, specifically an electrostatic loudspeaker (ESL) providing curvature in two directions for improved dispersion of sound waves. The compound curvature also provides a virtual focus of the propagated sound waves for accurate reproduction of musical program material recorded with standard single-point microphones. The highly directional nature of high frequency sound waves requires that a flat or cylindrical electrostatic transducer must be physically tall to allow a listener to either recline or stand. The two-axis curved structure enables a compact form of ESL to be realized, including bookshelf type loudspeakers whereas all known commercial units are comparable in height to that of a human listener. The individual curved ESL panels can also be readily combined to create larger transducer assemblies including omni-directional units.
    Type: Application
    Filed: April 12, 2007
    Publication date: October 18, 2007
    Inventor: MURRAY R. HARMAN
  • Publication number: 20070195976
    Abstract: An electrostatic ultrasonic transducer includes a first electrode that has through-holes, a second electrode that has through-holes, and a vibrating membrane that is disposed such that the through-holes of the first electrode and the through-holes of the second electrode form a pair, interposed between a pair of electrodes composed of the first electrode and the second electrode, and having a conductive layer applied with a direct current bias voltage. The first electrode and the second electrode each have counter electrode portions that are formed in the through-holes to face the vibrating membrane, and a modulated wave, which is obtained by modulating a carrier wave in an ultrasonic frequency band with a signal wave in an audible frequency band, is applied between the pair of electrodes.
    Type: Application
    Filed: February 21, 2007
    Publication date: August 23, 2007
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hirokazu Sekino, Kinya Matsuzawa, Hideki Kojima
  • Patent number: 7260230
    Abstract: A microphone (100) and method of manufacture thereof is disclosed. The microphone (100) includes a housing (108), a diaphragm assembly (120), a spacer (134), a backplate assembly (140), a body assembly (150), and a printed circuit board (164) disposed within the housing (100). The diaphragm assembly (120) and the backplate assembly (140) constitute a variable capacitor responsive to sound pressure level changes coupled through an acoustic port (118). The base capacitance is inversely proportional to the thickness of the spacer (134). The backplate assembly (140) is disk shaped with protrusions and coupled to the body assembly (150) such that an acoustic passage (172) is formed between an outer edge of the backplate assembly (140) and an inner periphery of the hollow body assembly (150). The body assembly (150) comprises conductive mount (158) for electrically coupling the backplate assembly (140) to a first surface (166) of a circuit board (164).
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: August 21, 2007
    Assignee: Knowles Electronics, LLC.
    Inventor: Jen Nan Feng
  • Patent number: 7233674
    Abstract: An electret condenser microphone includes a case, a diaphragm electrically connected to the case, a fixed electrode plate disposed opposing the diaphragm with a spacer interposed therebetween, the fixed electrode plate being formed of a metal plate coated with a polymer film on which an electret is formed, an insulating ring for insulating the fixed electrode plate from the case, a printed circuit board (PCB) defining a back chamber with the fixed electrode plate, and an integrated base for supporting the fixed electrode plate and the PCB and electrically connecting the fixed electrode plate to the circuit component embedded in the PCB through a connecting terminal. The integrated base includes a hollow cylindrical insulating body and metal plating layers formed on the top and bottom of the insulating body. Outer diameters of the metal plating layers are less than the insulating body and are electrically connected by a conductor.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: June 19, 2007
    Assignee: BSE Co., Ltd.
    Inventor: Chung Dam Song
  • Patent number: 7227966
    Abstract: A piezo-electric speaker ensures a uniform sound in a broad band and can easily reproduce a signal of large amplitude or sound. A piezo-electric speaker has a piezo-electric member to generate a vibration according to an electric signal applied thereto. A piezo-electric vibration plate converts the vibration to a sound. The piezo-electric vibration plate is positioned closely to the piezo-electric member. The piezo-electric vibration plate is divided into parts of any configuration and is connected to the piezo-electric member.
