Abstract: A tray handling apparatus comprises a plurality of guides, a chuck device, a linear movement device, and a rack and pinion device. A space defined by the erected guides is used to hold a tray stack. The chuck of the chuck device is located at the center position of the bottom area of the space. The linear movement device is used to move the chuck relative to the guides. The rack and pinion device is used to cause the guides to move symmetrically. When an operator moves any one of the guides, the other guides move symmetrically and the center of the bottom area of the space surrounded by the guides remains at the same location during the movement of the guides. The operator does not need to adjust the position of the chuck if the positions of the guides are changed.

Abstract: A substrate treating apparatus that transports a plurality of substrates with a transport unit includes the following elements. A treating section for treating the substrates, a table for receiving a FOUP (Front Opening Unified Pod) storing the plurality of substrates, and an attaching and detaching unit disposed between the treating section and the table for attaching and detaching a lid to/from an access opening of the FOUP placed on the table. The transport unit is movable to a transfer position opposed to the access opening of the FOUP across the attaching and detaching unit, and has a plurality of support members for supporting the plurality of substrates, the transport unit being arranged to transport the substrates as held by the support members between the treating section and the FOUP.

Abstract: The item-carrying system comprises: a robot comprising: a gripping portion for gripping an item; external force detecting means for detecting an external force applied to the gripping portion; opening-degree detecting means for detecting an opening-degree of the gripping portion; autonomous movement means; and receiving/passing motion deciding means for deciding a motion of the robot in an item receiving/passing operation, wherein the receiving/passing motion deciding means comprises: means for determining to start receiving an item that causes the gripping portion to start a receiving motion if the external force detecting means has detected an external force not less than a first predetermined value, when the gripping portion is not gripping an item; and means for determining the completion of a receiving motion on the basis of at least one of an external force and an opening-degree during the receiving motion.

Abstract: An apparatus to feed elongated metallic workpieces to a manufacturing process including a storage hopper configured to hold a plurality of workpieces that are randomly oriented and a movement device having a workpiece support that is automatically engageable with a workpiece.

Abstract: In one embodiment, an end effector having a first arm extending from an end effector support body, and a second arm extending from the end effector support body is provided. The first arm and the second arm have support extensions for supporting a peripheral region of a substrate, wherein the second arm and the first arm include sensors integrated thereon. The sensors are located at a distal end of the first and the second arms past the corresponding support extensions. The sensors are configured to indicate whether support arms for a container are within the travel path of the end effector in one embodiment. The end effector may be integrated into a system for transporting substrates.

Abstract: A substrate transport apparatus including a frame, a drive section connected to the frame and including at least one independently controllable motor, at least two substrate transport arms connected to the frame and comprising arm links arranged for supporting and transporting substrates, and a mechanical motion switch coupled to the at least one independently controllable motor and the at least two substrate transport arms for effecting the extension and retraction of one of the at least two substrate transport arms while the other one of the at least two substrate transport arms remains in a substantially retracted configuration.

Abstract: An apparatus and method for clamping and processing conveyor belt ends includes a stationary stand and a clamping member supported on the stand and configured to selectively retain an associated conveyor belt end therein. A belt processing member is configured to process the conveyor belt end retained in the clamping member, and a rail is detachably mounted on one of the stand member and the clamping member, and movably supports thereon the belt processing member for movement of the same along the conveyor belt end retained in the clamping member.

Abstract: The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

Abstract: An apparatus and method for transferring printed products conveyed in a shingled flow in a conveying direction by a conveyor to a transporter positioned above the conveyor. The shingled flow is conveyed with circulating clamps. Each printed product respectively projects with a leading end over a front end of a following printed product in the conveying direction and the circulating clamps respectively clamp the leading end of the printed products. Each printed product is lifted from below along one side of the shingled flow in a transfer region formed by the shingled flow and the above-positioned transporter. After the printed products are is lifted up, a trailing end of each printed product is gripped by a clamp of the transporter and then the printed products are further transported.

Abstract: A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.

