Abstract: A transfer head for an electronic component transfer apparatus and a method therefor. The transfer head includes a first vacuum pipet laterally spaced from a second vacuum pipet with a first pitch therebetween. The first pitch is variable between a first pitch position and a second pitch position.

Abstract: A turnover mechanism configured to turn over workpieces includes a bracket, a drive device, and a turnover module mounted on the bracket. The turnover module includes a rotating shaft, a plurality of suction assemblies, a plurality of horizontal drive assemblies, and a plurality of connecting rods. The guide rails are mounted on the rotating shaft. The suction assemblies are slidably coupled to each guide rail. The horizontal drive assemblies are mounted on the corresponding guide rails. Each connecting rod is connected between each two of the plurality of suction assemblies adjacent to each other. The connecting rod is configured to adjust distance between the two suction assemblies. Each horizontal drive assembly is connected to the suction assembly mounted at one end of the corresponding guide rail, and the horizontal drive assembly is configured to drive the suction assemblies coupled to the corresponding guide rail to move.

Abstract: A clamping mechanism includes an adjusting assembly, a driving assembly and a plurality of clamping assemblies. Each clamping assembly includes a base body slidably sleeved on the driving assembly. The adjusting assembly includes a first adjusting member, and a second adjusting member parallel to the first adjusting member. The first adjusting member is fixed to a base body located on a first end of the plurality of clamping assemblies. Opposite ends of the second adjusting member are fixed to the driving assembly and a base body located on a second end of the plurality of clamping assemblies. Each of the first and second adjusting members respectively define a plurality of first and second steps. The first steps and the second steps slidable resist sidewalls of the base body. An upward direction of the plurality of first steps is reverse to that of the plurality of the second steps.

Abstract: A handling device includes a base plate defining an X-Y plane, a plurality of X rails movably supported on the base plate and extending in an X-direction, a plurality of Y rails movably supported on the base plate and extending in a Y-direction perpendicular to the X-direction and a drive system supported on the base plate for moving the X rails in the Y-direction and for moving the Y rails in the X-direction, wherein a spacing between the X rails varies as the X rails move, and wherein a spacing between the Y rails varies as the Y rails move, and wherein the spacing between the X-rails is continuously variable with respect to the spacing between the Y rails.

Abstract: A variable tape feeder is provided. The variable tape feeder includes a frame having an accommodating section and a component feeding section on a transfer path that transfers a carrier tape having components packaged with a cover tape. Width adjusters for the transfer path, the accommodating section, and the component feeding section are installed respectively on the transfer path, accommodating section, and component feeding section to adjust widths thereof according to widths of the carrier tape, the accommodating section, and the component feeding section, respectively. Width sensors for the transfer path, the accommodating section, and the component feeding section detect widths adjustment of the transfer path, the accommodating section, and the component feeding section width adjusters, respectively. A controller outputs a response signal in response to signals detected by the respective sensors installed in the component feeding section and the accommodating section.

Abstract: A substrate processing system includes a control section configured to control a series of transfer operations and preset to control operation of a container transfer apparatus, operation at a substrate access area, and operation of a substrate handling apparatus independently of each other. The control section includes a schedule creating portion configured to create a transfer schedule by individually adjusting operation timing of the container transfer apparatus, operation timing at the substrate access area, and operation timing of the substrate handling apparatus such that, in a state while a first lot of substrates are treated in the processing system, but the container transfer apparatus and the substrate access area are unoccupied, a container with a second lot of unprocessed substrates stored therein is transferred onto the substrate access area, thereby minimizing total transfer time.

Abstract: A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism.

Abstract: A front opening unified pod (FOUP) for holding wafers is invertible and compatible with process machines in an inverted orientation. The FOUP can safely transport and store wafers while in a non-upright orientation. The shelves within the FOUP are capable of collapsing and constraining the wafers. Further, a method of holding wafers for processing is provided.

Abstract: A transfer device of a handler for testing semiconductor devices is provided in which a pitch between each of a plurality of picker heads may be adjusted without replacing a cam plate. The transfer device may include a base part, a plurality of picker heads movably mounted on the base part, and a cam plate movably mounted on the base part and having a plurality of inclined cam grooves formed therein. Each picker head is connected to a corresponding cam groove by a connection part extending therebetween, with an end of each connection part movably coupled to its respective cam groove. A driving unit reciprocates the cam plate so that, as the ends of the connection parts move within the cam grooves, a position of the picker heads may be varied.

Abstract: A semiconductor wafer transfer equipment transfers a plurality of semiconductor wafers, held in grooves of carriers in an erected state, to a boat using first and second wafer elevators equipped with a comb-teeth portion and a wafer grip and transfer unit. The first and second wafer elevators correspond to the carriers and the boat and are equipped with a position correction mechanism which corrects positions of comb-teeth openings of comb-teeth members provided on the comb-teeth portion, corresponding to semiconductor wafers housed in the grooves of the carriers.

Abstract: An apparatus for stacking semiconductor wafers comprises a housing configured to releasably maintain a plurality of semiconductor wafers in fixed positions relative to the housing. The apparatus also includes a transfer guide proximate to the housing, the transfer guide configured to facilitate the transfer of the plurality of semiconductor wafers into the housing. Also included is a member configured to detach the semiconductor wafers from the housing so as to collect the semiconductor wafers into a stack.

