Permanently Fixed Coupler Patents (Class 385/51)
  • Patent number: 6934444
    Abstract: A practical realization for achieving and maintaining high-efficiency transfer of light from input and output free-space optics to a high-index waveguide of sub-micron thickness is described. The required optical elements and methods of fabricating, aligning, and assembling these elements are discussed. Maintaining high coupling efficiency reliably over realistic ranges of device operating parameters is discussed in the context of the preferred embodiments.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: August 23, 2005
    Assignee: SiOptical, Inc.
    Inventors: Margaret Ghiron, Prakash Gothoskar, Robert Keith Montgomery, Vipulkumar Patel, Soham Pathak, Kalpendu Shastri, Katherine A. Yanushefski
  • Patent number: 6931178
    Abstract: A fiber optic coupler comprises a metal tube and a clear hollow silicone insert, with a tapered region including a first set of grabbers and a constant area region including a second set of grabbers. A tapered optical element is coupled to an optical fiber, when both the tapered optical element and the optical fiber are mechanically secured by crimping the metal tube and the silicone insert in the proximity of the first and second sets of grabbers, as by using a standard crimper tool.
    Type: Grant
    Filed: January 6, 2004
    Date of Patent: August 16, 2005
    Assignee: Honeywell International Inc.
    Inventor: Robert J. Saccomanno
  • Patent number: 6917032
    Abstract: A semiconductor photodetection device includes a light incident facet for receiving light from an optical waveguide. Light received at the light incident facet is refracted through a photo-absorption layer to register photonic events. A material may be introduced between the optical waveguide and the light incident facet to improve responsiveness of the device. The light incident facet may be at an angle to the direction of the light emitted from the optical waveguide to cause the incident light to be refracted through several layers of the semiconductor photodetection device.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: July 12, 2005
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventor: Hideki Fukano
  • Patent number: 6913399
    Abstract: An optical component formed from a fiber directly coupled to a photodiode without any intervening optical components such as mirrors or lenses is disclosed. The optical component includes a stripped optical fiber having a core with a flat distal end that extends through a ferrule. The distal flat end of the core is printed with an annular coating of metal leaving a central portion of the core uncovered. The coated flat end of the core is initially aligned with an aperture or active area of a rear side of a back-illuminated photodiode which also includes a coating of metal. With the two parts in abutting engagement, a reflow or a partial melting process is carried out to directly couple the fiber core to the photodiode.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: July 5, 2005
    Assignee: Intel Corporation
    Inventors: Yen-Ping Ho, Delin Li
  • Patent number: 6886365
    Abstract: The method for making the fiber optic Fabry-Perot sensor includes securing an optical fiber to a substrate, and forming at least one gap in the optical fiber after the optical fiber is secured to the substrate to define at least one pair of self-aligned opposing spaced apart optical fiber end faces for the Fabry-Perot sensor. Preferably, an adhesive directly secures the at least one pair of optical fiber portions to the substrate. The opposing spaced apart optical fiber end faces are self-aligned because the pair of optical fiber end portions are formed from a single fiber which has been directly secured to the substrate. Also, each of the self-aligned spaced apart optical fiber end faces may be substantially rounded due to an electrical discharge used to form the gap. This results in integral lenses being formed as the end faces of the fiber portions.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: May 3, 2005
    Assignee: Harris Corporation
    Inventors: Raymond C. Rumpf, Syed H. Murshid
  • Patent number: 6885788
    Abstract: A light reception/emission device built-in module with optical and electrical wiring combined therein includes: an optical waveguide layer including a core portion and a cladding portion; first and second wiring patterns formed on a main surface of the optical waveguide layer; a light reception device disposed inside the optical waveguide layer, the light reception device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the first wiring pattern; and a light emission device disposed inside the optical waveguide layer, the light emission device being optically connected with the core portion of the optical waveguide layer and being electrically connected with the second wiring pattern. With this configuration, optical coupling between the optical waveguide and the light reception/emission device can be conducted precisely.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: April 26, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Iwaki, Yutaka Taguchi, Tetsuyoshi Ogura, Yasuhiro Sugaya, Toshiyuki Asahi, Tousaku Nishiyama, Yoshinobu Idogawa
  • Patent number: 6882782
    Abstract: The invention concerns a photonic device comprising a first section including a material adapted to interact with photons, a second section including a material adapted to interact with photons, with an area of said first section and an area of said second section abutting each other wherein at least a part of said first area and a part of said second area defines a low temperature bonding area to provide adaptability for a plurality of applications based on a combination of materials having specific characteristic benefits, however without introducing unwanted effects having a negative influence on the quality of optical signals.
