Abstract: A plate material processing system includes a plate material processing machine and a loader. The plate material processing machine holds a front end portion of an unprocessed plate material by a work holder and moves the unprocessed plate material on a table forward, backward, leftward and rightward. The loader includes: a plate material attaching unit; and a pivoting mechanism for pivoting the plate material attaching unit on a predefined arc-shaped trajectory while maintaining the plate material attaching unit in a constant orientation as viewed in a planar manner. When the plate material attaching unit is at a foremost position, the work holder is positioned to the other side of the left and right sides relative to a processing head, away from the unprocessed plate material loading position side, thereby preventing the work holder and the plate material attaching unit from interfering with each other.

Abstract: A device (14) allows a door of a balance draft shield enclosure (12) to be activated by a carrier fork (4) of a robot (5). The vertically movable draft shield door (13) sets open an access opening in a raised position and closes the opening in a lowered position. A door-lifter with a force-application element (41) is connected to the draft shield door for application of an upward-directed vertical force. A transmitting mechanism (15), standing clear of the balance (11) includes a force-receiving element (20, 21, 26, 27) that is moved vertically by the carrier fork, between upper and lower end positions. It further includes at least one direction-reversing element (22, 23, 24, 25, 29), coupled to the force-receiving element for coupling to the force-application element, a return spring (28), and a spring-biased locking latch (30).

Abstract: An automatic pallet exchange device includes: a pallet magazine 1 that accommodates a plurality of pallets 3 respectively having a plurality of horizontally extending protrusions 16 so as to be taken in and out in horizontal directions; a pallet fixing part 23 that allows the plurality of protrusions 16 to be engaged with a plurality of depression parts 17 to horizontally fix the pallet 3 and a pallet fixing table 20 on which the pallet fixing part 23 is arranged. The pallet 3 horizontally fixed by the pallet fixing part 23 is horizontally turned and horizontally moved to exchange the pallets 3 between the pallet fixing table 20 and the pallet magazine 1.

Abstract: In a chip mounting apparatus, a structure is employed that a separation facilitation head keeping part is provided for detachably keeping a plurality kinds of separation facilitation heads in a wafer ring holding part and a chip separation facilitation unit is allowed to access to the separation facilitation head keeping part by a moving mechanism to automatically carry out a changing operation for changing the separation facilitation head between the separation facilitation head keeping part and a separation facilitation head attaching part provided in the chip separation facilitation unit without annoying operator's hands. Thus, the separation facilitation head can be automatically changed to improve the operation rate of the apparatus.

Abstract: The invention concerns an arrangement for filling and/or emptying receptacles filled and/or to be filled with articles, essentially including at least one handling device for transporting receptacles that have been and/or are to be filled between a reservoir and a device which alters the level of the receptacles, at least one device which alters the level of the receptacles, and at least one reservoir for holding receptacles that have been and/or are to be filled, which is distinguished in that the arrangement is designed as a closed unit, such that the handling device is surrounded in cell fashion by the at least one device altering the level of the receptacles and by the at least one reservoir.

Abstract: This reaction vessel support is of the type comprising at least one supporting plate (46, 48) designed to take one or more reaction vessels, and mounted rotatably about an axis of rotation (R). In one aspect of the invention, the support comprises at least one control member (94, 96) comprising releasable means (100) of coupling to a movable actuating element (40) of an actuator (10), in such a way as to enable the control member (94, 96) to be moved by the actuator (10), with the control member (94, 96) and the supporting plate (46, 48) being connected together in such a way that a movement of the control member (94, 96) by the actuator (10) is able to bring about a rotation of the supporting plate (46, 84) about the axis of rotation (R) in at least one direction of rotation. Of particular application to supports for microassay plates comprising wells laid out in a matrix arrangement.

Abstract: Plural wok pairs composed of a plurality of works are stored in work storing means. A movable sensor 45 fitted to a conveyance robot 5 detects the position of one of the work pairs in the work storing means, and the work gripping means 25 takes out a plurality of works at one time from the work storing means. One of the plurality of works is held temporally by temporal work holding means 6 or 7 while the other work is conveyed to a jig Y. In the course of conveyance, a fixed sensor 63 detects the relative positional relationship between the work and the work gripping means 25. If the relative positional relationship deviates from the regular positional relationship, the movement of a robot arm 31 is corrected.

Abstract: A high-speed tray transfer system for trays of semiconductor devices for increasing the rate at which trays are delivered to, and advanced through, a pick and place that moves orthogonal to the tray movement, so as to increase the overall throughput speed of a semiconductor handling machine. The invention utilizes two or more platens that carry trays. The platens can pass over, under or otherwise around each other so that while one platen is under and servicing the pick and place, another platen is cycling around and preparing another tray of electronic devices for the pick and place.