Abstract: A manufacturing apparatus and associated method for handling disks disposed in merged pairs in a carrier is provided, wherein spacings between adjacent pairs of the disks are greater than spacings between disks forming each pair. The apparatus includes a first disk contacting surface defining a first cavity that is sized to receivingly engage a selected one of the pairs of disks. A second disk contacting surface defines second and third cavities that are sized to receivingly engage individual disks of the selected pair of disks, wherein disks that are operably engaged in the cavities are spatially separated more adjacent the second disk contacting surface than at the first disk contacting surface.

Abstract: An apparatus for taking over singulated objects, in particular at least slightly elongated objects, wherein the objects are supplied on an endless feed conveyor (1) which is formed by two endless conveyor strips forming a V-channel, and wherein the objects are subsequently transferred to a following endless sorting conveyor (3) with transport positions at fixed mutual intermediate distances or pitch distances, wherein the apparatus further comprises an endless positioning conveyor (2), immediately following the feed conveyor, as well as a control, which controls the speed of the conveyor (1) and of the positioning conveyor (2), and hence the transfer of the objects onto the positioning conveyor (2), wherein the intermediate distances of the transferred objects on the positioning conveyor correspond to values previously entered in the control, and wherein the objects are taken over from the positioning conveyor by the sorting conveyor (3) by means of grippers (4).

Abstract: A freeze dryer comprises a chamber having a rectangular slot through which vials are inserted into the chamber. An assembly for loading and/or unloading the chamber comprises a transfer bar extending across the slot. The bar is pivotally attached at each end to first and second flat springs, each spring being wound on a respective rotatably mounted spool located proximate the slot. Drive means are provided for synchronously rotating the spools to effect movement of the bar into or out from the chamber and for selectively rotating the spools to raise or lower the bar.

Abstract: For optimizing the transfer and reception of glass substrate plates to and from a receiving station, such as a transfer mechanism for the glass substrate plates to a process station or a storage cassette unit, the invention provides an apparatus for transferring and accepting glass substrate plates with a double fork gripper having two superimposed, individual fork grippers, which is characterized in that the fork grippers are movable relative to one another perpendicular to their extension planes.

Abstract: The present invention relates to a method for rapid transfer of a work object in both the horizontal and vertical directions using a robot unit (10) having a gripping mechanism (12) preferably from one workstation (3) to another (4), the work piece (2) weighing between one kilo and forty kilos and the transfer in the horizontal direction being at least one meter but less than ten meters and at least partially being effected along an essentially horizontally extending beam unit (20), and the gripping mechanism (12) being arranged in such a way that, at least in one end situation (E1) along the beam (20), it can collect and/or deliver a work object (2) in a position (E2) situated beyond the end situation (E1) along the said horizontal beam (20), which robot unit is controlled by means of a control unit (50) and is driven by means of a belt member (24) and at least two motors (26, 27) comprising rotor units connected to drive wheels (26A, 27A) for the said belt member (24), the said motors (26, 27) being immovab

Abstract: A tool magazine system and a gripper for a machining spindle. The gripper is fed to the tool laterally with respect to the rotational or longitudinal axes of the tool, particularly substantially at right angles to the axis, and should grasp the tool.

Abstract: A micro device using assembly system for feeding, programming, and placing micro devices on circuit boards includes a robotic handling system capable of picking up and placing the micro devices on the circuit boards on a conveyor system. A control system controls the conveyor system and the robotic handling system. An input feeder provides the micro devices and a programming system is capable of programming a plurality of micro devices in sockets which are in line parallel with the input feeder. The input feeder responds to communication with the control system to feed the unprogrammed micro devices while the programming system programs the micro devices and communicates to the control system. The robotic handling system responds to communication of the programming system with the control system to pickup and places the programmed micro devices on the circuit boards at high speed.

Abstract: An object of this invention is to provide a preform conveying device of high production efficiency under the technical theme of aligning the plurality of preforms in single rows at high speed, while eliminating contact of individual preforms with other preforms and minimizing the chances of contact with device parts.