    Type: Grant
    Filed: May 16, 2001
    Date of Patent: April 19, 2005
    Assignee: Schott Glas
    Inventors: Samuel D. Conzone, Joseph S. Hayden, Alexander J. Marker, III, Marren Walther, Rainer Liebald, Ulrike Beer, Ulrich Peuschert, Ruediger Sprengard, Tobias Käleer
  • Patent number: 6874948
    Abstract: A method and apparatus for bonding optical fibers are disclosed. A fiber bonding device feeds an optical fiber through a supportive sheath having a ceramic tip at its end. The optical fiber extends slightly beyond the ceramic tip and is aligned with the focal point of a laser, which causes the end of the optical fiber to melt, forming a molten region. The ceramic tip then extends partially into a substrate surface, causing the molten region of the optical fiber to become bonded to the substrate. The process is controlled by computer logic, such that it is an automated, precision process for bonding optical fibers.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: April 5, 2005
    Assignee: The Regents of the University of California
    Inventors: Mark Brian Farrelly, Theodore David Bennett
  • Patent number: 6870992
    Abstract: Optical components may be aligned for transverse-optical coupling by: fabricating a first optical component on a substrate; fabricating an alignment member on the substrate suitably positioned relative to the first optical component; and assembling a second optical component onto the alignment member, thereby establishing transverse optical coupling between the optical components. The substrate may preferably be substantially planar. The alignment member may mechanically engage the second optical component so as to accurately establish and stably maintain transverse optical coupling. The first optical component and the alignment member may preferably be fabricated on the substrate using precision spatially selective materials processing techniques. Transverse optical coupling between two optical components may be stably maintained by substantially embedding transverse-coupled portions of the components in a substantially solid substantially transparent low-index medium.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: March 22, 2005
    Assignee: Xponent Photonics Inc
    Inventors: Charles I. Grosjean, Guido Hunziker, Paul M. Bridger, Oskar J. Painter
  • Patent number: 6862386
    Abstract: A method of making an all-fiber Mach-Zehnder interferometer comprising at least two optical fibers comprises the steps of bringing the fibers in a reciprocal contact relationship for a contact section thereof; fusing together and tapering the fibers in at least a first portion of said contact section; forming at least two optical couplers between the fibers in a second and a third portions of said contact section, located at opposite sides of said first portion.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: March 1, 2005
    Assignee: Corning Incorporated
    Inventors: Valeria Corio, Aurelio Pianciola
  • Patent number: 6847761
    Abstract: An object beam divided by a light dividing means 12 is caused to enter a photo-refractive polymer layer 6 through an optical fiber 23. On the other hand, a reference beam divided by the light dividing means 12 is irradiated on the photo-refractive polymer layer 6 through a lens 13 from the opposite side. In this manner, the object beam is superimposed on the reference beam in the photo-refractive polymer layer 6 to provide an interference fringe or pattern. Since a photo-refractive polymer has a specific characteristic whereby the refractive index changes according to the intensity of irradiation light and the change is fixed after the irradiation light is stopped, a diffraction grating 5 corresponding to the interference fringe is recorded on the photo-refractive polymer layer 6. This diffraction grating 5 exhibits a specific characteristic whereby the object beam emitted from the optical fiber 23 is emitted in the direction of the reference beam.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: January 25, 2005
    Assignee: Nippon Sheet Glass Co., Ltd.
