Mounting Or Support Patents (Class 381/361)
  • Patent number: 11956580
    Abstract: A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the microphone element.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: April 9, 2024
    Assignee: HOSIDEN CORPORATION
    Inventors: Shunji Muraoka, Shushin Noda, Yoshifumi Yamanaka, Kouta Onoyama, Daisuke Kitaguchi, Jun Miyajima
  • Patent number: 11924607
    Abstract: An acoustic waterproof structure is provided according to the present application, which includes a casing, a waterproof breathable film, a stretchable material piece and a rigid supporting piece. A casing sound hole is provided on the casing, one side of the waterproof breathable film is sealed and connected to the casing and covers the casing sound hole, and the other side of the waterproof breathable film abuts against the stretchable material piece. A stretchable material piece sound hole is provided on the stretchable material piece; at least one through hole is provided on the rigid supporting piece, one side of the rigid supporting piece is sealed and connected to the casing and extrudes the stretchable material piece, and the other side of the rigid supporting piece is configured to connect to an acoustic device.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: March 5, 2024
    Assignee: GOERTEK INC.
    Inventors: Qinglei Luan, Yang Yang
  • Patent number: 11890994
    Abstract: There is provided an on-board-device bracket capable of appropriately mounting a front portion of an imaging means with respect to a windshield. An on-board-device bracket 10 is formed by a bracket body portion 11 and a front portion 16 connected to a front part of a center portion of the bracket body portion 11. Slits 17 along the front portion 16 are formed between the front portion 16 and the bracket body portion 11. The front portion 16 includes, at the front end thereof, a front bonding portion. The front portion 16 is bent by the slits 17 individually from the bracket body portion 11 and displaced with respect to a windshield 1.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: February 6, 2024
    Assignee: NIFCO INC.
    Inventors: Takanori Otake, Shohei Seko, Hideaki Hashimoto
  • Patent number: 11889670
    Abstract: An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: January 30, 2024
    Assignee: Cochlear Limited
    Inventors: Tom Meeusen, Koen Erik Van den Heuvel, Jan Vermeiren, Stijn Eeckhoudt
  • Patent number: 11863925
    Abstract: In at least one embodiment, a microphone assembly including a substrate, a printed circuit board (PCB), a micro-electro-mechanical systems (MEMS) transducer, a first lid, and a second lid is provided. The substrate defines a first port that extends completely therethrough. The PCB defines a sound opening that extends completely therethrough. The MEMS transducer is positioned on a first side of the substrate. The first lid defines a second port and covers the MEMS transducer and the first port. The first lid and the substrate define a front volume of air that surrounds the MEMS transducer. The second lid is positioned on the second side of the PCB. A cavity of the second lid, the sound opening of the PCB, the sound opening of the PCB, and the first port of the substrate define a back volume of air that is greater than the front volume of air.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: January 2, 2024
    Assignee: Harman International Industries, Incorporated
    Inventors: Sullivan Do, Yu Du
  • Patent number: 11818542
    Abstract: The present invention provides a MEMS microphone comprising (i) a substrate layer, (ii) a fixed backplate, and (iii) an intermediate layer sandwiched between the substrate layer and the fixed backplate. The substrate layer has a first opening through the thickness of the substrate layer. The intermediate layer has a second opening through the thickness of the intermediate layer. The fixed backplate forms a ceiling of the second opening, and the second opening is larger than the first opening and extends into the first opening, forming a looped recess (“undercut”). The looped recess is defined by a looped ledge on the substrate, a looped sidewall around the second opening, and a looped ceiling from the fixed backplate. The looped sidewall and the looped ceiling are made of a same material.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: November 14, 2023
    Assignee: GMEMS TECH SHENZHEN LIMITED
    Inventors: Guanghua Wu, Xingshuo Lan, Zhixiong Xiao
  • Patent number: 11778390
    Abstract: The disclosure describes devices and methods for starting up a microphone assembly. The device may be implemented on an integrated circuit that includes a direct current (DC) bias circuit. The DC bias circuit may be coupled to a transducer and configured to supply a DC bias signal to the transducer. The DC bias circuit includes a multi-stage charge pump and a low pass filter (LPF) circuit. The LPF circuit includes an adjustable resistance and a capacitor. A resistance of the adjustable resistance may be reduced to reduce the settling time of the LPF while starting (e.g., turning on) the microphone assembly.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: October 3, 2023
    Assignee: KNOWLES ELECTRONICS, LLC.