Abstract: An occurrence component lack at a component arrangement position, designated by a mounting program, of a component feed part, which feeds components to be mounted, is determined. Whether a spare component for the lacking component to be mounted is present in a spare component feed area of the component feed part is determined, and supply of the component to be mounted from a designated component arrangement position of the component feed part is switched to supply of the spare component from the spare component feed area.

Abstract: Non-symmetrical molded articles, such as large preforms, are handled by a handling system into which an array of molded articles are transferred from a mold having a pitch separation The handling system has an arranging station configured to receive and align a first set of molded articles, which arranging station is further configured to receive and align a second set of molded articles in an opposingly orientated direction to the first set. To reduce the pitch separation, the arranging station includes a closure mechanism that brings together the first and second sets of molded articles in a substantially linear array. Once in the linear array, a handling device operates to pick up and crate the linear array of preforms. Transfer and pick-up of the preforms can be accomplished using a multi-function, multi-axis robot that supports take-out tubes and suction pads.

Abstract: A vacuum chamber for transporting at least one workpiece has two or more openings defining respective opening areas for treating or handling the at least one workpiece. A transport device is arranged relative to the openings and includes a drive shaft rotatable around a drive shaft rotational axis. Two or more conveyors transport at least one workpiece. A linear driver is operationally independent to linearly move respective ones of the two or more conveyors relative to the drive shaft, with a drive component in a radial direction relative to the axis. An obstructing member is provided for closing the openings when one of the conveyors is positioned adjacent to the openings by rotating the transport device and is moved by the linear drive towards the opening.

Abstract: A flexible tool for handling small objects, as well as a method for handling small objects using the flexible tool. The flexible tool comprises one or more mini robots, such as a free arm robot and one or more hexapod(s) working in an internal workspace when performing operations on small objects. Furthermore, an external space can be used for storing the objects during non-operation. The hexapods are to engage with a small object and to move a small object between the internal workspace and the external space, and the free arm robot is to move one or more hexapod(s). Fast measurements of robot positions are included, the measurements being feed back to a computer system controlling the mini robots. The computer system further comprises vision and motion planning.

Abstract: An apparatus includes a chamber for containing a fluid, a guide seated in the chamber, and a transfer robot for loading and/or unloading a plurality of wafers to and/or from the guide. The wafers are located on the guide. The guide has a supporting member for supporting a wafer and a stopper member for preventing the wafer from being inclined over a predetermined range. The stopper member is in contact with a wafer edge disposed at a higher position than a wafer edge supported by the supporting member. A wafer guide has a stopper member to prevent adjacent wafers from being inclined and coming in contact with each other. Therefore, it is possible to suppress a poor drying such as water spots (or watermarks) produced when wafers are adhered to each other in a drying process.

Abstract: A robot wherein the condition for a work and a sequence of movements to be performed may be set in connection with positions. In addition to setting a position at which a work is performed, the robot sets the conditions for performance of a work at a set position and of a sequence of movements between set positions. The set conditions may be memorized in connection with the set positions so as to be performed as are read out.

Abstract: A rotary deblistering apparatus is described. It comprises a rotatable drum having plurality of circumferential pack holding means each adapted to hold and retain a blister pack. The drum can rotate to locate the pack holding means at a plurality of peripheral work positions including a pack loading position, a pack deblistering position, and a pack detachment position. The blister packs can be loaded onto the drum through a loading means, preferably the loading means has a storage magazine able to supply a continuous number of packs to the drum. For a peelable pack, prior weakening or cutting of the backing of the pack may be necessary or desired. Such action could be carried out at the pack deblistering position. Alternatively, there is a prior weakening and/or cutting position around the drum.

Abstract: A substrate transfer system comprises plural end-effectors that are placed so as to touch a periphery of a cone having a vertical angle at a 2&thgr; angle with respect to a central axis at an arbitrary &thgr; angle to a horizontal plane, wherein substrates are interchanged and simultaneously transferred where the end-effectors are in a horizontal position. Besides, since the end-effectors are vertically located, the minimum rotational radius of the system that is projected to a horizontal plane, can be reduced. This contributes toward the reduction of an installation area for a substrate processing equipment in which the substrate transfer system is equipped.