    Inventor: Kenjiro Hamanaka
  • Patent number: 6841486
    Abstract: A process comprising: (a) applying a stop etch mask to a substrate, the mask defining the location on the substrate of a groove for receiving a waveguide and one or more fiducials for positioning the optical device on the substrate relative to the waveguide; and (b) etching the substrate to define the fiducials and the groove, the groove being dimensioned to receive at least a portion of a waveguide and the fiducials enabling the optical device to be positioned on the substrate such that it is optically aligned with the waveguide.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: January 11, 2005
    Assignee: Tyco Electronics Corporation
    Inventors: Robert Addison Boudreau, Christian Drabenstadt, Jeffery Emerson Schramm
  • Patent number: 6836602
    Abstract: Methods of bonding optical components are disclosed. Bonding is achieved without use of adhesives or high temperature fusion. The invention is useful for bonding optical fibers together and for bonding optical fiber arrays to lens arrays.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: December 28, 2004
    Assignee: Corning Incorporated
    Inventors: John F. Filhaber, Clarence E. Ford, Jr., Robert Sabia, Jackson P. Trentelman
  • Patent number: 6832860
    Abstract: An optical module includes a holder formed of a medium having light transmittance. The optical module further includes an optical device for converting an optical signal into an electric signal, and vice versa; a light guide member having a core being a path of the optical signal generated by the optical device, and a clad installed outside the core and for forming an interface from which the optical signal is reflected, together with the core; and a holder formed on an end of the light guide member for fixing the optical device and the light guide member of which optical axes are aligned with respect to the same point, the holder through which the optical signal can penetrate. In the optical module, the light guide member and the holder may be formed as a single body. The optical module can stably transmit an optical signal using the optical module and, further, be used in a variety of ways by changing the optical characteristics of the medium having light transmittance of the holder.
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: December 21, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eung-yeoul Yoon, Jong-hwa Won
  • Patent number: 6816652
    Abstract: Techniques and devices that couple multiple pump fibers to a double-clad fiber by using a sleeve, a lens, an input fiber ferrule, and an output fiber ferrule.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: November 9, 2004
    Assignee: Calmar Optcom, Inc.
    Inventors: Hong Lin, Claire Yan Chen Lin
  • Patent number: 6788852
    Abstract: Coupler packages for providing protection against the elements for fused fiber couplings. The coupler package has an inner and outer cylinder for providing additional buffering against vibration, temperature expansion, corrosion, and water penetration. The double tube structure increases the penetration length for water, while the seals decrease the cross section for water penetration.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: September 7, 2004
    Assignee: Finisar Corporation
    Inventors: Senlu Xu, Steve Wang, Johnny Zhong
  • Patent number: 6780274
    Abstract: A fiber collimator is provided, comprising at least two optical components, one of the optical components (e.g., an optical element such as a collimating lens or a plano-plano pellet) having a surface that has a comparatively larger cross-sectional area than the surface of the other optical component(s) (e.g., at least one optical fiber). The optical components are joined together by fusion-splicing, using a laser. A gradient in the index of refraction is provided in at least that portion of the surface of the optical element to which the optical fiber(s) is fusion-spliced or at the tip of the optical fiber. The gradient is either formed prior to or during the fusion-splicing. Back-reflection is minimized, pointing accuracy is improved, and power handling ability is increased.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: August 24, 2004
    Assignee: Lightpath Technologies, Inc.
    Inventors: Pierre Bernard, Mark A. Fitch, Paul Fournier, Marc Farrell Harris, William P. Walters
  • Patent number: 6770945
    Abstract: In a semiconductor photo-detector of the present invention, a first semiconductor layer, a second semiconductor layer having, and a photo-absorption part composed of a photo-absorption layer sandwiched between these layers are disposed on a substrate, at least the photo-absorption layer is formed at a position apart inwardly by a finite length from an end surface of the substrate, an end surface of the second semiconductor layer and the substrate or the end surface of the substrate is provided with a light incident facet angled inwardly as it separates from the surface of the second semiconductor or the surface of the substrate.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: August 3, 2004
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventor: Hideki Fukano
  • Patent number: 6758935
    Abstract: A fiber collimator is provided, comprising at least two optical components, one of the optical components (e.g., an optical element such as a collimating lens or a plano—plano pellet) having a surface that has a comparatively larger cross-sectional area than the surface of the other optical component(s) (e.g., at least one optical fiber). The optical components are joined together by fusion-splicing, using a laser. A gradient in the index of refraction is provided in at least that portion of the surface of the optical element to which the optical fiber(s) is fusion-spliced or at the tip of the optical fiber. The gradient is either formed prior to or during the fusion-splicing. Back-reflection is minimized, pointing accuracy is improved, and power handling ability is increased.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: July 6, 2004
    Inventors: Pierre Bernard, Mark A. Fitch, Paul Fournier, Marc Farrell Harris, William P. Walters
  • Patent number: 6712528
    Abstract: The invention relates to an optical assembly for opto-electronic packages comprising an optical fibre secured on the underside of an elongated support member in optical alignment with an opto-electronic device, wherein said support member is affixed to an aligning member, which in turn is affixed, e.g., by laser welding, to a welding platform. In a preferred embodiment, the elongated support member is a planar parallelepiped. In a further preferred embodiment, the elongated support member is a parallelepiped with an axially extended slot, in which the optical fibre is secured with its longitudinal axis substantially parallel to the axially extended slot.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: March 30, 2004
    Assignee: Corning O.T.I. S.r.l.