    Inventors: Raminder Jit Singh, Jose Prado
  • Patent number: 11765525
    Abstract: A method of manufacturing a charger insert part of a hearing instrument charger device comprising a charger casing having a receiving portion, and a first charger element, includes: obtaining a first virtual model of the rechargeable hearing instrument shaped or to be shaped to at least partly conform to a shape of a portion of an ear canal of a user, wherein the first virtual model comprises an allocated position for a second charger element; obtaining a second virtual model of the charger insert part for manufacturing the charger insert part, such that when the charger insert part is placed in the receiving portion, the first charger element will be in a relation with the second charger element; and shaping, by a manufacturing process, the charger insert part based on the second virtual model, the second virtual model being based on the first virtual model.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: September 19, 2023
    Assignee: GN HEARING A/S
    Inventors: Henrik Nielsen, Søren Davids, Thomas John Chappell
  • Patent number: 11716970
    Abstract: The invention concerns a method for monitoring a livestock facility and/or livestock animals in a livestock facility. It includes receiving audio signals comprising sounds generated in a livestock facility from two or more microphones. Sounds of interest in the audio signals are localized, the sounds of interest being both sounds generated by livestock animals and sounds generated by noise sources. The localization further comprises the steps of utilizing models of noise sources in an airspace based on localization in noise reduction algorithms to filter off noise sources from the audio signal, resulting in a filtered audio signal, and the step of analysing the filtered audio signal.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: August 8, 2023
    Assignee: SoundTalks NV
    Inventors: Dries Berckmans, Wim Buyens
  • Patent number: 11652310
    Abstract: A detachable capacitor connection structure is provided for a storage device. In an embodiment, a connection element detachably connects a capacitor module including one or more capacitors to a circuit board such that the capacitor module is stacked over the circuit board. The connection element includes: a first connector including two pin headers, mounted on a bottom plane of the capacitor module; and a second connector including two sockets, mounted on a top plane of the circuit board corresponding to the bottom of the capacitor module, suitable for connecting the first connector to the circuit board.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: May 16, 2023
    Assignee: SK hynix Inc.
    Inventors: Xiaofang Chen, Danyang Qiao, Wenwei Wang
  • Patent number: 11647329
    Abstract: A microphone unit including a tubular case having an opened top and an opened bottom, a waterproof film made of metal that has a thickness of 0.01 mm or more and 0.05 mm or less, a hardness of 100 HV or more, a proof stress of 70 N/mm2 or more, and a tensile strength of 350 N/mm2 or more, the waterproof film being fixed to the bottom of the case so as to block an opening part of the bottom of the case, a substrate arranged in the case, a microphone mounted on the substrate, and a sealing member that seals an opening part of the top of the case.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: May 9, 2023
    Assignee: HOSIDEN CORPORATION
    Inventors: Tsutomu Matsushita, Hiroyuki Harano, Ryuji Awamura, Kensuke Nakanishi
  • Patent number: 11647318
    Abstract: An audio accessory system that includes a holder to hold an audio accessory in two positions is provided. The holder comprises a first retention platform having a cable coupled thereto, a second retention platform and a back retention wall extending between the first and second retention platforms. The first and second retention platforms and the back retention wall form a clip for retaining the audio accessory. The holder further comprises an electrical interface, at the back retention wall, for coupling the cable to a corresponding electrical interface of the audio accessory. The clip is interchangeably mountable in first and second positions relative to the audio accessory, such that: in the first and second positions, respectively, the clip mounts to the audio accessory with the cable extending from a bottom or a top of the audio accessory.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: May 9, 2023