Abstract: Various methods and apparatus for handling a plurality of disks and repositioning them into pairs is provided. In one embodiment, a nest is configured to hold a cassette and includes a nest. The nest includes a curved surface with ribs or teeth extending therefrom which define a row of grooves. The grooves are dimensioned to hold a pair of disks in concentric contact merge orientation and the teeth facilitate movement of pairs of disks into the grooves.

Abstract: A substrate processing apparatus (1) includes a wafer loading/unloading and arraying part (14) to remove substrates W from a container (C) where a plurality of unprocessed substrates W to be processed are accommodated at regular intervals, substrate arraying part (51a, 51b, 60) for arranging the substrates W having been removed from two containers (C) at the loading/unloading and arraying part (14) at pitches half the pitch to arrange the substrates in the container (C), a processing part (4) for applying a designated process on the substrates (W), a transfer mechanism (17) for transporting the substrates (W) arranged by the substrate array part (51a, 51b, 60) to the processing part (4) and a stand-by part (75) to allow the substrates arranged by the substrate array parts to stand in readiness temporarily.

Abstract: An apparatus including a pick-and-place apparatus and methods of operating a pick-and-place apparatus. The pick-and-place apparatus includes a frame, a plurality of vacuum rails movable in the frame, a row of vacuum nozzles on each vacuum rail, a plurality of stop members, a first mechanism for biasing the vacuum rails apart, toward, and into engagement with the stop members, and a second mechanism for biasing the vacuum rails together. The vacuum rails have a maximum pitch, in which the vacuum rails are biased apart by the first mechanism and engage the stop members, and a minimum pitch, in which the second mechanism overcomes the bias of the first mechanism and biases the vacuum rails together. The pick-and-place apparatus can pick up a two dimensional array of electrical parts, change spacing between the electrical parts, rotate the two-dimension array of electrical parts and place the parts in carrier tape.

Abstract: The present invention relates to feeder assemblies, and more specifically, relates to feeder assemblies for a tube-filling machine. The present invention includes at least one robotic arm capable of moving tubes and tube holders between two locations. The robotic arm may also move the tubes and tube holders relative to one another in order that the distance between adjacent tubes is substantially equal to the holders which carry and house the tubes.

Abstract: A substrate arraying method, a substrate arraying device and a small-sized processing apparatus commonly includes a step of taking 26 sheets of wafers W out of one carrier C at regular intervals of L, a step of taking 26 sheets of wafers W out of another carrier C at regular intervals of L and a step of respectively inserting the 26 sheets of wafers W taken out of the latter carrier C between the 26 sheets of wafers W taken out of the former carrier C to form a group of wafers 100 where 52 sheets of wafers W are arranged at regular intervals of L/2 which is substantially half of the intervals of L. Consequently, it is possible to complete the stable formation of substrates group in a short time.

Abstract: An adjustable wafer transfer machine that includes an adjusting mechanism for changing the spacing between adjacent wafers to accommodate placement of the wafers in either a smaller wafer carrier or a larger wafer carrier and a transfer mechanism for transferring the wafers between the smaller wafer carrier and the adjusting mechanism and for transferring the wafers between the larger wafer carrier and the adjusting mechanism. The adjusting mechanism comprises a pair of flat plates disposed parallel to and opposite one another and a plurality of elongated opposing dividers slidably mounted on the plates. The dividers are disposed vertically adjacent to one another at spaced apart intervals and they extend horizontally to support the wafers along a portion of their perimeter. A positioning mechanism is operatively coupled to the dividers for changing the spacing between the dividers and, correspondingly, between the wafers supported on the dividers.

Abstract: Improved variable-pitch pick and place devices may include one or more improvements such as a mechanical linkage such as pantograph linkage, the linkage itself linked to a plurality of device-gripping mechanisms arranged in a row so as to keep uniform, though variable, spacing between the device-gripping mechanisms, with the number of such mechanisms being increased relative to the number of parts in the linkage for reduced tolerance stack-up and improved positioning accuracy. The horizontal position of the linkage may be fixed at a position not at an end thereof, and desirably within the middle third or at the middle thereof. The linkage may be controlled at three points. These points may include a vertically flexible but horizontally fixed link to a supporting structure at the middle of the pantograph, a link at one end of the pantograph to one side of an endless loop of timing belt, and a link at the other end of the pantograph to the other side of the endless loop of timing belt.

Abstract: A substrate processing apparatus (1) includes a wafer loading/unloading and arraying part (14) to remove substrates W from a container (C) where a plurality of unprocessed substrates W to be processed are accommodated at regular intervals, substrate arraying part (51a, 51b, 60) for arranging the substrates W having been removed from two containers (C) at the loading/unloading and arraying part (14) at pitches half the pitch to arrange the substrates in the container (C), a processing part (4) for applying a designated process on the substrates (W), a transfer mechanism (17) for transporting the substrates (W) arranged by the substrate array part (51a, 51b, 60) to the processing part (4) and a stand-by part (75) to allow the substrates arranged by the substrate array parts to stand in readiness temporarily.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.

Abstract: An apparatus for transferring wafers between wafer holders such as wafer cassettes, etching drums and the like includes a tank for containing a liquid transfer medium in which the wafers can be transferred. The apparatus includes a wafer transfer unit that can transfer a plurality of wafers such as semiconductor wafers between wafer holders, and maintain the wafers in a desired relative orientation during transfer. For example, the wafers can be maintained in a parallel relationship. The apparatus can be used to automatically transfer wafers to etching drums without cross-indexing of the wafers and without manual handling of the wafers.