    Inventors: Roberto Galeotti, Mark Andrew Shaw, Giacomo Coppo
  • Patent number: 6701046
    Abstract: A fused optical coupler comprising a polarization maintaining fiber and a standard fiber is provided. The cross-section of the said standard fiber is smaller than the cross-section of the polarization maintaining fiber in the area of fusion of the coupler. The internal forces in the coupling area are sufficiently low to provide an extinction ratio of more than 20 dB at the output of the polarization maintaining fiber.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: March 2, 2004
    Assignee: Corning O.T.I. SpA
    Inventors: Aurelio Pianciola, Paolo Vavassori, Valeria Corio
  • Patent number: 6684014
    Abstract: The invention relates to a micro-optic adhesive assembly and a method for making a micro-optic assembly. The method of joining optical assemblies in accordance with the present invention improves the strength and shock resistance of adhesive joints in micro-optic devices without affecting the optical path. The adhesive assembly of the present invention has sufficiently flexibility to be able to conform to different alignment geometries without introducing significant bulk or thermal expansion incompatibility. Further the improved method is compatible with the device manufacturing techniques and does not add significant manufacturing complexity.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: January 27, 2004
    Assignee: JDS Uniphase Corporation
    Inventors: Li Wu, Jiwu Ling, Weimin Chen, Chenggang Xin, Zhen Miao, Cuilian Zhan
  • Patent number: 6665475
    Abstract: A groove assembly for holding at least one fiber optic. The assembly includes a base, a cover and a small carrier disposed between the base and the cover. The carrier has at least one groove. At least one fiber optic is disposed in this groove and terminates at an edge surface of the carrier. The base and cover have respective edge surfaces serving as attachment surfaces for attachment of the assembly to a planar lightwave circuit (PLC). The PLC has at least one waveguide terminating at an edge, to which the fiber requires alignment. The base and/or cover are preferably formed from a material enabling attachment to the PLC, e.g., transparent to energy used for curing an adhesive. The carrier is formed from material enabling a substantially more precise formation of the grooves, e.g., silicon.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: December 16, 2003
    Assignee: JDS Uniphase Corporation
    Inventor: Kenzo Ishida
  • Patent number: 6658182
    Abstract: A temperature stabilized tapered fiber optic component is produced, such as a fiber optic coupler or a fiber optic filter. In the case of the component such as a coupler, at least two fibers are fused and tapered to achieve a desired taper profile with suitable mechanical and wavelength properties. In the case of a component such as a fiber filter, only one fiber is tapered. Once the component is formed, it is solidly secured to a rigid substrate that produces a mechanical stress such as to compensate for any modal phase shift of the component due to temperature variation. Also, the mechanical phase dependence of the component may be adjusted in relation to the substrate to provide the desired temperature compensating effect. Preferably, both these features are used to achieve the best possible temperature stabilization.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: December 2, 2003
    Assignees: ITF Technologies Optiques Inc., ITF Optical Technologies Inc.
    Inventor: François Gonthier
  • Patent number: 6640032
    Abstract: An optical member-bonding structure includes a first optical component, a second optical component, and an integral substrate having a mounting face on which the first and second optical components are mounted, at least the first optical member being bonded to the integral substrate, wherein a bonding face of the first optical member is bonded to the mounting face of the integral substrate with a cured and shrunk optical adhesive in such a state that an optical axis of the first optical member is aligned with that of the second optical member at a precision of not more than 1 &mgr;m, a groove is formed in a such bonding region of that mounting face of the integral substrate as being bonded with the first optical member, and at least part of the optical adhesive is filled into the groove.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: October 28, 2003
    Assignee: NGK Insulators, Ltd.
