Abstract: An object is to provide a chemical solution application apparatus capable of applying a chemical solution evenly and without irregularity by a spin coating method. A plurality of nozzles are provided for applying a chemical solution to an application object that is fixed over a stage. Each of the nozzles is individually mobile in vertical and horizontal directions. For this reason, controlling a discharging point or pattern is possible, and application responding to a wider viscosity range of chemical solutions is possible. By implementing the present invention, a chemical solution application apparatus equipped with a discharging method of a chemical solution by which a coating film having a small film thickness distribution over an entire substrate and an even thickness can be obtained, as well as for which use efficiency is improved by cutting down on waste of a chemical solution to be discharged.

Abstract: In an apparatus for performing a substrate developing process, a first washing tank and a second washing tank are disposed on both sides of a substrate support section for supporting the substrate opposite to each other to wash a developing nozzle. The developing nozzle moves in a horizontal direction from the first washing tank toward the second washing tank and supplies a developing solution onto the substrate in the meantime. After supplying the developing solution, the developing nozzle is received in the second washing tank, and the developing solution adhered to the developing nozzle is removed by a washing solution in the second washing tank.

Abstract: A coating apparatus includes a liquid film forming mechanism configured to form a liquid film of a process liquid for preventing a contaminant derived from a coating liquid from being deposited or left on a back side peripheral portion of a substrate. The liquid film forming mechanism includes a counter face portion facing the back side peripheral portion of the substrate and a process liquid supply portion for supplying the process liquid onto the counter face portion. The coating apparatus further includes a posture regulating mechanism disposed around the substrate holding member and configured to damp a vertical wobble of the peripheral portion of the substrate being rotated. The posture regulating mechanism includes delivery holes arrayed in a rotational direction of the substrate and configured to deliver a gas onto a back side region of the substrate on an inner side of the peripheral portion.

Abstract: The temperature of a developing solution is varied depending on the type of resist or the resist pattern. The developing solution is applied while scanning a developer nozzle having a slit-shaped ejection port that has a length matching the width of the effective area of the substrate. After leaving the substrate with the developing solution being coated thereon for a predetermined period of time, a diluent is supplied while scanning a diluent nozzle, thereby substantially stopping the development reaction and causing the dissolved resist components to diffuse. A desired amount of resist can be quickly dissolved through the control of the developing solution temperature, while the development can be stopped before the dissolved resist components exhibit adverse effect through the supply of the diluent a predetermined timing, whereby achieving a pattern having a uniform line width and improved throughput.

Abstract: An in-liquid turn bar disposed in a developing tank includes a first cylindrical member disposed outside and a second cylindrical member disposed inside. In the first cylindrical member, plural slit-shaped discharge openings for discharging the developer along a longitudinal direction are formed. In the second cylindrical member, plural nozzle holes for ejecting the developer are formed. A pipe-shaped introduction portion for introducing the developer is provided at one end of the second cylindrical member, and the plural nozzle holes are formed gradually larger as they go from the other longitudinal end to the one end. Regulating plates for regulating the amount of the developer discharged from both transverse ends of the photosensitive web are provided at both transverse ends of the first cylindrical member.

Abstract: There is provided an apparatus including: a processing cup having an opening opened upward to allow a substrate to be loaded and unloaded, an exhaust port for exhausting an unnecessary atmosphere produced in forming a film applied on the substrate, and an aspiration port for aspirating external air; and an aspiration device aspirating the unnecessary atmosphere through the exhaust port, wherein when the substrate is accommodated in the opening of the processing cup, the substrate has a perimeter spaced from the opening by a predetermined gap, and below the substrate accommodated in the processing cup there is formed an exhaust flow path extending from the aspiration port to the exhaust port.

