Abstract: A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1?n2|/n1<1%. The surface roughness of the convex structure is less than that of the sidewall of the waveguide layer. The second circuit layer is disposed on the second dielectric layer.

Abstract: The present invention is to provide a beam homogenizer, a laser irradiation apparatus, and a method for manufacturing a semiconductor device, which can suppress the loss of a laser beam and form a beam spot having homogeneous energy distribution constantly on an irradiation surface without being affected by beam parameters of a laser beam. A deflector is provided at an entrance of an optical waveguide or a light pipe used for homogenizing a laser beam emitted from a laser oscillator. A pair of reflection planes of the deflector is provided so as to have a tilt angle to an optical axis of the laser beam, whereby the entrance of the optical waveguide or the light pipe is expanded. Accordingly, the loss of the laser beam can be suppressed. Moreover, by providing an angle adjusting mechanism to the deflector, a beam spot having homogeneous energy distribution can be formed at an exit of the optical waveguide.

Abstract: A sliding bearing for an internal combustion engine including a copper-based bearing alloy including silver and tin upon which an overlay is applied. The overlay comprises resin and MoS2, and the adherence of the overlay to the alloy is enhanced by a roughened alloy surface formed of grooves extending in the sliding direction.

Abstract: A light emitting element and a light receiving element are installed on a wiring board mounted in a housing case. Light emitted from the light emitting element is irradiated on an object to be detected through a first lens installed in the housing case. Light reflected by the object to be detected is received by the light receiving element through a second lens installed in the housing case. The housing case is formed of a grounded conductive material, and the wiring board is formed of a material having a coefficient of linear expansion equivalent to that of the housing case.

Abstract: A planar waveguiding device has the cores of the fibre tails directly connected to the path regions of the waveguiding structure. The devices are produced by attaching the fibre tails before the path layer is deposited. The direct connections are produced when the path layer is sintered.

Abstract: Slide assemblies, which each include a metallic member and a ceramic member to slide with the metallic member. The metallic member has a sliding surface coated with a mixture consisting essentially of a solid lubricant and a binder. The mixture of the solid lubricant and the binder is a combination selected from the group consisting of LiF+MoO.sub.3, PbO+Cu, MoS.sub.2 +Cu, LiF+Ni--Cr--Mo--Si, and LiF+Co--Mo--Cr--Si. Silicon nitride, sialon, mullite, partially stabilized zirconia, or silicon carbide is preferably used as the ceramic member. The slide assemblies exhibit excellent high frictional resistance and wearing resistance even in dry condition at high temperatures.