Abstract: A processing method for processing a substrate includes: a first arrangement step of mounting, on a stage provided in a processing container to mount the substrate on the stage, a plate-shaped protective member which is prepared in advance at a location in the processing container different from a location on the stage and which is configured to protect an upper surface of the stage; an adjustment step of adjusting a distance between the stage and an annular cover member provided above an edge portion of the stage to a second distance different from a first distance between the stage and the cover member when the substrate is processed; and a pretreatment step of performing a pretreatment in the processing container to change a state in the processing container to a predetermined state, wherein the protective member has a thickness different from a thickness of the substrate.

Abstract: A driving mechanism according to an aspect includes a first pulley configured to rotate around a first axis, a motor configured to rotate the first pulley around the first axis, a second pulley disposed to be separated from the first pulley and configured to rotate around a second axis parallel to the first axis, a first belt laid around the first and second pulleys and configured to transmit power of the motor from the first pulley to the second pully, a third pulley disposed side by side with the second pulley in a direction along the second axis and configured to rotate around the second axis integrally with the second pulley, a fourth pulley disposed to be separated from the third pulley and configured to rotate around a third axis parallel to the second axis, a second belt laid around the third and fourth pulleys and configured to transmit the power of the motor from the third pulley to the fourth pulley, and a first bearing located between the second and third pulleys and configured to support the secon

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

Abstract: A substrate conveying robot includes a cable guide that is arranged inside a housing, in which a robot cable extending from an arm is arranged, and that deforms to follow the robot cable moved as the arm is moved up and down.

Abstract: The present disclosure provides an apparatus and a method for transferring a wafer, and an apparatus for controlling transferring a wafer. The apparatus for transferring a wafer includes a transfer chamber, at least one process chamber, a first detection unit, and a control unit, wherein the transfer chamber is provided therein with a transfer unit; the at least one process chamber is in connect with the transfer chamber, and a chamber door is provided at a connect position; the first detection unit includes a first transmit end and a first receive end, the first transmit end is provided on one of the transfer unit and the chamber door, and the first transmit end is provided on the other one of the transfer unit and the chamber door.

Abstract: Systems, methods, and computer-readable media are disclosed for container transporters and related item manipulation devices. In one embodiment, an example item manipulation device may include a support platform, and a conveyance surface coupled to the support platform, where containers can be moved over the conveyance surface from a first end of the support platform to a second end of the support platform. Some embodiments may include a first actuator extending along a length of the conveyance surface, a sliding component configured to be actuated from a first end of the first actuator to a second end of the first actuator, and a rotary actuator coupled to the sliding component. Example embodiments may include a member coupled to the rotary actuator, the member configured to be actuated from a first position to a second position via the rotary actuator, and a suction cup assembly coupled to the member.

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening through which one or more substrates are capable of being transported between the substrate carrier and the factory interface. The load port can also include an actuator coupled to the frame, and a load port door coupled to the actuator and configured to seal the transport opening. The frame height can be greater than the height of the load port door, and less than 2.5 times the height of the load port door.

Abstract: There is provided a load port, including: a frame including an opening via which a transfer target object is capable of passing in a substantially horizontal posture; a load port door configured to engage with a container door capable of opening and closing a loading/unloading port of a storage container including slots capable of accommodating the transfer target object in a multi-stage manner, and to open and close the opening of the frame; and a mapping mechanism configured to map information on an accommodation state including presence or absence of the transfer target object in each of the slots in the storage container via the opening and the loading/unloading port.

Abstract: Embodiments of the present application provide a weighing device that comprises a weighing unit for weighing wafers, a support structure placed on the weighing unit, at least two support platforms disposed on the support structure and each having a bearing surface for supporting peripheral regions of the wafers, and a driving part for driving the support platforms to move on the support structure, so as to adapt the at least two support platforms to bear the differently sized wafers. Since a wafer contacts merely several support platforms, cleanness of the wafer is better maintained during the weighing process; at the same time, the support platforms are enabled to stably bear differently sized wafers through adjustment of movements of the support platforms on the support structure.

Abstract: The present disclosure provides a carrier mechanism including at least one rotator, a supporting unit, and a driving unit. The rotator rotates about an axis and has a gradually enlarged cam surface. The supporting unit has at least one carrier. The carrier has a first passive member and a second passive member contacting two sides of the rotator respectively. The driving unit has at least one driver to drive the rotator to rotate about the axis so as to push the first passive member and the second passive member. Thus, the carrier can precisely adjust the location of the carrier.