Abstract: A developing apparatus, a developing processing method, a developing processing program, and a computer readable recording medium recording the program, which can reduce the consumption amount of the developing solution and the developing processing time irrespective of the type of resist materials or the shape of resist patterns, are provided. A step of horizontally holding a substrate and rotating the substrate around a vertical axis at a prescribed rotation rate, and a step of intermittently supplying a developing solution to a center of the substrate from a discharge port of a developing solution nozzle arranged opposing to the surface of the substrate are executed. In the step of intermittently supplying the developing solution to the center of the substrate, an intermittence time and a substrate rotation rate in the intermittence time are set to prevent the developing solution supplied to the substrate from drying.

Abstract: A puddle of developer supplied from a developer discharge nozzle is placed on a substrate held stationary. Next, the substrate is held stationary for a predetermined length of time, with the puddle of developer allowed to remain on the substrate. This causes a development reaction to proceed. Subsequently, deionized water is supplied from a deionized water discharge nozzle to the substrate to stop the development reaction, and the substrate is rotated while part of the puddle of developer is allowed to remain on the surface of the substrate. This makes a dissolution product easy to diffuse in the developer remaining on the surface of the substrate to promote the dissolution of the resist. A rinsing process and a drying process are performed to complete the development process.

Abstract: In an apparatus for performing a substrate developing process, a first washing tank and a second washing tank are disposed on both sides of a substrate support section for supporting the substrate opposite to each other to wash a developing nozzle. The developing nozzle moves in a horizontal direction from the first washing tank toward the second washing tank and supplies a developing solution onto the substrate in the meantime. After supplying the developing solution, the developing nozzle is received in the second washing tank, and the developing solution adhered to the developing nozzle is removed by a washing solution in the second washing tank.

Abstract: A method and apparatus for developing a resist on a substrate in which a sacrificial surfactant-containing liquid is first applied to a resist as a pretreatment to reduce developing process defects and to improve the development process time and the uniformity of the resist. The pretreatment is followed by supplying a developing solution to the resist and thereafter developing the resist.

Abstract: Rinsing nozzles 310a to 310e are moved on a wafer W while they are discharging rinsing solution 326. At that point, discharging openings 317a to 317e are contacted to developing solution 350 coated on the wafer W or rinsing solution 326 on the wafer W. Thus, the impact against the wafer W can be suppressed. As a result, pattern collapse can be prevented. In addition, a front portion of the developing solution 350 can push away the developing solution 350.

Abstract: A process for developing an imaged lithographic printing plate, including the step of delivering developing fluid to the plate at a high volumetric flow rate for a short dwell time such that the non-image is completely solubilized while the image remains unaffected by the developing fluid. At sufficient volumetric flow rate, the developer solution at the target area is constantly displaced during the development time, whereby no boundary layer forms on and travels with the plate during the development time and thus the target area is always in contact with fresh developer solution.

Abstract: In a liquid processing apparatus a spin chuck holds a wafer having a surface supplied with a liquid to be applied through a nozzle receiving the liquid through a feed path and whether the liquid passing through the feed path has fluctuation is detected by a fluctuation detection device. Thus the liquid's condition in the feed path can be determined significantly accurately. Supplying the substrate with the liquid without fluctuation allows the substrate to receive the liquid in an optimal condition. A satisfactory liquid process can thus be performed.

Abstract: The invention discloses a developing apparatus and a developing process. Wherein the developing process comprises following steps. First, a developing apparatus and a substrate are provided, wherein the developing apparatus comprises a conveyer and a nozzle. Then, the substrate is conveyed along a first direction by the conveyer, and the nozzle is driven to move along a second direction opposite to the first direction, wherein the nozzle sprays a developer over the substrate as moving. As mentioned above, the non-uniformity of development can be reduced.

Abstract: Disclosed is a processing device of a photo-sensitive material which comprises a conveying device for conveying a photo-sensitive material, a slot die for applying a processing liquid to the photo-sensitive material conveyed by the conveying device, a reservoir tank of the processing liquid, a supply device of the processing liquid for supplying a processing liquid in the reservoir tank of the processing liquid to the slot die, a support roll of the photo-sensitive material arranged at a position opposite to and spaced from a tip of the slot die, a device for detecting a photo-sensitive material, and a driving device for rotating the support roll of the photo-sensitive material which can rotate the support roll at least in the direction reverse to a conveying direction of the photo-sensitive material.