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: June 5, 2007
    Inventor: Fujihiko Kobayashi
  • Patent number: 7216417
    Abstract: Method for manufacturing an electromechanical sensor element for converting mechanical forces produced by the movements and vital functions or a person into electric signals, in which method a sensor film (11) is provided with metallic electrodes (15,16) placed on either side of it, at least one of said electrodes being a signal electrode, in which method is produced by cutting off a larger amount of sensor element material, in which method in the manufacture of sensor element material the electrodes are created in a continuous roll-to-roll process, and in which method the sensor element material is produced by laminating as a continuous roll-to-roll process. At least the sensor element material consists of repeated electrode patterns and a sensor element of a desired size and/or shape is formed by cutting the material between the patterns.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: May 15, 2007
    Assignee: Emfitech Oy
    Inventor: Heikki Raisanen
  • Patent number: 7218742
    Abstract: A microphone assembly comprising a housing, the housing including an upper lip, a silicon backplate having a top portion, a bottom portion, an annular side portion, a silicon spacer integrally formed with the backplate and comprising at least one protrusion extending from and integral to the top portion of the silicon backplate, the spacer further comprising an insulating layer, such as silicon dioxide or a fluoropolymer. A plurality of openings extend from the top portion of the backplate to the bottom portion of the backplate. A single diaphragm, comprised of metallized polymer film, acts as both a protective environmental barrier and a sensing electrode of a capacitive electroacoustic sensing transducer. A metal ring is positioned against the upper lip of the metal housing. The diaphragm is adhesively affixed to the ring, and the ring, in cooperation with the upper lip and a spring, secure the diaphragm against the insulating layer of the spacer.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: May 15, 2007
    Assignee: Shure Incorporated
    Inventors: Kelly Q. Kay, Mark W. Gilbert
  • Patent number: 7210213
    Abstract: A speaker collective substrate with component insertion hole sections and electrode sections has a plurality of speaker forming areas. An electrical speaker section, which comprises a magnetic circuit section and a vibration section, is inserted into each of the component insertion hole sections. Then, a collective lid, in which a plurality of lids have been formed for sealing the electrical speaker sections, is attached onto the speaker collective substrate. After that, the speaker collective substrate and the collective lid are divided into individual speaker forming areas along partition lines extending in the directions of the X and Y axes to form individual dynamic speakers. Thus, it is possible to mass-produce dynamic speakers with uniform quality through a collectively manufacturing process.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: May 1, 2007
    Assignee: Citizen Electronics Co., Ltd.
    Inventors: Kazumi Miyamoto, Naoki Miura
  • Patent number: 7184563
    Abstract: A condenser microphone having a housing, a diaphragm assembly and backplate located within the housing. A spacer isolates the diaphragm assembly from the housing and spaces the diaphragm assembly from the backplate. The spacer has a first portion disposed between the backplate and the diaphragm assembly, and a second portion disposed between the diaphragm assembly and the wall of the housing. A conductive member electrically connects the backplate to a ground.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: February 27, 2007
    Assignee: Knowles Electronics LLC.
    Inventor: James Steven Collins
  • Patent number: 7177434
    Abstract: A generally pyramid shaped sound module is provided that is attachable to a balloon for producing hi-fidelity sound effects. The sound module includes a piezoelectric element connected at the top of the pyramid shaped piezo amplification device. An electric circuit is connected to the piezoelectric element by wires. The electric circuit includes a power supply, such as one or more batteries, and the circuitry necessary for producing or reproducing a desired sound (e.g. musical notes, voices, sounds, prerecorded sound, a combination of the aforementioned, etc.). The pyramid shape allows the piezoelectric element to be coupled to the balloon without physically touching the balloon surface. Thus, even when the balloon begins to deflate, the sound quality of the sound module can be maintained.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: February 13, 2007
    Assignee: Sing-A-Tune Balloons, LLC
    Inventor: Melchiore Tripoli
  • Patent number: 7171012
    Abstract: Affixed in intimate contact to the inside surface of a front board 10a of a conductive capsule 10 provided with a receiving sound aperture 10aa is a conductive back electrode board provided with air vent apertures 11a, 11b which are positioned not in alignment with the receiving sound aperture, these apertures 10a and 11a, 11b being connected by a slit 10ad. A polarized FEP film 12 which is an electret film is disposed on the surface of the back electrode board 11 opposite from the front board 10a, and a conductive diaphragm 14 is disposed on the surface of the FEP 12 opposite from the back electrode board 11 with a spacer 13 interposed therebetween which extends around the outer periphery of the opposite surface of the FEP 12. These component parts are accommodate in the capsule 10 to constitute an electret condenser microphone which is capable of suppressing sensitivity degradation due to ingress of grit from the outside to the electret film.