Abstract: A mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine having a plurality of chip-carrier plates, a magazine to store the plurality of chip-carrier plates, and a transport arrangement having a first and second clamping device that are disposed on a movable holder is disclosed. The transport arrangement is designed to remove a selected chip-carrier plate from the magazine and deliver it to a chip processing station. After processing, the selected chip-carrier plate is removed and deposited in the magazine. Movement of the chip-carrier plates is controlled such that the selected chip-carrier plate is positioned at a collection point to be collected from the magazine. Movement of the transport arrangement holder is controlled such that the first and second clamping devices are disposed in a vertical arrangement on the holder and are constructed to individually release or grip a chip-carrier plate in a similar angular position of the holder.

Abstract: Jig interchanging mechanism for supplying and carrying out a component holding jig to and from an electronic component supply portion is moved by a component image taking camera moving mechanism for moving the component image taking camera above the electronic component supply portion, the compact electronic component mounting apparatus and the electronic component mounting method excellent in an operational efficiency can be realized.

Abstract: Load storage equipment according to the present invention includes rotary racks 21, each of which is supported independently on a story 1 or 2, and which may not extend vertically through the slab 4 between the stories 1 and 2. The storage equipment also includes a transferrer 51 common to the rotary racks 21. Each of the rotary racks 21 can turn on a vertical axis 22 and includes load supports 32 arranged circumferentially around the vertical axis 22 and vertically. The transferrer 51 extends vertically near the sides of the rotary racks 21 and through the slab 4. The transferrer 51 includes a carrier 81, which can vertically move to carry loads to and from the load supports 32.

Abstract: An automated system for handling material and parts cut therefrom. The system includes means for unloading a material pallet positioned on a shelf within a first storage device and loading the material on a movable cart, transporting the material to an unloading station wherein the material is positioned onto a first shuttle table, the shuttle moving to a laser cutting station, unloading the cut material from the cutting station after parts are cut in the material, and transporting the cut parts on a pallet to a selected shelf in a second storage device using movable carts. The skeleton material remaining after the cutting operation is collected for eventual disposal. A second shuttle table is used to prepare additional material for cutting after the material brought by the first shuttle table is moved to the laser cutting station.

Abstract: A product wafer processed by a semiconductor manufacturing apparatus is transferred to a check apparatus for checking, and a result thereof is sent to a host computer. A product wafer determined as being failed as a result of the checking is transported into an empty carrier by a built-in type wafer transport apparatus under the instruction of the host computer. The carrier in which the product wafer determined as being failed is accommodated is regarded as a rework lot by the host computer. Based on manufacturing standard information for rework held by the host computer, rework processing is performed through a wafer manufacturing operation. Therefore, such a semiconductor device manufacturing line results in that the carrier accommodating the product wafer is transferred and handled smoothly.

Abstract: An apparatus for transporting and an apparatus for conveying microplates between two locations are provided. The transport includes a pair of rails, a microplate transport carriage for moving along the rails, a rotary platter for loading and unloading microplates on the carriage, a controller for generating signals for controlling the position of the carriage on the rails and the rotation of the platter on the carriage, and a servo for moving the carriage or rotating the platter in response to a control signal. The transport moves microplates along the rails in accord with any of several methods for performing different tasks. The conveyor includes an extendable support frame, a pair of oppositely disposed tensioning elements arranged within the frame, a conveyor belt which wound around the elements and extends as the support frame is extended, and a motor for driving the conveyor belt.

Abstract: A buffer apparatus includes a vertically moving mechanism containing a plurality of horizontally moving mechanisms to store carriers and transfer carriers to and from a load port, and one or more buffer load ports adjacent to the buffer apparatus to charge and uncharge the buffer apparatus by means of a guided vehicle, an overhead vehicle, or a human. A buffer system includes a buffer apparatus and a processing system load port to transfer carriers from the buffer apparatus to a processing system load port. An arrayed buffer system includes a plurality of buffer systems where each buffer system interacts with an individual set of load ports or a pair of buffer systems interacts with a shared set of load ports. A combination of arrayed buffer systems includes a plurality of adjacent arrayed buffer systems capable of sharing a single, environmental front-end mechanism maintenance space and capable of being serviced from the front.

Abstract: An apparatus for random access storage and retrieval of a plurality of microplates is provided. The apparatus includes a plurality of microplate racks arranged in a stack. Each of the racks is mechanically engaged with a plurality of support columns and each of the columns has a plurality of locking devices corresponding to the plurality of racks. The apparatus also includes a lift, coupled to the support columns, for moving the stack or a portion thereof, and a controller, coupled to the lift and the locking devices. The controller is responsive to a signal to access a desired rack or microplate to cause actuation of one or more of the locking devices corresponding to the rack adjacent to the desired rack or microplate, followed by actuation of the lift, thereby moving a portion of the stack a sufficient distance to allow access to the desired rack or microplate.

