Abstract: Described herein is a sensor probe for association with a portion of an aircraft. The sensor probe includes a microphone assembly having a portion configured to receive audio signals. The sensor probe further includes a nosecone associated with the microphone assembly. The nosecone assembly is configured to shield the portion of the microphone assembly from noise generated by direct impact of an airflow for a plurality of local flow angles. In some examples, the nosecone includes a tip and a body portion, wherein a diameter of the body portion of the nosecone is smaller than a length of the nosecone and the nosecone is configured to mitigate drag of the sensor probe in an airflow.

Abstract: Provided is a unidirectional microphone including ribbon diaphragms which is reduced in dimensions. The microphone includes a bidirectional ribbon microphone unit and an omnidirectional condenser microphone unit. The ribbon microphone unit includes a pair of ribbon diaphragms. The condenser microphone unit is disposed between the pair of ribbon diaphragms.

Abstract: A passive vibration cancellation system manufactured of a plurality of waterproof diaphragms and a more rigid support structure is sized to cover a microphone of an auditory prosthesis. The system includes multiple flexible diaphragms that deform in opposite directions when acted upon by sound, but deform in the same direction when acted upon by vibrations. The system can further include a collar or other compliant element to help secure a microphone assembly into the auditory prosthesis housing, while further reducing vibration transmission between the housing and the microphone.

Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port disposed in the substrate. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.

Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Abstract: A top-port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid with an acoustic port, and the MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the lid-mounted MEMS microphone die.

Abstract: The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs. The surface mount package features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The microphone package has a substrate with metal pads on its top and bottom surfaces, a sidewall spacer, and a lid.

Abstract: A microphone system has a base coupled with first and second microphone apparatuses. The first microphone apparatus is capable of producing a first output signal having a noise component, while the second microphone apparatus is capable of producing a second output signal. The first microphone apparatus may have a first back-side cavity and the second microphone may have a second back-side cavity. The first and second back-side cavities may be fluidly unconnected. The system also has combining logic operatively coupled with the first microphone apparatus and the second microphone apparatus. The combining logic uses the second output signal to remove at least a portion of the noise component from the first output signal.

Abstract: A narrow directional microphone including a film for suppressing wind noise capable of being displaced by a wind pressure, a unidirectional microphone unit having a front acoustic terminal, a cylindrical acoustic tube having a prescribed axial length, and an acoustic resistor disposed at a position which is on an outward side of the film and at which the resistor does not come into contact with the film even when the film is displaced by the wind pressure. A rear end of the acoustic tube is coupled to a side of the front acoustic terminal of the unidirectional microphone unit, and a front end opening of the acoustic tube is covered with the film.

Abstract: A microphone is disclosed in which a housing is formed by a cap (13) sealed to a substrate (11). A MEMS die (10) is mounted on the substrate (11), the MEMS die (10) incorporating a membrane (12). The membrane (12) has a first surface facing the substrate and in fluid communication with an acoustic inlet port (14) in the cap (13) via an acoustic path (17) and a second surface facing the inner surface of the cap, which second surface along with part of the inner surface of the cap (13) defines at least part of a sealed chamber (19) within which a volume of air is trapped.

Abstract: An electronic device is provided. The electronic device includes a case, a microphone array housing consists of a first acoustic extending structure, a second acoustic extending structure, an interface IC, a first membrane and a second membrane. The case includes a first acoustic opening and a second acoustic opening. The first acoustic extending structure is connected to the first acoustic opening. The second acoustic extending structure is connected to the second acoustic opening. The first membrane receives a first acoustic signal via the first acoustic opening and the first acoustic extending structure. The second membrane receives a second acoustic signal via the second acoustic opening and the second acoustic extending structure.

Abstract: Provided is a microphone capable of reducing a plane area seen from above, and further increasing a capacity of a back chamber of an acoustic sensor. An interposer 52 is mounted on a top surface of a circuit board 43, and an acoustic sensor 51 is mounted on the top surface thereof. A signal processing circuit 53 is accommodated in a space 70 provided in the interposer 52, and mounted on the circuit board 43. The acoustic sensor 51 is connected to the circuit board 43 through a wiring structure provided in the interposer 52. The acoustic sensor 51, the interposer 52 and the like are covered by a cover 42 put on the top surface of the circuit board 43. In the cover 42, a sound introduction hole 48 is opened in a position opposed to the front chamber of the acoustic sensor 51. The interposer 52 is formed with a ventilation notch 71 for acoustically communicating a space below a diaphragm 56 of the acoustic sensor 51 with a space inside the cover 42 and outside the interposer 52.

Abstract: An autonomous and controllable system of sensors and methods for using such a system of sensors are described.

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract: A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.

Abstract: A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.

