Abstract: In a component mounting device (1) which has a first mounting lane (L1) and a second mounting lane (L2) and which is structured so as to be able to select either an independence mounting mode or an alternation mounting mode, when device type changing operation is performed with change of the type of boards which are the mounted objects, if a tape feeder float detecting sensor (17) that is provided in proximity of an opening (19) through which a part of the body or the foreign object enters in the component supplying part is, detects a part of the body such as a finger (26) of the operator or the foreign object, operation of the component mounting mechanism which belong to the mounting lane opposite to the mounting lane to which the component supplying part, in which the optical sensor is provided, belongs is stopped.

Abstract: When performing the device type changing operation with the change of the board type to undergo mounting, the component mounting device, which has a first mounting lane and a second mounting lane and which is structured so as to be able to select either an independent mounting mode or an alternate mounting mode, moves a mounting head of the mounting lane to and thereafter positions and fixes to a previously-set predetermined withdraw position [P] where entry of a portion of a body of an operator by way of an opening (19) formed in a protective cover (18a) can be prevented and where safety of the operator is not impaired even if a mounting head of a mounting lane on the other side has undergone collision.

Abstract: In a component mounting device (1) which includes a first mounting lane (L1) and a second mounting lane (L2) and for which an independence mounting mode and an alternation mounting mode are selectable, a first limited movable area (R1A) and a first limited movable area (R1B) in which the movements in the horizontal direction of a first mounting head (13A) and a second mounting head (13B) of the mounting lanes are permitted in the independence mounting mode, are set as areas different from second limited movable areas in the alternation mounting mode, to prevent the mounting head of the mounting lane which is continuously operating from entering into the area of the mounting lanes for which the device type changing operation is being performed.

Abstract: A method of wasting tips in an automated processing module is disclosed, which includes at least three positions for holding sample racks. One of the positions is a tip waste rack position holding a tip waste rack, which includes tip receiving openings. Furthermore, it includes a SWAP rack holding mechanism for temporarily holding a sample rack. The method includes transferring the tip waste rack from the tip waste rack position to an adjacent sample rack position. Once the tip waste rack is placed in the adjacent sample rack position, the error pipette tip is discarded into one of the tip receiving openings of the tip waste rack. Following this, the tip waste rack is transferred back to the tip waste rack position. The sample rack temporarily placed in the SWAP rack holding mechanism is transferred from the SWAP rack holding mechanism to the adjacent sample rack position.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A door detection system includes a robot arm unit and a movable unit. The robot arm unit includes at least one bearing platform and at least one level sensing structure disposed on the at least one bearing platform. The level sensing structure includes a plurality of contact sensors, and the wafer carrier device is disposed on the at least one level sensing structure. The movable unit includes at least one movable structure disposed on the robot arm unit. The wafer carrier device has a wafer pick-and-place opening corresponding to the door, and one end of the at least one movable structure can selectively contact the door of the wafer carrier device or been inserted into the wafer carrier device from the wafer pick-and-place opening.

Abstract: Four laser positioning units are used to position and control an X-Y stage which is movable in X and Y directions. For each laser positioning unit, a mirror constantly reflects laser beam to an optical position sensor, where the mirror is integrally mounted on a rotation unit which is integrally mounted on the one side of platform of X-Y stage, where the laser diode is mounted on another rotation unit which is stationary, the optical position sensor is also stationary. Each rotation unit includes a fine rotation stage and a coarse rotation stage, the fine rotation stage has very high resolution but short rotation range, and the coarse rotation stage has a large rotation range but low resolution. When moving the X-Y stage, four fine stages constantly rotate mirror or/and laser to reflect the laser beam onto the optical position sensor, the amount of rotations and geometry of position of laser and mirror gives precisely the position of moving stage.

Abstract: The invention relates to an apparatus for receiving and positioning veneers fed by conveyor means. The apparatus comprises means for gripping the veneers and means for detecting the location and/or position of the veneers on a conveyor belt. There is at least one gripping means on both sides of the feeding direction center line of the veneer. The gripping means are arranged to reciprocate essentially in the feeding direction of the veneers and to grip the veneer on its leading edge side and to position the veneer on the basis of the information provided by the detection means to the desired location in the feeding direction of the veneers.

Abstract: A robotic placement machine including a base operably connected to the Y axis actuator and the X axis actuator, a first Z axis actuator coupled to the first end of the base, the first Z axis actuator capable of moving up and down a first Z axis, a second Z axis actuator coupled to the second end of the base, the second Z axis actuator capable of moving up and down a second Z axis, and a pick and place plate operably connected to the first Z axis actuator and the second Z axis actuator, wherein the first Z axis actuator and the second Z axis actuator are each capable of moving independently of each other to tilt the pick and place plate is provided. Furthermore, a system comprising a first machine, second machine, and third machine to eliminate air bubbles when bonding two substrates is also provided. A method of optical bonding is further provided.