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Sze Yen Lim, Chi Meng Khong
  • Patent number: 11641541
    Abstract: The present disclosure discloses an acoustic input and output apparatus. The acoustic input and output apparatus may include a loudspeaker assembly, a sound-pickup assembly configured to pick up a sound signal, and a connection assembly including an elastic member, wherein a first end of the elastic member may connect to the loudspeaker assembly, and a second end of the elastic member may connect to the sound-pickup assembly. The elastic member may be configured to cause an average amplitude attenuation rate of vibrations within a phonic frequency band generated by the loudspeaker assembly to be larger than or equal to 35% in a process that the vibration transmits from the first end of the elastic member to the second end of the elastic member.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: May 2, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Chaowu Li, Yueqiang Wang, Fen You, Junjiang Fu, Zhongqi Wu, Qian Chen
  • Patent number: 11463817
    Abstract: A microelectromechanical systems (MEMS) die includes a substrate, a back plate, and a diaphragm. The back plate is coupled to the substrate and includes a dielectric layer and an electrode. The electrode is coupled to the dielectric layer and defines an opening that exposes a central portion of the dielectric layer. The diaphragm is oriented parallel to the back plate and is spaced apart from the back plate. In one implementation, a diameter of the opening is greater than or equal to 1/10 of the diameter of the diaphragm.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: October 4, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventor: Peter V. Loeppert
  • Patent number: 11418889
    Abstract: A back plate is disposed in a vibration area of a MEMS microphone. The back plate includes a central area located at a central portion of the back plate and having a plurality of acoustic holes formed therein, and a peripheral area located to surround the central area. The acoustic holes are arranged to be spaced apart from each other by the same interval.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: August 16, 2022
    Assignee: DB Hitek Co., LTD.
    Inventors: Jong Won Sun, Han Choon Lee, Kum Jae Shin
  • Patent number: 11362447
    Abstract: A detachable capacitor connection structure is provided for a storage device. In an embodiment, a connection element detachably connects a capacitor module including one or more capacitors to a circuit board such that the capacitor module is stacked over the circuit board. The connection element includes: a first connector including two pin headers, mounted on a bottom plane of the capacitor module; and a second connector including two sockets, mounted on a top plane of the circuit board corresponding to the bottom of the capacitor module, suitable for connecting the first connector to the circuit board.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: June 14, 2022
    Assignee: SK hynix Inc.
    Inventors: Xiaofang Chen, Danyang Qiao, Wenwei Wang
  • Patent number: 11352252
    Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: June 7, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ki Yeul Yang, Kyung Han Ryu, Seok Hun Yun, Bora Baloglu, Hyun Cho, Ramakanth Alapati
  • Patent number: 11284178
    Abstract: A microphone cord holding device attachable onto a standard microphone stand by a spring clamp comprising an upper and a lower U-shape end are attached to each other by a rigid elongate connector. One arm of the upper U-shape end is attached to the spring clamp. A hook and loop strap is fastened to the midpoint of the rigid elongate connector so that a microphone cord can be wrapped around the upper and lower U-shape ends and held in place by the hook and loop strap. The microphone cord holding device can be used without being attached to a microphone pole to help store the cord when the microphone is not attached to a microphone stand.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: March 22, 2022
    Inventor: William Kairy, Jr.
  • Patent number: 11252513
    Abstract: The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: February 15, 2022
    Assignee: Cirrus Logic, Inc.