Abstract: An apparatus for developing a polymeric film without the need for a water rinse step is disclosed. An object having a surface supporting a polymeric film is placed onto a support region within a pressure chamber of the apparatus. A fluid and developer is introduced into the pressure chamber and the object is processed at supercritical conditions to develop the polymeric film such that the polymeric film is not substantially deformed. The pressure chamber is then vented.

Abstract: A development apparatus for discharging a developer onto a surface of a semiconductor substrate (15) comprises a nozzle pipe (13) for supplying the developer, and a nozzle (14) having a shape of a spoon with a taper and discharging the developer supplied by the nozzle pipe onto the surface of the substrate. The nozzle sprays the developer onto the surface of the substrate at any spray angle under a low and constant pressure.

Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.

Abstract: An apparatus for washing contaminants from a coated surface of a material comprises an inclined substantially planar surface up which the material is passed, an inlet for the introduction of wash solution at the upper part of the planar surface and pressure applying means for holding the material in full contact with the surface.

Abstract: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

Abstract: The invention relates to a photographic processor and a method of processing photographic material. The photographic processor is adapted to achieve a high speed processing of photographic material by utilizing the combination of a vacuum platen and a stacker arrangement that is adapted to hold the media for a time necessary to process and/or dry the media. The system permits media to be fed to a first vacuum platen where a first solution is applied. The platen transports the media to a first vertical stacker arrangement, which holds the media for a desired processing time for the first solution. The media can then be pushed through a stop solution, if needed, and onto a second vacuum platen where a second solution can be applied. The media is then delivered to second vertical stacker arrangement that is designed to assure the proper amount of processing time for the second solution.

Abstract: A digital film processing system and film processing solution cartridge are disclosed. The cartridge comprises a housing and a chamber for storing a film processing fluid. The processing solution may be contained within a flexible bladder within the chamber. The cartridge may also include an integral applicator for coating the processing solution onto undeveloped film. The cartridge is generally removeably attached to the film processing system, but may also be refillable.

Abstract: Disclosed herein are a method and apparatus for efficiently processing workpieces which are developed using a liquid developer. According to the invention a first set of workpieces is obtained from an imaging station, a second set of workpieces is obtained from a workpiece collection device, and the workpieces from the first and second sets are aligned in a contiguous arrangement, with the workpieces from the first set preferably being interspersed with those from the second set. Developer is then applied to the group of contiguous workpleces, thereby reducing the amount of overrun or overspray of developer that would otherwise result from individual processing of workpieces. The invention is particularly well-suited for use in preparing lithographic printing plates.

Abstract: A substrate (SW) is rotatably held in an approximately horizontal position by a wafer holding and rotation mechanism (810). One end of a rinsing liquid supply nozzle (840) is rotatably supported by a rinsing liquid supply nozzle rotation supporting mechanism (850) to pass over the substrate (SW). In response to rotation of the rinsing liquid supply nozzle (840), the rotation axis of the rinsing liquid supply nozzle (840) moves in a direction closer to or away from the rotation axis of the substrate (SW), whereby the amount of projection of a tip portion of the rinsing liquid supply nozzle (840) is reduced.

Abstract: A developing apparatus for organic electroluminescent display panels comprises a developing unit for supplying a developing solution to be uniformly dispensed to the surface of an organic electroluminescent display panel by immersing the organic electroluminescent display panel into the developing solution or spreading the developing solution over the organic electroluminescent display panel, a cleaning unit having at least a bath connected to the end of the developing unit for spraying a recycled cleaning liquid or cleaning liquid over the organic electroluminescent display panel, a drying unit having at least an airflow driers, and a transporting unit for transporting the electroluminescent display panel; wherein the organic electroluminescent display panel is transported at a constant speed by the transporting unit of the developing apparatus.