    Type: Grant
    Filed: December 1, 2003
    Date of Patent: January 30, 2007
    Assignee: Hosiden Corporation
    Inventors: Toshiro Izuchi, Hiroshi Yamagata, Naosuke Fukada, Hideki Kozawa
  • Patent number: 7158646
    Abstract: An electrostatic loudspeaker requires a high voltage DC bias power supply to bias the stators and diaphragms of electrostatic speakers. A self biased power supply eliminates the need for an external power supply by deriving a high voltage bias from the stator AC signal voltages which have been rectified and run from a high voltage tap and/or through a voltage multiplier which has a voltage limiting means.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: January 2, 2007
    Assignee: American Technology Corporation
    Inventors: Jeevan G. Bank, James J. Croft, III
  • Patent number: 7158651
    Abstract: The invention relates to an electromagnetic driver comprising a soft magnetic core in the form of an E with three legs and a back, an alternating field driver, magnetically coupled to the soft magnetic core, for generating an alternating magnetic field in the soft magnetic core, depending upon a sound signal, a constant field driver magnetically coupled to the soft magnetic core for generation of a constant magnetic field in the soft magnetic core, a soft magnetic element for coupling to the plate of the planar diaphragm loudspeaker, lying opposite the back and magnetically closing the legs across at least one small induction gap, whereby the constant field and the alternating field are asymmetrically superimposed such that a resulting force, or a resulting torque on the soft magnetic element, is proportional to the sound signal.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: January 2, 2007
    Assignee: Harman/Becker Automotive Systems GmbH
    Inventors: Wolfgang Bachmann, Hans-Jürgen Regl, Gerhard Krump, Andreas Ziganki
  • Patent number: 7152299
    Abstract: Electro-dynamic loudspeakers typically include a diaphragm having a conductor applied to one of its surfaces. The diaphragm is secured to a frame. The conductor is connected to a power supply for providing electrical current through linear traces of the conductor that interact with magnetic fields generated by magnets that are mounted to the frame. The diaphragm is driven by a motive force created when current passes through the conductor within the magnetic field. The electrical current is varied to create an acoustical output from the electro-dynamic loudspeaker. Different frame structures are provided for simplifying the manufacturing process and defining a reduced cost electro-dynamic loudspeaker.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: December 26, 2006
    Assignee: Harman International Industries, Incorporated
    Inventors: Louis A. Mango, John F. Steere, David B. Garner, Steven W. Hutt, Ronald E. Fenwick
  • Patent number: 7136496
    Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: November 14, 2006
    Assignee: Sonion Nederland B.V.
    Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
  • Patent number: 7136500
    Abstract: An electret condenser microphone includes a housing, a diaphragm disposed within the housing, first and second sound inlet ports and an acoustic resistive material disposed within the housing and in the acoustic path between the second inlet port and the diaphragm. The acoustic resistive may further electrically couple a backplate coupled to the diaphragm to an amplifier disposed within the housing.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: November 14, 2006
    Assignee: Knowles Electronics, LLC.