Abstract: A substrate processing apparatus includes a first unit block including a first substrate transfer region, a first and a second processing modules provided to face a first and a second sides of the first substrate transfer region in a left-right direction, and a first and a second transfer mechanisms provided at the first and the second sides and configured to deliver a substrate to the first and the second processing modules; a second unit block, stacked on the first unit block, including a second substrate transfer region and a third transfer mechanism; a substrate carry-in/out block provided at a first side of a stack of the unit blocks and configured to deliver the substrate to the first and the third transfer mechanisms; a relay block provided at a second side of the stack and configured to deliver the substrate to the second and the third transfer mechanisms.

Abstract: Provided a light emitting device including a reflective layer including a plurality of nanostructures that are periodically two-dimensionally arranged, a planarization layer disposed on the reflective layer, a first electrode disposed on the planarization layer, an organic emission layer disposed on the first electrode, and a second electrode disposed on the organic emission layer, wherein the planarization layer includes a conductive material that is transparent with respect to light emitted by the organic emission layer, and wherein the planarization layer is disposed on upper surfaces of the plurality of nanostructures such that an air gap is provided between adjacent nanostructures of the plurality of nanostructures.

Abstract: A transfer station configured to handle cargo receptacles, wherein the transfer station includes: a transfer device that includes at least one holder component configured to hold and release cargo receptacles, at least one platform configured to support the cargo receptacles, at least one transfer device frame extending in a vertical direction, in which the at least one platform is mounted in a vertically displaceable manner, the transfer device frame includes at least one lifting drive component configured to vertically displace the platform, a base member on which the transfer device frame is mounted, an electronic circuit configured to control the operation of at least one component of the transfer station.

Abstract: A wafer handling apparatus includes at least one load port, an image capturing device and a processor. The load port is configured to receive a wafer carrier. The image capturing device is configured to capture an image of the wafer carrier received in the load port before one or more wafers are inserted into the wafer carrier. The processor is communicably connected to the image capturing device and is configured to determine whether the wafer carrier is in a condition that is unsafe for wafer placement based on the image captured by the image capturing device.

Abstract: Provided a light emitting device including a reflective layer including a plurality of nanostructures that are periodically two-dimensionally arranged, a planarization layer disposed on the reflective layer, a first electrode disposed on the planarization layer, an organic emission layer disposed on the first electrode, and a second electrode disposed on the organic emission layer, wherein the planarization layer includes a conductive material that is transparent with respect to light emitted by the organic emission layer, and wherein the planarization layer is disposed on upper surfaces of the plurality of nanostructures such that an air gap is provided between adjacent nanostructures of the plurality of nanostructures.

Abstract: A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

Abstract: Production system for series production of in particular motor vehicles, includes a container storage area storing containers containing components for production, production shelves, remote from container storage area, from which workers remove components from containers. Transport for transporting containers from container storage area to production shelves. Transport has automated guided vehicle (AGV) on which transport shelf is situated and designed so containers are automatically delivered from transport shelf to production shelves in a conveying direction (delivery direction). Handling device situated on AGV, has a base body and a handling unit situated on base body. Handling unit removes containers from transport shelf in conveying direction and delivering containers to production shelf.

Abstract: There is provided a processing apparatus including: a processing part including a plurality of process modules connected to each other in a first room, and a loader module provided in the first room and accommodating a carrier which receives a substrate processed by each of the plurality of process modules; and a plurality of pump units corresponding to the plurality of process modules, respectively, and arranged in a second room adjacent to the first room, wherein an installation area of the plurality of pump units is equal to or smaller than that of the processing part.

Abstract: Examples of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One example provides a hoop assembly for use in a processing chamber. The hoop assembly includes a confinement ring defining a confinement region therein. A hoop body mates with the confinement ring. The hoop body is slanted to reduce a thickness across a diameter of the hoop body. Three or more lifting fingers are attached to the hoop body and extend downwards. Each of the three or more lifting fingers has a contact tip positioned radially inward from the hoop body to form a substrate support surface below and spaced apart from the confinement region.

Abstract: A substrate treating apparatus includes a carrier platform, a transport mechanism, and a controller. The carrier platform places a carrier thereon. The carrier includes a plurality of shelves arranged in an up-down direction. The shelves are each configured to place one substrate thereon in a horizontal posture. The transport mechanism is configured to transport a substrate to a carrier placed on the carrier platform. The controller controls the transport mechanism. The transport mechanism includes a hand and a hand driving unit. The hand supports a substrate. The hand driving unit moves the hand. The controller changes a height position of the hand when the hand is inserted between two of the shelves adjacent to each other in the up-down direction, depending on a shape of a substrate taken from or placed on one of the shelves by the transport mechanism.