    Inventors: Jungo Kondo, Tetsuya Ejiri, Takashi Yoshino
  • Patent number: 6606434
    Abstract: A method of fabricating a structure comprising an optical fiber interconnect rigidly clamped within an enclosure wherein ends of the interconnect are offset. The method comprises selecting an enclosure material such that its coefficient of thermal expansion leads, during cooling, to a compressive force that minimizes tensile stress in the interconnect. An optical fiber interconnect structure and a semiconductor device fabricated according to the method are also disclosed.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: August 12, 2003
    Assignee: Lucent Technologies Inc.
    Inventor: Ephraim Suhir
  • Patent number: 6591044
    Abstract: An optical waveguide circuit module of the invention is a highly reliable optical waveguide circuit module where cracks are not generated in an optical waveguide circuit chip housed even under a high temperature and high humidity environment. An optical waveguide circuit chip (25) comprises a waveguide forming region (10) formed on a substrate (1). The waveguide forming region (10) has a waveguide configuration sequentially connecting optical input waveguides (2), a first slab waveguide (3), an arrayed waveguide (4) made of a plurality of channel waveguides (4a) arranged side by side, the channel waveguides having a different length each other, a second slab waveguide (5), and a plurality of optical output waveguides (6) arranged side by side.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: July 8, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kazuhisa Kashihara, Kazutaka Nara, Tunetoshi Saito, Takeshi Nakajima
  • Publication number: 20030123807
    Abstract: A first waveguide and a second waveguide are aligned by applying an alignment dot on end surfaces of the cores of first and second waveguides. The alignment dots are positioned in close proximity to one another, and are melted together.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 3, 2003
    Inventor: Kjetil Johannessen
  • Publication number: 20030081906
    Abstract: Methods of bonding optical components are disclosed. Bonding is achieved without use of adhesives or high temperature fusion. The invention is useful for bonding optical fibers together and for bonding optical fiber arrays to lens arrays.
    Type: Application
    Filed: September 25, 2002
    Publication date: May 1, 2003
    Inventors: John F. Filhaber, Clarence E. Ford, Robert Sabia, Jackson P. Trentelman
  • Publication number: 20030053757
    Abstract: An optical waveguide assembly is disclosed. The optical waveguide assembly includes having a substrate face, a cladding disposed on the substrate, and a waveguide core disposed within the cladding. The waveguide core has a waveguide core face such that the waveguide core face is aligned with the substrate face. The assembly further comprises a fiber support assembly having a support face in contact with the substrate face and a fiber having a fiber core face optically aligned with the waveguide core face. Non-adhesive means fixedly connects the substrate face to the support face. A method of non-adhesively bonding an optical waveguide to a fiber support is also disclosed.
    Type: Application
    Filed: September 10, 2002
    Publication date: March 20, 2003
    Inventors: Renyuan Gao, Anthony F. Garito
  • Patent number: 6535672
    Abstract: An optical waveguide device has a hybrid core and a cladding. A first waveguide having a glass core is coupled to a polymer waveguide disposed adjacent and parallel to the first waveguide such that the respective cores are contiguous in a coupling region. The polymer is a thermo-optically active polymer. A heater is provided over the coupling region and the refractive index of the polymer is varied by applying heat to the region. By application of sufficient heat, the refractive index of the polymer can be changed to approach the refractive index of the cladding whereby the device acts as a simple glass waveguide. In the absence of heat, the device acts as a MMI coupler.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: March 18, 2003
    Assignee: JDS Uniphase Inc.
    Inventor: Reza Paiam
  • Patent number: 6519394
    Abstract: A bonding structure of optical members has a first optical member, a second optical member, a first support member supporting the first optical member, and a second support member supporting the second optical member. The first support member is bonded to the second support member. The first support member and the second support member are bonded with each other via a hardened acrylic resin adhesive under a condition such that an optical axis of the first optical member and an optical axis of the second optical member are optically aligned with each other with an accuracy of within 1 &mgr;m. A viscosity of the acrylic resin adhesive before hardening is larger than 500 cP and lower than 5000 cP.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: February 11, 2003
    Assignee: NGK Insulators, Ltd.