    Inventor: James S. Collins
  • Patent number: 7132307
    Abstract: A silicon condenser microphone is described. The silicon condenser microphone of the present invention comprises a perforated backplate comprising a portion of a single crystal silicon substrate, a support structure formed on the single crystal silicon substrate, and a floating silicon diaphragm supported at its edge by the support structure and lying parallel to the perforated backplate and separated from the perforated backplate by an air gap.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: November 7, 2006
    Assignee: Knowles Electronics, LLC.
    Inventors: Zhe Wang, Qingxin Zhang, Hanhua Feng
  • Patent number: 7107665
    Abstract: A microphone assembly comprises a microphone, a connector secured to the underside of the microphone. A gasket has a sound collecting hole and is secured on the upper surface of the microphone.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: September 19, 2006
    Assignees: Citizen Electronics Co., Ltd., Citizen Iwate Co., Ltd.
    Inventors: Megumi Horiuchi, Tsutomu Ojima
  • Patent number: 7106869
    Abstract: The present invention relates to a condenser microphone whose body can be miniaturized while keeping a property and a sound quality comparable to those of a conventional condenser microphone. The condenser microphone includes a cylindrical body, a plurality of vibration plates which are formed into the shapes of squares and placed in parallel to a body axis line within the body, acoustic holes formed on a body side wall in a direction vertical to the vibration plates and back pole plates which are placed on a side opposite to the acoustic holes with the vibration plate between and face on the respective vibration plates at an interval of a micro gap. A potential of the back pole plate is varied according to a vibration of the vibration plate.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: September 12, 2006
    Assignee: Sony Corporation
    Inventors: Hiroshi Kanda, Shinji Ohyama, Yasuaki Tomiyama
  • Patent number: 7095864
    Abstract: An electrostatic transducer, such as a loudspeaker or microphone, comprises a multi-layer panel (1) incorporating an electrically insulating middle layer (2) sandwiched between first and second electrically conducting outer layers (3, 4). At least one of the layers has a profiled surface (6) where it contacts the surface of another of the layers. Furthermore a signal generator is provided for applying an alternating electrical voltage across the first and second layers (3, 4) to initiate vibration due to variation of the electrostatic forces acting between the layers, thereby serving as a loudspeaker (or for detecting variation of such electrostatic forces due to received vibration in the case of a microphone).
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: August 22, 2006
    Assignee: University of Warwick
    Inventors: Duncan Robert Billson, David Arthur Hutchins
  • Patent number: 7088837
    Abstract: An acoustical speaker and planar magnetic transducer therefore wherein the transducer is provided with at least array of spaced magnets which are oriented having their pole faces at an angle with respect to a plane defining a surface of a sound producing diaphragm on which extends an electrical trace circuit.
    Type: Grant
    Filed: August 14, 2003
    Date of Patent: August 8, 2006
    Inventors: Chris Von Hellermann, Dragoslav Colich
  • Patent number: 7072479
    Abstract: The present invention relates to a capacitor microphone which is characterized that even in a microphone with a small diameter such as a lavalier microphone, the noneffective electrostatic capacitance enables to be decreased and a better signal-to-noise ratio enables to be obtained. As shown in FIG. 2, in the capacitor microphone in which a vibration plate 10 strained and fixed on a support ring 11 and a charge back-plate 20 supported on one end-side of a cylinder base 21 face each other and are disposed through a spacer forming a gap, the spacer 30A having at least three spacer pieces, in which the each spacer piece has the same thickness and is disposed apart from the adjacent spacer pieces at generally equal angle on the same circumference, in place of the ring-shaped spacer.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: July 4, 2006
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Shioto Okita
  • Patent number: 7062052
    Abstract: An electret condenser microphone includes a casing member, a circuit board disposed in the casing member, an electrically insulating member disposed on the circuit board and having an outer surface opposing and spaced apart from the casing member, and an inner surface defining a central opening, an electrode plate mounted on the electrically insulating member, a plurality of electrically connecting members each intervening between the circuit board and the electrode plate to have the circuit board and the electrode plate electrically connected with each other, each of the electrically connecting members having a first portion disposed along the inner surface of the electrically insulating member, a second portion integrally formed with the first portion and radially outwardly extending from one end of the first portion, and a third portion integrally formed with the first portion and radially outwardly extending from the other end of the first portion, and a diaphragm disposed along the electrode plate and sp
    Type: Grant
    Filed: May 3, 2002
    Date of Patent: June 13, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiko Kajihara, Tooru Himori
  • Patent number: 7062058
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: June 13, 2006
    Assignee: Sonion Nederland B.V.