Abstract: Disclosed is a differential microphone unit which can improve the characteristics of a microphone unit and widen the directional range thereof. The disclosed differential microphone unit (100) is provided with: a microphone housing (20) which is provided with a pair of first sound holes (22a, 22b) on the same major surface (20a); a vibrating portion (11) which is disposed in the microphone housing and which vibrates according to differences in sound pressure transmitted via each of the pair of first sound holes; and sealing members (30, 130), which are disposed on the major surface of the microphone housing and which each contain a pair of second sound holes (31a, 31b, 131a, 131b) disposed so as to be in respective contact with the pair of first sound holes.

Abstract: A communication headset (1, 15, 25, 35) comprising a housing (2) and a peripheral slot (5) extending along the periphery (30) of the housing (2) in an intersecting plane (6) that intersects the housing (2). A space (7) extends in the intersecting plane (6) and communicates with the slot (5). A porous material (11) is arranged in the space (7), and a first microphone transducer (8) is arranged in the housing (2). The first microphone transducer (8) comprises a microphone opening (9), which is connected to the space (7). The peripheral slot (5) extends along the main part of the periphery (30) of the housing (2).

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: A sensor system is located in an environment composed of a first medium, where waves propagate with a first phase velocity, the sensor system including at least one main enclosure and a sensor array with at least two sensors, said sensor array being arranged inside the main enclosure, wherein the space inside the main enclosure between the sensor array and the inner surface of the main enclosure is filled with a second medium, in which waves propagate with a second phase velocity, the second phase velocity being different from the first velocity.

Abstract: A shielded microphone, and method for shielding a microphone, are provided for use in a communications device having a circuit board and a microphone. The microphone is provided in an electromagnetic shield and a resilient separator is provided over the shield. The device housing is stacked over the separator and shield, while the latter are stacked over the circuit board so that the separator and shield, with microphone there under, are sandwiched between the housing and the circuit board. By this sandwiching the separator is loaded onto the shield to drive the shield directly against the circuit board to make an electrical ground connection therewith, the microphone also being electrically connected to the printed circuit board. The resilience of the separator accommodates the variation in the stacking of the components.

Abstract: Methods, systems and apparatus are described for mitigating noise during sound recording. A noise mitigating microphone attachment comprises a foam structure. A first cavity extending from a first opening at a surface of the foam structure and into the foam structure. A microphone is inserted into the first cavity with sound receiving elements of the microphone fully installed in the structure. A second cavity extending from a second opening at the surface of the foam structure and into the foam structure is configured to receive sound from a sound source. The first cavity is fluidly connected to the second cavity within the foam structure so that a junction is formed between the first cavity and the second cavity. The junction, the sound cavity, and the sealing of the microphone work to shield the sound receiving elements of the microphone from sound other than received through the second opening.

Abstract: A dual diaphragm dynamic type microphone transducer that, among other things, provides control of source/receiver proximity effects without sacrificing professional level dynamic microphone performance.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: An electret loudspeaker device including a diaphragm, a first perforated electrode and a first spacer is provided. The diaphragm has an electret layer and an electrode layer. The first perforated electrode is stacked on a side of the diaphragm near the electret layer, and has multiple holes. The first spacer is stacked between the diaphragm and the first perforated electrode, and includes a first distribution area and plural second distribution areas. The first distribution area has first openings penetrating through the first spacer, and each first opening has a first opening space volume between the diaphragm and the first perforated electrode. Each second distribution area has second openings penetrating through the first spacer, and each second opening has a second opening space volume between the diaphragm and the first perforated electrode. A difference between the first and the second opening space volumes is greater than 10%.

Abstract: Methods, systems and apparatus are described for mitigating noise during sound recording. A noise mitigating microphone attachment comprises a foam structure. A first cavity extending from a first opening at a surface of the foam structure and into the foam structure. A microphone is inserted into the first cavity with sound receiving elements of the microphone fully installed in the structure. A second cavity extending from a second opening at the surface of the foam structure and into the foam structure is configured to receive sound from a sound source. The first cavity is fluidly connected to the second cavity within the foam structure so that a junction is formed between the first cavity and the second cavity. The junction, the sound cavity, and the sealing of the microphone work to shield the sound receiving elements of the microphone from sound other than received through the second opening.

Abstract: Methods, systems and apparatus are described for mitigating noise during sound recording. A noise mitigating microphone attachment comprises a foam structure. A first cavity extending from a first opening at a surface of the foam structure and into the foam structure. A microphone is inserted into the first cavity with sound receiving elements of the microphone fully installed in the structure. A second cavity extending from a second opening at the surface of the foam structure and into the foam structure is configured to receive sound from a sound source. The first cavity is fluidly connected to the second cavity within the foam structure so that a junction is formed between the first cavity and the second cavity. The junction, the sound cavity, and the sealing of the microphone work to shield the sound receiving elements of the microphone from sound other than received through the second opening.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's sprinted circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: A microphone unit comprises a microphone, leg members and a base. The microphone comprises a diaphragm for detecting sound and a housing for containing the diaphragm. The leg members project outwardly from a rear wall of the housing, and are provided near a second through-hole which connects a second inner space to outer space. The base is connected to the leg members to form a gap between the housing and the base. When the microphone unit thus formed in a simple structure and reduced thickness is mounted in a product, the gap allows the outer space to be connected to the second inner space through the second through-hole, making it possible to efficiently guide sound to the second inner space and obtain good differential characteristics.