    Inventors: Roberto Brioschi, Rkia Achehboune, David Patten
  • Patent number: 11244666
    Abstract: Earpieces and methods for acute sound detection and reproduction are provided. A method can include measuring an external ambient sound level (xASL), monitoring a change in the xASL for detecting an acute sound, estimating a proximity of the acute sound, and upon detecting the acute sound and its proximity, reproducing the acute sound within an ear canal, where the ear canal is at least partially occluded by an earpiece. Other embodiments are disclosed.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: February 8, 2022
    Assignee: Staton Techiya, LLC
    Inventors: Steven Wayne Goldstein, John Usher, Marc Andre Boillot
  • Patent number: 11166098
    Abstract: In some examples, an acoustic input device includes a housing comprising a plurality of acoustic ports, and a plurality of single-port acoustic transducers within the housing to receive respective acoustic waves from an environment outside the acoustic input device through corresponding acoustic ports of the plurality of acoustic ports, where a first acoustic port of the plurality of acoustic ports is located on a first surface of the housing, and a second acoustic port of the plurality of acoustic ports is located on a second surface of the housing that is opposite the first surface. The acoustic input device further includes a controller within the housing to receive outputs of the plurality of acoustic transducers.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: November 2, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wensen Liu, HyunWoo Choi
  • Patent number: 11117797
    Abstract: The present invention discloses a MEMS device and an electronics apparatus. The MEMS device comprises: a substrate; a MEMS element placed on the substrate; a cover encapsulating the MEMS element together with the substrate; and a port for the MEMS element to access outside, wherein the port is provided with a filter which has mesh holes and includes electrets to prevent particles from entering into the MEMS element.
    Type: Grant
    Filed: October 8, 2016
    Date of Patent: September 14, 2021
    Assignee: GOERTEK. INC
    Inventors: Quanbo Zou, Zhe Wang, You Wang, Xianbin Wang
  • Patent number: 11102562
    Abstract: The invention discloses a microphone encapsulation structure having a plurality of transducers, comprising: a housing; a circuit base plate, wherein the circuit base plate and the housing form an acoustic cavity, and a first acoustic through-hole is provided on the circuit base plate; a PCB (Printed Circuit Board) substrate disposed at a top of the circuit base plate, wherein the PCB substrate is provided with a plurality of second acoustic through-holes and the PCB substrate is provided with: a plurality of acoustic transducers each disposed directly above one of the plurality of second acoustic through-holes; and a plurality of ASIC (Application Specific Integrated Circuit) chips each connected to one of the plurality of acoustic transducers via gold wire.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: August 24, 2021
    Inventor: Jinghua Ye
  • Patent number: 11059716
    Abstract: Aspects of the disclosure provide a packaging technique for making a directional microphone which employs mechanical structures to cancel undesired background noise to realize the directional function instead of an extra sensor required in electronic noise-cancelling techniques, thus reducing footprint and cost of a directional microphone. A directional microphone based on this technique can include an acoustic sensor and a housing enclosing the acoustic sensor. The acoustic sensor can include a sensing diaphragm, a cavity below the sensing diaphragm, and a first substrate. The directional microphone device can further include a channel with an inlet open at an edge of the first substrate and an outlet connected with the cavity. The housing can include a cover attached to a second substrate supporting the first substrate. The cover can include a first opening over the sensing diaphragm and a second opening at a side of the cover.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: July 13, 2021
    Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag
  • Patent number: 11019306
    Abstract: A method of combining data streams from fixed audio-visual sensors with data streams from personal mobile devices including, forming a communication link with at least one of one or more personal mobile devices; receiving at least one of an audio data stream and/or a video data stream from the at least one of the one or more personal mobile devices; determining the quality of the at least one of the audio data stream and/or the video data stream, wherein the audio data stream and/or the video data stream having a quality above a threshold quality is retained; and combining the retained audio data stream and/or the video data stream with the data streams from the fixed audio-visual sensors.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: May 25, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stanley Chen, Kenneth W. Church, Vaibhava Goel, Lidia L. Mangu, Etienne Marcheret, Bhuvana Ramabhadran, Laurence P. Sansone, Abhinav Sethy, Samuel Thomas
  • Patent number: 10968097