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
  • Patent number: 7062055
    Abstract: A sonic actuator including a multi-layer membrane having a non-metallic elastomeric dielectric polymer layer with a first surface and a second surface, a first compliant electrode layer contacting the first surface of the polymer layer, and a second compliant electrode layer contacting the second surface of the polymer layer. The actuator further includes a support structure in contact with the sonic actuator film. Preferably, the non-metallic dielectric polymer is selected from the group consisting essentially of silicone, fluorosilicone, fluoroelastomer, natural rubber, polybutadiene, nitrile rubber, isoprene, and ethylene propylene diene. Also preferably, the compliant electrode layer is made from the group consisting essentially of graphite, carbon, and conductive polymers. The support structure can take the form of grid having a number of circular apertures.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: June 13, 2006
    Assignee: SRI International
    Inventors: Ronald E. Pelrine, Roy D. Kornbluh, Joseph S. Eckerle
  • Patent number: 7054456
    Abstract: An electrostatic speaker system is provided wherein a multitude of speakers are provided in the system, each speaker having a thin electrically conductive film membrane sandwiched between a pair of stator plates. The film membrane is directly coupled to a high voltage AC audio signal emanating from a power amplifier for reproducing an audio signal. The high voltage AC audio signal is not applied to the stator plates but instead indirectly coupled to the pair of stators by a plurality of condensers (in a voltage multiplier circuit) of a electrical circuit contained within each speaker of the system. By applying the high voltage AC audio signal to the film membrane, approximately one-quarter of the voltage typically used to drive an electrostatic speaker is required.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: May 30, 2006
    Assignee: Final Sound International Pte. Ltd.
    Inventors: Maarten Smits, Hidde W. de Haan
  • Patent number: 7043035
    Abstract: A microphone for converting sound into an electrical signal includes a generally cylindrical housing including an inlet for receiving sound, an inner backplate, and an outer backplate. The inner and outer backplates are generally cylindrical and substantially concentric with each other. A cylindrical membrane is disposed between the inner and outer backplates. The membrane divides an interior of said housing into a front volume and a back volume. The front volume is in direct communication with the inlet. The backplates and/or membrane are charged. Electronics are included for detecting movement of the membrane relative to the inner and outer backplates in response to the membrane moving when subjected to the sound. The backplates and membrane may be of a shape that approximates a cylinder, such as those that have a hexagonal or octagonal cross-section.
    Type: Grant
    Filed: December 7, 2000
    Date of Patent: May 9, 2006
    Assignee: SonionMicrotronic Nederland B.V.
    Inventors: Zacharias M. Rittersma, Alwin Fransen, Hendrik Dolleman
  • Patent number: 7031480
    Abstract: An electret condenser microphone has a casing member including a circular inlet portion and a cylindrical side portion integrally formed with each other, the side portion having a first section close to the inlet portion and a second section remote from the inlet portion and radially inwardly bent, a printed circuit board in the form of a circular shape and disposed in the casing member to be held in contact with the second section an electrode plate accommodated in a casing space defined by the casing member and the printed circuit board, an electrically connecting member intervening between and electrically connecting the printed circuit board and the electrode plate the electrically connecting member being partly disposed on and along the circumference of the printed circuit board, and a diaphragm located between the inlet portion and the electrode plate.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: April 18, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tooru Himori, Yoshinobu Yasuno
  • Patent number: 6996891
    Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns which are at least partially connected to each other via one or more narrow connecting strips, and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.