    Inventors: Jungo Kondo, Tetsuya Ejiri, Saori Takatsuji
  • Publication number: 20030012511
    Abstract: An optical fiber attachment assembly and method of making such an assembly. The assembly includes an optical device having an optical waveguide with an end surface exposed on an end surface of the device, and a bare optical fiber having an end surface cleaved at a predetermined angle and aligned with the end surface of the waveguide. The end of the fiber is affixed to the optical device by a first adhesive. A strain relief block positioned at a distance from the end surface of the optical device and the optical fiber is affixed to the strain relief block by a second adhesive to securely mount the fiber to the optical device. The optical device and the strain relief block are mounted on a carrier. Also described is a method for attaching an optical fiber to a waveguide in an optical device. The fiber attachment assembly and method can be used in a flip-chip configuration where the chip is mounted on a ground plane in a flipped orientation via a plurality of spacers.
    Type: Application
    Filed: July 10, 2001
    Publication date: January 16, 2003
    Applicant: Aeroflex-TriLink Corporation
    Inventors: Jack Po-oun Lin, Annette Sonja Jerinic
  • Publication number: 20020187432
    Abstract: A method of coupling optical waveguides comprising the steps of: (i) providing at least one pair of waveguides located such that (a) light radiation propagating through one of the waveguides will be at least partially coupled to a corresponding waveguide and, (b) these waveguides are separated by a gap of about 2 &mgr;m to about 500 &mgr;m long; the waveguides having positive dn/dT; (ii) filling the gap with a photo-polymerizable composition, the composition having dn/dT of −2×10−4/C to −4×10−4/C; (iii) providing simultaneous photo-radiation through said waveguides, wherein the photo-radiation photo-polymerizes the composition, thereby (a) creating a first region bridging between the waveguides, the first region having a first index of refraction, and (b) a second region encapsulating the first region, the second region having a second index of refraction, such that said first index of refraction of the first region is at least 0.
    Type: Application
    Filed: May 7, 2001
    Publication date: December 12, 2002
    Inventors: Steven B. Dawes, Michael E. DeRosa, Robert J. Hagerty
  • Publication number: 20020181882
    Abstract: A self-aligned optical coupler, and method of manufacturing thereof, for conducting light from and to vertical and/or horizontal ports on optical devices or optoelectric integrated circuits. The device or circuit having the respective port has keys and/or slots on the device or circuit for self-aligning an end of the optical coupler to the port. The end has corresponding slots and/or keys. Visual alignment marks may be used instead so as to permit automatic alignment with machine vision devices. The coupler may have one or a plurality of waveguides. One of the ends of the coupler may have a connector for a self-aligning optical connection to a connector receptacle of a module or a backplane.
    Type: Application
    Filed: April 30, 2002
    Publication date: December 5, 2002
    Inventors: Mary K. Hibbs-Brenner, Harold Y. Walker, Julian P.G. Bristow, Yue Liu
  • Publication number: 20020181880
    Abstract: The invention includes an optical fiber device, comprising at least one optical fiber over a substrate, at least one reentrant shape in the substrate adjacent to the optical fiber and a polymer that at least partially encapsulates the optical fiber and attaches the optical fiber to the at least one reentrant shape and methods for making the same.
    Type: Application
    Filed: April 19, 2002
    Publication date: December 5, 2002
    Inventors: Mindaugas F. Dautartas, Martin G. Meder
  • Patent number: 6490394
    Abstract: An athermal optical device and a method for producing the device, such as an athermal optical fiber reflective grating (20), are described. The athermal optical fiber reflective grating device (20) comprises a negative expansion substrate (22), an optical fiber (24) mounted on the substrate (22) surface, and a grating (26) defined in the optical fiber (24). The method for producing the athermal optical fiber reflective grating (20) device comprises providing a negative expansion substrate (22), mounting an optical fiber (24) with at least one reflective grating (26) defined therein onto the substrate (20) upper surface, and affixing the optical fiber (24) to the substrate (22) at at least two spaced-apart locations (30, 32).