Abstract: A media rework tool for discs and/or a spindle motor carrying a disc pack is disclosed that has a slider plate mounted on a base for lateral movement between a retracted position and an extended position. The slider plate holds a spindle motor with a disc pack mounted on it, and moves between the two positions. The tool includes a gripper assembly having a plurality of opposing arms for grasping predetermined discs within a disc pack on the spindle motor when the slider plate is in the retracted position. The gripper assembly raises the predetermined discs and any intermediate spacer rings upward for temporary storage on a media guide to allow the remainder of the disc pack to be reworked, such as for replacement of a defective disc or spindle motor when the slider plate is laterally moved to the extended position. Following reworking of the remainder of the disc pack, the spindle motor is returned to its centered position relative to the media guide and the gripper assembly.

Abstract: Placement head and placement system for a placement apparatus for placing components in a placement plane, at least one placement head being provided with at least one gripper for picking up and/or putting down the components. The gripper is fitted in an edge region of the placement head, with the result that, in the case of a projection of the placement head onto the placement plane, the image of the gripper situated in the placement position essentially does not project from the image of the placement head. According to the invention, simultaneous independent placement using a plurality of placement heads is possible without the risk of a collision of the placement heads.

Abstract: A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.

Abstract: An assembly for adjusting the height of a gripping mechanism on a machine for molding glass articles has an upright supporting a gripping head for gripping the glass articles, and an actuating assembly for activating the gripping head and, in use, moving the gripping head, with respect to the upright, between a gripping position gripping the glass articles, and a release position releasing the glass articles onto a supporting surface; the upright has a bottom connecting portion, which is connected to a structure of the machine so as to slide in a vertical direction, and the height of which is adjustable by means of a motor located beneath the supporting surface and in parallel with a transmission activated by a crank.

Abstract: A reticle capturing system includes a reticle that defines a first recess extending into the reticle from a first edge of the reticle and a second recess extending into the reticle from a second edge of the reticle. The reticle capturing system also includes a first finger selectively extending into the first recess and a second finger selectively extending into the second recess. The first and second fingers may be tapered so that the reticle capturing system will be self centering. The reticle capturing system may also include a third recess defined by the reticle and a third finger selectively extending into a recess. A method for capturing a reticle includes providing a reticle that defines a recess at an edge of the reticle and inserting the finger into the recess. The method may further include inserting a second finger into a second recess.

Abstract: The present invention relates to a flexible tool for handling small objects, as well as a method for handling small objects using the flexible tool. The flexible tool comprises one or more mini robots, such as a free arm robot and one or more hexapod(s) working in an internal workspace when performing operations on small objects. Furthermore, an external space can be used for storing the objects during non-operation. The hexapods are adapted to engage with a small object and to move a small object between the internal workspace and the external space, and the free arm robot is adapted to move one or more hexapod(s). Fast measurements of robot positions are included, the measurements being feed back to a computer system controlling the mini robots. The computer system further comprises vision and motion planning.

Abstract: A substrate handling robot includes an arm drive mechanism. A first arm is connected to the arm drive mechanism. A multiple substrate batch loader is connected to the first arm. A second arm is also connected to the arm drive mechanism. A single plane end effector is connected to the second arm. The multiple substrate batch loader produces a vacuum signal indicative of how many substrates are held by the multiple substrate batch loader. A vacuum signal interpreter alters the movement of the first arm in response to the substrate load number. An object sensor is connected to the second arm. The object sensor assesses the number of substrates in a cassette adjacent to the multiple substrate batch loader. A substrate loading sequence controller controls the first arm and the second arm in response to the number of substrates in the cassette, such that the second arm removes substrates from the cassette in such a manner as to facilitate complete loading of the multiple substrate batch loader.

