Abstract: A food-preparation apparatus for forming and baking a food product (5) from a dough portion (2) in a capsule (12) includes a housing (3) having a capsule-handling device (4) for opening and/or emptying the capsule (12), an upper plate (14), and a lower plate (11), arranged in the housing (3). The lower plate can be adjusted in a guide device between a receiving position (A) for receiving the dough portion (2) from the capsule (12), a position of interaction (W) for interacting with the upper plate (14) for baking and/or forming the dough portion, and an emptying position (E) wherein the lower plate (11) is inclined relative to a base surface (46) of the food-preparation apparatus.

Abstract: A substrate transfer mechanism for transferring a substrate to each of a plurality of stacked processing modules that process the substrate includes an arm base provided with a first driver, a lift configured to move up and down the arm base, a first arm extending transversely from a lower side of the arm base, and having a tip end that pivots around a vertical axis with respect to the arm base by the first driver, a second arm extending transversely from an upper side of the tip end of the first arm, and having a tip end that pivots around a vertical axis with respect to the first arm along with the pivoting of the first arm, and a substrate holder provided on an upper side of the tip end of the second arm, and configured to rotate around a vertical axis with respect to the second arm.

Abstract: A solid fuel skewer suspension burning system for a kiln, comprises a skewer rod and a solid fuel loading system. The skewer rod has a first end and a length that extends longitudinally. The solid fuel loading system includes a fuel centering and staging area that receives fuel from a conveyor system, and a fuel loading area that receives fuel from the fuel centering and staging area. The solid fuel is inserted upon the skewer rod at the fuel loading area. The solid fuel loading system also includes a first clamp, an airlock and a plow. The first clamp holds the skewer rod and defines a first position between the first clamp and a free end of the skewer rod. The airlock is spaced from the first clamp and has a first airlock gate and a second airlock gate. The plow reciprocates substantially longitudinally in cooperation with the skewer rod to advance fuel along at least a portion of the length of the skewer rod.

Abstract: A furnace for shaping glass sheets for aircraft transparencies using the cut-to-size method includes a preheat and cooling furnace defined as a first furnace, and a shaping furnace. A conveyor geared for reciprocating movement moves a bending iron supporting a glass sheet through the first furnace set to a preheat temperature. The glass sheet supported on the bending iron is heated in the shaping furnace by microwave beams from a gyrotron to heat portions of the glass sheet to be shaped to a complex shape. After the sheet is shaped, the conveyor moves the bending iron supporting the shaped glass sheet from the shaping furnace through the first furnace set to a cooling cycle.

Abstract: A production line oven includes a product gripping mechanism mounted above one side of the production line oven, a plurality of fixtures, a fixture gripping mechanism mounted under the product gripping mechanism, a lifting mechanism, and a conveyor mounted in other side of the production line oven. The product gripping mechanism includes a first guide rail, a support arm mounted to the first guide rail in sliding, and mechanical gripping members connected to the support arm. The fixture gripping mechanism includes a second guide rail and a clamp mechanism mounted to the second guide rail in sliding. The mechanical gripping members are configured to grip of a product. The fixture gripping mechanism is configured to grasp each the fixture to assemble or dismount the fixtures.

Abstract: Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.

Abstract: A solid fuel skewer suspension burning system for a kiln, comprises a skewer rod and a solid fuel loading system. The skewer rod has a first end and a length that extends longitudinally. The solid fuel loading system includes a fuel centering and staging area that receives fuel from a conveyor system, and a fuel loading area that receives fuel from the fuel centering and staging area. The solid fuel is inserted upon the skewer rod at the fuel loading area. The solid fuel loading system also includes a first clamp, an airlock and a plow. The first clamp holds the skewer rod and defines a first position between the first clamp and a free end of the skewer rod. The airlock is spaced from the first clamp and has a first airlock gate and a second airlock gate. The plow reciprocates substantially longitudinally in cooperation with the skewer rod to advance fuel along at least a portion of the length of the skewer rod.