    Abstract: Various embodiments of the present disclosure are directed towards a microphone including a support structure layer disposed between a particle filter and a microelectromechanical systems (MEMS) structure. A carrier substrate is disposed below the particle filter and has opposing sidewalls that define a carrier substrate opening. The MEMS structure overlies the carrier substrate and includes a diaphragm having opposing sidewalls that define a diaphragm opening overlying the carrier substrate opening. The particle filter is disposed between the carrier substrate and the MEMS structure. A plurality of filter openings extend through the particle filter. The support structure layer includes a support structure having one or more segments spaced laterally between the opposing sidewalls of the carrier substrate. The one or more segments of the support structure are spaced laterally between the plurality of filter openings.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: April 6, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo
  • Patent number: 10961113
    Abstract: A CMOS single chip includes a movable film, at least one support pillar, a base metal layer and a circuit integration. The movable film is disposed on a top layer of the CMOS single chip and has a plurality of through-vias. The support pillar is disposed under the movable film to provide a supporting force of the movable film. The base metal layer is formed under the support pillars and isolated from the support pillars, and faces towards the movable film to form a micro capacitor to sense one of the outside sensing signals. The area of the base metal layer is larger than the area of the movable film. The circuit integration is formed under the base metal layer, or formed under the base metal layer and on the side of the movable film, and connected to the movable film and the base metal layer.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: March 30, 2021
    Inventors: Chien-Chang Chen, Yi-Der Liang, Shiao-Yi Lin, Cheng-Kuang Yang
  • Patent number: 10934159
    Abstract: A MEMS package has a MEMS chip, a package substrate, a dammed-seal part. The MEMS chip has an element substrate which a movable element is formed, the element substrate has an element hole-part which the movable element is arranged. The dammed-seal part has an annular dam-member which is formed on the element substrate so as to surround the element hole-part and a gel member. The gel member is formed by hardening of gel which is applied on the annular dam-member.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: March 2, 2021
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Masashi Shiraishi, Akio Nakao
  • Patent number: 10924833
    Abstract: The disclosure relates to a microphone and a terminal device. The microphone includes a circuit board including a sound receiving hole; a signal converter configured to convert a sound signal into an electrical signal, wherein the signal converter includes a housing that forms a cavity, and wherein the cavity is connected to the sound receiving hole; and an adhesive member disposed in the cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: February 16, 2021
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Chiafu Yen, Hui Du
  • Patent number: 10872590
    Abstract: A foot stomp percussion device that creates dual tones when stomped on by the musician. The foot stomp comprises a housing comprising a main portion and a bottom ledge portion that extends beyond the main portion to enhance stability. In one embodiment, the main portion of the housing comprises a smaller and shallower cavity containing a piezo transducer and a larger and deeper cavity coupled to a volume potentiometer, as well as one or more electrical outputs to connect the foot stomp to a sound amplification system. The solid back portion of the foot stomp creates a low frequency tone when stomped on, and the front portion containing the larger and deeper cavity creates a high frequency tone when stomped on.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: December 22, 2020
    Inventor: Christian Salisbury
  • Patent number: 10827618
    Abstract: An electronic device comprises a housing comprising an audio opening, a Printed Circuit Board (PCB) arranged inside the housing, a microphone mounted on the PCB, and an audio channel assembly. The audio channel assembly comprises a first opening coupled to the audio opening, and a second opening coupled to an input of the microphone, wherein an audio channel is formed between the first opening and the second opening. The audio channel assembly is mounted on the PCB using a soldering part.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: November 3, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Jouni Tapio Mäki
  • Patent number: 10818577
    Abstract: A microphone packaging assembly (100) provides a printed circuit board (pcb) (106) for coupling to a microphone device (102) having a bottom acoustic port (104). The pcb provides an acoustic port opening (108) which aligns with the bottom acoustic port (104) of the microphone device (102). A solder pad pattern (110) is disposed on the pcb (106). The solder pad pattern (110) is configured to provide both electrical connection (114) and an incomplete solder seal (116) having purposeful acoustic leak to the microphone device (102). A conformable coating (126) provides a seal to the purposeful acoustic leak. A single acoustic test can be performed to detect proper environmental protection and acoustic sealing of the packaged assembly (100).
