Abstract: A device for applying adhesive to a substrate, having an application roller that is rotatable about an axis, an installation for dispensing adhesive to a circumferential area of the application roller, a dispensing region of the application roller for dispensing adhesive from the application roller, and having a doctor blade, wherein the dispensing region for adhesive in the rotation direction of the application roller is located behind the installation for dispensing the adhesive to the application roller and ahead of the doctor blade. In such a device it is provided that the application roller is rotatable about a vertical axis and the excess adhesive wiped by the doctor blade reaches a collection installation that is located below the doctor blade. In a method for applying adhesive to a substrate, excess adhesive that has not been applied to the substrate is disposed of.