    Type: Grant
    Filed: July 14, 1998
    Date of Patent: December 3, 2002
    Assignee: Corning Incorporated
    Inventors: George H. Beall, David L. Weidman
  • Patent number: 6487343
    Abstract: An optical structure for combining light from a plurality of individual optical fibers into a single optical transmission device. The structure can be incorporated into the optical probe of a spectrophotometric instrument and includes a plurality of optical send fibers having input and output ends and an optical light mixer having input and output ends. The output ends of the send fibers are secured in optical communication with the input end of the light mixer.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: November 26, 2002
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark S. Lewandowski, Kenneth R. Quast, Dean E. Myers, Mark A. Schmidt
  • Patent number: 6485190
    Abstract: The present invention discloses an improved in-line micro-optic component. The in-line micro-optic component includes an optical core attached to a first optical collimator by applying a first heat-curing epoxy. The in-line micro-optic component further includes a first gold-plated stainless steel holder holding the first optical collimator. The first optical collimator is inserted and fixed in the first stainless steel holder by applying a second heat-curing epoxy. The inline micro-optic component coupler further includes a second optical collimator. The in-line micro-optic component coupler further includes a second gold-plated stainless steel holder holding the second optical collimator. The second optical collimator is inserted and fixed in the second stainless steel holder by applying a third heat-curing epoxy.
    Type: Grant
    Filed: May 18, 1999
    Date of Patent: November 26, 2002
    Assignee: JDS Uniphase Inc.
    Inventor: Yu Zheng
  • Publication number: 20020131713
    Abstract: The invention provides an optical device wherein a tapered optical fiber is supported on a substrate which is at least partially coated with a polymeric material for protecting the tapered optical fiber during an impact therewith. A spacer is provided for suspending the tapered optical fiber over the at least partially coated substrate. The spacer is adjacent to non-tapered portions of the tapered optical fiber. Advantageously, an adhesive is used as the spacer so as to secure the tapered optical fiber in a predetermined position.
    Type: Application
    Filed: January 22, 2001
    Publication date: September 19, 2002
    Inventors: Yihlih Peng, Warren Lewis
  • Publication number: 20020131701
    Abstract: An inexpensive optical module that avoids misalignment of optical axes and is fixed together with high reliability. Optical elements are aligned with each other and then fixed to a connecting member. The connecting member has first and second bonding surfaces. A relatively large area of the first and second bonding surfaces contacts the optical elements. The connecting member has a simple structure. This facilitates the manufacturing of the connecting member. The distance between the optical elements and the connecting member is minimized. Thus, the optical element is fixed together with high reliability.
    Type: Application
    Filed: March 7, 2002
    Publication date: September 19, 2002
    Applicant: Nippon Sheet Glass Co., Ltd.
    Inventor: Xiaofan Zhu
  • Publication number: 20020131715
    Abstract: An optical coupling between first and second optical components 1, 8 in which an input face 2A through which light is to pass of the first component 1 being directly bonded to an output face 8C through which light is to pass of the second component 8. Such a coupling may be provided, for example, between a rib waveguide 2 and an optical fibre 7.
    Type: Application
    Filed: March 15, 2002
    Publication date: September 19, 2002
    Applicant: Bookham Technology Plc
    Inventor: Dominic Joseph Brady
  • Patent number: 6453096
    Abstract: A jig for the batch production of optical communication apparatuses includes a jig body whose upper surface is provided with a plurality of U-shaped recesses arranged in a matrix array to receive silicon bases each carrying optical devices and a plurality of vacuum holes vertically formed through the jig body, to communication with the respective bottom surfaces of the U-shaped recesses. The silicon bases received by the U-shaped recesses are held onto the bottom surfaces thereof when a vacuum is applied thereto through the vacuum holes. A method using the jig enables batch production by simultaneously processing many silicon bases.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: September 17, 2002
    Assignee: Aligned Technologies Incorporated
    Inventors: Do Youl Kim, Han Jun Koh, Min Ho Choi
  • Patent number: 6445856
    Abstract: The most common method of testing the various aspects of light traveling in a waveguide includes tapping a portion of the light and directing the tapped portion at an appropriate sensor. Conventionally, the simplest method for tapping light utilized a fused fiber coupler; however, even this method requires additional fiber splicing and management steps that increase manufacturing costs. The present invention uses a beam splitter, positioned inside a centerpiece sleeve in the path of the light, to direct a portion of the beam through the wall of the centerpiece sleeve to a monitoring sensor, preferably a photodiode. The centerpiece sleeve includes a window, which is at least partially transparent to the light, enabling the tapped portion of the light to reach the monitoring sensor. Preferably, the centerpiece sleeve is manufactured entirely out of glass.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: September 3, 2002
    Assignee: JDS Uniphase Corp.