Abstract: A geometric end effector system for use on a robot. The system includes a platform and a frame secured to the platform. At least one base is arranged at a predetermined position on the frame. The system also has an anchor mount secured to the base and a component connected to an end of the anchor mount by a collar assembly. A key is arranged between the component and the anchor mount.

Abstract: A device suitable for producing an image of an object disposed in an object space by means of a sensor comprises at least the sensor, a first lens assembly disposed in front of the sensor, a stop plate comprising a light passage disposed in front of the first lens assembly, a second lens assembly disposed in front of the stop plate and the object space disposed in front of the second lens assembly. The device further comprises a light source, as well as a diffuser which is disposed on a side of the object space that is averted from the light source.

Abstract: A method of controlling contact load in an apparatus for mounting electronic components on a substrate, in which a head is lowered at high speed to slow down starting position where there is no risk that the electronic component makes contact with the substrate (S1), and from there the head is lowered at low speed until a predetermined target contact load is detected. The process of lowering the head at low speed includes the steps of moving down the head a predetermined distance (S3), measuring load after the step of moving down the head (S5), and determining whether the measured contact load has reached the target contact load (S9). The steps of moving down the head (S3) and measuring the load (S5) are repeated until the measured load reaches the target contact load. The actual load is precisely controlled to be close to a very small set level of target contact load. Accordingly, electronic components using low dielectric constant material are mounted without the risk of damage.

Abstract: The invention relates to a method and to an apparatus for sorting non-sorted containers in a predetermined sequence in an order-picking system which comprises a main conveying track by means of which the non-sorted containers are transported within the order-picking system, in particular to an order-picking workstation or into a container store, in a main conveying direction, said apparatus having a conveying-track circuit, which can be connected to the main conveying track via an introduction point, for introducing containers into the conveying-track circuit, and via a discharge point, for discharging containers which are located in the conveying-track circuit, and having at least one transfer device, which is arranged within the conveying-track circuit such that containers can be exchanged between a first exchange point and a second exchange point of the conveying-track circuit (FIG. 1).

Abstract: A non-contact conveying device (10) using superconducting magnetic levitation capable of stably conveying an object (11), including: a conveying table (12) having a bottom with permanent magnets (16-19) to convey the object (11); a conveying guide unit (13) having superconductors (20) immediately below the respective magnets (16-19); distance sensors (21) on the conveying guide unit (13) for detecting a distance between the conveying table (12) and the conveying guide unit (13); damping coils (25) in the conveying guide unit (13) for generating a magnetic field upon energization thereof to damp vibration of the conveying table (12); and a control device (27) for detecting vibration of the conveying table (12) by signals from the distance sensors (21) and for controlling current applied to the damping coils (25). If disturbance occurs on the object (11) conveyed contactlessly by the superconducting magnetic levitation, the vibration is stopped within a short period of time.

Abstract: A wafer conveyance system is described for transporting one or more wafers that undergo, while being transported, different processes at a plurality of wafer processing apparatuses inside which one or more wares are processed. A hermetically closed chamber is provided that defines an isolated environment inside which a controlled atmosphere. At least one guide path is provided inside the hermetically closed chamber. At least one mobile element is movable inside the hermetically closed chamber along the at least one guide path to transport one or more wafers from one wafer processing apparatus to another. A plurality of position sensors that detect positions of the at least one mobile element are deployed along each of the at least one guide path in such a manner that they are deployed at intervals close together when near the wafer processing apparatuses and deployed at wider intervals elsewhere. In another aspect, the guide rails may be constructed of a plurality of connectable rail units.

Abstract: A calibration cassette pod for robot teaching and a method of using the calibration cassette pod are described. In the calibration cassette pod, a cassette pod body and a cassette pod door are first provided wherein the cassette pod body is constructed of a top panel, a bottom panel, two side panels and a front panel to enclose a cavity therein. A first plurality of ribs is formed on an inside surface of the cassette pod body, each having a predetermined depth sufficient to support an edge portion of a wafer. An optical detector housing is mounted on an opening in the front panel and is adapted for receiving an optical detector therein. An optical detector that includes a light emission source and a photo diode receiver for determining the position of the edge portion of the wafer is mounted in the optical detector housing.

Abstract: A robotic arm has a pair of gripper fingers designed to grip a variety of containers, including capped and uncapped test tubes as well as containers having unique gripping means. The fingers each have upper and lower projections separated by a groove, the respective projections facing each other when mounted to grippers on the robotic arm. The projections and groove serve to firmly hold the containers as well as self-align the unique gripping means on initially unaligned containers within the fingers as the fingers close around the containers. The fingers have clearance to avoid contact with caps on capped test tubes. Stops are provided at the top of each finger to engage one another and prevent fully closed fingers from deforming. The robotic arm may be transported along a rail mounted above the instrument and a gripper assembly, having a gripper arm, mounted to the robotic arm may be rotated above the instrument to move the container to various locations within the instrument.