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: October 27, 2020
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Andrew P Miehl, Kathryn Johnson, Deborah A Gruenhagen, Rammone Bartlett, Karl F Mueller, Ido Amit
  • Patent number: 10779068
    Abstract: A microphone includes finger grips extending at least partially around a circumference of the microphone head and/or handle to improve a performer's grip thereon during use. A transducer is located and oriented within the head to improve reception based on grip location.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: September 15, 2020
    Inventor: Andrew Williams, Sr.
  • Patent number: 10775197
    Abstract: According to one embodiment, a sensor includes a sensing element portion and a first magnetic portion. The sensing element portion includes a supporter, a deformable film portion supported by the supporter, and a first element including a magnetic layer and being provided at the film portion. The first magnetic portion is separated from the sensing element portion. The first magnetic portion includes a plurality of first holes. A width of one of the plurality of first holes along a second direction is narrower than a length of the sensing element portion along the second direction and wider than a length of the first element along the second direction. The second direction crosses a first direction from the film portion toward the first element.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 15, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Yoshihiko Fuji, Keiju Yamada, Kei Masunishi, Michiko Hara, Yoshihiro Higashi, Kazuaki Oakamoto, Shiori Kaji
  • Patent number: 10644790
    Abstract: Technology for a cellular signal booster with a satellite location system signal rebroadcast functionality is disclosed. The cellular signal booster can identify a satellite location system signal received via a satellite location system module of the cellular signal booster. The cellular signal booster can provide the satellite location system signal to a signal path for amplification of the satellite location system signal. The cellular signal booster can broadcast an amplified satellite location system signal to a mobile device within a defined distance from the cellular signal booster.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: May 5, 2020
    Assignee: WILSON ELECTRONICS, LLC
    Inventor: Christopher Ken Ashworth
  • Patent number: 10634647
    Abstract: An abnormal noise detection method of a steering system is configured to detect an abnormal noise from the steering system. The steering system includes a column shaft configured to rotatably support a steering wheel and is configured to steer a wheel in response to rotations of the column shaft. The method includes measuring a sound from an end portion of the column shaft on a steering wheel-side by using a microphone arranged to face the end portion of the column shaft, and generating an abnormal noise detection signal due to the steering system from a sound signal to be output from the microphone.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: April 28, 2020
    Assignee: NSK LTD.
    Inventors: Yoshihiro Sato, Yasushi Muto, Masayuki Kanatsu
  • Patent number: 10516241
    Abstract: Presented and described is, amongst other items, an intercom plug-in connector (10) for audio connections, comprising a cylindrical housing (19) extending in the axial direction (27), in particular with a circular, or essentially circular, cross-section, whose first axial end (20) is formed by a plug-in extension (22) that on its front face (39) has a plurality of sockets (23a, 23b, 23c, 23d), in particular four sockets positioned relative to one another in an approximately V-shape, for contact pins (24a, 24b), and which at its second axial end (21) has a phone jack (25) for a phone plug (14).
