Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract: An absorbing mechanism includes a positioning member, an absorbing member, and at least one separating member. The positioning member defines a receiving chamber, for receiving a plurality of workpieces. The attaching member is constructed for absorbing the workpieces. The at least one separating member comprises a main body and a detaching portion. The main body is mounted on the positioning member. The detaching portion protrudes from the main body toward an axis of the positioning member, and forming an inclined surface away from the main body. The inclined surface defines at least one blow hole. The inclined surface towards the receiving chamber.

Abstract: A device for removing a ring-shaped label from a pack of substantially identical, abutting ring-shaped labels comprises a pick-up head which is provided with a stop surface and retaining devices for holding a ring-shaped label against the stop surface. The device comprises a storage holder for accommodating the pack of ring-shaped labels. A displacement device can displace the pack of ring-shaped labels from a storage position, in which the pack of ring-shaped labels is situated at a distance from the stop surface of the pick-up head, to a discharge position, in which the pack of ring-shaped labels is pushed against the stop surface of the pick-up head by means of an outer ring-shaped label. A blast of air is delivered when the outer ring-shaped label is held against the stop surface of the pick-up head.

Abstract: In a method of separating wafers (12) from a vertical wafer stack (16), the wafers (12) are transported away individually from above via movement means (23). The movement means (23) include circulating belts (24), with a suction surface (25) against which the uppermost wafer (12) abuts, the abutment of the wafer against the suction surface (25) being enhanced by negative pressure. To separate a plurality of wafers (12) located one upon another, the movement means (23) are subjected to at least one of the following two steps: a) water (30) is forcefully jetted against the leading edge of the uppermost wafer (12), the water being directed obliquely from beneath the latter, or b) the movement means (23) guide the wafer (12) over a stripping device (32) which butts against the underside of the moving wafer and both forces the wafer against the suction surface (25) and generates a braking action thereon. Thereafter, the wafer (12) is moved to a transporting path (35, 37) to be transported for further processing.

Abstract: A mailpiece unstacker device comprises a feed magazine for moving the mailpieces in a stack and on edge in a certain direction towards an unstacker head. It is provided with materials sensors for delivering signals indicating that a current mailpiece has a cover made of a plastics material and/or includes a metal material. A control unit forces the feed magazine and the unstacker head to operate as a function of the signals generated by the sensors so that the mailpieces are presented facing the unstacker head in positions that are inclined backwards to various extents.

Abstract: Apparatuses and methods for facilitating the separation and retrieval of a topmost disc stored in a vertical stack of similar discs, with minimal modification to existing production lines, are provided. A disc stacking apparatus configured to allow flow of preferably ionized air through an air channel within a spindle shaft and out through one or more air ports is also provided.

Abstract: A device for separating individual tires that have become entwined including a movable head for engaging at least one tire in a stack of tires, an engaging finger coupled to the movable head, and at least one manipulating apparatus for moving the engaging finger and the movable head to dislodge entwined tires.

Abstract: Unstacker apparatus (1) for unstacking flat items (E), the unstacker apparatus comprising a flat item feed magazine (M) in which the flat items are disposed in a stack and on edge and are moved in a certain direction (D) until they reach an unstacking plate (6) disposed in alignment with said feed magazine, whereupon they are ejected one-by-one in a perpendicular direction (P) that is perpendicular to said certain direction (D), the unstacker apparatus further comprising a blower member (13) which is disposed so as to blow a jet of air onto the flat items, and which is mounted in a manner such as to be retractable into the unstacking plate.

Abstract: Wafers are separated individually from a stack by directing multiple jets of fluid between an outermost wafer in the stack and an adjacent wafer. The jets have sufficient pressure and are sufficiently spaced apart around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without lateral movement there between. In the illustrated embodiment, a chuck is attached to a planar surface of the outermost wafer. The attached wafer and wafer stack, once separated by the jet of fluid, are moved relatively apart, such as by movement of the chuck. The wafers in the stack are thereby separated without contact between a wafer edge and a solid object (such as a container wall or hand), minimizing the risk of wafer breakage.

Abstract: Wafers are separated individually from a stack by directing multiple jets of fluid between an outermost wafer in the stack and an adjacent wafer. The jets have sufficient pressure and are sufficiently spaced apart around the wafer stack to cause the outermost wafer to separate longitudinally from the adjacent wafer without lateral movement there between. In the illustrated embodiment, a chuck is attached to a planar surface of the outermost wafer. The attached wafer and wafer stack, once separated by the jet of fluid, are moved relatively apart, such as by movement of the chuck. The wafers in the stack are thereby separated without contact between a wafer edge and a solid object (such as a container wall or hand), minimizing the risk of wafer breakage.