Abstract: Disclosed is an apparatus for loading one or more alloy ingots into a molding machine. The apparatus includes a holder configured to hold a plurality of the alloy ingots and dispense one or more of the alloy ingots into a melt zone of the molding machine through an opening in a mold of the machine. The holder is moved in a perpendicular direction with respect to an axis along a center of the opening in the mold between a first position in line with the opening in the mold to dispense one or more of the alloy ingots and a second position away from the opening in the mold. The apparatus can carry ingots of amorphous alloy material so that when the machine melts and molds the material, it forms a bulk amorphous alloy containing part.

Abstract: Systems for spacing and transferring objects between operative stations are provided. Such systems can be used with ovens for preforms for plastic material, in blowing or stretch-blowing machines and for other applications in the packaging field. Such systems provide spacing and transferring of objects advancing in procession on transport elements, from a minimum pitch to a preset pitch larger than said minimum pitch, and for transferring said spaced objects to handling elements.

Abstract: Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.

Abstract: A loading unit avoiding the need to enhance the performance of a lifting elevator mechanism, thus preventing an increase in the cost of the lifting elevator mechanism. The loading unit is configured to vertically move a substrate holder, holding a plurality of substrates, into and out of a cylindrical processing container upon heat treatment of the substrates. The loading unit includes: a lifting elevator mechanism for holding and vertically moving the substrate holder and a cap; and a pressing mechanism, having a piezoelectric actuator, for upwardly pressing against the cap lying at a bottom opening of the processing container.

Abstract: A semiconductor manufacturing apparatus and a wafer loading/unloading method thereof increase productivity.

Abstract: A stoker device including: a ladder conveyor having legs extending over a bed and a channel, a yoke connecting a rear portion the legs; a beam assembly fixed to the bed and coupling the yoke to a reciprocating drive, wherein the beam assembly an anchor attached to the bed on one side of the channel, a brace beam attached to the anchor and extending over the channel, and a front beam on an opposite side of the channel to the anchor.

Abstract: A material supply device for diffusion furnaces includes a main body, a fixing pedestal mechanism, a transmission mechanism and a cover mechanism for a furnace door. The main body includes a base portion and a main rod. The base portion is mounted on the main rod and the main rod extends through the base portion. The fixing pedestal mechanism is mounted on the main rod and is pivotedly mounted on a fixing pedestal. The transmission mechanism is mounted on the base portion and has a transmission rod slidably mounted on the base portion. The cover mechanism for a furnace door is fixed on an end of the transmission rod which is far away from the main body and is turnablely mounted on a cover of the furnace door. Based on the above assemblies, the present invention runs smoothly and improves production quality.

Abstract: In the present invention, a plurality of first units capable of accommodating the substrate and a second unit are provided, in which a substrate is carried between the first unit and the second unit. The first units and the second unit are arranged side by side in a plan view, and at least one of the plurality of the first units is a processing unit for performing processing for the substrate. The plurality of first units are arranged in a line in the horizontal direction, and at least two first units adjacent to each other in the horizontal direction of the plurality of first units are movable in the horizontal direction to be able to transfer the substrate to/from the second unit. According to the present invention, the substrate processing system including a plurality of units flexibly deals with various substrate processing recipes and reduces the processing time difference among substrates and the carriage waiting time of the substrate.

Abstract: Systems and methods for processing wafers, a combined post expose bake and chill unit, and an interface are disclosed. An exemplary system includes a lithography tool, local track, transfer device, transfer device handler, interface unit, and controller to schedule processing. An exemplary combined post expose bake and chill unit includes an enclosure having an opening in its side, and a bake unit and a chill unit in the enclosure. An exemplary interface includes a plurality of enclosures arranged around robot(s) that transfer wafers among the enclosures, one of the plurality of enclosures being an integrated bake and chill unit.