Abstract: A method and an apparatus for removing an organic film, such as a resist film, from a substrate surface are provided wherein a treatment liquid containing dissolved ozone, and preferably formed from liquid ethylene or propylene carbonate, or both, is contacted with the substrate having the organic film, and the organic film removed, wherein the apparatus contains (A) a treatment liquid delivery device, (B) a film contact device, (C) a liquid circulation device and (D) an ozone dissolution device.

Abstract: A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a apertures for dispensing developer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap. A differential voltage is applied to the developer plate and the wafer causing an electric field to be formed in the gap. Transportation of negatively charge photoresist material is facilitated by exposure to the electric field during the development process.

Abstract: On the occasion of developing processing, a mixed solution produced by stirring a developing solution and a solution with a specific gravity smaller than the developing solution is supplied to the front surface of a substrate and left as it is for a fixed period of time. After the mixed solution is separated into two layers of which the lower layer is the developing solution and the upper layer is the solution, developing progresses all at once in the entire surface of the substrate. Hence, time difference in start time of developing does not occur in the surface of the substrate, thereby enabling uniform developing and an improvement in line width uniformity of a resist pattern film in the surface of the substrate.

Abstract: The invention provides a method of photographic processing, comprising the steps of applying a first component of a processing solution to the surface of a silver halide photographic material to be processed and applying a second component of the processing solution to the surface of photographic material to be processed. When the applied first and second components have mixed together, the processing solution is active to oxidise silver in the photographic material. The invention also provides a photographic processor suitable for carrying out the method.

Abstract: A substrate (W) is held in an approximately horizontal position by a substrate holder (10) and is rotated by a spinning motor (13). A rinsing liquid supply nozzle (140) is rotatably supported at its one end by a second nozzle movement mechanism (150) and is rotated to pass over the substrate (W). The rinsing liquid supply nozzle (140) is rotated to pass over the substrate (W) and at the same time to discharge a rinsing liquid from its discharge unit. At this time, the rinsing liquid supply nozzle (140) and the substrate (W) are rotated so that a virtual scanning direction (La) of the substrate (W) is substantially perpendicular to a direction of extension of the rinsing liquid supply nozzle (140). That is, since the rinsing liquid supply nozzle (140) is shifted in the virtual scanning direction (La), a non-supplying area of the substrate (W) where a rinsing liquid is not supplied can successively be made up and eliminated as the scanning by the nozzle (140) proceeds.

Abstract: A treating liquid adjusting equipment for adjusting an alkali-based treating liquid for use in treating an organic film applied onto a substrate, which includes an adjusting portion. The adjusting portion for adjusting an alkalinity of the alkali-based treating liquid is such that a concentration of a first component contained in the alkali-based treating liquid and constituting an organic film of a same type as or different type from the organic film is in a range of 0.0001 to 2.0 mass %, and a concentration of an alkali component contained in the alkali-based treating liquid is in a range of 0.05 to 2.5 mass %.

Abstract: A developer supply nozzle moves from a first end toward a second end of a substrate for supplying a developer to the overall main surface of the substrate. After a lapse of a required developing time, a rinse discharge nozzle moves from the first end toward the second end of the substrate for supplying a rinse to the overall main surface of the substrate. A partition plate is provided for preventing the rinse discharged from a slit discharge port of the rinse discharge nozzle onto the substrate from flowing frontward in the direction of movement of the rinse discharge nozzle or washing away the developer supplied onto the substrate frontward.

Abstract: A photographic film developing apparatus maintains a photographic film, a developer solution and a second processing solution at a specific temperature while performing film development operation by directly applying the individual solutions to an emulsion side of the photographic film. After the developer solution and the second processing solution have been applied from respective processing solution application heads to the emulsion side of the photographic film, the quantity of each solution on the emulsion side is adjusted to form a layer of a specified thickness. While transfer belts advance each successive portion of the photographic film up to a processing solution wipe-out device, heaters provided close to the transfer belts heat the individual solutions applied to the photographic film through the transfer belts to maintain the solutions at the specific temperature.