Abstract: Provided are a parcel sorting system and method. The parcel sorting system is arranged in layers and includes: a parcel sorting layer located on an upper layer of the parcel sorting system, a moveable container carrying layer located on a lower layer of the parcel sorting system, a parcel delivery robot and a control device. The parcel sorting layer includes a modular entity platform that is a physical platform formed by splicing multiple splicable units and used for sorting parcels. The modular entity platform includes multiple delivery lattices arranged in an array and a traveling area constituted by gaps between the lattices and used for the parcel delivery robot traveling. One delivery lattices corresponds to one or more delivery path directions. The moveable container carrying layer includes multiple moveable containers, and a part of the containers are located below the lattices and receive the parcel from the parcel sorting layer.

Abstract: An apparatus for loading/unloading workpieces, including a furnace heating a workpiece, and a robot loading and/or unloading a workpiece into/from the furnace. The robot may include a manipulator linkage and a fork at an end of the manipulator linkage. The fork may have an upper side on which a workpiece is placed while being loaded into and/or unloaded from the furnace. The fork may include a parallel arrangement of fork elements, each fork element in the fork having a length and rectangular cross section perpendicular to the length. Each fork element may have a workpiece carrying surface on which a workpiece is placed and an opposite surface to the workpiece carrying surface. The fork element may include a heat insulator disposed on the workpiece carrying surface at least over an area where a workpiece is placed to equalize longitudinal thermal expansions in the workpiece carrying surface and the opposite surface.

Abstract: Disclosed is a method and a system for monitoring of environment and security in a fabrication facility. In one embodiment, a method comprising: transporting an automated material handling system (AMHS) vehicle from a first position to a second position; and detecting at least one parameter using at least one sensor located on the AMHS vehicle to determine at least one environmental or security condition between the first and second positions.

Abstract: A robot subassembly including roll, pitch, and/or vertical orientation adjustability capability of a ceramic or glass end effector. The robot subassembly includes a robot component, a mounting plate coupled to the robot component, wherein the mounting plate includes adjustable orientation relative to the robot component, and a brittle ceramic or glass end effector coupled to the mounting plate. Methods of adjusting orientation between a robot component and the end effector, as well as numerous other aspects are disclosed.

Abstract: A showerhead apparatus for a linear batch CVD system includes a movable showerhead, one or more gas supply conduits, and a translation mechanism. Each gas supply conduit provides a precursor gas to the showerhead. The showerhead includes conduits and channels arranged along the length of the showerhead to distribute precursor gas to the surfaces of substrates. The small distance between the substrates and the showerhead limits precursor gas flows from the channels to a small portion of each substrate beneath the showerhead. During a deposition process run, the translation mechanism causes the showerhead to move back and forth over the substrates along a direction perpendicular to a linear arrangement of the substrates. Parasitic deposition within the deposition chamber is substantially reduced in comparison to conventional showerhead apparatus. The ability to accurately control the precursor gas flows and the motion of the showerhead allows for improved thickness uniformity and device yield.

Abstract: A method for filling and closing pharmaceutical objects disposed in parallel rows in nests includes removing the objects from the nests at an inlet of a conveying device in a removal station and placing the objects into the conveying device. In the conveying device, the objects are fed in succession to a first weighing station and weighed, to filling station and filled and to a second weighing station and again weighed and to a closing station and/or crimping station and closed. After closing, the objects are removed from the conveying section. In every case, pre-sterilized objects are processed in an aseptic manner.

Abstract: A prober can suppress a decrease of a throughput in inspection of semiconductor devices on a substrate. The prober 10 includes a stage 11 having a horizontal mounting surface 11a that mounts thereon a wafer W on which semiconductor devices are formed; a probe card 16 provided to face the stage 11; three roller devices 26, each having a vertical rotational shaft, equally-spaced along a circumference of the mounted wafer W. Each roller device 26 is configured to rotate the wafer W on a horizontal plane while being in contact with a peripheral edge of the wafer W.

Abstract: A substrate transfer apparatus unloads a substrate from a transfer container in which a cover body airtightly closes a substrate unloading opening formed at a front surface of a container main body and multiple substrates are accommodated in the form of shelves. The substrate transfer apparatus includes a load port to which the transfer container is loaded; a detection unit configured to detect an accommodation status of the substrate in the container main body that is loaded to the load port and separated from the cover body; a substrate transfer device configured to enter the container main body and unload the substrate; and a correction device configured to correct the accommodation status of the substrate in the container main body before the substrate is unloaded from the container main body by the substrate transfer device when the detection unit detects abnormality in the accommodation status.