Abstract: A thermal processor is adapted for annealing substrates. The processor has a sealed process chamber. Air is excluded from the process chamber during processing to avoid oxidation of substrate surfaces, such as copper surfaces. The substrate temperature is controlled by selectively positioning the substrate between a hot plate and a cold plate operating at steady state conditions. During loading and/or unloading, the air flow is induced over the substrate. This keeps the substrate at a temperature low enough to avoid oxidation, even though the heater may remain on.

Abstract: In a heat treatment method in which a semiconductor wafer is carried into a heat treatment chamber constituted of a heat plate and a cover body covering the heat plate and processed, until the wafer is carried into the heat treatment chamber, an opening and closing operation of the cover body is performed to maintain the accumulated heat temperature of the heat treatment chamber at a prescribed processing temperature.

Abstract: For wafer processing, wafers are transferred between a thermal treatment chamber and a thermal treatment installation. The treatment chamber has a top section and a bottom section between which the wafer is accommodated during treatment. The thermal treatment installation has a loading chamber having loading means and transport means. The wafer is place on a wafer support while in the loading chamber, wherein the wafer support is configured as a ring having support elements to support the wafer. The wafer support loaded with the wafer is inserted into the thermal treatment chamber so that the wafer and the wafer support are positioned between the top section and the bottom section. The wafer is individually processed in the thermal treatment chamber. After processing the wafer, the wafer support is removed from the thermal treatment chamber.

Abstract: A system for the plasma treatment of parts. The system includes a chamber base sealingly engageable with a reaction chamber to form a treatment chamber and a lifting device operable to lift the reaction chamber from the chamber base. A transfer mechanism is operable to transfer parts along a guide to multiple treatment positions within the treatment chamber when the reaction chamber is disengaged from the chamber base. An electronic control system controls the transfer mechanism for transferring the plurality of parts to the treatment positions. The parts are treated with a plasma produced within the treatment chamber by a plasma-generating device.

Abstract: An apparatus and method whereby precise furnace cage positioning may be effectuated. The apparatus of the instant invention is embodied as a uniquely structured multi-plane positioning device which comprises the positional attachment of a drop furnace cage to a drop furnace quench tank via a combination of connecting structures attached to one or more positioning bars which limit the furnace cage's forward, backward and lateral movement as well as a pair of drop cage retrieval hooks directed for attachment to retrieval bars located between pairs of retrieving structures to accurately position the drop furnace cage for vertical retrieval into the furnace.

Abstract: A substrate processing apparatus has a film forming unit group disposed along a first transfer route and a developing processing unit group disposed along a second transfer route. A substrate is transferred along the first transfer route, undergoes film forming processing in the film forming unit group, and thereafter undergoes exposure processing. After undergoing exposure processing, the substrate is transferred along the second transfer route and undergoes developing processing in the developing unit group. The unit groups in which different sorts of processing are performed are disposed along the different transfer routes as described above, thereby enabling the substrate to be transferred efficiently.

Abstract: A substrate processing apparatus for performing processing having a plurality of processes, for example, resist coating and developing processing for a substrate, comprises a plurality of processing mechanisms each for performing predetermined processing for the substrate in correspondence with the plurality of processes and a transfer section for transferring the substrate. The transfer section includes a plurality of transfer mechanisms for carrying the substrate into or out of the plurality of processing mechanisms and a buffer mechanism provided at a position to which each of the plurality of transfer mechanisms is accessible and having a standby section for allowing the substrate to stand by thereon temporarily, and the plurality of processing mechanisms are provided around the transfer section.

Abstract: A feed chute apparatus for injecting fuel into a rotating cement kiln by gravity. The apparatus, which is positioned adjacent to a cement kiln and supported at an angle of inclination sufficient to allow tires or other combustible materials to be gravity fed into the cement kiln, has a feed ramp for guiding the combustible material into the kiln. A gate having a pair of opposing posts is positioned at the end of the feed ramp to control the rate of feed of the combustible material. In the rest position, the posts are extended in relation to the feed ramp to prevent the flow of combustible material. When the kiln rotates to a position where the feed opening in the wall of the kiln is aligned with the feed ramp, the gate retracts to allow the combustible material to be gravity fed into the kiln.