Abstract: Method and apparatus are provided for accurately placing first and second semiconductor wafers onto a first and a second platforms, respectively, in a single processing chamber despite changes in the exact positions of the platforms caused by variations in temperature within the chamber. A computer controls a mechanism having a pair of wafer-supporting blades to insert the wafers into the chamber. The computer determines from position sensors when the first wafer is centered over the first platform, then actuates lift pins associated with the first platform to lift the first wafer off of its respective blade. Then the computer in the same way in response to other position sensors moves the second wafer into alignment with the second platform, and raises by lift pins the second wafer off of its respective blade. Thereafter the computer removes the blades from the chamber, and lowers the wafers in precise positions onto their respective platforms.

Abstract: A self-teaching robot arm positioning method that compensates for support structure component alignment offset entails the use of a component emulating fixture preferably having mounting features that are matable to support structure mounting elements. Robot arm mechanism motor angular position data measured relative to component emulating fixture features are substituted into stored mathematical expressions representing robot arm vector motion to provide robot arm position output information. This information indicates whether the actual relative alignment between the robot arm mechanism and a semiconductor wafer carrier is offset from a nominal relative alignment. The robot arm mechanism position output information can be used to effect either manual or automatic correction of an offset from the nominal relative alignment.

Abstract: A wafer sorting system is provided. The wafer sorter system is used to simultaneously sort multiple semiconductor wafers of a cassette. The wafer sorter system includes multiple arms which extend from a tower. These arms are at different vertical locations along the tower. The wafer sorter system also comprises a robotic arm which may move the tower to a position where the arms contact wafers. These wafers are in different vertical slots of a cassette. Further included in the wafer sorter system is a belt which may rotate to move arms vertically through slots of the tower. Wafers may become attached to arms by applying a vacuum suction to each arm. The arms having wafers may be rotated to the belt in a clockwise or counterclockwise direction about a portion of the tower via a slot in the tower. The arms may then be attached to the belt. After the belt moves the arms to new levels of the tower, the arms may then be rotated back to their original positions.

Abstract: An apparatus for displacing a plurality of objects from a pickup station to a deposition station offset horizontally from the pickup station has a support movable in a horizontal transport direction between a position directly above the pickup station and a position directly above the deposition station, an elongated lift plate underneath the support and provided with grabs for picking up and releasing the objects, a flexible belt having a lower end extending in the direction and secured to the lift plate, a drive on the support for paying out and winding in the belt and thereby raising and lowering the plate, and rigid links connected between the plate and the support for inhibiting movement of the plate perpendicular to the direction.

Abstract: A multideck wafer processing system is described for the treatment of semiconductor wafers. The system includes at least two process chambers stacked one above the other to provide for higher wafer throughput per unit area of cleanroom space. The stacked process chambers enable sharing of pressurization, gas, electrical, and control support services for the processing chambers.

Abstract: This invention relates to a device for removing and transporting articles, such as ophthalmic lens mold sections, or packaging elements from a mold. The invention, in one embodiment includes first, second, and third assemblies; the first of which removes the articles from the molding station at a first location and transports them to a second location; the second assembly receives the articles from the first assembly and transports them to a third location, and the third assembly receives the articles from the second assembly and transports them to a fourth location. A second embodiment includes a flipper assembly disposed between the first and second assemblies, which flipper receives the articles from the first assembly and inverts them before depositing them onto the second assembly. This second embodiment is useful in conjunction with molded articles which are transported to the flipper assembly in an inverted position.

Abstract: A machine tool center (10) displays at least one machine tool (11, 12, 13) which has a working area (17) accessible through an operator door (16) to process workpieces (21). Furthermore, a loading/unloading station (14) for the workpieces (21) and a loading device (22) which transports the workpieces (21) between the loading/unloading station (14) and the respective machine tool (11, 12, 13) and changes these at the machine tool (11, 12, 13) are also provided. In the new machine tool center (10) the loading device (22) is arranged below the working space (17) of the machine tool (11, 12, 13) (FIG. 1).