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: December 24, 2019
    Assignee: RIEDEL COMMUNICATIONS INTERNATIONAL GMBH
    Inventors: Wolfgang Fritz, Thomas Riedel
  • Patent number: 10491991
    Abstract: A microphone and a method for manufacturing the same are disclosed. The microphone includes: a main substrate in which a first sound hole is formed; a sound sensing module formed in the main substrate corresponding to the first sound hole; a semiconductor chip electrically connected with the sound sensing module and formed on the main substrate; a cover mounted to the main substrate, and in which a second sound hole is formed; and a sound delay filter mounted corresponding to the second sound hole, and in which a plurality of filter holes are formed.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: November 26, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Ilseon Yoo, Hyunsoo Kim
  • Patent number: 10313798
    Abstract: An electronic device with directional MEMS microphone assembly is provided, including a MEMS microphone capsule with a PCB affixed thereto, and a housing affixed to the PCB. The microphone assembly includes a first internal port and a second internal port through the PCB, wherein the first and second internal ports fluidically communicate with the MEMS microphone capsule. The microphone assembly further includes first and second external ports through the housing, wherein the first external port is offset from the first internal port in an offset direction perpendicular to a thickness direction of the microphone assembly. The microphone assembly further includes first and second cavities located between the PCB and the housing, wherein the first cavity fluidically communicates with the first internal port and the first external port, and the second cavity fluidically communicates with the second internal port and the second external port.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: June 4, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Kevin Juho Venalainen, Brian W. Aznoe, Dana William Bourke
  • Patent number: 10294095
    Abstract: A micromechanical sensor that is produced surface-micromechanically includes at least one mass element formed in a third functional layer that is non-perforated at least in certain portions. The sensor has a gap underneath the mass element that is formed by removal of a second functional layer and at least one oxide layer. The removal of the at least one oxide layer takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: May 21, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Benny Pekka Herzogenrath, Johannes Classen
  • Patent number: 10271121
    Abstract: An electronic device comprising having an enclosure with an enclosure wall separating a surrounding environment from an encased space. The enclosure wall includes a top portion having an acoustic channel extending from the encased space to the surrounding environment and a bottom portion. A microphone assembly module positioned within the encased space, and having a microphone acoustically coupled to a sound inlet port that is aligned with the acoustic channel and an air permeable water resistant membrane. A first support member is dimensioned to translatably couple the microphone assembly module to the top portion of the enclosure wall and translate the microphone assembly in response to a pressure change within the acoustic channel, and a second support member is dimensioned to translatably couple the microphone assembly module to the bottom portion of the enclosure wall.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: April 23, 2019
    Assignee: Apple Inc.
    Inventors: Neal D. Evans, Jesse A. Lippert, Nikolas T. Vitt
  • Patent number: 10149087
    Abstract: A loudspeaker cabinet has a number of pairs of microphones, each pair includes the same internal microphone and a different external microphone. For each pair of microphones, a process (i) receives a first audio signal of sound captured by the internal microphone and a second audio signal of sound captured by the different external microphone, (ii) estimates, using first and second audio signals, a radiation impedance, and (iii) computes a detection value based on the radiation impedance in a frequency band. A difference between (i) a currently computed detection value associated with a given pair of microphones and (ii) a previously computed detection value associated with said given pair, is computed. The sound produced by the cabinet is adjusted, in response to the computed difference meeting a threshold. Other embodiments are also described and claimed.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 4, 2018
    Assignee: Apple Inc.