Abstract: Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.

Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.

Abstract: Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.

Abstract: An apparatus for dynamically adjusting the pitch between substrates in a substrate stack comprises first and second lift portions. The first lift portion supports a first group of the plurality of substrates, and the second lift portion supports a second group of the plurality of substrates. The first and second lift portions are operable to move the first and second groups of substrates in a first direction independently from each other. This independent movement enables the pitch, or spacing, between adjacent substrates to be dynamically adjusted so that an end effector of a robot can be positioned between such adjacent substrates to pick one of the substrates without inadvertently engaging another substrate that is not being picked. Other embodiments are disclosed.

Abstract: An apparatus for processing a wafer including a reaction chamber having a reaction space for processing the wafer, a susceptor positioned within the reaction chamber and having a sidewall, at least one light source positioned outside of the reaction space, at least one window in the reaction chamber, and wherein the at least one light source is directed through the at least one window to contact the sidewall.

Abstract: An apparatus for characterizing a wafer comprising an aligner comprising a chuck for receiving and rotating the wafer, a sensor for detecting the position of the wafer as it is rotated, a first actuator for lowering and raising the wafer vertically, and a second actuator for moving the chuck horizontally; and a weighing scale comprising a weight sensor disposed proximate to the aligner, and a cantilevered arm extending laterally from the weight sensor over the chuck of the aligner, the cantilevered arm having a through hole surrounding the chuck. The chuck is vertically movable relative to the weighing scale from a first position in which the wafer is supported by the chuck to a second position in which the wafer is supported by the cantilevered arm of the weighing scale. A method for characterizing a wafer using the instant apparatus is also disclosed.

Abstract: A feeding device includes a housing, a first conveying mechanism mounted on the housing, and a distribution mechanism. The housing forming a receptacle space includes a top surface defining a receiving opening communicated with the receptacle space. The distribution mechanism includes a slide platform slidably mounted on the top surface, a distribution member, and elastic members. The slide platform defines an unloading opening communicated with the receiving opening and a mounting groove adjacent to the unloading opening. The distribution member is movably mounted in the mounting groove. The elastic member elastically resists the distribution member to protrude out from the unloading opening. The stacked feeding trays resist the distribution member to move away from the unloading opening. When the top feeding tray is moved above the distribution member, the distribution member retracts by an elastic force to separate the top feeding tray from the stacked feeding trays located below.

Abstract: Disclosed is a container offload system for shipping containers, silos, and other storage containers. The offload system is comprised of a longitudinal body with spacers attached to the bottom section, in contact with a commodity. Commodity passes through gaps between the spacers into an offload channel. The commodity is offloaded from the container or silo through the offload channel. The offload system is built into containers or may be retrofitted. Furthermore, versions of the offload system may be retrofitted to fit in the hull of a marine vessel. In one version, the offload system is removable.

Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.

Abstract: An apparatus for characterizing a wafer comprising an aligner comprising a chuck for receiving and rotating the wafer, a sensor for detecting the position of the wafer as it is rotated, a first actuator for lowering and raising the wafer vertically, and a second actuator for moving the chuck horizontally; and a weighing scale comprising a weight sensor disposed proximate to the aligner, and a cantilevered arm extending laterally from the weight sensor over the chuck of the aligner, the cantilevered arm having a through hole surrounding the chuck. The chuck is vertically movable relative to the weighing scale from a first position in which the wafer is supported by the chuck to a second position in which the wafer is supported by the cantilevered arm of the weighing scale. A method for characterizing a wafer using the instant apparatus is also disclosed.

Abstract: The present invention discloses apparatuses and method for configuring a compartmentable equipment to accommodate emergency responses. An exemplary equipment comprises a plurality of removable compartments for storing workpieces so that in emergency events, such as power failure or equipment failure, the workpieces can be removed from the equipment for continuing processing without disrupting the flow of the fabrication facility. The compartmentable equipment can comprise emergency access ports, including mating interface to a portable workpiece removal equipment to allow accessing the individual compartments without compromising the quality, defects and yield of the workpieces stored in the stocker.

Abstract: A robot hand includes a mounting surface to which a work unit is mounted with some freedom of horizontal movement. A pair of anti-fall hooks is formed at a tip portion of the mounting surface to support a front edge portion of the work unit so as to prevent the work unit from falling off the mounting surface. A pair of support section is provided at a rear edge portion of the mounting surface to support a rear edge portion of the work unit. If, during placement of the work unit into a cassette, the work unit collides with the cassette, the work unit comes into contact with one of the support sections, and the work unit is rotated on the mounting surface about the contact point as a fulcrum so as to correct the misalignment of the work unit.