Abstract: A method and apparatus for sequentially heat treating small parts processes the parts individually through a heat treatment process at a predetermined rate, so that each part is heat treated for a predetermined time and all parts are heat treated equally. A plurality of parts on pallets are arranged in a vertical stack in a heat treatment furnace, and parts are sequentially removed and inserted at the ends of the stack at predetermined intervals so that each part progresses from one end of the stack to the other. A vertical guide holds a plurality of parts in a vertical stack. The parts are sequentially removed and inserted at the ends of the stack so that each part progresses from one end of the stack to the other. The stack is lifted to facilitate removing and inserting parts by a slide having movable jaws for gripping and releasing a pallet.

Abstract: A mold support frame assembly including a pair of mold support frames between which a connector extends and cooperates with to provide a thermally stable center. Each mold support frame includes a linkage extending between a pair of spaced legs and having a connection to a mold positioning member adjacent a centering location thereof so that thermal expansion and contraction takes place about the centering location. The connector includes a second mold positioning member that extends between the pair of mold support frames and has a second mold centering location. A second linkage extends between the pair of mold support frames and has a connection to the second mold positioning member adjacent its second mold centering location to provide thermal expansion and contraction of the second mold positioning member about its second mold centering location.

Abstract: A cart for unloading and transporting chain is provided. The cart includes a frame with a number of tracks of a predetermined configuration which are superimposed over one another. Long segments of chain are routed from an oven onto a transfer rail assembly which, in turn, routes the segment of chain to a given track mounted in the cart. Subsequent segments are similarly routed to other tracks in the cart after the cart is elevated to register the empty track to be loaded with the corresponding transfer rail. As a result, the unloading and transporting chain for rebuild and repair is significantly simplified while reducing the overall time and burden associated therewith.

Abstract: A resist process method includes the steps of, preparing a process section for processing a wafer, means for extracting the wafer from a cassette and conveying the substrate to the process section, a cleaning section for finally cleaning the wafer processed by the process section, means for transferring the wafer from the process section to the cleaning section, and means for receiving the wafer from the cleaning section and storing the wafer in a cassette, extracting the wafer from the cassette, conveying the extracted wafer to the process section, causing the process section to include at least a process of developing the resist coated onto the wafer, transferring the wafer from the process section to the cleaning section after at least the developing process, finally cleaning the non-resist coated surface of the wafer by applying a cleaning solution to at least the non-resist coated surface of the substrate in the cleaning section, and storing the finally cleaned wafer in the cassette.

Abstract: A system and method for processing a substrate. The system includes a substrate heating station, a processing station, a conveyor for transporting the heated substrate from the substrate heating station to the processing station and a conveyor heating station. A substrate transfer station is located between the substrate heating station, the conveyor heating station and the processing station for the transfer of the heated substrate to the conveyor in a thermally controlled environment isolated from contaminants. The substrate transfer station includes a housing having an interior chamber, first and second inlets for the separate passage of a substrate and conveyor into the interior chamber, and an outlet for the egress of the substrate and conveyor. The transfer station also includes a heater and a guide assembly for directing the conveyor between the conveyor inlet and the outlet.

Abstract: A discharge apparatus includes a housing into which a discharge pipe of a carbonization drum opens. A residue discharge chute which starts from the housing opens into a conveying device ending at an outlet. A filling-level meter is disposed at the residue discharge chute. The conveying device has a profiled separating shelf with an end remote from the mouth of the residue discharge chute, at which a bar screen is formed. The bar screen covers a delivery opening for fine residue and ends at the outlet for coarse residue. A vibrator is associated with the conveying device.