    Inventors: Sylvain J. Choisel, Adam E. Kriegel
  • Patent number: 10110980
    Abstract: Thus there is provided a guitar amplifier microphone unit including at least one microphone capsule having a respective microphone capsule holder and a frame for holding the at least one microphone capsule holder. The at least one microphone capsule holder is arranged displaceably and/or rotatably on the frame.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: October 23, 2018
    Assignee: Sennheiser electronic GmbH & Co. KG
    Inventor: Heinz Epping
  • Patent number: 10028065
    Abstract: Disclosed herein are methods, systems, and devices for remotely-processing one or more audio signals received at a hearing device. An example method includes a hearing device receiving from a media device a command to send to the media device an audio signal. Responsive to at least the command, the method includes the hearing device sending to the media device the audio signal. The method also includes the hearing device receiving from the media device a remotely-processed signal. Data included in the remotely-processed signals is based on audio data included in the audio signal. Based on at least the remotely-processed signal, the method includes the hearing device generating a stimulation signal and using the stimulation signal to deliver at least one stimulus to a recipient of the hearing device.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: July 17, 2018
    Assignee: Cochlear Limited
    Inventors: Michael Goorevich, Martin Hillbratt
  • Patent number: 10026414
    Abstract: A speech processing system placed in a vehicle to effectively acquire a voice of a driver includes a first microphone that is provided on a surface facing the driver of the vehicle out of a steering wheel of the vehicle, and inputs a voice of the driver, a second microphone that is provided at a position where the voice of the driver of the vehicle is blocked by at least part of the steering wheel in the vehicle, and inputs noise in the vehicle, and a noise suppressor that suppresses an estimated noise signal based on a first signal corresponding to the sound input to the first microphone and a second signal corresponding to the sound input to the second microphone, and generates and outputs a pseudo speech signal.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: July 17, 2018
    Assignee: NEC Corporation
    Inventors: Masanori Tsujikawa, Akihiko Sugiyama
  • Patent number: 10021471
    Abstract: To prevent penetration of water into a microphone unit side even if the rain falls on a cylindrical acoustic tube in a narrow directional microphone using the acoustic tube. The narrow directional microphone includes a cylindrical acoustic tube base portion, the acoustic tube base portion includes at least one slit-like opening extending along a longitudinal direction of the acoustic tube base portion, a plurality of short fibers are implanted in an outer peripheral surface of the acoustic tube base portion and base portion edge surfaces that form the opening, and the opening is covered with the short fibers.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: July 10, 2018
    Assignee: KABUSHIKI KAISHA AUDIO-TECHNICA
    Inventor: Hiroshi Akino
  • Patent number: 9998813
    Abstract: Provided is a microphone which is capable of detecting a face or the like of the person and maintaining an on-state even when the face or the like of the person which has approached the microphone does not move. A power supply of the microphone turns on according to a reception of a reflected light of an emission from the first and/or second light-emitting element, which is arranged at a position around an outer periphery of the sound pickup portion of the microphone by the first and/or second light-receiving element, which is arranged at an another position around the outer periphery of the sound pickup portion of the microphone.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 12, 2018
    Assignee: ABLIC INC.
    Inventor: Fumiyasu Utsunomiya
  • Patent number: 9986322
    Abstract: A system is disclosed for safely and efficiently removing or returning a radio microphone from a mounting surface. The system includes a first magnet attached to the rear side of a radio microphone and a second magnet located at a desired mounting position on the mounting surface. The second magnet preferably includes an outer vinyl layer to prevent breaking or cracking of the first second magnet when returning the radio microphone to its mounting position.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: May 29, 2018
    Assignee: Innovative Products Inc.
    Inventors: Bryan J. Schreiber, Michael J. Tinter
  • Patent number: 9794667
    Abstract: A system is disclosed for safely and efficiently removing or returning a radio microphone from a mounting surface. The system includes a first magnet attached to the rear side of a radio microphone and a second magnet located at a desired mounting position on the mounting surface. The second magnet preferably includes an outer vinyl layer to prevent breaking or cracking of the first second magnet when returning the radio microphone to its mounting position.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: October 17, 2017
    Assignee: Innovative Products Inc.
    Inventors: Bryan J. Schreiber, Michael J. Tinter
  • Patent number: 9716934
    Abstract: An acoustic device such as a microphone or speaker is positioned with and coupled to a housing to connect an acoustic port of the acoustic device with an external opening of the housing. A reservoir is connected to the external opening via a bleed channel. The bleed channel may be less resistive to liquid ingress than the acoustic port. As such, the reservoir and bleed channel may redirect liquid from the external opening away from the acoustic port. In some implementations, the reservoir and/or the bleed channel may be defined by one or more acoustically permeable barriers such as meshes that cover the acoustic port, compressible materials such as foams that form a perimeter around the acoustic port, and/or adhesive layers that couple the acoustic device, the housing, and/or one or more other components.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: July 25, 2017
    Assignee: Apple Inc.
    Inventors: Phillip Qian, Edward Siahaan, Erik L. Wang, Esge B. Andersen