Abstract: The present invention discloses apparatuses and method for configuring a compartmentable equipment to accommodate emergency responses. An exemplary equipment comprises a plurality of removable compartments for storing workpieces so that in emergency events, such as power failure or equipment failure, the workpieces can be removed from the equipment for continuing processing without disrupting the flow of the fabrication facility. The compartmentable equipment can comprise emergency access ports, including mating interface to a portable workpiece removal equipment to allow accessing the individual compartments without compromising the quality, defects and yield of the workpieces stored in the stocker.

Abstract: The present invention provides a method for inspecting UV illuminance in multi-level UV bake furnace for TFT-LCD manufacturing process and a pickup assembly device for performing the method. The method for inspecting UV illuminance in multi-level UV bake furnace for TFT-LCD manufacturing process includes the following steps: Step 1: providing a multi-level bake furnace for TFT-LCD manufacturing process, a pickup device, an inspection control system, and a sensor for inspecting UV illuminance; Step 2: mounting the sensor on the pickup device; Step 3: connecting the inspection control system and the sensor with communication; Step 4: operating the pickup device to bring the sensor to a site in a level of the multi-level UV bake furnace where inspection of UV illuminance is to be made; and Step 5: sensor collecting data and transmitting the data so collected to the inspection control system to thereby realize inspection.

Abstract: Provided is a substrate processing apparatus for loading substrates such as solar cell substrates on a tray in substrate processing equipment for processing a large number of substrates. The substrate processing apparatus includes: a tray carrying unit configured to receive and carry a tray; a substrate loading conveyor unit on which substrates to be loaded on a tray are arranged in a line; a substrate unloading conveyor unit on which substrates unloaded from a tray are arranged in a line; a first substrate carrying robot configured to pick up substrates from the substrate loading conveyor unit and carry the substrates to a tray placed on the tray carrying unit; and a second substrate carrying robot configured to pick up substrates from a tray placed on the tray carrying unit and carry the substrates to the substrate unloading conveyor unit.

Abstract: A component transfer device includes a holding mechanism (20) that positions and holds a component on a carrying surface (S) located at a predetermined height and a pull-out unit (40) that pulls out the component held on the carrying surface by the holding mechanism in a horizontal direction. The pull-out unit includes a grasping member (43, 44) that can separably grasp the component from a vertical direction, a cam member (42) that causes the grasping member to perform a component grasping operation and a component releasing operation at predetermined timings by exercising a cam function to the grasping member, a driving mechanism (41, 46, 47) that drives the cam member and the grasping member.

Abstract: A robot system according to an aspect of the embodiments includes a plurality of work holding units and a heat insulating member. The work holding units each hold a work to be conveyed on one surface and are arranged vertically one over another in some cases during conveying of the work. The heat insulating member is provided on another surface side of at least one of the work holding units.

Abstract: Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.

Abstract: The present invention relates to a distance adjustment system and a solar wafer inspection machine provided with the system. The inspection machine has a conveyer for carrying a solar wafer, an optical inspection system for inspecting the surface and color appearance of the wafer and an illumination inspection system. A holder is provided in the inspection position where the wafer is clamped along its width direction to prevent the wafer from offset. During the opto-electrical inspection, probes are brought into contact with conductive buses of the wafer and light is applied to the wafer to allow the probing of electric energy thus generated. An adjusting device is employed to adjust the clamping gap of the holder and the distance of the probes in accordance with the size of the solar wafer. The data are collected and transmitted to a sorting system for sorting the wafer.

Abstract: A workpiece transfer system may include a plurality of cassettes for storing workpieces, at least one workpiece processing apparatus, and a multi-joint industrial robot for loading and unloading workpieces to/from the cassettes. The multi-joint industrial robot may include a hand part for holding a workpiece, an arm part supporting the hand part so as to make the hand part rotatable, and a link mechanism that supports an arm joint part, positioned at a base side of the arm part, so as to make the arm joint part rotatable.

Abstract: A device for stacking a plurality of silicon wafers has an upright machine carrier for holding a plurality of silicon wafers, the silicon wafers being provided in a horizontal position in the machine carrier. The device has three identical loading cassettes for introducing several silicon wafers therein. The machine carrier has holding devices for the loading cassettes. The loading cassettes have a lower support surface for putting silicon wafers on in stack-like fashion, and a rear side wall running substantially perpendicular thereto. The loading cassette is designed in such a way that the side opposite the rear side wall, and the top side are freely accessible.