Abstract: A resist coating unit includes a coater cup surrounding a wafer W held by a spin chuck and an air supply mechanism for blowing an air into the coater cup. The air supply mechanism includes a hollow frame having a first open portion formed in the vertical wall, an air blowing device for blowing an air into the hollow frame, and a filter chamber unit into which the air within the frame is introduced. The filter chamber unit includes a first air introducing chamber having a heater arranged therein, a second air introducing chamber, an air stream control mechanism, and a filter unit. The air flowing within the frame flows into the first air introducing chamber through the first open portion so as to be uniformly heated by the heater and, then, is introduced into the second air introducing chamber. Then, the air uniformly heated by the heater is blown into the coater cup through the air stream control mechanism and the filter unit.

Abstract: The present invention is a solution treatment unit for supplying a treatment solution to a substrate and treating the substrate inside an accommodating vessel, comprising a frame for having the accommodating vessel mounted therein. The accommodating vessel has a structure which enables it to be pulled out in a predetermined direction from the frame. Therefore, the accommodating vessel can be pulled out from the frame at the time of maintenance, which makes it possible to secure sufficient work space for performing the maintenance and to appropriately perform the maintenance operation.

Abstract: A solution-receiving plate having solution-passing holes for passing a developer solution therethrough toward the back side of the plate is provided. Respective surfaces of the solution-receiving plate and a substrate are at the same height, and the solution-receiving plate is placed on the front-end side of the substrate and separated slightly from the front end of the substrate. A supply nozzle is moved to apply a developer solution. Accordingly, when the developer solution extended continuously between the perimeter of the substrate and the supply nozzle is severed, the severed developer solution is prevented from returning to the developer solution already spread over the substrate and thus flow and waves are prevented from occurring in the developer solution spread on the surface of the substrate. A resist pattern with a highly uniform line width is thus produced.

Abstract: A developer is supplied onto a substrate and thereafter a rinse discharge nozzle is moved toward an operating direction. The rinse discharge nozzle is so moved on the substrate as to continuously supply pure water onto the substrate from a slit discharge port of the rinse discharge nozzle while sucking and recovering the pure water from the surface of the substrate through a slit suction port, and a series of development is performed in a stationary state of the substrate.

Abstract: A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a application apertures for dispensing developer and a plurality of exit apertures for allowing excess developer to be removed from between the developer plate and the photoresist material layer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap with excess developer exiting through the exit apertures.

Abstract: A system and method is provided for applying a developer to a photoresist material wafer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a apertures for dispensing developer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap. The developer plate is disposed in very close proximity with respect to the wafer, such that the developer is squeezed between the two plates thereby spreading evenly the developer over the wafer.

Abstract: A digital film processing system and film processing solution cartridge are disclosed. The cartridge comprises a housing and a chamber for storing a film processing fluid. The processing solution may be contained within a flexible bladder within the chamber. The cartridge may also include an integral applicator for coating the processing solution onto undeveloped film. The cartridge is generally removeably attached to the film processing system, but may also be refillable.

Abstract: A photoresist developing nozzle, a photoresist developing apparatus and a photoresist developing method capable of effecting uniform development are provided even in the case of a large diameter wafer. A photoresist nozzle has a plurality of small chambers, developer supply flow passages for supplying developer to respective small chambers, and developer discharge sections for discharging developer supplied from the developer supply flow passages onto the wafer. The photoresist developing apparatus has the photoresist developing nozzle and the photoresist developing method uses the photoresist developing nozzle.

Abstract: A method of processing light sensitive material by the surface application of fresh processing solution to the surface of a moving belt by means of an applicator. The material to be processed is brought into moving contact with the moving belt, the resulting relative motion providing a high level of agitation and mixing of the processing solution.