Abstract: An oven with slide-out transfer guides is provided for use in conjunction with multiple conveyors ovens to provide quick and convenient accessibility to an oven's interior in case of product transfer difficulties. A slidable rail assembly is mounted in the oven, which also has an access port for transfer guide egress and ingress, and a transfer guide with opposed lips forming a slot which mounts the transfer guide on the rail assembly. When access to the oven's interior is necessary to remedy a product transfer problem, the oven of the present invention allows the transfer guide to slide along the rail while still supported by same, and said transfer guide can be partially removed from said oven without the need to turn off the oven. In this way, obstructions can be cleared quickly without significant down time, thereby saving the user both time and expense.

Abstract: The present invention relates to a tray for carrying a plurality of pallets loaded with several concrete blocks. The tray is a rectangular frame defining an upper surface, front and rear ends and upwardly-projecting flanges at both front and rear ends. The tray is adapted to receive the loaded pallets on its upper surface between the flanges. The invention further relates to a system adapted to carry the loaded tray through a block curing kiln. The kiln is composed of a plurality of longitudinal cells, as is already known, and the pallet-loaded trays are inserted in a consecutive linear abutment fashion in the cells. The relatively high flanges of each tray thus abut on one another, which prevents the overlapping of the trays, and thus prevents the damaging in this way of the concrete blocks.

Abstract: A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle .theta.

Abstract: An apparatus for infeeding batched material to an inlet opening of a material processing apparatus includes a lift mechanism disposed alongside the material processing apparatus and being operable to lift the batched material at least to the elevation of the inlet opening of the material processing apparatus, a delivery conveyor disposed alongside the material processing apparatus and adjacent to the lift mechanism and being operable to deliver the batched material to the lift mechanism, a transfer enclosure spaced from the lift mechanism and disposed above the inlet opening of the material processing apparatus, the transfer enclosure having a side entrance for receiving batched material from the lift mechanism and a bottom exit for subsequent discharge of the batched material into the material processing apparatus through the inlet opening thereof, a tilt assembly disposed between the lift mechanism and the transfer enclosure and being operable to either block or complete a path for transfer of the batched m

Abstract: A pusher furnace for heating workpieces has an elongate and generally horizontally extending chamber housing a plurality of trays to receive workpieces thereon to be heated within the chamber. The chamber is divided into at least two generally parallel rows of a plurality of trays and pusher mechanisms are provided adjacent each end of the chamber to push the trays along the rows to circulate them within the chamber. In one embodiment, the chamber is divided into three rows of trays wherein a pusher mechanism alternately transfers work trays from one row to the other rows. Each work tray is provided with a plurality of opposed slots at the upper and lower surface thereof so that work engaging fingers can be inserted into the slots for engaging underneath the workpieces for transfer to and from the furnace.

Abstract: An apparatus is provided for injecting fuel in the form of pieces of various sizes into a burning zone of a kiln having an end inlet. The apparatus includes two rubber tires rotating in opposite directions, at least one motor for rotating the tires, an entrance chute, and an exit chute. The tires rotate about horizontal and parallel axes that are in an inclined plane and spaced such that the outer radial surfaces of the tires are generally adjacent. The entrance chute has a vertical inlet portion for receiving the fuel pieces and downwardly accelerating the fuel pieces by gravity and an outlet portion open adjacent the tires for feeding the fuel pieces between the tires. The tires elastically deform around the various size fuel pieces and project them as the tires rotate. The exit chute has an axis perpendicular to the inclined plane of the tire axes for directing the projected fuel pieces through the kiln end inlet.

Abstract: A method of heat-treating a substrate to be loaded/unloaded to and from a substrate heating device for a prescribed time period cycle including the steps of transferring the substrate from a substrate conveying robot to a substrate transferring and receiving device, holding the received substrate in a position where it is subjected to only a limited influence of heating by a hot plate for a first time period prior to transferring the substrate to the hot plate, heating the substrate by the hot plate for a second time period, and removing the substrate from the hot plate by the substrate conveying robot after the second time period elapses. Preferably, the sum of the first time period and the second time period approximately equals the cycle time period.