Abstract: A miniature microphone is provided.

Abstract: An arrangement includes a circuit carrier and a housed microphone. A mounting side of the housed microphone is mounted on a top side of the circuit carrier. The housed microphone includes solderable contacts on the mounting side and a sound entry opening facing the circuit carrier. An acoustic channel connects the sound entry opening and surroundings above the circuit carrier.

Abstract: A microphone unit includes: a housing; a diaphragm which is disposed in the inside of the housing; and an electric circuit portion which processes an electric signal that is generated based on a vibration of the diaphragm. In the housing, a first sound guide space which guides a sound outside the housing to a first surface of the diaphragm via a first sound hole and a second sound guide space which guides a sound outside the housing to a second surface, that is, an opposite surface of the diaphragm via a second sound hole are formed. The electric circuit portion is disposed in either one of the first sound guide space and the second sound guide space; and an acoustic resistance portion which adjusts at least one of a frequency characteristic of the first sound guide space and a frequency characteristic of the second sound guide space is formed.

Abstract: A device includes a windscreen in a first surface, a gradient microphone housed in a capsule having first and second outlets coupled to openings in a second surface displaced from the first surface, a pressure microphone mounted between the first and second surfaces, and circuitry coupled to the gradient microphone and the pressure microphone and operable to combine the signals of the microphones and provide a combined microphone signal.

Abstract: A watch (1) has a microphone (16) placed in a watchcase (2), a bracelet (3) with two end parts respectively attached to two opposite sides of the case and at least one through aperture (7) made in a lateral wall (12) of the case. The through aperture defines a first sound wave guide channel, and opens into the case in the direction of said microphone. The microphone is connected in the case to a sound wave processing unit circuit (19) for voice recognition. The watch further includes an audio guide member (6) fitted with a second open sound wave guide channel that comes into direct contact with the external surface of the lateral wall of the case across an area (13) that extends on either side of the aperture so as to guide the sound waves towards said first channel. This guide member may be made in an end part of the bracelet. In this manner, any interference from reflecting cavities, edges or surfaces in said area close to the aperture can be removed or attenuated.

Abstract: A wideband voice electro-acoustic apparatus for a wireless telephone, including a mouthpiece for a wireless telephone. The mouthpiece has a wideband voice frequency response/passband in the frequency range of 200 Hz to 7000 Hz. The apparatus also includes an earpiece for a wireless telephone. The earpiece has a wideband voice passband in the frequency range of 200 Hz to 7000 Hz. The wideband voice electro-acoustic apparatus improves the voice quality of wireless voice band communication over that available using a conventional wireless telephone having an electro-acoustic passband smaller than 200 Hz to 7000 Hz.

Abstract: An electret accelerometer is provided in which a diaphragm, an electret, a back plate and an electronic circuit are placed in a casing and the casing is sealed to isolate the diaphragm from external acoustic signals.

Abstract: An unattached, contained semiconductor device includes a semiconductor die, for example a MEMS pressure sensor die. The semiconductor die is unattached from the interior cavity of a surrounding containment body in that the semiconductor die is free of adherence to the containment body to mitigate packaging stress and strain between the containment body and the semiconductor die.

Abstract: A microphone assembly includes a microphone composed of a case having an open end and a printed circuit board. The printed circuit board is disposed in the open case end. The microphone assembly further includes a metal screen coupled to the case over the printed circuit board for shielding the microphone from electromagnetic interference. The metal screen includes several apertures.

Abstract: A microphone includes: a housing that serves as a microphone grip; a microphone unit supported at one end of the housing; an air chamber provided behind the microphone unit in the housing. The air chamber is filled with a plurality of elastic particles. The individual particles are mechanically bonded to one another and part of the particles are mechanically bonded to the housing such that gaps are formed therebetween.

Abstract: In a sound receiver, a sound wave is directly received by microphones at a predetermined phase difference. The microphones are arranged in opening cavities of a casing, at positions that are different from the volume center points of the opening cavities. The microphones are supported by supporting springs in a state of not closely contacting inner peripheral walls. The sound wave received by the microphones is input to a signal processing unit and after a signal component in a predetermined low frequency band is removed by a filter, the resulting sound wave is amplified by an amplifier and is made in phase by a phase shifter and output.