Abstract: An apparatus for processing a substrate comprising a substrate holding mechanism for holding the substrate substantially horizontally, a chemical solution discharge/suction mechanism having a chemical solution discharge/suction portion which has a chemical solution outlet for discharging a chemical solution onto the substrate and chemical solution inlets for sucking up the chemical solution present on the substrate, and a chemical solution supply/suction system for supplying the chemical solution to the chemical solution discharge/suction mechanism simultaneously with sucking the chemical solution by the chemical solution supply/suction mechanism.

Abstract: A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.

Abstract: In a developing processing of a wafer having a resist film low in the dissolving rate in a developing solution formed thereon and subjected to an exposure treatment, a developing solution of a low concentration is supplied first onto a wafer and the wafer is left to stand for a prescribed time to permit a developing reaction to proceed, followed by further supplying a developing solution having a concentration higher than that of the developing solution supplied first onto the wafer, leaving the substrate to stand and subsequently rinsing the wafer, thereby improving the uniformity of the line width in the central portion and the peripheral portion of the wafer.

Abstract: One aspect of the present invention relates to a method and an apparatus for rinsing a substrate during a development process to mitigate pattern collapse. The apparatus includes a bath chamber; a substrate holder disposed in the bath chamber for holding the substrate having a resist pattern formed thereon; a first nozzle for dispensing a first rinsing solution having a first density and first surface tension into the bath chamber; a second nozzle for dispensing a second rinsing solution having a second density and second surface tension, which is less than the first rinsing solution, into the bath chamber; a drain disposed in a bottom portion of the bath chamber; and a controlling system operatively coupled to the first nozzle, the second nozzle and the drain designed to regulate and coordinate the operation of the first nozzle, the second nozzle and the drain.

Abstract: A developing method for a photosensitive resin printing plate which can reduce the cost for treating waste liquid by using an aqueous developing liquid not containing surfactant and recycling and reusing the developing liquid. A photosensitive resin printing plate which is hardened in a prescribed pattern by exposure is developed by spraying an aqueous developing liquid comprising either water only or two phases of gas and liquid to a surface of printing plate under a high pressure (water pressure 1 to 30 MPa, gas pressure not lower than 0.1 MPa), a hygroscopic photosensitive resin mixed in a worn-out developing liquid is separated and removed by means of filter or the like, and filtrate is recycled and reused as a developing liquid.

Abstract: There are disclosed a processing apparatus for a photosensitive material having a coating device of a processing liquid to a photosensitive material, which comprises using a slot die having a manifold and a slot at the inside of the die as a coating device, and a processing apparatus for a photosensitive material which comprises a photosensitive material transferring device, a photosensitive material detecting device, a slot die for coating a processing liquid to the photosensitive material and having a manifold and a slot at the inside of the die, and a device for supplying a predetermined amount of the processing liquid to the slot die, wherein a detection result at the detecting device of the photosensitive material is fed back to the supplying device of the processing liquid to control operation of the processing liquid supplying device.

Abstract: The present invention is a developing method for performing developing treatment for a substrate, having the steps of moving a developing solution supply nozzle from one end of the substrate to the other end along a horizontal direction and a predetermined direction above the rotating substrate, and supplying a developing solution to the substrate from the aforementioned developing solution supply nozzle during the movement, and when the developing solution supply nozzle moves from one end of the substrate to the other end, a rotational speed of the substrate is changed. According to the present invention, the amount of the developing solution supplied to the center area of the substrate is decreased, and thereby evenness of the developing solution within the substrate surface can be improved.

Abstract: One aspect of the invention is a system for digital dye color film processing. In one embodiment, a developer station applies a processing solution to film to initiate development of metallic silver grains and at least one dye image within the film. A scanning system illuminates the coated film with light having at least one frequency within the visible portion of the electromagnetic spectrum. The light interacts with the silver and at least one dye image within the film. The scanning station measures the light from the film and produces sensor data that is communicated to a data processing system. The data processing system processes the sensor data to produce a digital image. The digital image can then be output to an output device, such as a printer, monitor, memory device, and the like.