Abstract: An apparatus and method for maintaining the lateral spacing of parallel rows of tortillas while transferring tortillas between two vertically spaced conveyors. The tortilla transfer guide is positioned adjacent to two generally horizontal, vertically spaced endless belt conveyors. The tortilla transfer guide has at least one scalloped section having a center of curvature aligned with the longitudinal axes respectively corresponding to an associated row of tortillas travelling towards the guide on the upper conveyor and an associated row travelling away from the guide on the lower conveyor. Each scalloped section is capable of moving a laterally misaligned tortilla towards its center of curvature, which is aligned with the proper longitudinal row axis on the lower conveyor.

Abstract: A batched materials transferring apparatus includes an elongated drum, a bucket disposed in the drum, and a drive arrangement operable to move the bucket relative to the drum. The drum defines an interior chamber having a longitudinal axis. The drum has a top (or side) opening formed in a first end portion thereof and a bottom opening formed in a second end portion thereof with the top (or side) opening being axially displaced from the bottom opening. The bucket has a side opening formed therein and is slidably movable relative to the drum along the longitudinal axis between the first and second end portions. The drive arrangement is mounted adjacent to the drum and connected to the bucket through one end of the drum.

Abstract: A vertical heat-treating apparatus which is effective for preventing dust or fine particles from being attached to a wafer during the loading/unloading or transport of the wafer thereby to manufacture a high-quality wafers. This apparatus comprises a carrier stocker storing a plurality of wafer carriers, a loading/unloading mechanism for transferring the wafers between the wafer carriers and a heat-treating vessel, a plurality of heat-treating furnaces for heat-treating the wafers, a transport mechanism for transporting the heat-treating vessel to and from the vertical heat-treating furnace, and gas supply means for forming a clear gas stream passing exclusively through the loading/unloading mechanism and/or the transport mechanism.

Abstract: A hydrostatic cooker discharge apparatus comprises a flight conveyor, a first belt conveyor and a second belt conveyor. The flight conveyor sequentially receives horizontally oriented sticks of containers from a cooker. The first belt conveyor in conjunction with the flight conveyor transports the stick containers to a waterfall structure whereat the containers are reoriented to an upright position and are individually placed on the second belt conveyor for removal from the cooker area.

Abstract: An apparatus is disclosed which can automatically load semiconductor wafers into a vertical type heat treatment furnace and unload treated semiconductor wafers out of the heat treatment furnace. The semiconductor wafer treating apparatus comprises exchange unit for exchanging the semiconductor wafers between the cassette and the wafer boat in a predetermined exchange position, transfer unit for allowing the wafer-held boat to be transported between the exchange position and a respective, vertical type heat treatment furnace and for allowing the transfer of the wafer boat to be effected between the transfer unit and the respective heat treatment furnace, and an elevator unit provided in the heat treatment furnace and adapted to receive the wafer boat from the transfer unit and to load the wafer boat into a vertically erect process tube and unload the wafer boat from the process tube.

Abstract: A heat-treating apparatus includes a furnace for heat-treating wafers, installed so as to set its longitudinal direction vertically and having an opening which is formed in its lower end so as to allow a boat having semiconductor wafers mounted thereon to be loaded, a heat-insulating cylinder on which the boat is placed and which is adapted to keep the boat hot, a lifting unit for lifting and loading the boat and the heat-insulating cylinder into the furnace, and for lowering and unloading them from the furnace, a moving unit for pivoting the heat-insulating cylinder and retracting the cylinder from below the boat, and a handler unit for supporting and vertically moving the boat. After the wafers are heat-treated, the boat is moved downward by the lifting unit. The heat-insulating cylinder is retracted from below the boat by the moving unit while the boat is supported by the handler unit. Subsequently, the boat is further lowered by the handler unit so as to completely remove the boat from the furnace.

Abstract: A system and method for loading and unloading articles, especially adapted for moving semiconductor wafers into and out of a diffusion chamber. An article support is cantilevered for moving the articles into the chamber without touching it. A separately controllable cantilvered enclosure is provided for movement over the supported wafers when necessary for protection during the loading and/or unloading procedure. An inert gas controllably flows into the enclosure to provide a controlled atmosphere for the wafers during the loading and/or unloading procedure.

