Takes Article Therefor From Another Spaced Group Patents (Class 414/798.3)
  • Patent number: 8590143
    Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: November 26, 2013
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Kui Kam Lam, Yen Hsi Tang, Wai Yuen Cheung, Wing Kin Lam
  • Publication number: 20100172737
    Abstract: A high-speed process includes removing chips or interposers from a carrier web having a first pitch and transferring the chips or interposers to electrical components, such as RFID antenna structures, on a moving web having a second pitch. According to one method, a transfer drum transfers chips or interposers to a moving web of electrical components by picking a chip when the transfer drum is stationary, and transferring the chip to the moving web when the transfer drum is rotating such that a tangential velocity of the transfer drum is substantially equal to the linear velocity of the moving web. According to another method, a primary drum removes chips or interposers from a carrier web having a first pitch, and transfers the chips or interposers to a variably rotating secondary drum which then places the chips or interposers onto an electrical component on a moving web having a second pitch.
    Type: Application
    Filed: January 11, 2010
    Publication date: July 8, 2010
    Applicant: AVERY DENNISON CORPORATION
    Inventor: Jason MUNN
  • Patent number: 7179346
    Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: February 20, 2007
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Kui Kam Lam, Man Chung Raymond Ng, Yen Hsi Terry Tang
  • Patent number: 6733228
    Abstract: A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts being transported on the upper plane of the transporting member; and a shutter for opening and closing at the tip of the guiding groove, so as to cover the space above the first part in the row so as to prevent the part from flying out.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: May 11, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shigeki Takahashi, Nihei Kaishita, Akira Nemoto
  • Patent number: 6375406
    Abstract: A part transporting apparatus comprises: a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards.
    Type: Grant
    Filed: May 10, 1999
    Date of Patent: April 23, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shigeki Takahashi, Nihei Kaishita, Akira Nemoto
  • Patent number: 6338608
    Abstract: A part transporting apparatus comprises a guiding groove for lining up parts in one row and guiding the parts; a transporting member which is provided at the base of the guiding groove and transports the parts in a forward direction by itself moving forwards and backwards along the groove; and a driving means for reciprocally driving the transporting member in the forward and backward directions; wherein the transporting member is advanced slowly and retracted rapidly, so as to transport the parts forwards. Provided to this arrangement are: a stopper which operates so as to open and close in the width direction of the guiding groove, and hold the second part from the front of the row of parts being transported on the upper plane of the transporting member; and a shutter for opening and closing at the tip of the guiding groove, so as to cover the space above the first part in the row so as to prevent the part from flying out.
    Type: Grant
    Filed: May 10, 1999
    Date of Patent: January 15, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shigeki Takahashi, Nihei Kaishita, Akira Nemoto