Including Correction-material Field Patents (Class 400/240.1)
  • Patent number: 7540247
    Abstract: A shaped conductive pattern is located very-close to the top and bottom edges of a print ribbon, e.g., 0.18? or less, where the conductive pattern is sewn using a partially conductive thread, such as 20% steel and 80% polyester. A two-piece clamp used to sew the conductive feature has shaped opening in both pieces, a peripheral groove surrounding the shaped opening and vertical grooves outside peripheral groove in one piece, and a peripheral tongue surrounding the shaped opening and vertical tongues outside the peripheral tongue in the other piece, where the width of the vertical grooves is larger than the width of the peripheral groove.
    Type: Grant
    Filed: June 13, 2006
    Date of Patent: June 2, 2009
    Assignee: Printronix, Inc.
    Inventor: John S. Kinley
  • Patent number: 6852409
    Abstract: A multilayer pressure sensitive correction tape useful for masking handwritten and/or printed characters comprising a release liner, a masking layer and a pressure sensitive adhesive layer, wherein at least one of the layers is cured by radiation. In a preferred embodiment of the invention, the masking layer and pressure sensitive adhesive layer comprise formulations of reactive monomers or oligomers which are radiation-cured after the formulations are applied to the correction tape assembly. In a more preferred embodiment of the invention the masking layer and pressure sensitive adhesive layer formulations contain no volatile solvents when these formulations are applied to the correction tape assembly. The radiation-cured layers are essentially insoluble in organic solvents and water, and the radiation-cured layers exhibit improved film toughness and improved resistance to ink “bleed through”.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: February 8, 2005
    Assignee: BIC Corporation
    Inventors: Creg G. Bradley, Peter D. Gabriele, Teresa B. Hopper, Michael T. Nowak