    Inventor: Long Yang
  • Publication number: 20020114587
    Abstract: A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.
    Type: Application
    Filed: July 24, 2001
    Publication date: August 22, 2002
    Inventors: Suresh Golwalkar, Noah Davis, John Burns, Kannan Raj, Phil McClay, Wuchun Chou, Jonathan McFarland
  • Publication number: 20020114577
    Abstract: An optical member-bonding structure includes a first optical component, a second optical component, and an integral substrate having a mounting face on which the first and second optical components are mounted, at least the first optical member being bonded to the integral substrate, wherein a bonding face of the first optical member is bonded to the mounting face of the integral substrate with a cured and shrunk optical adhesive in such a state that an optical axis of the first optical member is aligned with that of the second optical member at a precision of not more than 1&mgr;m, a groove is formed in a such bonding region of that mounting face of the integral substrate as being bonded with the first optical member, and at least part of the optical adhesive is filled into the groove.
    Type: Application
    Filed: September 24, 2001
    Publication date: August 22, 2002
    Applicant: NGK Insulators, Ltd.
    Inventors: Jungo Kondo, Tetsuya Ejiri, Takashi Yoshino
  • Publication number: 20020110330
    Abstract: A package for a fiber optic device or fiber optic component having at least one optical fiber extending therefrom. The package is comprised of a support substrate for supporting the optical device or optic component, the support substrate having at least one optical fiber extending therefrom. A housing surrounds the substrate and has an opening at one end. At least one optical fiber extends through the opening. A layer of metal seals the opening of each end of the tube and the glass fiber cladding where the optical fiber extends through the layer of metal. The layer of metal is applied using a thin film deposition process, such as ion-beam assisted deposition, electron-beam deposition, or ion-beam deposition.
    Type: Application
    Filed: October 4, 2001
    Publication date: August 15, 2002
    Applicant: Gould Optronics Inc.
    Inventors: Jeffrey A. Brogan, Michael A. Centanni
  • Publication number: 20020110331
    Abstract: A method and apparatus for bonding optical fibers are disclosed. A fiber bonding device feeds an optical fiber through a supportive sheath having a ceramic tip at its end. The optical fiber extends slightly beyond the ceramic tip and is aligned with the focal point of a laser, which causes the end of the optical fiber to melt, forming a molten region. The ceramic tip then extends partially into a substrate surface, causing the molten region of the optical fiber to become bonded to the substrate. The process is controlled by computer logic, such that it is an automated, precision process for bonding optical fibers.
    Type: Application
    Filed: February 14, 2002
    Publication date: August 15, 2002
    Inventors: Mark Brian Farrelly, Theodore David Bennett
  • Patent number: RE38237
    Abstract: A fused fiber optic 1×4 or 2×4 coupler in which four optical fiber segments (A, B, C, D) extend longitudinally beside each other in a coupling region in which the fiber segments are at least partially fused together to form an assembly exhibiting a close packed cross section in which the fiber cores (11) are centered substantially at the corners of a four sided polygon having a pair or opposite internal acute angles substantially less than 90°.
    Type: Grant
    Filed: May 10, 2000
    Date of Patent: August 26, 2003
    Assignee: AOFR Pty. Limited
    Inventors: Martin C. Elias, Scott A. Johnston, Mark R. Hesling
  • Patent number: RE38586
    Abstract: A fiber optic coupler comprising a plurality of single-mode optical fibers, each of which is tapered to form a small diameter section that extends in contiguous relationship with the small diameter sections of the other fibers to form a coupling region. Each of the fibers has a core surrounded by a cladding of refractive index lower than that of the core. At least one of the fibers has a refractive index pedestal of refractive index ni between said core and cladding, wherein n1>ni>n2, n1 and n2 being the refractive indices of the core and cladding, respectively.
    Type: Grant
    Filed: May 10, 2001
    Date of Patent: September 14, 2004
    Assignee: Corning Incorporated
    Inventors: David L. Weidman, Donald R. Young, Jr.