    Type: Grant
    Filed: July 3, 2000
    Date of Patent: February 14, 2006
    Assignee: Emfitech Oy
    Inventor: Heikki Räisänen
  • Patent number: 6999596
    Abstract: A condenser sensor (10) comprises an electrically conductive case (20) having an opening portion (22a) formed therein and an opposing portion (22b) opposing to and spaced apart from the opening portion (22a); a fixed electrode (30) received in the electrically conductive case (20) through the opening portion (22a); an electrically conductive diaphragm (51) accommodated in the electrically conductive case (20), the electrically conductive diaphragm (51) spaced apart from the fixed electrode (30) and opposing to the opening portion (22a); an electrically conductive diaphragm supporting member (52) disposed in the electrically conductive case (20) to support the diaphragm (51); a circuit packaging board (60) disposed in the electrically conductive case (20) to be held in electrical contact with the fixed electrode (30) and the diaphragm (51) respectively through the electrically conductive case (20) and the diaphragm supporting member (52); and deformation protecting member (32) for protecting the opposing porti
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: February 14, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masayoshi Hiramoto, Kazumoto Doi, Yoshinobu Yasuno, Tatsuhiro Sawada
  • Patent number: 6987859
    Abstract: A raised microstructure for use in a silicon based device, such as a microphone, is disclosed. The raised microstructure comprises a generally planar film having a ribbed sidewall supporting the film.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: January 17, 2006
    Assignee: Knowles Electronics, LLC.
    Inventors: Peter V. Loeppert, Sung Bok Lee
  • Patent number: 6985597
    Abstract: The present invention includes a variable directional capacitor microphone in which two capacitor elements are combined. Each of the capacitor elements includes a vibrating plate and a fixed electrode, and an acoustic resistance can be adjusted in the state that the microphone has been assembled. The variable directional capacitor microphone of this invention includes capacitor elements 10a, 10b. In each of the capacitor elements 10a, 10b, each of vibrating plate supporting members 12a, 12b, each of spacer rings 13a, 13b, each of fixed electrodes 14a, 14b having through holes 141 and each of pedestals 15a, 15b having a through hole in each center of the pedestals are assembled in this order, respectively, in each of ring-shaped cases 16a, 16b. Each of vibrating plates 11a, 11b is strained and fixed on each of vibrating plate supporting members 12a, 12b, respectively.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: January 10, 2006
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventor: Hiroshi Akino
  • Patent number: 6978029
    Abstract: A condenser microphone apparatus which is used for a radio apparatus in order to reduce noises generated due to radiation of a high frequency signal of a transmitting unit. A series resistor is provided between a bypass capacitor provided between a drain and a source of an FET and a microphone signal output transmission line in order to prevent a high frequency voltage from being increased due to a resonance of the bypass capacitor and microphone signal output transmission line. Thus, the noises due to the radiation of the high frequency signal can be reduced.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: December 20, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Masaharu Ikeda
  • Patent number: 6961437
    Abstract: It is an object of the present invention to securely prevent a generation of an acoustic resonance due to a rear air chamber of a capsule support in a capacitor microphone including a microphone capsule and the capsule support and to improve assembly of a contacting terminal which is mounted in the capsule support. According to FIG. 1, a capacitor microphone of the present invention includes a microphone capsule 20 and a capsule support 10A which are connected through a connecting screw 24. A contacting terminal 140 contacting to a contact pin 23 of the microphone capsule 20 is disposed on the printed circuit board 120 housed in the capsule support 10A with an electric insulating block 180 held in the contacting terminal 140 and is fixed through the block 180 and an electric insulating cap member 160. Whereby, the cap member 160 increases the air proof grade of a rear air chamber and makes the air volume of the chamber as small as possible and constant so that an acoustic resonance is not generated.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: November 1, 2005
    Assignee: Kabushiki Kaisha Audio-Technica
    Inventors: Kazuhisa Kondo, Noriko Matsui