Abstract: An apparatus for loading semiconductor wafers into a cantilever diffusion tube includes a cantilever paddle supporting a boatload of wafers. The paddle is moved into alignment with the open end of the cantilever diffusion tube. The open end portion of cantilever diffusion tube is moved to surround the paddle and boat load of wafers. The paddle is lowered slightly, causing the boat load of wafers to be supported on an inside surface of the cantilever diffusion tube and providing clearance around the paddle. The cantilever tube is withdrawn from the paddle, which then is withdrawn from the path of the cantilever diffusion tube. The cantilever tube and the boatload of wafers is moved into the hot zone of the furnace. After a heat treating operation, the cantilever diffusion tube is withdrawn from the furnace, and the reverse operation is performed to unload the boatload of wafers.

Abstract: A rotary molding apparatus is described, including a heating chamber, cooling chambers and supports for molds which melt and cast workpieces of plastic. The cooling chambers can be arranged circularly around the heating chamber which is disposed at the center, or the heating chamber can be movable such that an opening thereof can be selectively aligned to one of the cooling chambers. The molds can be moved via the supports from a cooling chamber to the heating chamber and back again. This apparatus optimizes component utilization and minimizes cycle times.

Abstract: Disclosed is a furnace having a furnace chamber formed with a work inlet and a work outlet, and a work mount turntable rotatably provided within the furnace chamber, the furnace further comprising work carry-in means for carrying a work while mounting the work thereon into the furnace chamber through work inlet to transfer the work onto given one of work mount portions on the turntable, and work carry-out means for carrying a work mounted on one of the the work mounts out of the work outlet while mounting the work thereon. Each of the work mounts, the work carry-in means, and the work carry-out means is constituted by a plurality of strip members disposed at regular intervals. The respective strip members of each of the work carry-in means and the work carry-out means are arranged to move up and down passing through the gaps formed between the adjacent strip members of the work mounts.

Abstract: A horizontal furnace for processing semiconductor devices having a suspension cantilever which supports workpieces in the furnace tube to achieve particle or dust-free operation while still allowing the loading and unloading of workpieces to be heat-treated. The furnace tube consists of a heating chamber, a connecting chamber and a supporting chamber vertically connected to each other. The chambers correspond to an accommodating portion, a connecting portion and a supporting portion of the cantilever. The supporting chamber is kept at lower temperature than that of the heating chamber during heat processing to prevent deformation or creeping of the suspension cantilever.

Abstract: A treatment furnace having a longitudinally extending charging opening has a transversely extending furnace conveyor having an upstream end in the vicinity of the opening. A loading conveyor has an array of transversely extending approach rollers adjacent the charging opening so that a workpiece to be treated in the furnace can be rolled longitudinally along the approach rollers to a position transversely aligned with the charging opening. A loading apparatus for the furnace has at least two transversely extending arms each having an inner end pivoted inside the furnace about a longitudinal axis at the upstream end of the furnace conveyor and an outer end outside the furnace and an array of longitudinally extending loading rollers rotatable about horizontal and longitudinal axes is carried on the arms.

Abstract: A wafer processing apparatus includes a common path, extending in a Y-axis direction, in which one wafer or a plurality of wafers are conveyed, a plurality of process units stacked on both sides of the common path to constitute multi-stage structures, a main handler moved in the common path in the Y-axis direction and rotated about a Z axis at an angle &thgr; to load/unload the wafer into/from the process units, an arm section arranged to move in the main handler in the Z-axis direction, a plurality of holding arms arranged in the arm section to constitute a multi-stage structure so as to respectively hold the wafers, each holding arm being advanced and retreated on an X-Y plane from the arm section, an optical sensor, arranged in the arm section, for detecting a holding state of the wafer in each of the plurality of holding arms, and a controller for controlling an operation of the main handler, an operation of the arm section, and operations of the plurality of holding arms on the basis of a detection resul