Abstract: A reticle protection and transport system and method for a lithography tool. The system includes an indexer that stores a plurality of reticles and a removable reticle cassette. The removable reticle cassette is comprised of an inner chamber and an outer chamber. The system further includes an end effector coupled to a robotic arm. The end effector engages one of the plurality of reticles to enable the reticle to be positioned within the removable reticle cassette and thereafter transported. The system further includes a seal, coupled to the end effector and the robotic arm. To transport the reticle, the reticle is first loaded onto the end effector. Next, the end effector is used to create an arrangement wherein the reticle is loaded into the removable reticle cassette. Importantly, the reticle and removable reticle cassette do not come into contact with one another.

Abstract: The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Abstract: A loading apparatus for vertically stacking a plurality of articles includes a staging assembly. The staging assembly includes a staging platform configured to receive and support the articles. The staging platform is vertically movable to a plurality of vertical levels. The staging assembly further includes a lift drive to raise and lower the staging platform, and a positioning system to move the articles off of the staging platform at selected ones of the plurality of levels. A conveyor assembly is configured to transport the articles to the staging assembly. The positioning system may be operable to remove the articles from the conveyor assembly and position the articles on the staging platform. The positioning system may be operative to position the articles on the staging platform while the lift drive is raising or lowering the staging platform.

Abstract: A system and method for automatically replacing a tray in a handler system is disclosed. The system and method includes a stacker assembly for housing a plurality of trays, each tray holding at least one device, and a replacement apparatus for automatically replacing a tray in the stacker assembly with a replacement tray. The system and method further includes identifying a tray in need of replacement, adjusting the stacker assembly so that the tray in need of replacement is aligned with the tray replacement apparatus, and replacing the tray with the replacement tray.

Abstract: An apparatus and method for controlling wafer temperature and environment is provided. The apparatus includes a batch processing fixture for batch processing wafers at a first elevated temperature. The batch of wafers is not substantially ramped in temperature within the batch processing fixture. The apparatus also includes a single wafer processing apparatus for rapidly ramping temperature of a wafer of the batch from the first elevated temperature wherein a uniform temperature across the wafer is maintained during the ramping. Another embodiment of the apparatus (10) includes an RTP chamber (20) having an inert or reducing environment and that includes a pedestal (24) for holding a single wafer (16) and a heater unit (22) arranged so as to uniformly and rapidly heat the single wafer.

Abstract: An exposure method, which exposes a pattern of a mask carried on a mask stage onto a substrate, includes transferring the mask to the mask stage by a transfer device, and moving the transfer device to a position in which it does not hinder an exposure.

Abstract: A method and apparatus are provided for batch, continuous, or semi-continuous coating of optical lenses. The method and apparatus use a plurality of carriages which are reciprocally moved in the apparatus to transfer jigs from a jig filled carriage to a lens loading arm and to load the jigs with lenses and then to transfer the jigs now containing uncoated lenses to a leading empty carriage. Using such a reciprocating motion, a leading empty carriage is now filled with jigs containing uncoated lenses and the uncoated lenses in the carriage may then be coated by dipping the carriage in a coating tank. After coating, the coated lenses are removed from the system. A similar reciprocating motion is used in the coated lens unloading section.

Abstract: The present invention provides a wafer positioning device having wafer storage capability. The wafer positioning device has a wafer platform with wafer lift pins, a wafer position sensor, and a storage location in close proximity to the wafer platform and the wafer position sensor. The storage location may be above the wafer position sensor, in which case the wafer position sensor retracts or rotates so that the wafer lift pins may elevate a positioned wafer past the position sensor to the storage location. Alternatively, the storage location may be between the wafer platform and the wafer positioning device. The storage location is preferably formed by a plurality of rotatable towers or a plurality of retractable lift pins that are operatively coupled to the wafer platform and that have wafer support portions capable of assuming both a wafer storage position and a wafer passage position.

Abstract: A conveying system for conveying a substrate is provided with a sensor for measuring information related to flexure of the substrate during conveyance or the vertical position of the substrate. Conveyance of the substrate is controlled on the basis of the measurement by the sensor, whereby correct conveyance of the substrate is accomplished without being influenced by dispersive flexure amount of substrate.

Abstract: Of a plurality of wafers (15) circumferential edge portions of which are held by slot grooves (14) of a wafer cassette (13), the positions of a wafer (15) to be transferred and the wafers (15) above and beneath it are detected by a first sensor (16) and a second sensor (17). A calculating unit calculates an amount of bend of each wafer (15) based on the detected information. It is determine, based on the calculation result, whether the transfer arm (18) can be inserted under the wafer (15) to be transferred without contacting with the wafer beneath (15) and whether the wafer (15) to be transferred can be lifted up by the transfer arm (18) without contacting with the wafer above (15).